MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, HIGH SLEW RATE OPER
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MIL-M-38510/122 April 1980
MILITARY SPECIFICATION
MICROCIRCUITS, LINEAR, HIGH SLEW RATE OPERATIONAL AMPLIFIERS,
MONOLITHIC SILICON
specification approved merits Agencies Department Defense.
Scope. This specification covers detail requirements monolithic silicon, operational amplifiers. Three product assurance classes choicest case outline lead finish provided each type reflected complete part number.
Part number. part number shall accordance with MIL-M-38510.
1.2.1 Device type. device type shall follows: Device type Circuit
Single operational amplifier, internally compensated,
power, high performance
Single operational amplifier, internally compensated, high impedance, wide band
Single operational amplifier, externally compensated, high impedance, wide band
Single operational amplifier, internally compensated, precision, high slew rate Single operational amplifier, internally compensated,
rate
Single operational amplifier, externally compensated,
high slew rate
1.2.2 Device class. device class shall product assurance level defined MIL-M-38510.
1.2.3 Case outline. case outline shall designated follows:
Outline letter Case outline (see MIL-M-385Xfi, appendix
(8-lead can)
(10-lead, 1/4" 1/4", flat-pack)
Absolute maximum ratings.
Supply voltage range
Input voltage range -_-_
Differential input voltage range
Device type
Device types
Device types
Storage temperature range
Lead temperature (soldering, seconds)
Junction temperature
Voltages excess these applied short term tests voltage
difference does exceed volts.
supply voltages less than Vdc, absolute maximum input voltage
equal supply voltage (minus volts device types 03).
Beneficial comments (recommendations, additions, deletions) pertinent data which improving this document should addressed George Marshall Space Flight Center, National Aeronautics Space Administration, ATTN: EG02, Marshall Space Flight Center, 35812, using self-addressed Standardization Document Improvement Proposal Form 1426) appearing this document letter.
5962
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Recommended operating conditions.
Supply voltage range -Ambient temperature range
+125"C
Power thermal characteristics.
Package
8-lead
10-1 flat-pack
Case outline
Maximum allowable power dissipation
Maximum 6J-C
Maximum 6J-A
"C/VI 150"C/W
APPLICABLE DOCUMENTS
Issues documents. following documents, issue effect date invitation bids request proposal, form part this specification extent specified herein.
SPECIFICATION MILITARY
MIL-M-38510 Microcircuits, General Specification for.
STANDARD
MILITARY
MIL-STD-883 Test Methods Procedures Microelectronics.
(Copies specifications, standards, drawings, publications required contractors connection with specific procurement functions should obtained from procuring activity directed contracting officer.)
REQUIREMENTS
Detail specification. individual item requirements shall accordance with MIL-M-38510, specified herein.
Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-M-38510 herein.
3.2.1 Terminal connections. terminal connections shall specified figure
3.2.2 Schematic circuits, figure
schematic circuits shall specified
3.2.3 Case outlines. case outlines shall specified 1.2.3.
Lead material finish. lead material finish shall accordance with MIL-M-38510 (see 6.5).
Electrical performance characteristics. following electrical performance characteristics apply over full operating ambient temperature range +125*C supply voltages Vdc, unless otherwise specified (see table
3.4.1 Offset null circuit. Each amplifier having nulling inputs shall capable being nulled millivolt beyond volt -55*C 125"C using circuit figure
3.4.2 Frequency compensation. Device types shall free oscillation when operated unity gain noninverting node with external compensation source resistance <.10 kilohos, when operated test condition specified herein. Device type shall free oscillation when operated closed loop gain greater with external compensation.
