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HybridPACKHybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
V2.2, 2010-03
System Engineering
Edition 2010-03 Published Infineon Technologies 81726 Munich, Germany 2010 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. Life support devices systems intended implanted human body support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered.
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Revision History: 2010-03, V2.2 Previous Revision: V2.1 Page Subjects (major changes since last revision) Added support Logic Board v1.3b (Chapter Many editorial changes Previous Revision: V2.0 Page Subjects (major changes since last revision) Improved description connector X1-SIG1/K2 (Chapter 4.3) Many editorial changes Trademarks Infineon Technologies A-GOLDTM, BlueMoonTM, COMNEONTM, CONVERGATETM, COSICTM, C166TM, CROSSAVETM, CanPAKTM, CIPOSTM, CoolMOSTM, CoolSETTM, CONVERPATHTM, CORECONTROLTM, DAVETM, DUALFALCTM, DUSLICTM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPACKTM, EconoPIMTM, E-GOLDTM, EiceDRIVERTM, EUPECTM, ELICTM, EPICTM, FALCTM, FCOSTM, FLEXISLICTM, GEMINAXTM, GOLDMOSTM, HITFETTM, HybridPACKTM, INCATM, ISACTM, ISOFACETM, IsoPACKTM, IWORXTM, M-GOLDTM, MIPAQTM, ModSTACKTM, MUSLICTM, my-dTM, NovalithICTM, OCTALFALCTM, OCTATTM, OmniTuneTM, OmniViaTM, OptiMOSTM, OPTIVERSETM, ORIGATM, PROFETTM, PRO-SILTM, PrimePACKTM, QUADFALCTM, RASICTM, ReverSaveTM, SatRICTM, SCEPTRETM, SCOUTTM, S-GOLDTM, SensoNorTM, SEROCCOTM, SICOFITM, SIEGETTM, SINDRIONTM, SLICTM, SMARTiTM, SmartLEWISTM, SMINTTM, SOCRATESTM, TEMPFETTM, thinQ!TM, TrueNTRYTM, TriCoreTM, TRENCHSTOPTM, VINAXTM, VINETICTM, VIONTICTM, WildPassTM, X-GOLDTM, XMMTM, X-PMUTM, XPOSYSTM, XWAYTM. Other Trademarks AMBATM, ARMTM, MULTI-ICETM, PRIMECELLTM, REALVIEWTM, THUMBof Limited, AUTOSARis licensed AUTOSAR development partnership. Bluetoothof Bluetooth Inc. CAT-iqof DECT Forum. COLOSSUSTM, FirstGPSof Trimble Navigation Ltd. EMVof EMVCo, (Visa Holdings Inc.). EPCOSof Epcos FLEXGOof Microsoft Corporation. FlexRayis licensed FlexRay Consortium. HYPERTERMINALof Hilgraeve Incorporated. IECof Commission Electrotechnique Internationale. IrDAof Infrared Data Association Corporation. ISOof INTERNATIONAL ORGANIZATION STANDARDIZATION. MATLABof MathWorks, Inc. MAXIMof Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSof Mentor Graphics Corporation. Mifareof NXP. MIPIof MIPI Alliance, Inc. MIPSof MIPS Technologies, Inc., USA. muRataof MURATA MANUFACTURING OmniVisionof OmniVision Technologies, Inc. OpenwaveOpenwave Systems Inc. HATRed Hat, Inc. RFMDRF Micro Devices, Inc. SIRIUSof Sirius Sattelite Radio Inc. SOLARISof Microsystems, Inc. SPANSIONof Spansion Ltd. Symbianof Symbian Software Limited. TAIYO YUDENof Taiyo Yuden TEAKLITEof CEVA, Inc. TEKTRONIXof Tektronix Inc. TOKOof TOKO KABUSHIKI KAISHA UNIXof X/Open Company Limited. VERILOGTM, PALLADIUMof Cadence Design Systems, Inc. VLYNQof Texas Instruments Incorporated. VXWORKSTM, WIND RIVERof WIND RIVER SYSTEMS, INC. ZETEXof Diodes Zetex Limited. Last Trademarks Update 2009-10-19
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Table Contents
Table Contents
Table Contents List Figures List Tables 2.3.1 2.3.2 2.3.3 2.3.4 2.3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.5.7 3.5.8 3.5.9 3.8.1 3.8.2 3.8.3 3.8.4 4.4.1 4.4.1.1 4.4.1.2 Introduction Order Hybrid HybridPACKTM2 Design Features Main Features Dimensions Components Driver Board (6ED100HP2-FA) Logic Board HybridPACKTM2 DC-Link Capacitor Cooling Element Hybrid HybridPACKTM2 Evaluation Driver Board Main Features Data External Connector Assignment Mechanical Dimensions Driver Board Operation Driver Board Switching Mode Power Supply (SMPS) Input Logic IGBT Switch-off Behavior Maximum Switching Frequency Booster Short Circuit Protection Clamp Function Fault Output Temperature Measurement Voltage Measurement Switching Losses Definition Layers Driver Board Schematics, Layout Bill Material Schematics Assembly Drawing Layout Bill Materials Hybrid HybridPACKTM2 Logic Board External Connector Assignment Connector Driver Board (K1) Power Supply Microcontroller Configuration TC1767 Boot Configuration TC1767 Selecting Serial/Parallel Interface Watchdog Phase Current Sensing
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Table Contents 4.10 4.10.1 4.10.2 4.10.3 4.11 4.12 4.12.1 4.12.2 4.12.3 4.12.4 Resolver Interface Encoder Interface Hall Sensor Interface Interface Interface Mode Encoder Interface Mode Hall Sensor Interface Mode Definition Layers Logic Board Schematics, Layout Bill Materials Schematics Assembly Drawing Layout Bill Materials
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
List Figures
List Figures
Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Hybrid HybridPACKTM2 Block Diagram Hybrid HybridPACKTM2 Dimensions Hybrid HybridPACKTM2 (all dimensions HybridPACKTM2 IGBT Six-Pack Module DC-Link Capacitor HybridPACKTM2 Example Water Cooling Element HybridPACKTM2 Water Cooling System Technical Drawings (Part Water Cooling System Technical Drawings (Part Driver Board Mounted HybridPACKTM2 Module. External Connector Driver Board. Dimensions Driver Board Mounting Stand-offs HybridPACKTM2 Hybrid HybridPACKTM2 Evaluation Driver Board Block Diagram Schematic Input Logic Block Driver Board Maximal Switch-off Current Different DC-Link Voltages (Gate Resistance Parameter) Temperature Gate Resistors Switching Frequency Desaturation Protection Active Clamping Diodes Short Circuit Active Clamp Voltage=275V, Voltage Overshoot=628V) With Active Clamp Function Voltage=400V, Voltage Overshoot=604V) Fault Output Single Driver Fault Output During: Normal Operation Operation under Short Circuit Characteristics Temperature Measurements Characteristics Voltage Measurement Copper Isolation Layers Driver Board Schematics Block Overview SMPS Power Supply External Connector Fault Logic Input Logic IGBT Driver Bottom Transistor Phase IGBT Module. Voltage Measurement IGBT Module Temperature Measurement Assembly Drawing Driver Board (Top) part Assembly Drawing Driver Board (Top) part Assembly Drawing Driver Board (Bottom) part Assembly Drawing Driver Board (Bottom) part Driver Board Layer Driver Board Layer Driver Board Layer Driver Board Layer Driver Board Layer Driver Board Bottom Layer Hybrid HybridPACKTM2 Logic Board v1.2 Hybrid HybridPACKTM2 Logic Board v1.3b Block Diagram Logic Board External Connector Assignment Logic Board v1.2 External Connector Assignment Logic Board v1.3b Overvoltage Wrong Polarity Protection Circuit (same Logic Board v1.2 v1.3b) V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
List Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Boot Configuration TC1767 DIP-Switch Boot Configuration Switch (SW1) Serial/Parallel Interface Select Switch (SW2) Interface (Logic Board v1.3b only) Interface Proposal Using TLE5012. Picture Possible Physical Implementation Sensor Definition Layers Logic Board v1.2 Definition Layers Logic Board v1.3b Schematics Block Overview Logic Board v1.2 Schematics Block Overview Logic Board v1.3b Power Supply Logic Board v1.2 Power Supply Logic Board v1.3b JTAG Debug Connector (same Logic Board v1.2 v1.3b) Watchdog (same Logic Board v1.2 v1.3b) Resolver Logic Board v1.2 Resolver Logic Board v1.3b Level Shifter Adapting 3.3V Logic Levels Logic Board v1.2. Level Shifter Adapting 3.3V Logic Levels Logic Board v1.3b. Connector Driver Board (same Logic Board v1.2 v1.3b) Microcontroller Logic Board v1.2 Microcontroller Logic Board v1.3b Input Filter Logic Board v1.2. Input Filter Logic Board v1.3b. Microcontroller TC1767 Assignment Logic Board v1.2 Microcontroller TC1767 Assignment Logic Board v1.3b EEPROM (same Logic Board v1.2 Logic Board v1.3b) On-Board Temperature Measurement (Logic Board v1.3b only) Assembly Drawing Logic Board v1.2 (Top) Assembly Drawing Logic Board v1.3b (Top) Assembly Drawing Logic Board v1.2 (Bottom) Assembly Drawing Logic Board v1.3b (Bottom) Logic Board v1.2 Layer Logic Board v1.2 Layer Logic Board v1.2 Layer Logic Board v1.2 Bottom Layer Logic Board v1.3b Layer Logic Board v1.3b Layer Logic Board v1.3b Layer Logic Board v1.3b Layer Logic Board v1.3b Layer Logic Board v1.3b Bottom Layer
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
List Tables
List Tables
Table Table Table Table Table Table Table Table Table Data DC-Link Capacitor Data Characteristic Values (Typical Values) Bill Materials Hybrid HybridPACKTM2 Evaluation Driver Board External Connection Assignment Logic Board v1.2 External Connector Assignment Logic Board v1.3b User Startup Modes TC1767 Selecting Serial/Parallel Interface Bill Materials Hybrid HybridPACKTM2 Logic Board v1.2 Bill Materials hybrid HybridPACKTM2 Logic Board v1.3b
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
List Tables
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Introduction
Introduction
Hybrid HybridPACKTM2 shown Figure developed support customers during their first steps designing applications with HybridPACKTM2 IGBT module. following chapters provide detailed description main components their functionality. This information intended enable customers re-use modify original Hybrid design qualify their design production, according their specific requirements. boards Hybrid HybridPACKTM2 Evaluation Driver Board (further referred "Driver Board" Hybrid HybridPACKTM2 Logic Board (further referred "Logic Board") provided Infineon Technologies subjected functional testing only. their purpose system subjected same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) Product Withdraw (PWD) regular products. Legal Disclaimer Warnings further restrictions Infineon Technologies' warranty liability.
Order Hybrid HybridPACKTM2
Hybrid HybridPACKTM2 Hybrid HybridPACKTM2 Evaluation Driver Board (that ordered separately) have Infineon Technologies numbers ordered Infineon Sales Partners. ordering number Hybrid HybridPACKTM2: SP000635950 ordering number Hybrid HybridPACKTM2 Evaluation Driver Board: SP000552868
Information also found Infineon Technologies page: www.infineon.com
Figure
Hybrid HybridPACKTM2 V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Introduction
WARNING!
