| Fulltext Datasheet Results |
1 - 28 of about 28 for mp8000 |
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First line: 0731 mp8000 UNISEM SC70- Lead Free Package Data High Temperature Storage Life +150 1000 hours Device Soak Plating Date Code Reject Dev. Hrs. G600 MP8000 MP8000 MP8000 G600 MP8000 G600 MP8000 MIC94070 MIC5365 3.0YC5 MIC94060 MIC94060 MIC94060 MIC845 LYC5 MIC5213 2.8YC5 MIC810 JBC3 Abstract: .. MIC5365 3.0YC5 7A37783MNJ SC70-5 HTSL.L1 Sn 0801 76 0 76000 MP8000. MIC94060 YC6 7A08043MEY SC70-6 HTSL.L1 Sn 0731 76 0 76000 MP8000. MIC94060 YC6 7A08043MEZ SC70-6 HTSL.L1 Sn 0731 76 0 76000 MP8000 .. Tags: mp8000 0731 MIC94070 MIC5365 MIC94060 MIC845 MIC5213 MIC810 |
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First line: Nitto-MP8000 MP180S* Nitto Nitto MP8000 Nitto* Abstract: .. Description: Qualification of MP8000 for TO220. __ Description of Change: Dallas Semiconductor will change the mold compound .. Tags: Nitto MP8000 MP180S* Nitto-MP8000 TO220 package Qualification ON SEMICONDUCTOR TRACEABILITY Nitto* mp8000 4157 datasheet abstract.. |
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First line: MIC4127 mosfet 1500v RELIABILITY REPORT DATE: 2/15/05 QUALITY PURPOSE: Dual Side MosFet Driver Family PACKAGE TYPE Epad Soic .150 Epad Soic .150 Epad Soic .150 ASSEMBLY Amkor Philippines Amkor Philippines Amkor Philippines MP8000 MP8000 MP8000 0430 0429,0431 0435,0436 FORTUNE FORTUNE FORTUNE 4A23614 Abstract: .. MIC4126 BME SOIC-epad SnPb 85/15 MP8000 Level 2 +260C 3X AMKOR 1.42 x 1.6 mm. MIC4126 YME SOIC-epad Sn matte 100% MP8000 Level 2 +260C 3X AMKOR 1.42 x 1.6 mm. MIC4127 BME SOIC-epad SnPb 85/15 MP8000 .. Tags: MIC4127 sn 0436 mp8000 mosfet 1500v Epad Product MP8000 |
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First line: EME6600 JESD22-A113-B* eme6600cs JESD22-A113 JESD22-A113* MOISTURE SENSITIVITY CLASSIFICATION MICREL SURFACE MOUNT PACKAGES THIS TABLE: PRODUCT PACKAGES CLASSIFIED LEVEL REQUIRE BAKE PACK WITH APPROPRIATE WARNING LABEL PRODUCT PACKAGES CLASSIFIED LEVEL REQUIRE PACK ONLY WITH APPROPRIATE WARNING LABE Abstract: .. SOIC ALL 16L-24L 300 MILS WIDE 1 EME6600 or MP8000. SOIC ALL 28L 300 MILS WIDE 1. EME6600 or MP8000 LF<151X151. SOIC-FUSED LF ALL 8L 150 MILS WIDE 1 EME6600 or MP8000. SOT-223 ALL ALL ALL 1. SOT-23 ALL ALL .. Tags: JESD22-A113* JESD22-A113 JESD22-A113-B* warning G700 eme6600cs all transistor 7320 datasheet abstract.. |
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First line: Nitto MP8000 Abstract: .. to MP8000. __ Description of Change: The mold compound will be changed on all SOIC packages from Sumitomo EME6300 to Nitto MP8000 .. Tags: Nitto MP8000 ON SEMICONDUCTOR TRACEABILITY Nitto* mp8000 datasheet abstract.. |
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First line: Nitto MP8000 Nitto* MOLDING MATERIAL MP8000 PLCC MOISTURE SENSITIVITY LEVEL RECLASSIFICATION Altera's internal reliability monitors indicate drift Moisture Sensitivity Level (MSL) nondry-packed 44-, 84-pin PLCC packages that have seal date codes 98XX. While evaluations support rating* JEDEC-Std-020, Abstract: .. Altera is currently evaluating an alternative PLCC mold compound, Nitto’s MP8000, which is already in use for assembly of most of our FLEX QFP products. Upon completion of this evaluation, Altera .. Tags: MOLDING MATERIAL MP8000 Nitto* Nitto MP8000 MSL Rating EPM5192* EPM5192LC84 |