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TABLE Electrical performance
Test
Symbol
Conditions
(see figure unless otherwise specified)
Device type
Limits
MinI
Unit
Input offset voltage
Input offset voltage temperature sens ivity
-3.0
02,03
-4.0
-5.0
05,06
-8.0
-5.0I
02,03
-6.0
-8.0
05,06
-10.0 lio.o
from
01,02,03
-15.0 115.0
04.05.06
from
01,02,03
-30.0 130.0
-15.0 115.0
04,05,06
Input offset current
Input offset current temperature sensitivity
Input bias current
01,02
-10.0 110.0
-15.0 [1570
04.05.06
125.0
01,02,03
30.0 130.0
A110
from
104,05,06
-50.0 150.0
02,03
-200.01200.0 -100.01100.0
from
04,05,06
-400.01400.0
01,02,03
04,05,06
-400.01400.0
04,05,06
02,03
04,05,06
4,05,06
02,03
-20.0
-10.0
-15.0
-50.
-30.0
-20.0
-10.0
20.0
10.0
15.0
200.0
50.0
30.0
400.0
20.0
10.0
-15.0 115.0
1200.0
-50.0 150.0
30.a 130.0
4,05,06
1400.0
'ower supply rejection ratio
PSRR
02,03, 4,05,06
PSRR
02,03, 4,05,06
nput voltage common mode rejection ratio
02,03, 4,05,06
footnotes table.
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MIL-M-38510/122
TABLB Electrical parforaanca characteristic* Continued.
Syabol
figura unlet* otherwise specified)
Device type
Liait*
Unit
Input offset voltage adjustasnt
+VI0
(ADJ)
25*C
02-03
-54-
-55*C 1125*C
05-06
_fik
02,03
05,06
11.0
Input offset voltage adjustment
"Vio
(A0J)
25'C
I_OL.
02.03
I_Q4_
05.06
-55*C <^Ta 125*C
02.03
05.06
.1-4.0
1-5.0
1-6.0
1-9.0
-6.0
-7.0
-9.0
-11.0
Supply current
+VCC
Output voltage
ainiaua rate4 output current
+voirr
VniiT -to'
VQUT
Vn.T
VquT
V0UT
Output voltage awing
+V0P
Open loop voltage gain
-Ays
Voor
25*C
02.03
104.05.06
-55*C
02.03
104,05,06
"670"
25'C
-55*C 125*C
01,04,
05.06
10.0
10.0
02,03 10.0
25"C
-55'C 125*C
01,04, 05,06
02,03
4-1-
-10.0 -10.01
-io.ol
25*C
-55'C 125*C
25'C
-55"C 125*C
_ak.
12.0
02,03, 04,05,061
10.0
_fiL.
02,03, P*.0?.Q6
02,03, 04.05,06
10.0
02,03, 04,05,061
-12.01
25*C
ii_01
-11.ol
02,03
05,06
-55*C 5.Ta 125*C
I_01.
200.0
100.0
20.0
10.0
100.
V/mV
70.0
05,06 7.50
footnotes table.
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HIL-M-38
TABLE Electrical performance characteristics Continued.
Conditions
Device Limits
Test Symbol (see figure type Unit
unless otherwise specified)
Slew rate |+SR figure 25<>C V/vis
|-SR
125-C
Transient response: |TR(tr) |See figure
rise time fall timeland 60.0
iTR(tf) 45.0
04,05 50.0
50.0
-55"C
70.0
60.0
04,05 60.0
55.0
Transient response: |TR{+os) figure
overshoot land 40.0
!TR(-os) 50.0
04,05 40.0
40.0
-55"C
50.0
60.0
04,05 50.0
45.0
Settling time |+ts
l-ts figure
Output short circuit +Iqs 101,02,03
current figure
101,02,03
l-ios 25"C
figure
101,02,03
Tests common mode V(j|
Note that gain specified V10(ADJ) extremes. Some gain reduction usually seen vIO(ADJ) extremes. closed loop application (closed loop gain less than 1,000), open loop tests (Avs) prescribed herein should guarantee positive, reasonably linear, transfer characteristic. They not, however, guarantee that open loop linear, even positive, over operating range. either these requirements exist (positive open loop gain open loop gain linearity), they should specified contract purchase order additional requirements (see 6.3).
limits specified devices with offset voltages equal maximum limit. devices with offset voltages less than limit, offset adjust capability will tested guarantee adjustability millivolt beyond zero.
circuit current (l0s) test^hall performed deviee types atid since they output short cjjreuit protected-.