Please always take care dead-time settings driver avoid short circuit conditions IGBT module) always have mind that Hybrid HybridPACKTM2 inverter breaking chopper similar hardware protection absorb energy generated during regenerative breaking motor. case user shall ensure that voltage, current temperature monitored properly, e.g. software additional supporting hardware.
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
Design Features
Hybrid HybridPACKTM2 made PCBs (Driver Board Logic Board) mechanically electrically suitable used with IGBT Module HybridPACKTM2 (included), DC-bus capacitor cooler. these components build complete main inverter (H)EV applications 80kW.
Debug Connector Logic Board
IGBT driver 1ED020I12-FA
IGBT driver 1ED020I12-FA
IGBT driver 1ED020I12-FA
Watchdog IGBT driver 1ED020I12-FA IGBT driver 1ED020I12-FA IGBT driver 1ED020I12-FA
Supply meas. Temp. IGBT (x3) FAULT Signals
Supply
VDC, Temp
Encoder Other Sensor
Microcontroller TC1767
EEPROM
Logic
SMPS
DC-Bus Voltage Measurement (Isolated) 6ED100HP1-FA Driver Board
IGBT Temp. Measurement
Level Shifter
RS232 Current Measurement Resolver
Resolver Interface
Connector IGBT Module HybridPACKTM2
Current Current Current RS232 Supply
Encoder Resolver Other Sensor
Figure
Block Diagram Hybrid HybridPACKTM2
Figure show complete block diagram system following sections provide overview single components including main features, data, assignments mechanical dimensions.
Main Features
Complete main inverter (H)EV applications 80kW Automotive qualified IGBT module HybridPACKTM2 650V/800A IGBT Diode chipset Automotive qualified Driver 1ED020I12-FA Based coreless transformer technology 1200V driving capability detection TriCorefamily 32-bit microcontroller TC1767: member AUDO FUTURE product family designed automotive applications Possibility usage different motor position interfaces: encoder, resolver, (Giant Magneto-Resistance) hall sensor
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
Dimensions
Figure shows dimensions complete Hybrid HybridPACKTM2.
98.4
216.0
237.0
75.5
65.0 50.0
47.4
25.0
41.5
Figure
Dimensions Hybrid HybridPACKTM2 (all dimensions
Remark: Logic Board v1.3b longer than Logic Board v1.2 (100.4 comparing 98.4 mm).
Components
detailed technical information about different components please refer different pages Infineon Internet.
2.3.1
Driver Board (6ED100HP2-FA)
6ED100HP2-FA channel IGBT driver board, specially designed HybridPACKTM2 IGBT module. main features detailed description board, including schematics layout, found Chapter
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
2.3.2
Logic Board
Logic Board contains necessary components control system. Furthermore offers connections motor positioning system (encoder, resolver GMR) current measurement system. detailed description board please refer Chapter
2.3.3
HybridPACKTM2
(see Figure power module designed Full Hybrid Electrical Vehicle (HEV) applications power range 80kW. Designed junction operation temperature 150°C, module accommodates six-pack configuration generation Trench-Field-Stop IGBT matching emitter controlled diodes rated 800A/650V. based Infineon Technologies leading TRENCHSTOPIGBT Technology, which offers lowest conduction switching losses. HybridPACKTM2 designed direct water-cooled inverter systems (temperature coolant 75°C). copper base plate combined with high-performance ceramic substrate Infineon Technologies enhanced wirebonding process provides unparalleled thermal cycling power cycling reliability full hybrid inverter applications. compact inverter design driver stage easily soldered module. power connections realized with screw terminals.
Figure
HybridPACKTM2 IGBT Six-Pack Module
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
2.3.4
DC-Link Capacitor
power electronic capacitor B25655J4507K from company Epcos (see Figure strongly recommended (included) used DC-bus capacitor. Table shows main features capacitor. Please refer Epcos datasheet further details. Table Imax Lself Data DC-Link Capacitor Maximum ratings ±10% 450V 50Ws 120A 15nH
Characteristics
Test Data 600V 4V/µs 16V/µs Rins 675V 10000s
(dV/dt)max (dV/dt)s
10-4
1.0m Design Data Dimensions Approx. weight Impregnation Clearance 1.2kg Resin Filled Flat Copper
Climatic Category 0/110/21(IEC 68-1/2) Tmin Tmax Tstg 40°C 110°C
Max. Rel. Humidity
+110°C Terminals
Values after Test 68-2 Creepage distance days, 40°C, rel. humidity) Rins
Plastic Case
3000s
Mean Life Expentancy 15000h 300fit
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
Figure
DC-Link Capacitor HybridPACKTM2
2.3.5
Cooling Element
applications requiring higher power higher operation temperature usage water cooling element recommended. Figure shows cost water cooling system that included Hybrid HybridPACKTM2 which screwed directly HybridPACKTM2 Figure Figure showing technical drawings
Figure
Example Water Cooling Element HybridPACKTM2 V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
Figure
Water Cooling System Technical Drawings (Part
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Design Features
Figure
Water Cooling System Technical Drawings (Part
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure
Driver Board Mounted HybridPACKTM2 Module
Main Features
Hybrid HybridPACKTM2 Evaluation Driver Board offers following features: channel IGBT driver Electrically mechanically suitable IGBT Module HybridPACKTM2 Includes DC/DC power supply Isolated voltage measurement Short circuit protection with toff Undervoltage lockout IGBT driver Positive logic with CMOS level Fault signals fault output signal each common legs
Important: Driver Board used standalone board (without Logic Board from Hybrid Kit), resistor R534 (please refer Figure should populated (0R) connect grounds ("digital" "analog"). these grounds connected notice some signal disturbances. Driver Board used together with Logic Board complete Hybrid Kit) grounds already connected Logic Board (therefore design Driver Board R534 unpopulated) modification (soldering) should taken Driver Board. Application Note V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Data
values given Table (bellow) typical values, measured Table Parameter VSUPPLY Voltage Supply VPWM Signals Bottom IGBT (Active High) VFAULT /FAULT Detection Output (Active Low) IFAULT Max. /FAULT Detection Output Load Current VRST /RST Input (Active Low) ISUPPLY Supply Current Consumption (Idle Mode) (VSUPPLY=12V) VOUT Drive Voltage Level Maximum Peak Output Current PDC/DC Maximum DC/DC Output Power SMPS Unit Maximum Signal Frequency tPDELAY Propagation Delay Time tPDISTO Input Output Propagation Distortion tMININ Minimum Pulse Suppression Turn-on Turn-off2) VDESAT Desaturation Reference Level dmax Maximum Duty Cycle VCES Maximum Collector Emitter Voltage IGBT Operating Temperature (Design Target) TSTO Storage Temperature (Design Target) VIORM Maximum Repetitive Insulation Voltage
Data Characteristic Values (Typical Values) Value +[8.18] Unit
-40.+125 -40.+125 (1ED020I12-FA Driver 1420 4500 VPEAK Vrms
VISO Maximum Insulation Test Voltage (1ED020I12-FA Driver
max. switching frequency HybridPACKTM2module should calculated separately. Limiting factors are: max. DC/DC output power 4.6W channel max. board temperature measured around gate resistors used material. detailed information Chapter 3.5.3 Minimum value tMININ given 1ED020I12-FA IGBT driver datasheet Maximum ambient temperature strictly depends load cooling conditions 1ED020I12-FA datasheet complies with 60747-5-2 (VDE 0884 Part 2003-01.Basic Insulation 1ED020I12-FA datasheet complies with 1577
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
External Connector Assignment
Figure shows assignment external connector (K1) Driver Board. connector used Samtec MMS-112-01-L-DV. includes necessary signals board into operation, that supply, control monitoring. Driver Board used part Hybrid communication with Logic Board done through this connector.
TEMP_I GBT_W LTVn TEMP _IGBT_V EMP_I ST_I
MMS-112-01-L-D
Figure
External Connector Driver Board
Pins provide power supply. Driver Board must supplied with external regulated power supply. input voltage must kept between (nominal 12V) current consumption will depend different factors (PWM frequency, etc.). Please have mind that Driver Board used within Hybrid (together with Logic Board) "digital" ground (pins connected "digital" ground Logic Board. same valid pins (+12V). Therefore, case using complete Hybrid Kit, external power supply needs applied Driver Board additionally already done through Logic Board. Pins provide analogue power supply supplies "analog" ground supplies that internally generated Driver Board (please refer Figure intended used power supply temperature voltage measurements. Although available connector analogue power supply connected analogue supply Logic Board other side, through "analog" grounds Driver Logic Board mutually connected. pins connected monitoring signals: DC-link voltage measurement temperature measurement three different phases inside IGBT module. Pins (phase IGBT), (phase bottom IGBT), (phase IGBT), (phase bottom IGBT), (phase IGBT) (phase bottom IGBT) contain logic signals controlling drivers Driver Board. These signals generated TriCore TC1767 Logic Board case that Driver Board used part Hybrid Driver Board used part Hybrid signals should supplied through these pins. Pins Reset signal control IGBT drivers 1ED020I12-FA). Pins contain Fault Detection signals each phase logical "AND" combination phase fault Detection signals.
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Mechanical Dimensions Driver Board
max.
max. 16.5
Figure
Dimensions Driver Board
Driver Boards should fastened self taping screws soldered auxiliary connectors IGBT module. contact joints (solder points) between module auxiliary contacts should mechanically relieved order disburden solder connection possible. Relieve contact points carried mounting directly onto module mounting stand-offs (see Figure using self-tapping screws (thread forming with 2.5mm diameter) similar assembly material. screws should mounted sequence showed Figure
Figure
Mounting Stand-offs HybridPACKTM2
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Operation Driver Board
Figure shows block structure Driver Board. following chapter describes these blocks detail.
15V/-8V
15V/-8V
LINK VOLTAGE MEASUREMENT SMPS IGBT Driver IGBT Driver IGBT Driver
15V/-8V 15V/-8V (x3)
RESET
LOGIC
FAULT FAULT FAULT
IGBT Driver
IGBT Driver
IGBT Driver
IGBT MODUL TEMP (U,V,W)
RESET FAULT FAULT FAULT FAULT
Connector INPUT LOGIC (PWM)
IGBT MODUL TEMPERATURE (U,V,W) LINK VOLTAGE MEASUREMENT
Figure
Hybrid HybridPACKTM2 Evaluation Driver Board Block Diagram
3.5.1
Switching Mode Power Supply (SMPS)
Driver Board integrated DC/DC converter which generates required secondary isolated unsymmetrical supply voltage +15/-8V. bottom driver voltages independently generated using unipolar input voltage 12V. additional supply voltage (5V) generated forwarded external connector (K1, Driver Board used standalone board, used supply external components system (current measurement, motor interface, etc.) circuit details please refer Figure
3.5.2
Input Logic
Driver Board dedicated system six-pack HybridPACKTM2 IGBT configuration therefore necessary separated signals. schematics Figure shows input logic block with positive logic. block made filters each signal order reduce noise. Additionally these signals pulled-down order avoid unwanted switching-on drivers. Please have mind that Hybrid HybridPackTM2 does provide dead time automatically (meaning that hardware alone provides dead time) user generate signals with correct dead time means software).
