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l)esi};noi's Dala Sheet MINIATURE SIZE, AXIAL LEAD MOUNTED STANDA
Top Searches for this datasheetMR501, MR502, MR504 MR506, MR508, MR510 l)esi};noi's Dala Sheet MINIATURE SIZE, AXIAL LEAD MOUNTED STANDARD RECOVERY POWER RECTIFIERS designed power supplies other applications having need device with following features: High Current Small Size High Surge Current Capability Forward Voltage Drop Void-Free Economical Plastic Package Available Volume Quantities STANDARD RECOVERY POWER RECTIFIERS 100-1000 VOLTS AMPERE Oesigner's Oata "Worst Case" Conditions Designers Data sheets permit design most circuits entirely from information presented. Limit curves representing boundaries device characteristics given facilitate "worst case" design. MAXIMUM RATINGS Rating Symbol Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage Blocking Voltage Vrrm Vrwm 1000 Volts Non-Repetitive Peak Reverse Vottage Vrsm 1050 Volts Average Rectified Forward Current (Single phase resistive load,ta Board Mounting) (EIA Standard Conditions 1/32", Non-Repetitive Peak Surge Current (surge applied rated load conditions) ifsm (one cycle) Operating Storage Junction Temperature Range Tj.Tstg to+175 THERMAL CHARACTERISTICS Characteristic Symbol Unit Thermal Resistance, Junction Ambient (Recommended Printed Circuit Board Mounting, Note Page B8JA STYLE CATHODE ANODE millimeters 9.40 9.65 0.370 0.380 4.83 5.33 0.190 0.210 1.22 1.32 0.048 0.052 26.97 27.23 1.072 ELECTRICAL CHARACTERISTICS Characteristic Symbol Unit Instantaneous Forward Voltage Volts -9.4 Amp, Amp, 1.04 ReverseCurrent(rateddcvoltage) Derate reverie power dissipation. Note Page Derate shown Figure Pulse Test: Pulse Width (is. Duty Cycle 2.0%. MECHANICAL CHARACTERISTICS Case: Void Free, Transfer Molded Finish: External Leads Plated, Leads readily Solderable Polarity: Indicated Cathode Band Weight: Grams (Approximately) Maximum Lead Temperature Soldering Purposes: from case tension 1143 MR501, MR502, MR504, MR506, MR508, MR510 (continued) NOTE DETERMINING MAXIMUM RATINGS Reverse power dissipation possibility thermal runaway must considered when operating this rectifier reverse voltages above volts. Proper derating accomplished equation M).' tAimax) Tj(maxi R0JaPf{AV> R<9JApR|AV) where "TA(max) Maximum allowable ambient temperature Tj(maxj Maximum allowable junction temperature temperature which thermal runaway occurs, whichever lowest.) PF(AV) Average forward power dissipation PR(AV) Average reverse power dissipation R#ja Junction-to-ambient thermal resistance Figure permits easier equation taking reverse power dissipation thermal runaway into consideration. figure solves reference temperature determined equation (2): Tj(max) R6JAPR<AV) Substituting equation into equation yields: TA{max) r0JApRAV> Inspection equations reveals that ambient temperature which thermal runaway occurs orwhereTj whan forward power zero. transition from boundary condition other evident curves Figure difference rate change slope vicinity data Figure based upon conditions. common rectifier circuits. Table indicates suggested factors equivalent voltage conservative design; i.e.: VRIequiv) Vin(PK) Factor derived considering properties various rectifier circuits rectifiers reverse