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Device type shall free oscillation when operated gains greater with external compensation.
Electrical test requirements. electrical test requirements shall specified table applicable device type device class. subgroups table limits table which constitute minimum electrical test requirements screening, qualification, quality conformance device class specified table
TABLE Electrical test requirements.
MIL-STD-883 Subgroups (see table III) Class
test requirements Class devices Class devices devices
Interim electrical parameters (pre burn-in) (method 5004) None
(Final electrical test parameters (method 5004) 1*,2,3,4 1*i2
test require (method 5005) 1,2,3,4,5, 16,7,8,9,12 1,2,3,4,5, 6,7,8,9 1,2,3,4,7
iGroup end-point group class electrical parameters (method.5005) 1,2,3 table delta limits table delta limits table delta limits
{Additional electrical subgroups group periodic inspections applicable 5,6,8,9,12
IGroup end-point electrical parameters (method 5005) 1,2,3
*PDA applies subgroup (see 4.2c).
Marking. Marking shall accordance with MIL-M-38510. option manufacturer, marking country origin omitted from body microcircuit, shall retained initial container.
Microcircuit group assignment. devices covered this specification shall microcircuit group number (see MIL-M-38510, appendix
QUALITY ASSURANCE PROVISIONS
Sampling inspection. Sampling inspection procedures shall accordance with MIL-M-38510 methods 5005 5007, applicable, MIL-STD-883, except modified herein.
Screening. Screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior qualification quality conformance inspection. following additional criteria shall apply:
Burn-in test (method 1015 MIL-STD-883), class devices; test condition using circuit shown figure test condition using circuit shown figure
Interim final electrical test parameters shall specified table herein.
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percent defective allowable (PDA) class devices shall
specified MIL-M-38510. class devices shall percent based failures from group subgroup test after cooldown final electrical test accordance with method 5004 MIL-STD-883, with intervening electrical measurements. interim electrical parameter tests performed prior burn-in, failures resulting from burn-in screening excluded from PDA. interim electrical parameter tests prior burn-in omitted, then screening failures shall included PDA. verified failures group subgroup after burn-in divided total number devices submitted burn-in that shall used determine percent defective that lot, shall accepted rejected based applicable device class.
Qualification inspection. Qualification inspection shall accordance with MIL-M-38 510. Inspections performed shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
Quality conformance inspection. Quality conformance inspection shall accordance with MIL-M-38510 specified herein. Inspections performed shall those specified method 5005 MIL-STD-883 herein groupa inspections (see 4.4.1 through 4.4.4).
4.4.1 Group inspection. Group inspection shall accordance with table method 5005 MIL-STD-883 follows:
Tests shall specified table herein.
Subgroups shall omitted.
Subgroup shall added group inspection specified table herein. LTPD subgroup shall classes.
4.4.2 Group inspection. Group inspection shall accordance with table
method 5005 MIL-STD-883 follows:
Electrical parameters shall specified table herein. class devices, delta limits shall apply only subgroup group inspection.
Steady state life test class devices shall accordance with table method 5005 MIL-STD-883, using circuit shown figure alternate burn-in conditions used, circuit shown figure shall used.
4.4.3 Group inspection. Group inspection shall accordance with table
method 5005 MIL-STD-883 follows:
End-point electrical parameters shall specified table herein. Delta limits shall apply only subgroup group inspection class devices.
Subgroup shall added group inspection requirements shall consist tests, conditions, limits specified subgroup group LTPD subgroup shall classes.