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
R520 100R
C900 100pF/100V/COG
R521
GND_DIG1 GND_DIG1 R522 100R C901 100pF/100V/COG
R523
GND_DIG1 GND_DIG1 R524 100R C902 100pF/100V/COG PWMWT R525 GND_DIG1 GND_DIG1 R526 100R C903 100pF/100V/COG PWMWB PWMVT PWMVB PWMUT R527 GND_DIG1 GND_DIG1 R528 100R C904 100pF/100V/COG PWMUB
R529
GND_DIG1 GND_DIG1 R530 100R C905 100pF/100V/COG
R531
GND_DIG1 GND_DIG1
Figure
Schematic Input Logic Block Driver Board
3.5.3
IGBT Switch-off Behavior
stray inductances system voltage overshoots occur during switching-off IGBT. Such overshoots added DC-link voltage, that maximum blocking voltage IGBT capacitor might exceeded causing damages both components link capacitor IGBT module). order avoid such risks active clamping circuit used (see Chapter 3.5.6). Without such protection methods maximum current would limited DC-link voltage voltage overshoots switching-off. voltage overshoots minimized increasing gate resistor, which will reduce di/dt value. Figure shows maximal switch-off current different DC-link voltages different values gate resistor. These results were obtained with DC-link capacitor described Chapter 2.3.4.
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
1800 1600 1400 1200 1000 Rgoff=2.7Ohm
Figure
Rgoff=3.9Ohm
Rgoff=4.7Ohm
Maximal Switch-off Current Different DC-Link Voltages (Gate Resistance Parameter)
3.5.4
Maximum Switching Frequency
IGBT switching frequency limited available power temperature. According theory power losses generated gate resistors function gate charge, voltage step driver output switching frequency. energy dissipated mainly through raises temperature around gate resistors. When available power DC/DC converter exceeded, limiting factor switching frequency absolute maximum temperature material. allowed operation temperature Generally power losses generated gate resistors calculated according Equation (1):
RGext RGint
Equation resembles switching frequency, represents voltage step driver output, dissipated power, IGBT gate charge value corresponding +15V/-8V switching operation. This value approximately calculated from datasheet value multiplying 0.77, that 6.6µC Therefore maximum frequency limited available power will
Smax 4.6W 6.6µC 30.3kHz
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board Figure shows experimentally determined board temperature dependencies with switching frequency 26°C ambient temperature). From Figure concluded that maximum switching frequency limited temperature.
Gate resistor temperature switching frequency Ta=25°C
Gate resistor temperature Switching frequency (KHz)
Figure
Temperature Gate Resistors Switching Frequency
3.5.5
Booster
transistors driver used amplify driver signals. this driving IGBTs supplied with sufficient current even driver alone can't deliver enough current. transistor used switching IGBT another transistor switching IGBT off. transistors dimensioned have enough peak current drive HybridPACKTM2 modules. Peak current calculated like Equation (2):
peak Gint Gext Driver
circuit details please refer Figure
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
3.5.6
Short Circuit Protection Clamp Function
short circuit protection Driver Board basically relies detection voltage level higher DESAT 1ED020I12-FA driver implemented active clamp function. Thanks this operation mode, collector-emitter overvoltage, which result stray inductance collector current slope, limited. Depending stray inductance, current voltage voltage overshoot during turn changes. Figure shows parts circuit needed desaturation function active clamping function.
Figure
Desaturation Protection Active Clamping Diodes
case short circuit collector-emitter saturation voltage will rise driver detects short circuit occurrence protect IGBT turned off. consequence IGBT turn-off process there will occur voltage overshoot stray inductance module DC-link. This voltage overshoot lower than maximum IGBT blocking voltage. Therefore Driver Board active clamping function whereby clamping will increase voltage booster also increase voltage directly gate. typical turn-off waveform under short circuit condition room temperature HybridPACKTM2 module without additional protective functions shown Figure Typical waveform under short circuit condition with active clamp function room temperature shown Figure seen, voltage overshoot without active clamping voltage 275V close maximum IGBT blocking voltage HybridPACKTM2 (650V), which could damage devices. With active clamping voltage overshoot reduced voltage increased without damaging IGBT module 400V voltage observed voltage overshoot approximately 604V, Figure design implemented 510V clamping diodes. level clamping voltage must adjusted depending application.
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure Short Circuit Active Clamp Voltage=275V, Voltage Overshoot=628V) With Active Clamp Function Voltage=400V, Voltage Overshoot=604V)
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
3.5.7
Fault Output
When short circuit occurs voltage detected desaturation protection 1ED020I12-FA IGBT switched off. fault reported primary side driver long there reset signal applied driver. fault signal (/FLT) active schematic design implemented Driver Board seen Figure
Figure
Fault Output Single Driver
Short circuit occurs Ready signal Fault signal
Figure
Fault Output During: Normal Operation Operation under Short Circuit
fault signal (/FLT) will state short circuit occurs will remain until /RST signal pulled down. Driver Board each three legs fault signal (FAULTUn, FAULTVn, FAULTWn). seen Figure will warn case DESAT-FAULT condition phases. three fault signals connected logical gate output this gate, together with phases fault signals, forwarded external connector (K1). Application Note V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
3.5.8
Temperature Measurement
IGBT module HybridPACKTM2 includes three integrated (Negative Temperature Coefficient) sensors which simplify thermal measurements inverters significantly. NTCs located same ceramic substrate together with IGBT diode chips. module filled with silicon isolation purpose under normal operation conditions requirements isolation voltages met. isolation capability tested with 2.5kV final test minute 100% module production. NTCs connected main connector (pins means circuit showed Figure Figure shows relationship between IGBT module base plate temperature three phases output voltage IGBT module temperature block (TEMP_IGBT_U, TEMP_IGBT_V, TEMP_IGBT_W, K3.10/K3.19/K3.15)
Temperature Measurement
Output voltage TEMP_IGBT Temperature IGBT Module (°C)
Figure
Characteristics Temperature Measurements
Note: This temperature measurement suitable short circuit short term overload detection should used only module protection against long term overload malfunction cooling system.
3.5.9
Voltage Measurement
Hybrid HybridPACKTM2 voltage link measured means isolation amplifier which offers necessary galvanic isolation (see Figure 31). output this circuit connected external connector (Vdc, K1.9). Figure shows relationship between link voltage output signal.
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
DC-Link Voltage
DC-Link Voltage 0,0071x 1,3296
Figure
Characteristics Voltage Measurement
Switching Losses
Switching losses different comparing values given HybridPACKTM2 IGBT module datasheet. Main reason this discrepancy that switching voltages used Driver Board (+15V turn-on turn-off) differ from HybridPACKTM2 characterisation switching voltages (+15V/-15V). Turn-on losses expected close values datasheet HybridPACKTM2, mentioned, this will different turn-off losses. general turn-off losses depend stray inductances DClink increase linear with DC-link voltage. case Driver Board turn-off losses increase linearly because fact that active clamping feature increases turn-off losses decrease di/dt.
Definition Layers Driver Board
Driver Board made keeping following rules copper thickness space between different layers shown Figure
Copper
Isolation 1-2: 2-3: 3-4: 4-5: 5-6:
Figure
Copper Isolation Layers Driver Board V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Schematics, Layout Bill Material
meet individual customer requirements make Driver Board HybridPACKTM2 module platform development modifications, necessary technical data like schematics, layout components included this chapter.
3.8.1
Schematics
IGBT_ DRIVER_UT VP15_U 8_UT FLTn COLU NDUT ND_UT
IGBT_ MODULE
CONNECT
IGBT_ DRIVER_UT SMPS 12Vin SMPS FLTn IGBT_ DRIVER_UB VP15_U VN8_ 15.0 COLUB NDUB GND_
_DIG
IGBT_ DRIVER_UB _DIG IGBT_ DRIVER_VT VP15_VT NPUT_L OGIC PWMUT PWMVB PWMWT PWMWB PWMUT PWMUB PWMVT PWMVB PWMWT PWMWB M_UT M_UB M_VT M_VB M_WT M_WB NPUT_L OGIC FLTn FAULT FAULT FAULT FAULT WMUT PWMUB PWMVT WMWT PWMWB PWM_ PWM_ PWM_ PWM_ PWM_ PWM_ FLTn 8_VT OLVT NDVT ND_VT
IGBT_ DRIVER_VT IGBT_ DRIVER_VB
VP15_VB 8_VB NDVB ND_VB
FAULT_ LOGI FLTUn FLTV FAUL FAUL FAUL
IGBT_ DRIVER_VB IGBT_ DRIVER_WT VP15_WT 8_WT
T_INn
LT_n
RST_I FAUL
FLTn
COLWT NDWT ND_WT
FAULT_ LOGI
IGBT_ DRIVER_WT IGBT_ DRIVER_WB VN8_ GNDWB ND_WB
Temp1
Temp2 Temp3
IGBT_ DRIVER_WB IGBT_ MODULE
LINK_VOL _MEA VDC_mea s_uc POWER_VCC LINK_VOL _MEA TEMP TEMP IGBT IGBT_U TEMP_IG IGBT_W IGBT_U IGBT_V MP_I GBT_W MP_I GBT_U MP_I GBT_V Temp Temp Temp Temp Temp Temp
CONNECT TEMP
Figure
Schematics Block Overview
V2.2, 2010-03
Temp4
FLTn
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
=15V
z=15V
X_7W
=15V
Vz=1
Vz=1
=15V
0805
Figure
SMPS Power Supply
KL_30 +12.
KL_30 +12.0V D_DI A50_DB TEMP_HP2_U RST_IN PWMWT PWMWB PWMVT PWMVB PWMU PWMU
D_AN TEMP_BOAR LTWn TEMP_H P2_W LTVn TEMP_H P2_V
D_DI
TW-12-06-L-D -475-SM-
Figure
External Connector
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Hybrid HybridPACKTM2 Evaluation Driver Board
LTVn 50V/ 50V/ IG50 +5.0V
50V/ 100n/ /X7R +5.0V
G11GW
+5.0V
183S
183S
Q11A
Figure
Fault Logic
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
M_WT
R520 100R
C900 100pF/100V/CO
R521
GND_DIG1 GND_DIG1 M_WB R522 100R C901 100pF/100V/CO
R523
GND_DIG1 GND_DIG1 M_VT R524 100R C902 100pF/100V/CO PWMWT R525 PWMWB PWMVT GND_DIG1 M_VB R526 100R C903 100pF/100V/CO PWMVB PWMUT R527 PWMUB
GND_DIG1
GND_DIG1 GND_DIG1 M_UT R528 100R C904 100pF/100V/CO
R529
GND_DIG1 GND_DIG1 M_UB R530 100R C905 100pF/100V/CO
R531
GND_DIG1 GND_DIG1
Figure
Input Logic
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
0pF/ FLTn B_01
4u7/ /X7R
A160 25V/ MB510
INRDY 50V/ T2_U ZXTP 2012Z B_07 4u7/ 25V/ 4u7/ /X7R 14_U T1_U ZXTN
LAMP
IG50 +5.0V
2-FA
100n
Figure
POWER
IGBT Driver Bottom Transistor Phase
OLUT
COLVT
OLWT
V/X7R
2n/50V/
modu
L+_P1
GV_T EV_T
CL+_P2
GW_T EW_T
COLU Temp2 Temp
Temp Temp
CV_B V_NTC2 V_NTC1 GV_B EV_B
OLWB
Temp Temp5
L+_P3
V/X7R
2n/50V/
CL-_N
FS800R06KE3
00R06KE3
Figure
IGBT Module
V2.2, 2010-03
CL-_N3
FS800R
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
ER_VC
VD_I
VANA5 V/CO VANA50 V/X7R ANA1 PL-7 IN+B D_AN
16V/ V/X7R
50V/
NGND
IN+A
D_VB
52AR
50V/
5_VB 0V/X7R
V/X7R
TLE4 6GV5
Figure
Voltage Measurement
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
+5.0V 5/1% MP_I GBT_W 5/1%
8552
10K5/ 50V/
50V/
50V/ /50V +5.0V
TEMP _IGB
TEMP _IGB
_ANN
10K5/ 0n/50 /X7R
_AGN
Figure
IGBT Module Temperature Measurement
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Hybrid HybridPACKTM2 Evaluation Driver Board
3.8.2
Assembly Drawing
Figure
Assembly Drawing Driver Board (Top) part V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure
Assembly Drawing Driver Board (Top) part V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure
Assembly Drawing Driver Board (Bottom) part V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure
Assembly Drawing Driver Board (Bottom) part V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board detail information zoom function your viewer zoom into drawings Figure Figure Figure Figure
3.8.3
Layout
Layout Driver Board shown Figure (Top Layer), Figure (Layer Figure (Layer Figure (Layer Figure (Layer Figure (Bottom Layer).
