Photocouplers Photorelays Preface type isolator favored manu
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2010-3
Photocouplers Photorelays
Preface
type isolator favored manufacturers, photocouplers serve noise protectors many electronic devices. Toshiba's photocouplers consist either GaAs infrared LED(s) silicon photodetector(s) housed white mold package. LEDs adopted high-speed photo-IC types their highspeed high-light output. Toshiba's innovative white mold packaging also greatly contributes high sensitivity, high superb reliability.
White overmold (epoxy) Detector Dome (silicon) Infrared Lead frame
Perspective view TLP521-1
Cross section TLP521-1
CONTENTS
Product Index Products Photocoupler Product Tree Selection Guide Transistor-Output Darlington-TransistorOutput Photocouplers Photocouplers Logic Signal Transmission. Photocouplers IGBT/MOSFET Gate Drive Photorelays (1-Form-A 2-Form-A) Photorelays (1-Form-B, 2-Form-B 1-Form-A/1-Form-B) Triac-Output Photocouplers Thyristor-Output Photocouplers. Photovoltaic-Output photocouplers Products Manufactured Toshiba Semiconductor (Thailand) Co., Ltd.) Part Naming Conventions Package Information Lead Form Options Packages Package Dimensions Rank Marking Packing Information Photocoupler Magazine Packing Specifications Tape-and-Reel Specifications Board Assembly. Example Land Patterns Board Assembly Considerations Device Degradation Projected Operating Life Based Light Output Degradation Safety Standard Approvals Photocoupler Application Circuit Examples Competitor Cross Reference
Extensive Line Products
meet customers' various needs, offer extensive product portfolio shown below well generalpurpose photocouplers. Photo-IC couplers: High speed advanced functions (highly integrated detectors) Zero-crossing phototriac couplers: Phototriac-output devices with zero-crossing detection Photovoltaic couplers: MOSFET gate drive (high voltage output achieved using photodiode array) Photorelays (MOSFET-output devices): AC-DC switches (MOSFET output) Mechanical relay replacement
Safety Standard Approvals
approval been obtained under file number E67349 most photocouplers. EN60747-5-2approved photocouplers also offered with wide selection output (transistor, thyristor, triac, output photorelay). designs these devices meet other standards including IEC380/VDE0806, IEC60950/EN60950 IEC60065/EN60065.
Small-Package Products
Toshiba offers wide variety photocouplers small package meet space-saving requirement increasingly smaller thinner products. Packaging options include mini-flat packages (MFSOPs) half-pitch (1.27 mini-flat packages.
Overseas Manufactured Photocouplers
Part general-purpose photocouplers with transistor triac outputs manufactured Toshiba Semiconductor Thailand Co., Ltd. This will help customers procure components locally overseas assembly products.
Product Index
Part Number Package MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 MFSOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 MFSOP6 MFSOP6 MFSOP6 MFSOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP8 2.54SOP8 2.54SOP8 2.54SOP8 2.54SOP8 2.54SOP8 2.54SOP8 DIP4 DIP8 DIP4 DIP8 DIP4 DIP8 DIP4 DIP8 DIP4 DIP4 DIP8 DIP4 DIP8 Output [TLP109]* [TLP109]* [TLP118]* [TLP109]* [TLP109(IGM)]* [TLP118]* [TLP118]* [TLP116A]* Transistor Transistor Darlington transistor Transistor Transistor Transistor Thyristor Triac Triac Triac Triac Triac Triac Triac Triac MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Transistor Transistor Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Page 13,38 10,38 Part Number Package DIP4 DIP8 MFSOP6 MFSOP6 SOP4 SOP16 SOP4 SOP16 SOP4 SOP16 SOP4 SOP16 DIP4 DIP8 DIP16 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP4 DIP4 DIP4 DIP6 DIP6 DIP6 DIP8 DIP6 DIP6 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 Output MOSFET (Photorelay) MOSFET (Photorelay) Triac Triac Triac Triac Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Transistor Transistor Transistor Transistor Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Transistor Transistor Thyristor Thyristor Triac Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Page 13,38 10,38 10,38 10,38 11,38 11,38
TLP104 TLP105 TLP108 TLP109 TLP109 (IGM) TLP112 TLP112A TLP113 TLP114A TLP114A (IGM) TLP115 TLP115A TLP116 TLP116A TLP117 TLP118 TLP124 TLP126 TLP127 TLP130 TLP131 TLP137 TLP148G TLP151 TLP160G TLP160J TLP161G TLP161J TLP163J TLP165J TLP166J TLP168J TLP170A TLP170D TLP170G TLP170J TLP172A TLP172G TLP173A TLP174G TLP174GA TLP176A TLP176D TLP176G TLP176GA TLP179D TLP180 TLP181 TLP190B TLP191B TLP192A TLP192G TLP197A TLP197D TLP197G TLP197GA TLP199D TLP200D TLP202A TLP202G TLP206A TLP206G TLP206GA TLP209D TLP222A TLP222A-2 TLP222G TLP222G-2 TLP224G TLP224G-2 TLP224GA TLP224GA-2 TLP225A TLP227A TLP227A-2 TLP227G TLP227G-2