characteristics. Example: Find TA(max) MR510 operated Voltdc supply using full wave center-tapped circuit with capacitive filter such that 6.0A,(lp(AV) I(PK)'I(AV) Input Voltage V(rms) (line center tap), Rqja Step Step Step Step Find Vp{eqUjv). Read 1.11 from Table vR(equw) 1-41it283il1.11) Find from Figure Read RfljA Find Pp(AV) from Figure Read Pf(AV) @JPK =10&IF(AV) 3.0A Find TArmax) from equation (3). T/Wmax) (28) TABLE VALUES FACTOR Circuit Half Wave Full Wave. Bridge Full Wave Center-Topped Load Resistiva Capacitive* Resistive Capacitiva Resistive Capacitiva Sine Wave Square Wave 0.45 0.61 1.11 1.22 0.45 0.61 0.55 0.61 0.90 1.22 1.11 1.22 that VR(PK) Vin(PK) tUse fine center voltage MAXIMUM REFERENCE TEMPERATURE FIGURE FORWARD POWER DISSIPATION REVERSE VOLTAGE (VOLTS) IF(AV). AVERAGE FORWARD CURRENT (AMP) 1144 MR501, MR502, MR504, MR506, MR508, MR510 (continued) CURRENT DERATING (Reverse Power Loss Neglected) FIGURE BOARD MOUNTING AMBIENT TEMPERATURE FIGURE SEVERAL LEAD LENGTHS RESISTIVE LOAD BOTH LEADS HEAT SINK WITH LENGTHS SHOWN LEAD TEMPERATURE FIGURE 1/8" LEAD LENGTH LEAD TEMPERATURE FIGURE FORWARD VOLTAGE INSTANTANEOUS FORWARD VOLTAGE IVOLTSI FIGURE FORWARD VOLTAGE TEMPERATURE COEFFICIENT +5.0 +4.0 +3.0 +2.0 -1.0 -2.0 NGEX INSTANTANEOUS FORWARD CURRENT IAMP) 1145 MR501, MR502, MR504, MR506, MR508, MR510 (continued) FIGURE MAXIMUM SURGE CAPABILITY FIGURE TYPICAL REVERSE CURRENT NUMBER CYCLES JUNCTION TEMPERATURE THERMAL CHARACTERISTICS FIGURE THERMAL RESPONSE -11- DUTY CYCLE-tp/tl PEAK POWER, Ppk, peak -TIME equivalent aiuare power pulse. r(tl r(tp) rlt])] where: ATjl tfte increea junction temperature above laad tamparatura. rft) normalized value tramiant tfiannal reeictance tima, rttt normalizad valua tramiant thermal reejatancej. Iimt TIME (mal LEAD LENGTH 1/4" laad ihould maaured uaing thermocouple plecad laad cloia ponibla poinL tharmal maai con- point normallv lar|a anough that tisnificamly mpond hwt-"aurgoepenoroted diode raautt pulaad oparation once itoady-itato conditioni Uiing maawrad value thtjunction tam- daterminad TJ-TL ATJL NOTE AMBIENT MOUNTING DATA FIGURE STEADY-STATE THERMAL RESISTANCE LEA0 LENGTH (INCHES) Data ttwrmil Iflfj^l Aown ut*d typical vdun preliminary anginMrlng point hnvomun cannot mtiiurad. TYPICAL VALUES RflJA'N STILL MOUNTING METHOD LEAD LENGTH. (IN) MOUNTING METHOD MOUNTING METHOO actor Puah-ln Terminate MOUNTING METHOD P.C. Board with 1-1/2" 1-1/2" Ceppar Board Ground Plan* 1146 MR501, MR502, MR504, MR506, MR508, MR510 (continued) FIGURE APPROXIMATE THERMAL CIRCUIT MODEL THERMAL CIRCUIT MODEL (For Conduction Through Laads) ta(at -WV- ta<k). abov* pwmitt junction thermal raainanca mounting configuration found- glvan total laad langth, votuw occur Mtwn lid* ractlflar brought cIom posslbla haat Tarms modai signify: Laad Tamparatura Caaa Tamparatura Junction Tamparatura Ambient Tamparatura Tharmal Resistance, Haat Sink Ambiant Tharmal Resistance, Lead Haat Sink Tharmal Resistance. Junction Caaa Total Power Dissipation Forward Power Dissipation Reverse Power Dissipation rafar anode cathoda sidas respectively.) Valuat tharmal rasistanca components ara: Typically Maximum. fl0j Typically Maximum. maximum laad tamparatura found follows: where RflJL TYPICAL DYNAMIC CHARACTERISTICS FIGURE