Figure
Driver Board Layer
Figure
Driver Board Layer
Figure
Driver Board Layer
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board
Figure
Driver Board Layer
Figure
Driver Board Layer
Figure
Driver Board Bottom Layer
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Hybrid HybridPACKTM2 Evaluation Driver Board
3.8.4
Bill Materials
Table Reference
Bill Materials Hybrid HybridPACKTM2 Evaluation Driver Board Value Device Package C1206
4u7/25V/X7R 1,C874,C880,C885,C889 100n/50V/X7R C23_VB,C23_UT,C23_UB,C821 C79,C80,C81,C82,C83,C84 C822 C827,C830,C835,C891 C828,C831 C832 C833,C881,C886,C894,C895 C866,C869,C872,C877,C882,C887 C867,C870,C873,C879,C883,C888 C875,C876 C878 C884 C890,C907 C896,C898,C899 C897,C906 C900,C901,C902,C903,C904,C905 C908,C910,C911,C913,C914,C916 C909,C915 C912 D4,D6,D8,D10,D11,D14,D16,D18 D5,D7,D9,D13,D15,D17 22n/50V/X7R 10u/16V/X7R 100n/16V/X7R 150p/50V/C0G 330p/50V/COG 10n/50V/X7R 4u7/50V/X7R 22u/35V 22u/63V 100nF/100V/X7R 22n/50V/X7R 22u/16V/X7R 10n/50V/X7R 100n/50V/X7R 100pF/100V/COG 10n/50V/X7R 1u/16V/X7R 1u/16VV/X7R ES1A 1SMA5929BT3G
C0603
C0603 C1206 C0402 C0402 C0402 C0402 C1210 C0810 C1206 C0402 C1210 C0603 C0805 C0603 C0603 C0603 C0603 DO214 DO214 DO214 DO214
P6SMB510A ES1D MURA160T3G SMBJ14CA 1SMB5935BT3 BZV55/C13 1SMB30AT3
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board Table Reference D21,D22,D23 Q11,Q12 R14_UB,R206,R207,R214 R28_UB R29_UB R31_UB Bill Materials Hybrid HybridPACKTM2 Evaluation Driver Board (cont'd) Value Device LED_LSM676-MQ MMS-112-01-L-DV 09HVD6B-EMGF-NR MURATA_BLM21P221SN FS800R06KE3 IPD144N06NG IPD90P03P4L-04 BCR183S BCR10PN Package D0805 24POL 09HVD6B-EMGF-NR L0805 HybridPACKTM2 TO252 TO252 SOT363 SOT363 R0603 R0603 R0805 R0603 R0805 R2512
R33_UT,R33_UB R34_UB,R193 R82,R83,R84,R85,R86,R87,R182 R127,R510 R132 R133,R134,R135,R136,R137,R138 R139 R145,R146 4k75 /0.1% 0.1% 590K 0.1%
R0402 R0402 R0603 R0603 R1206 R0603 R0603 R1206
96,R197,R198 R184 R187 R194 R199,R533 R201 R203,R205,R208,R209,R211,R213 R204,R210,R212 R408 80K6 19K6 0R025 10K/1% 158R
R0402 R0603 R2010 R1210 R0603 R0603 R0603 R0603
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Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Evaluation Driver Board Table Reference R509 Bill Materials Hybrid HybridPACKTM2 Evaluation Driver Board (cont'd) Value Device Package R0603 R0603 R0603 R0603 R0603 R1210 R0603 R0603 R0603 SOT89 SOT89 PG-DSO-20 SO-8 DIP-8 MSOP-8 SCT595 SOT363 SOT23-5
9,R531 R512,R514,R516 R517,R518,R519 R520,R522,R524,R526,R528,R530 R534 R535 R536 R537 U4,U5,U6,U7,U8,U9 U18,U33,U34 220R 100R 226K TRANSFORMER2 ZXTN2010Z ZXTP2012Z 1ED020I12-FA AD8552ARZ ACPL-782T LM3478MM TLE4296GV50 74LVC1G11GW MAX6457UKD3A-T
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Hybrid HybridPACKTM2 Logic Board
Hybrid HybridPACKTM2 Logic Board
Logic Board contains components control Hybrid HybridPACKTM2. Furthermore provides interface others elements which build complete inverter system: motor interface (encoder, resolver, hall sensor), current sense interface, communication (CAN RS232) additional analogue digital inputs/outputs. supported versions: version v1.2 Figure (not produced anymore) version v1.3b Figure Figure shows block structure Logic Board following chapters describe these blocks detail. Although block structure shown Figure applied both versions, v1.2 v1.3b different details. Comparing v1.2 Logic Board v1.3b further step development Hybrid that offers some features customer most important interface detailed described Chapter 4.10. features Logic Board v1.3b comparing v1.2 following: On-Board bottom Logical Board) temperature measurements (Figure 74); Usage Infineon Technologies TLE7368E Micro Controller Power Supply (Figure 59); Added some reference power supply converters; Implemented parallel communication interface resolver chip AD2S1200YST (IC8 Figure added belonging circuitry (see Figure 65); Added more options trimming resolver signal added test points measuring resolver signals; Implemented differential signaling encoder interface (instead single ended interface v1.2); Improved phase current sense filtering adapted filter signals 5kHZ cut-off frequency means second order filter (Figure 70); Adapted filtering DC-Bus voltage measuring signals, temperature sensing signals, emulated encoder outputs resolver chip (Figure 70); Removed general purpose digital leak pins connector; added differential signaling interface external interface 34-pin connector replaced with 50-pin connector; (Figure Figure 47);
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Hybrid HybridPACKTM2 Logic Board
Figure
Hybrid HybridPACKTM2 Logic Board v1.2
V2.2, 2010-03
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Hybrid HybridPACKTM2 Logic Board
Figure
Hybrid HybridPACKTM2 Logic Board v1.3b
Debug Connector
Watchdog
Logic Board
Supply
Meas. Temp. IGBT (x3)
FAULT Signals
Supply
Microcontroller TC1767
VDC, Temp Encoder Other Sensor
EEPROM
Level Shifter
RS232 Current Measurement Resolver
Resolver Interface
Driver Board
HybridPACK
Current Current Current
Connector
RS232
Supply
Encoder Resolver Other sensor
Figure
Block Diagram Logic Board
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Hybrid HybridPACKTM2 Logic Board
External Connector Assignment
Logic Board external connector X1-SIG1 (Harwin M80-5123442 Logic Board v1.2) (Harwin M805125042P Logic Board v1.3b) provides interface external systems: motor (encoder, resolver, Hall sensor GMR), current sense, communication (CAN RS232) extra analogue digital inputs/outputs. Figure Table showing assignment connector X1-SIG1 Logic Board v1.2. Figure Table showing assignment connector Logic Board v1.3b. female part 34-pin connector Harwin M80-5123442 (Logic Board v1.2) socket Harwin M80-4603442. female part 50-pin connector Harwin M80-5125042P (Logic Board v1.3b) socket Harwin M80-4605042.
StatorTemp PosA PosB PosZ PosU PosV PosW DIO_1 DIO_2 DIO_3 DIO_4
ADC_IN1 ADC_IN2 ADC_IN3 +12.0V +12.0V GND_DIG1 VANA5.0 GND_ANA1
Motor Interface (Encoder) Motor Interface (Hall Sensor)
Motor Interface (Resolver)
Phase Current Sense
Communication VDIG5.0 GND_DIG1 CAN1_L CAN1_H ASC_TX ASC_RX Power Supply General Purpose Ana/Dig IN/OUT
Bottom View Crimp Connector M80-4603442 (counterpart Logic Board v1.2 M80-5123442)
Figure Table Number
External Connector Assignment Logic Board v1.2 External Connection Assignment Logic Board v1.2 Name ADC_IN1 StatorTemp ADC_IN2 PosA Type Input Input Description General Purpose Analog Motor Temperature Measurement General Purpose Analog Encoder Phase V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Number External Connection Assignment Logic Board v1.2 Name ADC_IN3 PosB KL_30_IN PosZ KL_30_IN PosU GND_DIG1 PosV VANA50 PosW GND_ANA1 VDIG50 GND_DIG1 CAN1_L DIO1 CAN1_H DIO2 ASC_TX DIO3 ASC_RX DIO4 Type Input Input Input Input Input Input Input Input Input Input Input Input Description General Purpose Analog Encoder Phase Encoder Phase index Hall Sensor Phase Hall Sensor Phase Hall sensor Phase Resolver Sine (high) Current Sense Phase Resolver Sine (low) Current Sense Phase Resolver Cosine (high) Current Sense Phase Resolver Cosine (low)
Supply +12.0V Power Supply Supply +12.0V Power Supply Supply Digital Ground Supply +5.0V Analog Power Supply Supply Analog Ground
Supply +5.0V Digital Power Supply Output Resolver Excitation (high) Supply Digital Ground Output Resolver Excitation (low) Input line Signal General Purpose Digital High line Signal General Purpose Digital General Purpose Digital RS-232 Receiver Input General Purpose Digital
Output RS-232 Transmitter Output
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Hybrid HybridPACKTM2 Logic Board
VANA50 GND_ANA1 iGMR_CSn+ iGMR_DATAiGMR_DATA+ iGMR_CLKiGMR_CLK+ CAN1_L CAN1_H ASC_TX ASC_RX GND_DIG1 +12V +12V GND_DIG1 GND_DIG1
ADC_IN1 ADC_IN2 ADC_IN3 StatorTemp GND_ANA1 DIO_1 DIO_2 DIO_3 VDIG50 GND_DIG1 iGMR_CSniGMR_Ren_DE+ iGMR_Ren_DEPosA/iGMR_A+ PosA/iGMR_APosB/iGMR_B+ PosB/iGMR_BPosZ/iGMR_Z+ PosZ/iGMR_ZPosU/iGMR_U PosV/iGMR_V PosW/iGMR_W GND_DIG1 VDIG50 Power Supply Motor Interface (Resolver) Motor Interface (Encoder) Motor Interface (Hall Sensor) Motor Interface (iGMR Sensor) Phase Current Sense
Communication General Purpose Ana/Dig IN/OUT
Connected
Bottom View Crimp Connector M80-4605042 (counterpart Logic Board v1.3b M80-5125042P)
Figure
External Connector Assignment Logic Board v1.3b
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Hybrid HybridPACKTM2 Logic Board
Table Number
External Connector Assignment Logic Board v1.3b Name ADC_IN1 ADC_IN2 ADC_IN3 StatorTemp GND_ANA1 DIO1 DIO2 VANA50 DIO3 GND_ANA1 VDIG50 GND_DIG1 iGMR_CSnI_W iGMR_REn_DE+ iGMR_CSn+ iGMR_DATA+ PosA/iGMR_AiGMR_CLKPosB/iGMR_B+ iGMR_CLK+ PosB/iGMR_BCAN1_L PosZ/iGMR_Z+ CAN1_H PosZ/iGMR_ZASC_TX Type Input Input Input Input Input Description General Purpose Analog Resolver Sine (high) General Purpose Analog Resolver Sine (low) General Purpose Analog Resolver Cosine (high) Motor Temperature Measurement Resolver Cosine (low)
Supply Analog Ground Output Resolver Excitation (high) General Purpose Digital General Purpose Digital General Purpose Digital Output Resolver Excitation (low) Supply +5.0V Analog Power Supply Supply Analog Ground Supply +5.0V Digital Power Supply Input Input Input Current Sense Phase Current Sense Phase Current Sense Phase Supply Digital Ground Output iGMR Chip Select (differential signal) Output iGMR Read Enable (differential signal) Output iGMR Chip Select (differential signal) Output iGMR Read Enable (differential signal) Input Input Input Input Input Input iGMR Data (differential signal) Encoder Phase (differential signal) iGMR Data (differential signal) Encoder Phase (differential signal) Encoder Phase (differential signal) Encoder Phase (differential signal) line Signal Encoder Phase index (differential signal) High line Signal Encoder Phase index (differential signal)
Output iGMR Clock (differential signal) Output iGMR Clock (differential signal)
Output RS-232 Transmitter Output V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Number External Connector Assignment Logic Board v1.3b Name PosU/iGMR_U ASC_RX PosV/iGMR_V GND_DIG1 PosW/iGMR_W KL_30_IN GND_DIG1 KL_30_IN VDIG50 GND_DIG1 GND_DIG1 Type Input Input Input Input Description Hall Sensor Phase RS-232 Receiver Input Hall Sensor Phase Hall Sensor Phase
Supply Digital Ground Supply +12.0V Power Supply Supply Digital Ground Supply +12.0V Power Supply Supply +5.0V Digital Power Supply Supply Digital Ground Connected Supply Digital Ground
Connector Driver Board (K1)
Chapter 3.3.