Life test (method 1005 MIL-STD-883) class devices; test condition using circuit shown figure test condition using circuit shown figure
4.4.4 Group inspection. Group inspection shall accordance with table
method 5005 MIL-STD-883. End-point electrical parameters shall specified table herein.
Methods inspection. Methods inspection shall specified appropriate tables. Electrical test circuits prescribed herein referenced test methods MIL-STD-883 shall acceptable. Other test circuits shall require approval qualifying activity.
4.5.1 Voltage current. voltage values given, except input offset voltage differential voltage) referenced external zero reference level supply voltage. Currents given conventional currents positive when flowing into reference terminal.
Text continues page
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Device type Case
OFFSET
OFFSET
Device types Case
BANDWIDTH CONTROL
OFFSET
OFFSET
Device type Case
Device types 0&,-tnid-06 Case
OFFSET
INOUTPUT
BANDWIDTH
OUTPUT OFFSETADJ
FIGURE Terminal connections.
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Device type
OFFSET ADJUST
Harris Semiconductor
FIGURE Schematic circuits.
OFFSET AOJO OFFSET AOJO-
BANDWIDTH CONTROL
INPUT+0
INPUT-O
Harris Semiconductor FIGURE Schematic circuits Continued
NOTE: Unless otherwise specified, resistance values ohms.
MIL-M-38510/122
r"*"
10.6 2.70
R25.R26
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Device typt
OFFSET AOJO
CONTROL
IHPUT+O
OUTPUT
INPUT-O OFFSET
NOTE: Unless otherwise specified, resistance values
Harris Semiconductor
FIGURE Schematic circuits Continued.
MIL-M-38510/122
Device types:
OOUT
FIGURE Offset null circuit (all device types).
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Mim-38510/122
JAN1N5616. JAN1N5614. equivalent.
Device types
0.01
0AN1N5616,
JAN1N5614, equivalent
FIGURE Test circuit steady state, accelerated burn-In. operating life tests.
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MIL-M-38510/122
device types
IOOKA
PULSE
NOTES:
Input signal requirements:
Square wave, duty cycle.
device types.
tTLH tTHL
compensation capacitor required device types 750fi device types device
types
FIGURE Test circuit dynamic burn-in operating life tests.
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Parameter Apply volts) Switch positions Measure Measured parameter Unit
+Vcc -Vcc lvAc 111)1111 Value Unit Equation
IVio |VI0
|II0 (E1-E4) 100, (E2-E5) 100, (E3-E6)
1+IlB 1+IlB (E1-E7) 100, (E2-E8) 100, (E3-E9J
1-IlB |-IIB (E1-E10) 100, (E2-E11) 100, CE3-E12)
I+PSRR l+PSRR log1Q \E13"E14/
l-PSRR l-PSRR VE15-E16,!
ICMRR ICMRR 1Q4\ V^EH-EIS
l+vIO(ADJ) l~VIO(ADJ) l"vIO(ADJ) (E1-E20)
1+vOUl -VQUT
l+V0P I-VQP
l+Avs !+AVS E26-E25 V/mV
1-AVS l-Avs E27-E28 V/mV
l+SR notes 1+SR V/ys
notes I-SR V/us
I+Ios
l-ios
FIGURE Test circuit static dynamic teats Continued.
MIL-M-38510/122
Device types
INPUT
SLEW RATE WAVEFORMS
2.5V-
2.5V-V-
OUTPUT
2.5V
2.5V
notes:
load
'load
^dc-2
v10(adj)
(ADJ)
FIGURE Test circuit static dynamic tests Continued.
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Device types
aout.o
e0UTO
FIGURE Test circuit static dynamic tests Continued.
amter
+PSRR
-PSRR
+vI0(AW>
"vlq(ADJ)
-vqut
+VoP -V0P
+AVS
"AVS
Device
Apply
"VCC
Sviteli
FIGURE
Measure
Value Unit
notes
notes
notes
Measured paraaeter
Equation
(E1-E4) 100, (E2-E5) 100, (E3-E6)
(E1-E7) 100, (E2-E8) 100, CE3-E9)
(E1-E10) 100, (E2-E11) 100, (E3-E12)
log1(
^n-Ew)
-PSRR
CMRR
10810(fn^iiir)
(E19-E1) -vI0(ADJ) (E1-E20)
+AVS
E26-E25
E27-E28
TR(tr) TR(tf)
fini
final
V/ns V/us
static dynanic tests Continued.