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First line: EP900i G600 mold compound SUMITOMO-G600* G600 mold compound SUMITOMO g600 PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND PLCC PACKAGES Change Description: Altera will implement standard Sumitomo-G600 series mold compound Plastic J-Lead Chip Carrier (PLC Abstract: .. assembled at ASE Malaysia and Amkor Philippines that are currently using Nitto’s MP8000 series mold material will be molded with Sumitomo-G600 series mold compound. This mold material had been .. Tags: SUMITOMO g600 G600 mold compound SUMITOMO-G600* G600 mold compound EP900i PCN0512 |
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First line: EME G600 SUMITOMO EME G600 SUMITOMO g600 EME-G600* Sumitomo EME-G600 material Abstract: .. Change detail is as follows: Mold compound from Nitto MP8000-AN to Sumitomo EME-G600 As part of this material change the use of die coating on some nvSRAM products has been discontinued. Simtek .. Tags: SUMITOMO EME G600 SUMITOMO g600 Sumitomo EME-G600 material SUMITOMO* Nitto* mp8000 G600 mold compound G600* EME-G600* EME G600* Dow Corning Compound datasheet abstract.. |
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First line: 999s* MP8016 ANALOGIC CORP/ DATA HfcsE MP8000 Series 14,15 16-Bit Converters MP8000 Series converters offers system designer wide choice resolution, conversion rate, analog input digital output configuration, while providing high accuracy long-term time temperature stability. Resolutions 14-, 15-, 1 Abstract: .. ANALOGIC CORP/ DATA HfcsE D MP8000 Series 14,15 and 16-Bit AID Converters Description The MP8000 Series of A/D converters offers the system designer a wide choice of resolution, conversion rate .. Tags: MP8016 999s* MP8016* MP8015 MP8015* datasheet abstract.. |
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First line: SUMIKON EME-G700 EME-G700* EME-G700 datasheet SUMITOMO G700 SUMITOMO EME G700 PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND PACKAGES Change Description: Altera will standardizing Sumikon EME-G700 series mold compound Altera's quad flat pack (QFP) packages. packages assembl Abstract: .. ASE in Malaysia and Amkor in Korea that are currently using Nitto’s MP8000 series and Sumitomo’s EME-6300HJ series will be standardized on the EME-G700 mold compound. The moisture sensitivity .. Tags: SUMITOMO EME G700 SUMITOMO G700 EME-G700 datasheet EME-G700* SUMIKON EME-G700 PCN0504 |
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First line: M24C16K QREE0016 QUALIFICATION REPORT MP8000 Mold Compound Shenzhen THIS REPORT This Qualification Report summarizes reliability trials results performed qualify Nitto Mold Compound called MP8000 used package (Small Outline Package) Shenzhen plan. This material already qualify Muar plan (see qualifi Abstract: .. QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen. THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called .. Tags: M24C16K Nitto* mp8000 MP8000 |
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First line: so14 package QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes reliability trials results performed qualify Nitto Mold Compound called MP8000 used SO14 package (Small Outline Package) Muar plan. This material already qualify package (see q Abstract: .. QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar. THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called .. Tags: so14 package Nitto* mp8000 MP8000 |
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First line: Ablestik LMISR4 Ablestik Ablestik 8290 Abstract: .. This material set will replace the original Nitto MP8000-AN mold compound and Ablestik 84-1 LMISR4 for Simtek products with Sn/Pb and Matte Tin termination plating. Full MSL characterization .. Tags: Nitto* mp8000 G600 mold compound Ablestik LMISR4 Ablestik 84-1 Ablestik 8290 Ablestik* datasheet abstract.. |