Power Supply
complete system (Driver Board Logic Board) must supplied with external power supply connected connector X1-SIG1 Logic Board v1.2 Logic Board. Logic Board v1.2 +12V power supply should connected pins X1-SIG1 GND_DIG1 pins X1-SIG1. Logic Board v1.3b +12V power supply should connected pins GND_DIG1 pins input voltage should kept between current consumption will vary depending different factors, i.e. frequency. This supply line will forwarded Driver Board through connector (pins +12V). both boards protection circuit will avoid damages case overvoltage wrong polarity (see Figure 48).
_30_ +12.
V55/
90P03 P4L-04 +12.
1SMB 30AT3
Figure
Overvoltage Wrong Polarity Protection Circuit (same Logic Board v1.2 v1.3b)
supply block (see Figure Logic Board v1.2 Figure Logic Board v1.3b) generates necessary voltages components logic board (5V, 3.3V 1.5V). Furthermore (analogue digital) connected external connector (X1-SIG1/K2) supplying external systems (i.e. current sensor). Application Note V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Logic Board v1.2 power-on sequence supply signals will following (see Figure 58): after applying main power supply system (+12V) will switched-on. soon VANA50/VDIG50 (VOUT U13) reaches correct level signal will activate VDIG15 will generated. After that RESET output will turn-on (VDIG33/VANA33). Finally signal POWERrstn (RESET output U12) will activated waking-up microcontroller. Logic Board v1.3b used Infineon Technologies TLE7368E Micro Controller Power Supply After applying main power supply IC13 will switched-on (Figure 59). soon 5V/3.3V/1.5V power supplies reached their correct values signal POWERrstn (RO_1 RO_2 outputs IC12) will activated wakingup microcontroller.
Microcontroller
microcontroller block block overview given Figure Logic Board v1.2 Figure Logic Board v1.3b) contains following elements: TC1767 (Logic Board v1.2 Figure Logic Board v1.3b Figure 32-Bit Microcontroller member Infineon Technologies AUDO FUTURE product family designed automotive applications. TriCoreCPU providing high-end microcontroller performance combined with sophisticated capabilities (please refer datasheet further details); Input filter (see Figure Logic Board v1.2 Figure Logic Board v1.3b): passive filters digital analogue signals voltage dividers voltage level adaptation; EEPROM (Figure 73): 256kB Electrically-Erasable Programmable Read-Only Memory optimized automotive applications where low-power low-voltage operations essential (for more details refer AT25256A-10TQ-2.7 datasheet). communication with microcontroller done through SSC0 interface (high-speed synchronous serial interface, SPI-compatible); RS-232 (pins ASC_TX ASC_RX connector X1-SIG1/K2) (pins CAN1_H CAN1_L connector X1-SIG1/K2) Transceivers (see Figure Logic Board v1.2 Figure Logic Board v1.3b); Possibility connect debugging systems like Lauterbach JTAG connector K3-OCDS (Header 8X2) please refer Figure
4.4.1
Configuration TC1767
TC1767 configured with respect different boot modes with respect different interfaces (serial/parallel) resolver iGMR position sensors.
4.4.1.1
Boot Configuration TC1767
Figure
Boot Configuration TC1767 DIP-Switch
picture above (Figure shows definition boot configuration switch (DIP-Switch Figure 72). meaning switches will described following Table position switch equal logical dedicated pin.
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Hybrid HybridPACKTM2 Logic Board
Table 11XXX10X 010XX100 10101100 10100100 1011X10X
User Startup Modes TC1767
CFG[7.0]
Type Boot TC1767 Internal Start from Flash
Bootstrap Loader Mode, Generic Bootloader pins Bootstrap Loader Mode, Bootloader Alternate Boot Mode, Bootloader fail Alternate Boot Mode, Generic Bootloader pins fail reserved; don't this combination
others
DIP-Switch numbers (SW1 Figure shadowed line indicates default settings. represents don't care state.
4.4.1.2
Selecting Serial/Parallel Interface
DIP-4 switch (SW2 Figure used select serial/parallel interface communication with resolver iGMR position sensor please refer Table Table 00002) 1111 others
Selecting Serial/Parallel Interface
SW2[4.1]
Inetrface Resolver/iGMR iGMR enabled (SPI Incremental mode) Resolver Parallel Mode Resolver Serial Mode iGMR disabled reserved; don't this combination
OFF3)
DIP-Switch numbers equal open switch, equal closed switch represents don't care state.
Figure
Boot Configuration Switch (SW1) Serial/Parallel Interface Select Switch (SW2)
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Hybrid HybridPACKTM2 Logic Board
Watchdog
Logic Board contains pin-selectable watchdog timer that supervises microcontroller activity signalizes when system operating improperly. During normal operation, microcontroller (GPTA39) should repeatedly toggle watchdog input (WDI, Figure before selected watchdog time-out period elapses report that system processing code properly. this does occurs, supervisor asserts watchdog output (WDO) which will reset microcontroller PORSTn (external power-on hardware reset). state three logic control pins (SET0, SET1 SET2) determines watchdog timing characteristics (see table Figure 61). jumper allows disabling watchdog functionality very easy way.
Phase Current Sensing
Phase current sensing signals should connected Logic Board connector X1-SIG1/K2 pins I_U, (Figure Logic Board v1.2 Figure Logic Board v1.3b). Logic Board designed work with current transducers (not provided with Hybrid Kit) with voltage output proportional current (usually deploying Hall effect like sensors). User take (analog) available X1-SIG1/K2 pins supply current transducers. exact type current transducer will depend many parameters application, usually most important motor current consumption. Please notice that control 3phase balanced synchronous system enough measure just phases, since phase current calculated algebraic combination measured currents.
Resolver Interface
Logic Board includes 12-Bit Resolver-to-digital converter (meaning converter) which integrates onboard programmable sinusoidal oscillator that provides sine wave excitation resolvers (pins connector X1-SIG1/K2). more details please refer data sheet component (AD2S1200YST) schematics circuit Logic Board v1.2 Figure Logic Board v1.3b Figure With resistors (R155, R156, R157, R158, R159 R160) user trim LMH6672 (dual op-amp) output voltage values (resolver excitation). Logic Board v1.3b given additional possibility trim resolver excitation with potentiometers (R483, R484, R485 populated, user should solder them needed). Please refer data sheet used resolver trim this values properly. resolver response should connected between pins (sine) (cosine) connector X1-SIG1/K2.
Encoder Interface
encoder used sensor motor position/speed sensing following pins connector X1-SIG1/K2 should connected: phase should connected PosA (Logic Board v1.2) between pins PosA/iGMR_A+ PosA/iGMR_A- (Logic Board v1.3), phase should connected PosB (Logic Board v1.2) between pins PosB/iGMR_B+ PosB/iGMR_B- (Logic Board v1.3b) phase (index zero marker) should connected PosZ (Logic Board v1.2) between pins PosZ/iGMR_Z+ PosZ/iGMR_Z(Logic Board v1.3b).
Hall Sensor Interface
Hall sensor used sensor motor position/speed sensing following pins connector X1-SIG1/K2 should connected: phase should connected PosU (Logic Board v1.2) PosU/iGMR_U (Logic Board v1.3b), phase should connected PosV (Logic Board v1.2) PosV/iGMR_V (Logic Board v1.3b) phase should connected PosW (Logic Board v1.2) PosW/iGMR_W (Logic Board v1.3b).
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Hybrid HybridPACKTM2 Logic Board
4.10
Interface
mentioned beginning Chapter Logic Board v1.3b supports interface means bi-directional (SPI compatible), encoder incremental) Hall sensor interface. explicitly recommended Infineon Technologies TLE5012 GMR-based angular sensor rotor position sensing. 5012 360° angle sensor that detects orientation magnetic field. This achieved measuring sine cosine angle components with monolithic integrated Giant Magneto Resistance. more details about TLE5012 please refer data sheets Infineon Technologies internet pages.
100n/ T_uC 92LV 100R 1130 1128 10p/ 1129 100n/
100n/ 74LV 04GW
LV03
Figure
Interface (Logic Board v1.3b only)
4.10.1
Interface Mode
schematics interface Logic Board shown Figure Signals connector X1-SIG/K2 that used interface are: iGMR_CSn+/iGMR_CSn- (Chip Select, differential signals), iGMR_REn_DE+/iGMR_REn_DE- (Read Enable, differential signals), iGMR_DATA+/iGMR_DATA- (Serial Data, differential signals) iGMR_CLK+/iGMR_CLK- (SSC Clock, differential signals) signals listed Table Figure presented schematics possible technical solution (implemented Infineon Technologies System Engineering) usage TLE5012. with TLE5012 additional components mounted perpendicular electric motor shaft just shown Figure TLE5012 opposite side next motor shaft.