Device types
INPUT
SLEW RATE WAVEFORMS
VFINAL
INPUT
VFINAL VPEAK
NOTES:
LOAD
OVERSHOOT, RISE FALL TIME WAVEFORMS
ILOAD
input device type only.
switch positions device type only.
Input above figure.
Input -200 above figure.
Input above figure.
Input above figure
400i2,
Input above figure.
Input above figure.
Input above figure.
Input above figure.
RLjjj. Ki2.
above figure.
(ADJ)
(ADJ)
FIGURE Test circuit static dynamic tests Continued.
MIL-M-38510/122
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Device types
Parameter
+PSRR
-PSRR
CHRR
+VIO(AOJ)
_VI0(ADJ)
+V0UT -V0UT
+V0P -V0P
+AVS
-AVS
TR(tr) TR(tf)
Apply volts)
"Vcc
Switch positions
Measure
Value Unit
notes
notes
notes
Measured parameter
Equation
(E1-E4) 100, (E2-E5) 100, (E3-E6)
(E1-E7) 100, (E2-E8) 100, (E3-E9)
-ItB 100, (E2-E11) 100, (E3-E12)
+PSRK
^15-E16/
CMRR 1n/2
+Vl0(ADJ) (E19-E1) "Vio(ADJ) (E1-E20)
+AVS
E26-E25
7-E28
TR(tr) TR(tf)
-V,. peak final
_Vfinal
Unit
V/mV
V/mV
V/ys V/ys
FIGURE Test circuit static dynamic tests Continued.
Device types
INPUT
VFINAL
OVERSHOOT, RISE FALL TIME WAVEFORMS
INPUT
+V-2.5V-
OUTPUT
SLEW RATE WAVEFORMS
NOTES:
LOAD
itiA
ILQAD
inPut device type only.
switch positions device type only.
Input above figure.
Input -200 above figure.
Input above figure.
Input above figure.
1.33 667ft, above figure.
Input +66.7 above figure.
Input -66.7 above figure.
Input -1.67 +1.67 above figure.
-1.67 above figure.
Input
+1.67
(ADJ)
(ADJ)
FIGURE Test circuit static dynamic tests Continued.
MIL-M-38510/122
Device type
OUTPUT
ERROR BAND FROM FINAL VALUE
SETTLING TIME
FIGURE Settling time circuits.
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MIL-M-38510/122
Device type
OUTPUT
,0%_T
FROM FINAL VALUE
SETTLING
TIME
l.6kXI 50pF
400J1
-OOUT
FIGURE Settling time circuits Continued.
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Device types
90%-
OUTPUT
10%-4-
SETTLING
TIME
-ERROR
FROM FINAL VALUE
4iATk-
FIGURE Settling time circuits Continued.
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MIL-M-38510/122
Device type
90%-
OUTPUT
V-r\
-tHatU-
SETTLING
TIME
ERROR FROM FINAL VALUE
SOIL
OOUT
FIGURE Settling time circuits Continued.
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TABLE 111. Group inspection.