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First line: Q092XS1 SHORT FORM DEVICE INFORMATION TYPE FUNCTION FAMILY PROCESS Abstract: .. KMC184-3a MG46FC-AM MP8000. DIE PROCESS. PACKAGE PROCESS. TYPE TS92X. FUNCTION RAIL TO RAIL HIGH OUTPUT CURRENT OPERATIONAL. AMPLIFIER FAMILY. FAMILY R/R OPAMP. DEVICE INFORMATION. STANDARD LINEAR .. Tags: hf2c* epoxy qualification Q092XS1 |
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First line: mp8000 datasheet for 64K RAM A194/FH* Static CY7C1021 Cypress Semiconductor Static Device: CY7C1021 Package: 44-pin, 400-mil Abstract: .. Mold Compound Name/Manufacturer: Nito-MP8000. Lead Frame material: A194 FH. Lead Finish, composition: Solder Plated, 90%Sn, 10%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: A194/FH* datasheet for 64K RAM mp8000 A194 CY7C1021 |
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First line: Asynchronous Static RAM, 3.3V Operation CY7C1021V33 Cypress Semiconductor Static RAM, 3.3V Operation Device:CY7C1021V33 Package: 44-pin, 400-mil Abstract: .. Mold Compound Name/Manufacturer: Nito-MP8000. Lead Frame material: A194 FH. Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: A194 CY7C1021V33 |
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First line: 97101 tc 97101 Static CY7C1021 Cypress Semiconductor Static Device:CY7C1021 Package: 44-pin, 400-mil Abstract: .. Mold Compound Name/Manufacturer: Nito-MP8000. Lead Frame material: A194 FH. Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: tc 97101 datasheet for 64K RAM 97101 CY7C1021 |
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First line: F82C735 F82C735* TM1977B daewon tray F82C735A* Please respond your distributor have issues with timeline content this change. response from customers will deemed acceptance change change will implemented pursuant milestones forth this attached PCN. Information this document provided connection with Abstract: .. Molding compound Sumitomo 6300HG MP8000. Lead Frame Etched Alloy-42. lead frame. Stamped Copper lead frame. Tray # IMT KX-1420-2.7-0611-3 Daewon 827-3283-9. Marking Method Ink Laser. Marking Content .. Tags: daewon tray tm1977b S-Specs f82c735a* F82C735* daewon 1420 daewon* datasheet abstract.. |
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First line: SHORT FORM DEVICE INFORMATION TYPE FUNCTION FAMILY PROCESS PROCESS WAFER SIZE CHIP DIMENSION MASK REFERENCE METALLIZATION PASSIVATION PASSIVATION METHOD THICKNESS PASSIVATION Abstract: .. MOLD MATERIAL HC10-2 Ciba 2184 MG46FC-AM MP8000. DIE PROCESS. PACKAGE PROCESS. TYPE TS95X. FUNCTION RAIL TO RAIL HIGH OUTPUT CURRENT OPERATIONAL. AMPLIFIER FAMILY. FAMILY R/R OPAMP. DEVICE INFORMATION .. Tags: TS951 test SOt23 HC10.2 epoxy qualification datasheet abstract.. |
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First line: LM358DT LM358D* DSG-COM/03/145 LEADFREE PLATING PACKAGE MUAR first lines 2003/02/7 Abstract: .. Mold compound MP8000 CH4 MP8000 CH4. Wire bond method Thermosonic Thermosonic. Lead finishing NiPdAu preplated Tin plating SnPb85/15 LEAD-FREE components are defined by STMicroelectronics .. Tags: LM358D* MARKING JM LM358DT lm358d LM358CD* IC TL082* Ablebond 8390 Ablebond 71-1 datasheet abstract.. |
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First line: diode Tunel CLCC 84 Nitto-MP8000 UltraLogicTM 128-Macrocell Flash CPLD CY7C374i/CY7C375i (Shrink) Cypress Semiconductor UltraLogic 128-Mcell Flash CPLD Device: CY7C374I/375I (Shrink) Package: 84-pin PLCC/84-pin CLCC/160-pin TQFP Abstract: .. Mold Compound Name/Manufacturer: Nitto-MP8000. Lead Frame material: Copper. Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: Nitto-MP8000 CLCC 84 diode Tunel CY7C374i CY7C375i CY7C374I 375I |