FORWARD RECOVERY TIME FIGURE REVERSE RECOVERY TIME FORWARD CURRENT (AMP) IR/IF, DRIVE CURRENT RATIO FIGURE RECTIFICATION WAVEFORM EFFICIENCY FIGURE JUNCTION CAPACITANCE REPETITION FREQUENCY (kHz) REVERSE VOLTAGE (VOLTS) 1147 MR501, MR502, MR504, MR506, MR508, MR510 (continued) RECTIFIER EFFICIENCY NOTE FIGURE SINGLE-PHASE HALF-WAVE RECTIFIER CIRCUIT rectification efficiency factor shown Figure calculated using formula: V20(dcl V20(dc) ''(do) p(rms) V20{rms) V20(ac) V20(dc) 100% sine wave input (ujt) diode, assumed lossless, maximum theoretical efficiency factor becomes: "(sine) -100% -100% 40-6% square wave input amplitude efficiency factor becomes: ^(square) 100% full wave circuit twice these efficiencies) frequency input signal increased, reverse recovery time diode (Figure becomes significant, resulting increasing voltage component across opposite polarity forward current, thereby reducing value efficiency factor shown Figure should emphasized that Figure shows waveform efficiency only; does provide measure diode losses. Data obtained measuring component with true voltmeter component with voltmeter. data used Equation obtain points figure. 1148 MR501, MR502" MR504 MR506, MR508, MR510 MINIATURE SIZE, AXIAL LEAD MOUNTED STANDARD RECOVERY POWER RECTIFIERS designed power supplies other applications having need device with following features: High Current Small Size High Surge Current Capability Forward Voltage Drop Economical Plastic Package STANDARD RECOVERY POWER RECTIFIERS 100-1000 VOLTS 3AMPERE Available Volume Ouantities Data "W'orst Case" Conditions Designers Data sheets permit design most circuits entire from information presented. Limit curves repreSenting boundaries device characteristics given facilitate "worst case" design. MAXIMUM RATINGS Reting Symbol 1000 1050 Unit Volts Peak Repetitive Reverse Voltage VRRM Working Peak Reverse Voltage VRWM Blocking Vol.age Non-Repetitive Peak Reverse Vol.age VRSM Average Rectified Forward Current (Single pha58 resistive load, 95"c. Board Mounting) (EIA Standard Condi.ions 1/32". 85°C) Non-Repetitive Peak Surge IFSM Current (surge applied rated load conditions' (one cycle) -65'0+175 Operating Storage Junction Temporalu Ranga TJ,Tstg STYLE CATHODE ANODE MILLIMETERS INCHES THERMAL CHARACTERISTICS Characteristic Symbol R8JA Unit 9.40 4.83 1.22 26.97 9.65 5.33 1.32 27.23 0.370 0.380 0.190 0.210 0.048 0.052 fAA::! 1.07 Thermal Resistance, Junction Ambient (Recommended Printed Circuit Board Mounting, Note Page °C/W CASE ELECTRICAL CHARACTERISTICS C"'roctoriltic nstantaneoul Forward Voltage Amp, 175°C) Amp, 25°C) Symbol 1.04 Unit MECHANICAL CHARACTERISTICS Case: Void Free, Transfer Mo(ded Finish: External Leads Plated, Leads readily Solderable POlarity: Indicated Cathode Band Weight: Grams (Approximate(y) Maximum Lead Temperature SOldering Purposes: 3000 1/8" from case tension Rove. Curren. (rated vol.age) l000C Derate shown Figure Test: Width; Duty Cycle; 2.0%. Derate reverse power dissipation. StJj" Note Page 1143 MR501, MR502, MR504, MR506, MR508, MH510 (continued) NOTE DETERMINING MA)UMUM RATINGS Reve. powlr diaipation possibility therma' run8W'ay when forw PONer zero. transition from boundary ,condition othar avident curves Figure difference rate change till "ope vicinity 165o dlta