Subgroup Symbol STD- Test Conditions figure Type 1imits Type 1imits Type limits Type Haiti Type limits Unit
unless otherwise specified itin
lv10 |VI0 IVqi |Vq, -3.0 -3.0 -3.0 -4.0 -4.0 -4.0 -4.0 -4.0 -4.0 -5.0 -5.0 -5.0 -8.0 -8.0 -8.0
liio I110 |Vq| IVqi IVq, -10.0 10.0 -10.0 10.0 -10.0 10.0 -10.0 10.0 -10.0 10.0 -10.0 10.0 -15.0 15.0 -15.0 15.0 -15.0 15.0 -25.0 25.0 -25.0 25.0 -25.0 25.0 -25.0 25.0 -25.0 25.0 -25.0 25,0
l+IlB +IlB IVQ, IVq, |Vcm -20.0 20.0 -20.0 20.0 -20.0 20.0 -10.0 10.0 -10.0 10.0 -10.0 10.0 -15.0 15.0 -15.0 15.0 -15.0 15.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0 1200.0
|-IlB 1-IlB "IIB IVqm |VCM IVq, -20.0 20.0 -20.0 20.0 -20.0 20.0 -10.0 10.0 -10.0 10.0 -10.0 10.0 -15.0 15.0 -15.0 15.0 -15.0 15.0
f+x0s 3011
|-I0s 3011
l+PSRR 4003 l+Vcc lo.o 20.0
l-PSRR 4003 |-VCC -10.0 -20,0
ICMRR 4003 I+VCC 25.0 -Vcc
!"vI0(ADJ) -4.0 -5.0 -5.0 -6.0 -9.0
IIQC 4005 0.15 3.70 3.70
|VI0 IVcm -5.0 -5.0 -5.0 -6.0 -6.0 -6.0 -6.0 -6.0 -6.0 -8.0 -8.0 -8.0 -10.0 10.0 -10.0 10.0 -10,0 10.0
IVcm IVq, IVch -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -50.0 50.0 -50.0 50.0 -50.0 50.0 -50.0 50.0 -50.0 50.0 -50.0 50.0 uV/'C
IAVi0MT |AV10/AT IVI0 (test (test. -15.0 15.0 -15.0 15.0 -15.0 15.0 -30.0 30.0 -30.0 30.0
|4II0MT |AII0/AT itest (test -100.Ol 100.0 -lOO.OllOO.O -100.Ol 100.0 -400.0 1400.0 -400.0 1400.0 pA/'C
1+IlB l+IlB +IlB IVq, IVCM IVq, -50.0 50.0 -50.0 50.0 -50.0 50.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30,0 30.0 -30.0 30.0 -30.0 30.0 1400.0 1400.0 1400.0 1400.0 1400.0 1400.0
"Iii "IIB "IIB IVq, IVcm IVCM -50.0 50.0 -50.0 50.0 -50.0 50.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 -30.0 30.0 1400.0 1400.0 1400.0 1400.0 1400.0 1400.0
1+lOS 3011 -45.0 -45.0 -45.0
l-Ios 45.0 45.0 45.0
i+PSRR 4003 i+Vcc
footnotes
TABLE III. Group iiupeccion Continued.
Subgroup Symbol MIL-STD-1 Test Conditions ivCC -i15 figure unless otherwise specified Type limits Type limits Type limits Type limits Type limits Unit
method
l-PSRR 4003 |-VCC
ICMRK 4003 I+VCC -VCC
|+VI0(ADJ) 11,0
j"vI0(ADJ) -6.0 -7.0 -7.0 -9.0 -11.0
4005 0.20
IVio IVCM IVCM -5.0 -5.0 -5.0 -6.0 -6.0 -6.0 -6.0 -6.0 -6.0 -8.0 -8.0 -8.0 -10.0 -10.0 -10.0 10.0 10.0 10.0
IVQ, -IVq, -30.0 -30.0 -30.0 30.0 30.0 30.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 -50.0 -50.0 -50.0 50.0 50.0 50.0 -50.0 -50.0 -50.0 50.0 50.0 50.0
|AVI0/AT [VI0 (test (test 12.5 -15.0 15.0 -15.0 15.0 -15.0 15.0 -30.0 30.0 -30.0 30.0 UV/"C
|Aii0/at (16st (test 12.5 -200.0 200.0 -100.0 100.0 -100.0 100.0 -400.0 1400.0 -400.0 pA/"C
