Request Acceleration Switching Plating Type Two-Terminal Diodes D
|
|
|
Top Searches for this datasheet
Ref. 84-119e November 2006 Messrs.
Request Acceleration Switching Plating Type Two-Terminal Diodes
Dear Valued Customer, asked customers switching plating letter dated July 2005 (Ref. 83-033) and, thanks your cooperation, progress transition much faster than expected. Therefore, hereby inform that Shindengen about discontinue manufacture Sn-Bi plating type two-terminal diodes. Below shows planned schedule. <Products concerned> package products <Planned schedule discontinuation> Shindengen plans stop manufacture September, 2007. have completed changeover yet, kindly requested accelerate transition.
hope this will cause much trouble, your cooperation would highly appreceiated.
Shindengen Electric Mfg. Co., Ltd.
Masatoshi Nagashima Manager Semiconductor Quality Assurance Sect.
Intended Packages 1FPackageProductsexample 1)D1F20 7)D1FM3 13)D1FJ4 19)G1VL22C 25)DL04-18F1 31)ST04-27F1 2)D1F60 8)D1FP3 14)D1FJ10 20)KL3L07 26)ST03-58F1 32)VR-61F1 3)D1F60A 9)D1FS4 15)D1FK60 21)KL3N14 27)ST03-68F1 4)D1FL20U 10)D1FS4N 16)D1FK70 22)KL3R20 28)ST04-14F1 5)D1FL40 11)D1FS4A 17)G1VL8C 23)KL3Z07 29)ST04-16F1
Exhibit
6)D1FH3 12)D1FS6 18)G1VL10C 24)KL3Z18 30)ST04-18F1
2FPackageProductsexample 1)D2F20 7)D2FS4 13)D2FK60 19)KP15L08 25)KP10LU07 2)D2F60 8)D2FS6 14)KP10L06 20)KP15N14 26)K1VP15C 3)D3F60 9)D3FP3 15)KP10L07 21)KP15R25 27)K1VP24 4)D4F60 10)D3FS4A 16)KP10L08 22)KP4L07 28)KP4F8 5)D2FL20U 11)D3FS6 17)KP10N14 23)KP4N12 29)KP4F12 6)D2FL40 12)D3FJ10 18)KP10R25 24)ST02D-170F2
M2FPackageProductsexample 1)M2FH3 7)KU10R23N 13)KU5N12 2)M2FM3 8)KU10R27N 14)KU10LU07 3)KU10L08 9)KU10R29N 15)KU10S31N 4)KU10N14 10)KU10S35N 16)KU5S31N 5)KU10N16 11)KU10S40N 17)KU4F8 6)KU5R29N 12)KU15N14 18)KU4F12
Technical Data
Evaluation Sn-Bi plated products
Solderability Solder joint reliability Whisker Recommended soldering conditions Reliability Tests
DEVICE DEVELOPMENT DEPT.1 SEMICONDUCTOR DIV. SHINDENGEN ELECTRIC MFG.CO.,LTD.
Evaluation Sn-Bi plated products
1Evaluation Solderability wetting balance method
Conditions Temperature solder bath245 Preconditioning105100RH8h Testing methodWetting balance method(measurement zero-cross time) Dipping speed2/s Evaluation Result <2F>
Electolytic Plating terminals
Type solderSn-37PbSn-3.0-0.5Cu
Dipping depth0.2
Sample number11
Sn-Bi
Zero cross time(s)
Solder bath temperature() Type solderSn-3Ag-0.5Cu
Electolytic Plating terminals
Zero cross time(s)
Sn-Bi
Solder bath temperature Type solderSn-37Pb Notice: Above data only reference characteristics certain Product, cannot guaranteed
Evaluation solder junction reliability(Pull-off strength terminal)
Conditions Type solder pasteSn-37PbSn-3.0-0.5Cu Testing substrateFR- =1.6 Thickness copper foil:35m Pretreatment105100RH8h Soldering conditions Sn-37Pb heat140 to160 60sec. 120sec. Peak temperature
Terminal
Solder
5mmmin
Measuring method pull-off strength terminal
Sn-3.0-0.5Cu heat150 to190 60sec. 120sec. Peak temperature Testing methodmeasurement pull-off strength terminal after temperature cycle(-40 125) No.of samples:n=11
Evaluation Result <2F>
Type solder-Ag-Cu
Electolytic Plating terminals Sn-Bi
Pull-off strength
1000
Temperature cyclenumber cycles Type solderSn-3Ag-0.5Cu
Electolytic Plating terminals Sn-Bi
Pull-off strength
Electrolytic plating terminals
Sn-Pb
1000
Temperature cycle(number cycles) Type solderSn-37Pb Notice: Above data only reference characteristics certain Product, cannot guaranteed
Plating whisker evaluation terminal
Conditions Room temperature test1year Constant temperature/humidity test6085, 1000 Temperature cycle test-30 80,1000cy Result result which observed terminal surface (scanned type electron microscope) shown.
Room temperature test, 1year
Generating whisker seen.
Constant temperature/humidity test6085, 1000
Generating whisker seen.
Temperature cycle test-30 80,1000cy
About whisker() generated, there practically problem
Notice: Above data only reference characteristics certain Product, cannot guaranteed
Recommended soldering conditions
12FM2FG1F
Infrared reflow method Peak Temperature Heating Preheating
Temperature()
Time(s)
Preheating time
temperature
90+30-30s 30+30-30s 250,10s less Max255
Heating temperature time Peak Temperature Number Heating times
Wavesolder conditions
Solder temperature: 260+5-5 Heating time: 10+1-1s Number times:
Hand solder conditions
Packages
Temperature soldering iron 350+10-10 380+10-10
Heating time 3+1-1s 3+1-1s
Number times
Reliability tests
12FM2FG1F Resistance soldering heat test
Moisture soaking125, 24h85, 65%, 168h(expect THD) Soldering heat conditionsInfrared-ray reflow
Wavesoldering
Solder heat resistance conditions refer Recommendation soldering conditions"
Result Infrared-ray reflow 0/22 Wavesoldering 0/22
Temperature cycle test
Preconditioning: Resistance soldering heat test
Test conditions:Tstg 30minRT 5minTstg 30min 100cycles Result Infrared-ray reflow 0/22 Wavesoldering 0/22
Moisture resistance test
Preconditioning: Resistance soldering heat test Test conditions: 85+2-2, 85+5-5%RH,1000h Result
Infrared-ray reflow 0/22
Wavesoldering 0/22
Notice: Above results temperature cycle test moisture resistance test reference data.
Other recent searches
SYM-2500 - SYM-2500 SYM-2500 Datasheet
ST3485E - ST3485E ST3485E Datasheet
S6678ZOV301RA460 - S6678ZOV301RA460 S6678ZOV301RA460 Datasheet
10X1000us - 10X1000us 10X1000us Datasheet
MRF644 - MRF644 MRF644 Datasheet
M29W641DH - M29W641DH M29W641DH Datasheet
M29W641DL - M29W641DL M29W641DL Datasheet
M29W641DU - M29W641DU M29W641DU Datasheet
HYMD232M646 - HYMD232M646 HYMD232M646 Datasheet
D10SD6M - D10SD6M D10SD6M Datasheet
CAT5241 - CAT5241 CAT5241 Datasheet
2SK242 - 2SK242 2SK242 Datasheet
Privacy Policy | Disclaimer
© 2013 Datasheets.org.uk