Figure basad upon conditions. must considered when OP8rlting rectifier reverse voltages aboWl VOlts, Proper derating accomplished equltion 11): TJ/max) ROJAPF/AVi ROJAPR/AVi where A/max) Maximum allowabla ambiant temperature J(max) Maximum allowable junction temperature (1750 temperature ther(1) common rectifier circuits. Table indicates suggested factors equivalent voltage conservativa design; i.e.: VR(equiv) Vin(PK) Factor derived considering properties various rectifier circuits rectifiers rave. characteristics. Example: Find TA(mex) MR510 operated Volt runaway occurs, whichever lowest.) PF/AV) Average forward power dissipation PR(AV) Average reva power dissipation supply using full WfNe center~t.pped Circuit with capacitive filter such that 6.0A.IIF(AV) 3.0A).I(PK)Ii(AV) Input Voltage V(rms) (line center tap). ROJA CIW. Step Stap Step Find VR/equiv)' Reed VR(equiv) ReJA Junction-tCHllTlbient merm.' resistance Figure permits easier equation taking reverse power dissipation thermal runaway into consideration. figure solves reference temperature determined equation (2): 1.11 from Table 1.41)(283)(1.11) Find from Figure Reed ROJA 2ff>CIW. IF(AV) Find PF(AV) from Figure Reed PF(AV) =TJ(max) ROJAPR(AV) Substituting equation into equation yields: TA(maxl ROJAPF(AV) Step Inspection equations reveals that ambient temperature atwhich thermat runaway occurs where 175°C, Find Almax) from equation (3), A~m8x) 167-(28) 550C. TABLE VALUES FACTOR Circui't Load Sine Wave Half Wave Full Win' Bridge Resistive 0.45 0.61 Full Wave Center- Tapped°t Resistive 0.45 0.61 1.11 1.22 Capacitive 0.55 0.61 Resistive 0.90 1.22 Capacitive 1.11 1.22 Square Wave °Note thlt VR~PK) Vin(PI() tUse line conter volt_ Vin' FIGURE MAXIMUM REFERENCE TEMPERATURE FIGURE FORWARD POWER DISSIPATION 10r-r-.-r-~-r-r-r_-~-~ Imlr-;~-4-~-~,w~ 1~,r-~-~-~-~-+_-+_~-~'" 1~1r-~-~-_+-~r_+_-~.~ .'"' 1~,r-~-_+-~-~-+_-+_~-4_+_+_+ REVERSE VOLTAGE (VOLTS) IFIAV). AVERAGE FORWARD CURRENT lAMP) 1144 MR501, MR502, MR504, IVIR506, MR508, MR510 (continued) CURRENT DERATlIIiG (Reverse Power Loss Negllected) FIGURE BOARD MOU~ITlNG FIGURE FORWARD VOLTAGE r"O.,-.-,-r-,-,-.,-,-.-,-,-,-, 1'-, t'-.:!'"1JI;r-R6JA-2S0CIW 5:?::: ~r.-.l ~,":~ (,,[ I(PK) I(AV) I-CAPACITIVE LOADS 250~ TYPICAL/, .:.~ MAXIMUM R6JA'50oCIW"~ ~:::1~;;;' I(PK) NOTE: RESISTIVE LOAD AMBIENT TEMPERATURE IOC) 1611 FIGURE SEVERAL LEAD LENGTHS !'-. r-.)~ !'-.~ I'\. t'-, 1I32" RESiSTIVk LolAD BOTH LEADS HEAT SINK WITH LENGTHS ASSHDWN 5/S" "r-. LEAD TEMPERATUI~E (DC) INSTANTANEOUS FORWARD VOLTAGE (VOLTSI FIGURE 1/8" LEAD LENGTH +5.0 FIGURE FORWARO TAGE TEMPERATURE COEFFICIENT ""'~ I(PK) _(RESISTIVE I(AV) LOAD) :-:- SQUAREWAVE CAPACITIVE LOADS :(PK) (AV) 5.0~ BOTH LEADS SINK WITH EQUAL '{,ENGTHS +3.0 +2.0 TYPICAL RANGE, -1.0 r""'- ;.-r0.5 ""II 0"0.2 LEAD TEMPERATURE (DC) INSTANTANEOUS FORWARD CURRENT (AMP) 1145 MR501, MR502, MR504, MR506, MR508, MH510 (continued) FIGURE MAXIMUM SURGE CAPABILITY FIGURE TYPICAL REVERSE CURRENT ~100 J)UtJ VRRM APPUEo BETWEEN EACH CYCLE -il'- PRIOR SURGE SURGE. NOTED ~NON.REPETITIVE 100% RATED VOLTAGE ././ RATED VOLTAGE RATED VOLTAGE, ~ETlTIVE F-l1i f./.?50 C""- o::i .!)J~ JUNCTION TEMPERATURE (OC) III"- NUMBER CYCLES THERMAL CHARACTI:RISTICS FIGURE THERMAL RESPONSE o.5:~ ~ppk 0.05 =r(t) normalized wlfue trlMnt ttwmaI resisranct -,0' "'TJla Ppk. RSJL r(11 +!p) ,(tp) ,(1111 -where: :z:,. ~J~;:~':~ junction ttmPlnnurtlbOWl OUTY CYCLE !pit PEAKPoWER.Ppk.ispelkol.n LEAD LENGTH lIf' TIME equMiktnt IIIUWI pOWlr pulse. .