l+IlB l+IlB IVCM IVCM -50.0 -50.0 -50.0 50.0 50.0 50.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 1400.0 1400.0 1400.0 1400.0 1400.0 1400.0
1-ilb !_iib "ilb IVCM -50.0 -50.0 -50.0 50.0 50.0 50.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 -30.0 -30.0 -30.0 30.0 30.0 30.0 1400.0 1400.0 1400.0 1400.0 1400.0 1400.0
3011 -60.0 -60.0 -60.0
l-ios 3011 60.0 60.0 60.0
I+PSRR 4003 i+Vcc
l-PSRR 4003 j"vcc
ICMRR 4003 I*V0C -Vcc via,
|+vi0(adj) 11.0
j"vio(adj) -6.0 -7.0 -7.0 -9.0 -11.0
4005 0.20
l+V0p 12.0 10.0 10.0 10.0 10.0
l-Vop 1-12.0 -10.0 -10.0 -10.0 -10.0
|+AVS Vqut 200.0 100.0 100.0 20.0 10.0
l-Avs kfl, VOUT 200.0 100.0 100.0 20.0 10.0
10.0 10.0 .10.0 10.0
|"VOUT IVQUT -10.0 -10.0 -10.0 -10.0 -10.0
footnotes table.
Subgroup
TABLE III. Group inspection Continued.
Symbol
+V0P
vout
-Vf,
+*VS
TR(cr)
TR(.tr)
TR(tf)
TR(+os)
TR(tr)
TR(+os)
MIL-STD-863 method
4004
4004
4002
footnotes table
Conditions -VCC figure unless otherwise specified
kii, V0UT
kii,
VQUT
VQUI
kii, vqut
kii, Vqut
VQUT
vqut .13/
Type limits
100.0
100.0
10.0
11.0
100.0
100.0
10.0
10.0
10.0
-11.0
-10.0
-11.0
-10.0
Type limits
10.0
70.0
70.0
10.0
10.0
70.0
70.0
10.0
-10.0
-10.0
-10.0
-10.0
60.0
60.0
40.0
40.0
70.0
70.0
50.0
50.0
70.0
70.0 50.0
50.0
Type limits
10.0
70.0
70.0
10.0
10.0
70.0
70.0
10.0
25.0
25.0
20.0
20.0
-10.0
-10.0
-10.0
-10.0
45.0
45.0
50.0
50.0
60.0
60.0
60.0
60.0
60.0
60.0
60.0
60.0
Type limits
10.0
15.0
15.0
To".
10.0
15.0
15.0
10.0
25.0
25.0
20.0
20.0
-10.0
-10.0
-10.0
-10.0
50.0
50.0
40.0
40.0
60.0
60.0
50.0
50.0
60.0
60.0
50.0
50.0
Type limits
10.0
10.0
10.0
10.0
100.0
100.0
84.0
84.0
-10.0
-10.0
-10.0
-10.0
50.0 50.0
40.0
40.0
55.0
55.0
45.0
45.0
55.0
55.0
45.0
45.0
V/mV V/mV
V/mV
V/mV
V/ps
V/ns
V/us
V/us
TABLE III. Group inspection Continued.
Subgroup Symbol MIL-STD-1 Test Conditions figure Type limits Type limits Type limits Type limits Type limits Unit
method unless otherwise specified
I+SR 4002 20.0 20.0 84.0 V/lls
4002 20.0 20.0 V/ms
igure 1.20
l"t. |See figure -;-_- 1.20
achieved algebraically subtracting common mode voltage from each supply algebraically adding common mode voltage (i.e.,
-VCC
Using test circuit, +VI0(ADj) will force output voltage voltage greater than -Viq(adJ) wil1 force output voltage voltage less than
Test numbers which require read record measurement plus calculation, omitted except when subgroups being accomplished group sampling inspection group (class inspection. Device types device types device type
-SR, device type V/ps minimum. tests TR(tr) TR(tf)> device type maximum.