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
DATA 2LV0
V/X7
X7R/ EMK10 7B71 0V/X7 LMK31 /EMK10 V/X7 R/EMK1 B710 V/X7 B710
AM26
Figure
Interface Proposal Using TLE5012
Figure
Picture Possible Physical Implementation Sensor V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
4.10.2
Encoder Interface Mode
Infineon Technologies iGMR sensor TLE5012 used with encoder interface well. This working mode referred Interface mode theTLE5012 data sheet. avoid signal integrity problems, within Hybrid expected that phase signals zero (index) signal provided differentially. connector X1_SIG (Figure encoder inputs are: PosA/iGMR_A+ PosA/iGMR_A (phase PosB/iGMR_B+ PosB/iGMR_B (phase PosZ/iGMR_Z PosZ/iGMR_Z (phase index) please refer Table Please refer TLE5012 data sheet iGMR sensor running incremental mode.
4.10.3
Hall Sensor Interface Mode
TLE5012 supports Hall sensor interface mode well (iGMR emulates Hall sensor mode). this purpose connector X1-SIG/K2 inputs PosU/iGMR_U (phase PosV/iGMR_V (phase PosW/iGMR_W (phase should connected. Please notice Figure that pull-up resistors 3.3V (R491, R492 R493) already provided Logic Board. more details Hall sensor mode please refer TLE5012 data sheet.
4.11
Definition Layers Logic Board
Logic Board made keeping following rules copper thickness space between different layers shown Figure Logic Board v1.2 layers) Figure Logic Board v1.3b layers).
Copper Isolation 1-2: 2-3: 3-4:
Figure
Definition Layers Logic Board v1.2
Copper
Isolation 1-2: 2-3: 3-4: 4-5: 5-6:
Figure
Definition Layers Logic Board v1.3b
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
4.12
Schematics, Layout Bill Materials
meet individual customer requirements make Logic Board HybridPACKTM2 module platform development modifications, necessary technical data like schematics, layout components Logic Board included this chapter.
4.12.1
Schematics
TRSTn KOUTn
KOUTn
ATCH ATCH
EL_SH IFTER SUPPLY MUBn MVTn MVBn PWMW MWBn FLT_Un FLT_Vn FLT_Wn LT_n PWMU T_uc PWMU PWMVT_uc PWMVB_uc PWMW T_uc PWMW B_uc FLTUn_uc FLTVn_u FLTWn_uc RSTn_uc T_uC MVT_uC T_uC B_uC FLTU FLTVn_uC FLTW FLTn_uC ST_IN EL_SH IFTER PWMU PWMVB PWMW FLTU FLTV FLTW ST_I
ECTOR_ Driv rBoar
CONN
FLTUn FLTVn FLTWn FLTn ST_I
AN1_L AN1_H SC_TX SC_RX rTemp PosU PosW
rTemp PosA PosB PosZ PosU PosV PosW Resolv SAMPLE ESETn VELn ESETn_
rTem SLS0
C_uC
MP_IGBT_W IGBT_U TEMP_I GBT_V TEMP_Board
TEMP_H P2_W TEMP_H P2_U TEMP_H P2_V TEMP_BOAR ECTOR_ Driv rBoar
solv
IO_1 IO_2 IO_3 IO_4
Figure
Schematics Block Overview Logic Board v1.2
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Schematics Block Overview Logic Board v1.3b
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
100n/16V/
ATA_BLM21P2 u/16V/ SPD09P06PLG
100n/16V/ D_DI
TPS76733QD
IG33 VANA3 ATA_BLM2 ANA1 POWER 10V/X7R 100n/16V/ 10uf V/X7R
D_ANA1
R114
/0.33W 220nF/5
47uH /B82464G4 S340T3
100uF/3 MAL214095001E3
220nF/ V/X7
TPS7 6715QD
uF/6 V/X7
_GND
D_DI
TLE6 389- 2GV50
R121
IG50 +5.0V R122
680R
00n/16V/
ABLE
VOUT
R119
847BL
+12.
D_DI
1.4W
R116
D_DI KL_30_I +12.
BZV55
D90P03P4 KL_30 +12.0V
1SMB3 0AT3
D_DI
Figure
Power Supply Logic Board v1.2
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
6X7R MAL2 STBY _STBY STBY MON_ STBY
STBY
SS12 V_Vr
V/X7R
X7R/
5V_MAL
VANA5 TA_BL
C1C2C2+
MBRS3
DRV_
TA_BL
V/X7R
V/X7R 16V/ SMK-R belle ERrs
10V/
D_AN MURATA_BL 21SN
STBY Q_T1
3AASA50
P03P4
V/X7 R/F_
TEMP TRIM BZV55/ D_AN
V/X7R
X7R/ 5F10
+12. MB30
REF1
Figure
Power Supply Logic Board v1.3b
X3-OC
Figure
JTAG Debug Connector (same Logic Board v1.2 v1.3b)
V/X7 R/F_
RATA_ BLM2
V/X7R
V/X7R
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
set1
lay, Disa bled 100m
SET0 SET1 SET2
MAX636 9KA-T
Figure
Watchdog (same Logic Board v1.2 v1.3b)
+5.0V LT1639HS R102
R103
_ANA
LT1639HS
_ANA R104 inLO R105
L_30 +12.0V C1112 100n/
4266GSV
MURA TA_B LM21P221S
C1111 22uF/16V /X7R
AGE= LT1639HS
_ANA R106 R107
GND_DIG1 ND_DIG1
AGE= LT1639HS
_ANA R108 CosLO R109 _ANA CosLO SinLO GND_A 10uF/10V/X 10n/16V NA50 +5.0V
C143 22uF/16V/X 7/16V /X7R 10n/16V R156 bd_opt
C144 100n/ GND_A
ND_A
GND_A +5.0V R157 tbd_opt DGND
tbd_opt
IN-1 IN+1
R155
R110
GND_DIG1 n/16V /X7R 4u7/25V
DIG50 +5.0V
R158 tbd_opt
VDIG33
R159 tbd_opt
D_DIG1
DGND DVdd ALOU LKIN
GND_DIG1
MPLE
74LV C1G04GW
DVdd DB11/S DB10/S
CosLO SinLO AGND
IN-2 IN+2
LMH6672
GND_A
D_AN R160 tbd_opt
ND_DIG1 1200YS
DIG50 +5.0V ND_DIG1 /25V /X7R
GND_DIG1
10n/ /X7R
20pF/50V /COG
GND_D
_DIG1
Figure
Resolver Logic Board v1.2
20pF /50V/COG
HCM49 8.192MA BJ-UT
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
0n/5 /X7R/C0
VANA50 +5.0V C1163 GND_ANA1
KL_30 +12.0V
IC25
TLE4266GSV10 MURATA_BLM21PG221SN
C1111 22uF/16V/X7R C143 22uF/16V/X7R C144 100n/25V/X7R
Testpad_SMD_Etting
100n/16V/X7R IC4A PACKAGE LT1639HS R102 R103 GND_ANA1 IC4B PACKAGE LT1639HS GND_ANA1 R104 R105
n/16 7/25
VANA50 +5.0V
n/16 uF/1 /X7R 7/16 n/16
GND_DIG1
GND_DIG1 GND_DIG1 R483 5K_pot_0,25W_20%_Bour ns_3314J_opt Testpad_SMD_ GND_ANA1
Testpad_SMD_Etting
GND_ANA1 SinLO VDIG50 +5.0V GND_ANA1
GND_ANA1 R156 GND_ANA1 C1216
,25W_2 rns_33 14J_op
2K4/0.1% R155 VANA50 +5.0V 2K4/0.1% Testpad_SMD_Etting
Testpad_SMD_Etting
Testpad_SMD_Etting
IC4C PACKAGE GND_ANA1 LT1639HS R106 R107 IC4D PACKAGE LT1639HS GND_ANA1 R108 R109 GND_ANA1 R110
GND_
IN-1 OUT1 IN+1
Testpad_SMD_Etting
GND_DIG1
C1217
Testpad_SMD_Etting GND_ANA1 RESET DGND AD2S1200_RESETn AD2S1200_FS2 AD2S1200_FS1 AD2S1200_LOT AD2S1200_DOS
R157 390/0.1%
R158 2K4/0.1% IN-2 OUT2 IN+2
Testpad_SMD_Etting
CosLO
AD2S1200_CSn AD2S1200_RDVELn AD2S1200_DB11_SO AD2S1200_DB10_SCLK AD2S1200_DB9 AD2S1200_DB8 AD2S1200_DB7
XTALO
DVdd SAMPLE RDVEL DB11/SO DB10/SCLK
GND_ANA1
GND_ANA1 R160 2K4/0.1%
GND_DIG1 AD2S1200YST R485 5K_pot_0,25W_20%_Bour ns_3314J_opt
VDIG33 +3.3V
C1164
AD2S 0_DB6 AD2S 0_DB5 AD2S 0_DB4 AD2S 0_DB3
IC30 AD2S1200_SAMPLEn AD2S1200_SOE
AD2S 0_DB2 AD2S 0_DB1 AD2S 0_DB0
100n/16V/X7R
HCM49 8.192MABJ-
pF/5 pF/5
7/25
GND_DIG1 GND_DIG1 GND_DIG1
Figure
Resolver Logic Board v1.3b
74LVC2G04GW
n/16
R471
VDIG50 +5.0V
GND_DIG1
0pF/ 50V/
0pF/ 50V/
VCCA VCCA
MWT_u PWMWB_u PWMV MVB_u MUT_u PWMUB_u FLTWn_ FLTn_u
R159 3K3/0.1%
LMH6672
0pF/ 50V/
PWMWT PWMW PWMVT PWMVB
6V/X7R 6V/X7R 6V/X7R 6V/X7R FLTn FLTWn VDIG 0pF/ 50V/ 0pF/ 50V/ FLTUn 0pF/ 50V/
PWMUT PWMU
+3.3
6V/X7R
4ALVC
Figure
Level Shifter Adapting 3.3V Logic Levels Logic Board v1.2
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
PWMW
PWMWB PWMVT
PWMW MWB_ PWMVT PWMVB_ PWMU MUB_ RST_IN FLTUn FLTWn FLTn_
PWMVB RST_ PWMU
PWMUB
VDIG
VCCB VCCB
V/X7R 16V/
FLTVn
+5.0
AL_PAR LEL_ IG50 +5.0V
00_D K_uC OT_uC OS_uC 1200 11_SO_uC
S120 S120 S120 S120 S120 S120 B10_ S120 S120 S120 B11_ S120 S120 S120 S120 S120
100n/16
74LVC 16T245D
1133 100n/ /X7R
Figure
Level Shifter Adapting 3.3V Logic Levels Logic Board v1.3b
KL_30 +12.0V
KL_30 +12. _DIG VANA50_D TEMP_HP2_U RST_INn PWMWT PWMWB PWMVT PWMVB PWMUT PWMUB
D_ANA1 TEMP_BOAR LTWn TEMP_HP2_W LTVn TEMP_HP2_V
TW-12- L-D- 475- SM-A
Figure
Connector Driver Board (same Logic Board v1.2 v1.3b) V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
BRKO BRKIN
2T1n
Figure
Microcontroller Logic Board v1.2
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
KINn
CAN_
CANH
ncod NDEX itch
lver rial ,3,4 _TC1 .SCL driv inpu driv Reso RIAL RALL MODE ault 2S12 CSn_
Figure
Microcontroller Logic Board v1.3b
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
+5.0V R174 atorT
+5.0 C172 0p/50V ADC_IN1 R177 R178 +5.0 R186 R188 ADC_IN2 R194 ND_ANA R198 C180 100p /50V +5.0 R195 R199 ADC_IN3 R203 D_ANA R208 ND_ANA R217 GND_AN C191 100p/ C187 100p /50V C184 p/50V R192 D_ANA DIO_3 R200 C178 p/50V R181 C173 p/50V DIO_1 R182
R176 D_ANA
TA45 100p/50V/X PosA