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First line: UltraLogicTM 128-Macrocell Flash CPLD CY7C374i/CY7C375i Cypress Semiconductor UltraLogic 128-Mcell Flash CPLD Device: CY7C374I/375I Package: 84-pin PLCC/84-pin CLCC Abstract: .. Mold Compound Name/Manufacturer: Nitto-MP8000. Lead Frame material: Copper. Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: 97127 2611* CY7C374i CY7C375i CY7C374I 375I |
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First line: UltraLogicTM 32-Macrocell Flash CPLD CY7C371i Cypress Semiconductor UltraLogic 32-Mcell Flash CPLD Device: CY7C371i Package: 44-pin PLCC Abstract: .. Mold Compound Name/Manufacturer: Nitto-MP8000. Lead Frame material: Copper. Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: CY7C371i |
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First line: diode Tunel tunel QTP# 96471/96472 May, 1997 UltraLogicTM 64-Macrocell Flash CPLD CY7C372I/373I Cypress Semiconductor UltraLogic 64-Mcell Flash CPLD Device: CY7C372I/373I Package: 44-pin PLCC Abstract: .. Mold Compound Name/Manufacturer: Nitto-MP8000. Lead Frame material: Copper. Lead Finish, composition: Solder Plated, 90%Sn, 10%Pb. Die Attach Area Plating: Silver Spot. Die Attach Method: Paste .. Tags: tunel diode Tunel precondition DIP JEDEC CY7C372I 373I |
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First line: ISO9001-approval* MOLDING MATERIAL MP8000 Nitto MP8000 Qualpack TSS463 TSS461C TSS463 Controller Serial Interface TSS461C Controller TSS463/TSS461C Controllers 1999 January Abstract: .. 1 SUMITOMO 6300 molding compound 2 NITTO MP8000 molding compound 3 Electrical test with Quality program at 25°c, 125°c and -40°c 4 Performed on molded device opened using acid 5 No .. Tags: Nitto MP8000 MOLDING MATERIAL MP8000 ISO9001-approval* TS80C31X2 HMT-65664A TSS463 TSS461C TSS463 TSS461C |
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First line: TEMIC DATABOOK hp83000 ISO9001-approval* Qualpack MG2RT/MG2RTP Qualification Package MG2RT MG2RTP Radiation Tolerant SCMOS3 Technology Abstract: .. Molding Material Nitto MP8000. Flammability rating UL94V-0. Marking Method Printed ink. Coding example T. optional special customer marking TSC8032X2-MCA © INTEL 80,82 Date-code Lot nbr. Dry packing .. Tags: ISO9001-approval* hp83000 TEMIC DATABOOK rta gm PART MARKING A101 mp8000 MG2RTP MG2RT MG2RTP G227* MG2RT MG2RTP |
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First line: PGA-156 p103 pot datasheet Reliability Data Program Expanded Version July 2000 Cover Abstract: .. , XC17256E, XC17256D PLCC- 44, 20 Silver Epoxy Sumitomo 6300H, MP8000. Reliability Combined Device Mean Test Total. Test No. Lots Failures On Test Hrs/Cycles Device Hrs. T/C. Pressure Pot. Hast. Solderability .. Tags: p103 pot datasheet PGA-156 datasheet abstract.. |
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First line: HQFP 208 20E-08* mp8000ch4 XC4006 121C-2* Reliability Data Program Expanded Version Jan. 2000 Cover Abstract: .. PLCC- 84, 44, 20 Silver Epoxy Sumitomo 6300H, MP8000. Reliability Combined Device Mean Test Total. Test No. Lots Failures On Test Hrs/Cycles Device Hrs. T/C. Pressure Pot. Hast. Solderability. Resistance .. Tags: 121C-2* XC4006 mp8000ch4 20E-08* HQFP 208 xilinx xc5206 xc9536 XC3030 XC17256E XC1701 XC1700D tQFP-176 Reliability Test Methods for Packaged Devices mp8000 CMOS GATE ARRAY A9903* datasheet abstract.. |
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