=r(11 normolizld voI.1 tim. 1tC. tr_ntthtrmall'llllt~ 0.02 J.+1IIII1 ",,::;: :::::= ,,~I "'fficontly diode pullld opeqtion once conditions nlthilvld. Using mIIIUI'eII VII. junction tim- =11. ~hol~io;:;. dllonninod .1111. lholood _rod using thlnnocoupll pllcld 5.ok ~J"JL +~TJLI 1.0k 11111 1110 TIMI: (0l1Il NOTE AMBIENT MOUNTING DATA O.t:. thown ",-mel ,"'scanc:.lunctlon-to-amblent (R'JA' fOl' mountinp -nOW" u.:J typkal .line dlua fOt' preliminary .".In.'''' point temperetu~ FIGURE STEADY-STATE THERMAL RESISTANCE SINGLE LEAD HEAT'SiNK INSIGNIFICANT HEAT FLOW THROUGH OTHER LEA~ c.nnot meaured. iO", to!!,. -",V' j!:;: ,.,. 01:> i-'" -.," TYPICAL ;::. TYPICAL VALUES RI/JAIN STILL MOUNTING METHOD MAXIMUM LEAD LENGTH (IN) "oJA 1-"'"- MOUNTING METHOD .C:. 8o.,d Avelt. Co.,.,. SUlrf~ BOTH LEAOS HEAT SINK. EQUAL LENGTH iJff~UU MOUNTING METHOD V_tot T.,.I. MOUNTING MElltOD P.c. 80erd with 1-112" 1-1/2" Copper Surf. LEAO LENGTH (INCHES) 1146 MRS01, MRS02, MRS04" MRS06, MRS08, MRS10 (continued) FICIURE APPROXIMATE THERMAL CIRCUIT MODEL THERMAL CIRCUIT MO[IEl (Fo, Hili CondUC1ion Through 1110 ""(A) "ILIA) AfJ(A) Lam, TAIKI~ Ambient Thermal .Istene-. Sink Ambi-ent Temperatu. Pi8L Therma' ",_Istanee, .tSlnk Temptlratur. Thermal .btance, Junc- ~TAI"" T_L~'A_l T_C~(A_l ~-T~"~ ~Ibl. Junction T.mp.tur. tion Toul Pow.r Dlulpatlon Forward Pow., D'-Ipatlon Reve,. Power .I.,.tlon ISub.eripts lnet refer anode cathode lid. Valu. thwma' .Inance components .re: qOCIW/IN. TyplCIIlly C/W/IN Maximum. RtfJ Typically leGe/W Maximum. maximum 'ea:t temperature found follow.: mod" permits junction thermal NtlftInCe IInY mounting conf.,rat:lon found. For. glwn toul IeMI length, lowest vatu. occ~lr when ,Ide r.ctlf., brought CIOM" mod" .nlfy; heIIt sink. Term. TJlma.) 6TJL RBJL TJLe,O TYPICAL DYNAMIC CHARACTERISTICS 25°C) FIGURE FORWARD RECOIVERY TIME FIGURE REVERSE RECOVERY TIME Vlfj=-i-LVI, F-201lmA 1111 Vfr-2.0~ Vi-'" nollignKi.m below ,r-. I-Irr Ip200mA, FORWARO CURRENT (AMP, IR/IF. DRIVE CURRENT RATIO FIGURE RECTIFICATION WAVEFORM EFFICIENCY FIGURE JUNCTION CAPACITANCE NbMl,horii5 VALUE Or-51) ~D.5 t"\MEAS~RJo b~T! INPU~ W~VE~O~ 'r-. -.J\I'vJUU-2.0 REPETITION FREQUE"CY (kHz) <.>- "'10 lOll lOll REVERSE VOLTAGE (VOLTS' 1147 MR501, MR502, MR504, MR506, MR508, MB510 (continued) RECTIFIER EFFICIIENCY NOTE FIGURE RECTIFIER CIFICUIT rectification efficienc,y factor calculated using formula: shown Figura V2oldC) square wENe input amplitude efficiency faletar becomes: square ldC) Plrms) V2olrms) V2olac) V2oldc) Pldc) full wave circuit twice these efficiencies) sine wave input (wt) diode, assumed loss less, ma:(imum theoretical efficiency factor becomes: ,,2RL frequency input signal increased, reverse recClvery time diode (Figure becomes significant, resulting increasing voltage component across opposite polarity forward current, thereby reducing value O(sine) 100% 100% 40.6% efficiency factor shown Figure should emphasized that Figure shovvswaveform efficiency only; does provide measure diode losses. 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