R180 R183 C175 100p/50V/X
R184
R185 ND_ANA C176 100p /50V
D_ANA
D_DIG1 DIO_2 R193 TA17 100p/50V/X PosB
GND_D R187 R190 C177 100p/50V/X
R191
D_DIG1 TA32 100p/50V/X PosZ
GND_D R197 R201 C181 100p/50V/X
R202 ND_ANA
C183 100p /50V
D_DIG1 DIO_4 R210 TA21 100p/50V/X PosU
GND_D R204 R207 GND_D R213 PosV R216 C189 100p/50V/X C185 100p/50V/X
R205
D_DIG1
R214
GND_D R222 R224 PosW R227 C193 100p/50V/X
R223 GND_AN R230 GND_AN C196 100p/ C194 100p/
R229 0R_opt R231 _Board R236 GND_AN C198 100p/ R234
GND_D
R237 C199 100p/50V/X
R238 R239 R240 R241 C201 100p/50V/X C200 100p/50V/X
Figure
Input Filter Logic Board v1.2
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Temperature Measurements
General Purpose Analogue
ANA5
Encoder Inputs/iGMR Inputs (iGMR Emulates Encoder)
ANA5 ANA5
Hall Sensor/iGMR Inputs (iGMR Emulates Hall Sensor) Assumed Open-Collector output from Hall sensor
Phase Current Sense
ANA5
ACKA
General Purpose Digital IN/OUT
Emulated encoder outputs AD2S1200
Figure
Input Filter Logic Board v1.3b
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
47n/ /X7R
C148 100n/16V/X 47n/16V/X 47n/16V/X NA33 GND_A 1+3.3V C147 DIG15 +1.5V C145
+3.3V TC1767 ackage
C146
nalog Supply _DDM _DDMF _DDA
100n/16V
GND_A
U24F nalog C1767
U24G ackage U24J Port C0/1, C0/1, 0/OU 1/OU 2/OU 3/OU RST0 4/OU O10/SLS O00& O11/SLS O01& LSI01/OUT 89/S O02&S 90/T 9/OU 10/OU T92/ 11/OU T93/ 12/OU T94/ N0/RX 13/OU T95/ 14/OU T96/ N1/RX 15/OU T97/ C1767 ackage P0.0/IN0/HW UT0/OUT P0.1/IN1/HW UT1/OUT P0.2/IN2/HW UT2/OUT P0.3/IN3/HW UT3/OUT P0.4/IN4/HW UT4/OUT P0.5/IN5/HW UT5/OUT P0.6/IN6/HW EQ2/OU 6/OUT62 P0.7/IN7/HW EQ3/OU 7/OUT63 P0.8/IN8/OUT 8/OU P0.9/IN9/OUT 9/OU P0.10/IN10/OUT10/OU P0.11/IN11/OUT11/OU P0.12/IN12/OUT12/OU P0.13/IN13/OUT13/OU P0.14/IN14/RE Q4/OUT14/OUT P0.15/IN15/RE Q5/OUT15/OUT C1767 ackage
GND_A
GND_A D_AN
ND_A
U24H GPTA 0/IN16/OUT16/OU T72/BRK IN/BR 1/IN17/OUT17/OU 2/IN18/OUT18/OU 3/IN19/OUT19/OU 4/IN20/E UT20/OUT76 5/IN21/OUT21/OU 6/IN22/OUT22/OU 7/IN23/OUT23/OU 8/IN24/IN48/MT 24/OUT 9/IN25/IN49/MRS UT49 10/IN26/IN50/OUT 26/OU 11/IN27/IN51/SC LK1B /OUT27/OUT51 12/IN16/OUT 16/A 13/IN17/OUT 17/A 14/IN18/OUT 18/A 15/B TC1767 ackage
U24I Port GPTA C0/1, P2.0/IN32/OUT32/OU P2.1/IN33/T Y0A/OU O03/SLS P2.2/IN34/OUT34/OU P2.3/IN35/OUT35/OU P2.4/IN36/RCLK 36/OUT P2.5/IN37/OUT110/OU T37/ DY0A P2.6/IN38/RV ALID0A /OUT111/OUT P2.7/IN39/RDA 0A/OUT39 P2.8/S LSO04/S O14/EN00 P2.9/S LSO05/S O15/EN01 P2.10/IN10/OUT 0/MR P2.11/IN11/OUT 1A/FCLP0B P2.12/IN12/OUT 2/MTS /SOP P2.13/IN13/OUT LSI11/S TC1767 ackage
U24K GPTA 0/IN28/IN52/OUT 28/OU 1/IN29/IN53/OUT 29/OU 2/IN30/IN54/OUT 30/OU T54/ TCLK 3/IN31/IN55/OUT 31/OU T55/ TCLK TC1767 ackage
U24L MLI0 P5.0/IN26/IN40/OUT 8/OUT40 P5.1/IN27/IN41/OUT 9/OUT41 P5.2/IN28/IN42/OUT 10/OUT P5.3/IN43/OUT 11/OU P5.4/IN29/IN44/OUT 12/OUT P5.5/IN30/IN45/OUT 13/OUT P5.6/IN31/IN46/OUT 14/OUT P5.7/IN47/OUT 15/OU P5.8/OU DATA P5.9/OU LID0B P5.10/OU T91/ DY0B P5.11/OU T92/ CLK0B P5.12/OU T93/ O07/TDAT P5.13/S P5.14/OU T94/ DY0B P5.16/OU T95/ C1767 ackage FG7R161 CFG6 R162 CFG5 R163 CFG4 R164 CFG3 R165 CFG2 R166 CFG1 R167 CFG0 R168 680R 680R 680R 680R 680R 680R 680R
co_1 1571983-1 _DIG1
IG33 183S
+3.3V 10uF/ D_LSM676- illat Pack
IG15 82422A1
10uF/ B824 1103K
IG33 Genera _opt TMOD TC1767
OCDS JTAG Control AP2/ KOUT TMS/ Pack
+1.5V
igit Power upply
/X7R 16V/
Figure
Microcontroller TC1767 Assignment Logic Board v1.2
V2.2, 2010-03
00n/
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
+3.3V
+1.5V
47n/ /X7R
47n/16V/X
47n/16V/X
C148 100n/16V/X C147
V_FA
IC24E -TC1767-256F133H nalog Supply _DDM _DDMF _DDA
NA33 +3.3V
GND_A
100n/16V
ackage ND_A ND_RE
GND_A GND_A
GND_A 1GND_A GND_A D_RE
IC24F -TC1767-256F133HL nalog nputs ackage
D_AN
C1767 256F133HL Port P0.0/IN0/HWC FG0/OU UT56 P0.1/IN1/HWC FG1/OU UT57 P0.2/IN2/HWC FG2/OU UT58 P0.3/IN3/HWC FG3/OU UT59 P0.4/IN4/HWC FG4/OU UT60 P0.5/IN5/HWC FG5/OU UT61 P0.6/IN6/HWC FG6/RE Q2/OUT6/OU P0.7/IN7/HWC FG7/RE Q3/OUT7/OU P0.8/IN8/OUT8/OUT P0.9/IN9/OUT9/OUT P0.10/IN10/OUT10/OUT66 P0.11/IN11/OUT11/OUT67 P0.12/IN12/OUT12/OUT68 P0.13/IN13/OUT13/OUT69 P0.14/IN14/RE Q4/OUT 14/OUT70 P0.15/IN15/RE Q5/OUT 15/OUT71 ackage
C145
D_AN
0_11 0_12 0_14
D_AN
D_AN IC24H 1_10 0/IN16/OUT 16/OU IN/BR 1/IN17/OUT 17/OU 2/IN18/OUT 18/OU 3/IN19/OUT 19/OU 4/IN20/E OP/OU T20/OUT76 5/IN21/OUT 21/OU 6/IN22/OUT 22/OU 7/IN23/OUT 23/OU 8/IN24/IN48/MTS R1B/O UT24/OUT 9/IN25/IN49/MRS T1B/O UT25/ 10/IN26/IN50/OUT26/OU T50/ 11/IN27/IN51/SC LK1B /OUT 27/OUT51 12/IN16/OUT16/A 13/IN17/OUT17/A 14/IN18/OUT18/A 15/B 1767- 256F133HL ackage IC24I P2_5 TA39 CLK1 2_12
IC24J CLK0 LSO0 LSO1 LSO2 3_10 P3_11 P3_12 P3_13 SC0/1, P3.0/OUT84/RX P3.1/OUT85/TX P3.2/OUT86/S P3.3/OUT87/MR P3.4/OUT88/MT P3.5/S LSO00/S O00& P3.6/S LSO01/S O01& P3.7/S LSI01/OUT 89/S LSO02& P3.8/S LSO06/OU P3.9/OUT91/RX P3.10/OUT 92/RE P3.11/OUT 93/RE P3.12/OUT 94/RX P3.13/OUT 95/T AN0/T P3.14/OUT 96/RX P3.15/OUT 97/T AN1/T K-TC1767-256F133HL ackage
Port C0/1, P2.0/IN32/OUT 32/OUT28/T P2.1/IN33/TRE 0A/OUT 33/S O03/SLS P2.2/IN34/OUT 34/OUT29/T P2.3/IN35/OUT 35/OUT30/T P2.4/IN36/RCLK 0A/OU T36/ P2.5/IN37/OUT 110/OUT37/RR DY0A P2.6/IN38/RV ALID0A /OUT111/OUT38 P2.7/IN39/RDA TA0A /OUT39 P2.8/S LSO04/S P2.9/S LSO05/S P2.10/IN10/OUT0/MRS P2.11/IN11/OUT1/S CLK1A LP0B P2.12/IN12/OUT2/MTS P2.13/IN13/OUT3/S LSI11/SD C1767-256F133HL ackage
IC24L IC24K P4.0/IN28/IN52/OUT 28/OUT52 P4.1/IN29/IN53/OUT 29/OUT53 P4.2/IN30/IN54/OUT 30/OUT54/E P4.3/IN31/IN55/OUT 31/OUT55/E K-TC 1767- 256F133HL ackage 5_10 5_11 5_12 5_13 5_15 Port P5.0/IN26/IN40/OUT 8/OUT P5.1/IN27/IN41/OUT 9/OUT P5.2/IN28/IN42/OUT 10/OUT42 P5.3/IN43/OUT 11/OU P5.4/IN29/IN44/OUT 12/OUT44 P5.5/IN30/IN45/OUT 13/OUT45 P5.6/IN31/IN46/OUT 14/OUT46 P5.7/IN47/OUT 15/OU P5.8/OUT 89/RD P5.9/OUT 90/RV P5.10/OUT91/RR DY0B P5.11/OUT92/RC LK0B P5.12/OUT93/S 07/TDATA P5.13/S LSO16/TV ALID P5.14/OUT94/T DY0B P5.16/OUT95/T K-TC1767-256F133HL ackage
+3.3V R499 R500 R501 R502 R503 R504 R505 R506 100k CFG7 100kCFG 100kCFG 100kCFG 100kCFG 100kCFG 100kCFG 100kCFG
co_1-1571983-1 GND_D
K-TC ower upply 00n/ 00n/ 00n/ 00n/ 16V/ 00n/ 16V/ 00n/ 16V/ 00n/ 16V/
00n/
00n/ 16V/
00n/ 16V/
00n/16
00n/16
00n/
00n/16
+3.3V 16V/
+3.3V
422A 1103K 676- 256F133H illat XTAL XTAL 10u/ 10V/ +3.3V 422A 1103K 10u/ 10V/
IG33 1767 -256F1 neral ntro TESTMOD _opt
1767- OCDS Cont TMS/
Figure
Microcontroller TC1767 Assignment Logic Board v1.3b V2.2, 2010-03
+1.5V
00n/16
00n/
00n/ 16V/
00n/ 16V/
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
00n/ 16V/
5256 A-10 TQ-2
Figure
EEPROM (same Logic Board v1.2 Logic Board v1.3b)
VANA50 +5.0V
Unit temperature sensor (Ambient) Position: bottom Logic Board Temp 10mV/°C 500mV Temp -40C: +100mV Temp +125C: +1,750V LPF: -3dB 32Hz
C1211 100n/50V/X7R
270K LM50C C1212 22n/50V/X7R Temp_Board
Vout
Figure
On-Board Temperature Measurement (Logic Board v1.3b only)
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
4.12.2
Assembly Drawing
Figure
Assembly Drawing Logic Board v1.2 (Top)
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Assembly Drawing Logic Board v1.3b (Top)
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Assembly Drawing Logic Board v1.2 (Bottom)
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Assembly Drawing Logic Board v1.3b (Bottom)
detail information zoom function your viewer zoom into drawings Figure Figure Figure Figure
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
4.12.3
Layout
Layout Logic Board v1.2 shown Figure (Top Layer), Figure (Layer Figure (Layer Figure (Bottom Layer). Layout Logic Board v1.3b shown Figure (Top Layer), Figure (Layer Figure (Layer Figure (Layer Figure (Layer Figure (Bottom Layer).