m-c, tests TR(+og) TR(_os), device type +50.01 maximum.
tests -SR, device type +45.0 V/ys minimum. tests TR(tr) TR(tf)> device type +60.0 maximum.
tests TR{+08) TR(_0S), device type +50.0* maximum.
tests 100, -SR, device type +45.0 V/(is minimum. Vjq(aDJ) ce8t will performed follows: tester will measure make determination whether positive negative. positive, tester will check Vio(ADJ) more negative than zero volts. negative, tester will check ^IO(ADJ) more positive than aero volts. limits specified this table indicate minimum adjustability required device having equal max/min limit.
Device types I0UT Device types loUT
tests 102, -tg, device type 1.00 maximum, device type 1.10 maximum.
MIL-M-38510/122
4.5.2 Life teat cooldown procedure. When devices matured following application operating life burn-in test condition, they shall cooled rooa temperature prior removal bias.
Inspection packaging. Inspection packaging shall accordance with MIL-M-38 510.
TABLE Group end-point electrical parameters.
type
(test table III) (mV)
(test table III) (nA)
(test table III) (nA)
Limit
Delta
Limit
Delta
-3.0
-0.5 1+0.5
-20.0
20.0
10.0
-20.0
-10.0
-4.0
-0.5 1+0.5
+10.01
-10.0
10.0
-8.0
-10.0
10.0
-8.0
+10.01
-4.0
-0.5 1+0.5
-15.0
15.0
10.0
-15.0
15.0
-5.0
-1.5 1+1.5
00.0
-20.0
20.0
+200.0
-20.0
-1.5 1+1.5
+20.01
00.0
20.0
+200.0
-20.0
+20.01
NOTE: Each above parameters shall recorded before after required burn-in life tests determine delta's (A).
PACKAGING
Packaging requirements. requirements packaging shall accordance with MIL-M-38510.
NOTES
Notes. notes specified MIL-M-38510 applicable this specification.
Intended use. Microcircuits conforming this specification intended original equipment design applications logistic support existing equipment.
Ordering data. contract purchase order should specify following:
Complete part number (see 1.2).
Requirements delivery copy quality conformance inspection data pertinent device inspection supplied with each shipment device manufacturer, applicable.
Requirements certificate compliance, applicable.
Requirements notification change product process procuring activity addition notification qualifying activity,
app1icable.
Requirements packaging packing.
Requirements failure analysis (including required test condition method 5003 MIL-STD-883) corrective action, reporting results, applicable.
Requirements product assurance options.
Requirements carriers, special lead lengths lead forming, applicable. These requirements shall affect part number. Unless otherwise specified, these requirements will apply direct purchase direct shipment Government.
Requirements positive open loop gain open loop gain linearity, applicable (see table
This Material Copyrighted Respective Manufacturer
MIL-M-38 510/122
Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-M-38510 MIL-STD-1331.
Logistic support. Lead materials finishes (see 3.3) interchangeable. Unless otherwise specified, microcircuits procured Government logistic support will procured device class National Aeronautics Space Administration device class Department Defense (see 1.2.2) lead finish (see 3.3). Longer length leads lead forming shall affect part number.
Substitutability. crosp-reference information below presented convenience users. Microcircuits covered this specification will functional replace listed generic-industry type. Generic-industry microcircuit types have equivalent operational performance characteristics across military temperature ranges reliability factors equivalent MIL-M-38510 device types have slight physical variations relation case size. presence this information shall deemed permitting substitution generic-industry types MIL-M-38510 types waiver provisions MIL-M-38510.
Military-device Generic-industry _type._type_
2700
2600
2620
2500
2510
2520
ans: Army Navy Force NASA
Review activities: Army Navy
Force
User activities: Army
Navy Force
Preparing activity: NASA
Agent:
(Project 5962-0314)
010160
This Material Copyrighted Respective Manufacturer
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