Figure
Logic Board v1.2 Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.2 Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.2 Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.2 Bottom Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
Figure
Logic Board v1.3b Bottom Layer
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board
4.12.4
Bill Materials
Table Reference
Bill Materials Hybrid HybridPACKTM2 Logic Board v1.2 Value Device Package C0402
10n/50V/X7R 100n/16V/X7R C60,C61,C62,C63,C67,C69 C76,C77,C80,C81,C104 C78,C88,C90 C79,C82 C83,C84 C91,C92 C105,C108 C110 C143,C1111 C144,C1112 C145,C146,C147,C161,C162 C150,C151 100pF/50V/COG 4u7/16V/X7R 10n/16V/X7R 10uf/10V/X7R 4u7/25V/X7R 20pF/50V/COG 22u/16V/X7R 220nF/50V/X7R 100uF/35V 100uF/10V 2.2nF 10uF/6.3V/X7R 22uF/6.3V/X7R 4.7n/50V/X7R 22uF/16V/X7R 100n/25V/X7R 47n/16V/X7R 10uF/6.3V
C0402
C0402 C1206 C0402 C1206 C1206 C0402 C1210 C0805 C1010 C3528 C0402 C1206 C1206 C0603 C1210 C0603 C0402 C3216 C0402
100p/50V/X7R 200,C201 MBRS340T3 BZV55/C13 1SMB30AT3 LED_LSM676-MQ B82789C0104N001 Jumper TW-12-06-L-D-475-SM-A
SOD80 L0805 B82789C0 12POL
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Reference L1,L2,L5,L8 L6,L7 Q2,Q3 R7,R8,R9,R71,R73,R173 R72,R87,R89,R91,R94,R97 Bill Materials Hybrid HybridPACKTM2 Logic Board v1.2 (cont'd) Value Device MURATA_BLM21P221SN 47uH/B82464G4473M B82422A1103K SPD09P06PLG BC847BL3 IPD90P03P4L-04 BCR183S 100R Package L0805 B82464G4 C1210 TO252-3 TSLP3-1 TO252-003 SOT363 R0603 R0402 R0402 R0603 R0402 R0603 R0603 R0603 R0603
R84,R85,R86,R88,R165 R90,R93,R96,R99 R92,R95,R98,R100,R134,R135
17,R228,R235,R236 R111 R112 R113 R114 R119 R131,R132 R133 R150,R151,R153,R171 R155,R156,R157,R158,R159,R160 R170,R229,R315 R172 47mR/0.33W 680R 680R 0R_opt 220R
R0603 R0603 R1210 R0805 R0603 R0603 R0603 R0603 R0603 R0402 R0603 R0603 R0603
238,R240 0,R216,R227,R237,R239,R241 Application Note Tyco_1-1571983-1 AT25256A-10TQ-2.7
R0603 TSSOP-08 V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Reference X1-SIG1 X3-OCDS1 Table Reference Bill Materials Hybrid HybridPACKTM2 Logic Board v1.2 (cont'd) Value Device 74ALVC164245DGG LT1639HS LMH6672 AD2S1200YST 74LVC1G04GW HCM49 8.192MABJ-UT TPS76733QD TLE6389-2GV50 TPS76715QD EH2645ETTTS-20.000M TLE6250GV33 MAX3232EIPWRQ1 MAX6369KA-T SAK-TC1767-256F133HL TLE4266GSV10 Harwin M80-5123442 HEADER MAX6457UKD3A-T Package TSSOP-48 SO-14 LQFP-44 SOT353 HCM49 P-DSO-14 SM_Q_EH26 TSSOP-16 SOT23-8 LQFP-176 SOT223-4 34POL 16POL SOT23-5
Bill Materials hybrid HybridPACKTM2 Logic Board v1.3b Value Device Package C0402
100n/16V/X7R C169,C170,C171,C1110,C1210 C1160,C1161,C1163,C1164 C76,C77,C80,C81,C104 C79,C82 C83,C84 C85,C1151,C1153 C86,C1135,C1136,C1154,C1155 C93,C1152 C105,C108 Application Note 100n/16V/X7R 4u7/16V/X7R 10n/16V/X7R 10uF/10V/X7R 4u7/25V/X7R 20pF/50V/COG 100n/50V/X7R 22u/16V/X7R/F_1463575
C0603 C1206 C0402 C1206 C1206 C0402 C0603 C1210
220nF/100V/C3216X7R2A2 C1206 24KT5 100uF_35V_MAL21409700 C1010_CAP_Pin1_Plus 22uF/6.3V/X7R C1206 V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Reference C110 C143,C1111 C144 C145,C146,C147 C150,C151,C1157,C1158 Bill Materials (cont'd)for hybrid HybridPACKTM2 Logic Board v1.3b Value Device 4.7n/50V/X7R 22uF/16V/X7R 100n/25V/X7R 47n/16V/X7R 10u/10V/X7R Package C0603 C1210 C0603 C0402 C1206 C0402
1n/50V/X7R 3,C1194,C1195,C1196,C1197 C174,C179,C182 C191,C194,C196 100p/50V/X7R 6800p/10V/C0G
C0402 C0603 C0603 C0603 C0805 C0603 C1210 C1206 C0603 C1206 C0603 C0402 C1210 C0402
10p/50V/X7R 147,C1148,C1149 C1064,C1065,C1067 C1112,C1167 C1128,C1130 C1142 C1144,C1146 C1145 C1150 C1156 C1159 C1166 3300p/10V/C0G
100n/50V/X7R/C0805F104K5
10p/16V/X7R 4u7/10V/X7R 4u7/10V/X7R/F_9402195 1u/25V/X7R/F_1637035 680n/50V/F_1414702 220n/25V/X7R/F_1414626 1n/16V/X7R
4.7u/50V/X7R/C1210F475K5
1n/50V/X7R_opt 8,C1209 C1211 C1212 100n/50V/X7R 22n/50V/X7R
C0805 C0603 R0603
C1217 D5,D6 D7,D8,D9 MBRS340T3 BZV55/C13 1SMB30AT3 LED_LSM676-MQ SS12_1A_If_20V_Vr BAT54-04W B82789C0104N001
SOD80C_Pin1_Cathode Vishay_TLMK2300 DO214AC_SMA_Pin1_Cathode SOT323 EPCOS_B82789C0
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Reference IC4,IC31 IC13 IC16 IC17 IC23 IC24 IC25 IC26 IC28,IC30 IC29 IC32 IC33 IC52 IC53 IC54 K3-OCDS L1,L8,L9,L10,L11,L12 L6,L7 R474,R475,R476 R197,R234,R238,R240,R456 R90,R93,R96,R99 R101,R128,R169 Bill Materials (cont'd)for hybrid HybridPACKTM2 Logic Board v1.3b Value Device AT25256A-10TQ-2.7 74ALVC164245DGG LT1639HS LMH6672 AD2S1200YST TLE7368E EH2645ETTTS-20.000M TLE6250GV33 MAX6369KA-T SAK-TC1767-256F133HL TLE4266GSV10 DS92LV010 74LVC2G04GW 74LVCH16T245DL DS90LV031A AM26C32QD MAX3232EIPWRQ1 MAX6143AASA50 LM50CIM3 Jumper TW-12-06-L-D-475-SM-A Harwin M80-5125042P HEADER WE_7447709470 MURATA_BLM21P221SN B82422A1103K BDP949 IPD90P03P4L-04 BCR183S Package TSSOP8 TSSOP48 SO14 LQFP44_P0_8 SO36-38 Ecliptek_EH2645 SOT23-8 LQFP176_p0_50 SOT223 SOT363 SSOP48 SO16-1 SO16-1 TSSOP16 SOT23 jumper_2way
Samtec_TW-12-06-L-D-475-SM-A
Harwin_M80-5125042P tyco_1761686-6 WE-PD_744770 L0805 L1210 SOT223 TO252-3 SOT363 R0402
MURATA_BLM21PG221SN L0805
R0402
R0402 R0603
V2.2, 2010-03
Hybrid HybridPACKTM2 Evaluation Applications with HybridPACKTM2 Module
Hybrid HybridPACKTM2 Logic Board Table Reference Bill Materials (cont'd)for hybrid HybridPACKTM2 Logic Board v1.3b Value Device Package R0603
R113 R131,R132 R133 R149,R154 R150,R151,R153 R155,R156,R158,R160 R157 R159 R170,R224,R498 R171 R172 R175,R184,R191,R198,R205 R178,R179,R188,R189,R196,R199 R182,R193,R200 R183,R190,R201,R237,R239,R241 R214,R217,R223,R228,R230,R235 R215,R218,R472 R229 R429,R430,R431,R447 R483,R484,R485 R486 R487 R488,R489,R490,R494,R495,R496 R491,R492,R493 R506 2K4/0.1% 390/0.1% 3K3/0.1% 0R_opt 220R 100R
SMK-R000 Isabellenhuette R1206 R0603 R0402 R0402 R0402 R0603 R0603 R0603 R0603 R0603 R0603 R0402 R0402 R0402 R0402 R0402 R0402 R0402 R0603
5K_pot_0,25W_20%_Bourn Bourns_3314J s_3314J_opt 0.1% 270K 100k Tyco_1-1571983-1 DIP-4/SM Testpad_SMD_Ettinger HCM49 8.192MABJ-UT R0402 R0603 R0603 R0603 R0402 Tyco_1-1571983-1 Ettinger_12_18_815_testpad Citizen_HCM49
V2.2, 2010-03
Published Infineon Technologies
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