TLP227GA TLP227GA-2 TLP260J TLP261J TLP265J TLP266J TLP280 TLP280-4 TLP281 TLP281-4 TLP284 TLP284-4 TLP285 TLP285-4 TLP320 TLP320-2 TLP320-4 TLP330 TLP331 TLP332 TLP350 TLP350H TLP351 TLP351H TLP358 TLP358H TLP360J TLP361J TLP363J TLP371 TLP372 TLP373 TLP504A TLP512 TLP513 TLP521-1 TLP521-2 TLP521-4 TLP523 TLP523-2 TLP523-4 TLP525G TLP525G-2 TLP525G-4 TLP531 TLP532 TLP548J TLP549J TLP550 TLP551 TLP552 TLP553 TLP554 TLP555 TLP557 TLP558 TLP559 TLP559 (IGM) TLP560G TLP560J TLP561G TLP561J TLP570 TLP571 TLP572 TLP590B TLP591B TLP592A TLP592G TLP597A TLP597G TLP597GA TLP598AA
Recommended part
Product Index
Package DIP6 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP6 DIP6 DIP6 DIP8 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 DIP6 DIP4 DIP6 DIP6 DIP6 MFSOP6 MFSOP6 MFSOP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 Output MOSFET (Photorelay) Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Darlington transistor Darlington transistor Darlington transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Thyristor Triac Triac Transistor MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Triac Page 14,38 14,38 11,38 11,38 15,38 15,38 Part Number
Part Number
TLP598GA TLP620 TLP620-2 TLP620-4 TLP621 TLP621-2 TLP621-4 TLP624 TLP624-2 TLP624-4 TLP626 TLP626-2 TLP626-4 TLP627 TLP627-2 TLP627-4 TLP628 TLP628-2 TLP628-4 TLP629 TLP629-2 TLP629-4 TLP630 TLP631 TLP632 TLP651 TLP700 TLP700H TLP701 TLP701H TLP705 TLP708 TLP714 TLP715 TLP716 TLP718 TLP719 TLP731 TLP732 TLP733 TLP734 TLP748J TLP750 TLP751 TLP754 TLP759 TLP759 (IGM) TLP762J TLP763J TLP781 TLP797GA TLP797J TLP798GA TLP2066 TLP2095 TLP2098 TLP2105 TLP2108 TLP2116 TLP2118 TLP2166A TLP2200 TLP2360 TLP2403 TLP2404 TLP2405 TLP2408 TLP2409 TLP2409(IGM) TLP2418 TLP2451 TLP2530 TLP2531 TLP2601 TLP2630 TLP2631 TLP3022(S)
TLP3023(S) TLP3042(S) TLP3043(S) TLP3052(S) TLP3062(S) TLP3063(S) TLP3064(S) TLP3082(S) TLP3100 TLP3110 TLP3111 TLP3113 TLP3114 TLP3115 TLP3116 TLP3118 TLP3119 TLP3120 TLP3121 TLP3122 TLP3123 TLP3125 TLP3130 TLP3131 TLP3203 TLP3212 TLP3213 TLP3214 TLP3215 TLP3216 TLP3217 TLP3218 TLP3219 TLP3220 TLP3230 TLP3231 TLP3240 TLP3241 TLP3250 TLP3275 TLP3312 TLP3375 TLP3542 TLP3762(S) TLP3782(S) TLP3783(S) TLP3902 TLP3904 TLP3914 TLP3924 TLP4006G TLP4007G TLP4026G TLP4027G TLP4172G TLP4176G TLP4192G TLP4197G TLP4202G TLP4206G TLP4222G TLP4222G-2 TLP4227G TLP4227G-2 TLP4592G TLP4597G 6N135 6N136 6N137 6N138 6N139
Package DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 2.54SOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP6 2.54SOP4 2.54SOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP8 2.54SOP4 2.54SOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 USOP4 USOP4 DIP6 DIP6 DIP6 DIP6 MFSOP6 SSOP4 SSOP4 SSOP4 DIP8 DIP8 2.54SOP8 2.54SOP8 2.54SOP4 2.54SOP4 2.54SOP6 2.54SOP6 2.54SOP8 2.54SOP8 DIP4 DIP8 DIP4 DIP8 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8
Output Triac Triac Triac Triac Triac Triac Triac Triac MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Triac Triac Triac Photovoltaic Photovoltaic Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay)
Page
Products
Transistor-Output Coupler Certified Reinforced Insulation Mini-Flat Package: TLP284/-4 TLP285/-4
TLP284, TLP284-4, TLP285 TLP285-4 additions Toshiba's portfolio transistor-output photocouplers mini-flat SOP4 package that comply with international safety standards reinforced insulation. TLP284/TLP284-4: input, single/quad TLP285/TLP285-4: input, single/quad These photocouplers feature isolation voltage 3750 Vrms (min) extended operating temperature range -55°C 110°C). Thus, they suitable wide variety applications, including power supplies requiring high-density board assembly, hybrid ICs, home appliances, communications equipment programmable controllers.
voltage: (min) UL1577 (File E67349) BSI-approved: EN60065: 2002 EN60950-1: 2006 VDE-approved: EN60747-5-2 Maximum operating isolation voltage: Maximum permissible overvoltage: 6000 Creepage/clearance: (min) Isolation thickness: (min) Isolation voltage: 3750 Vrms (min)
UL-recognized: Collector-emitter
Anode Cathode Emitter Collector
Anode, Cathode Cathode, Anode Emitter Collector
TLP284
Package Dimensions
TLP285
Package Dimensions
Unit:
Unit:
0.25
0.25
0.25 0.15
0.15
10.3 0.25
1,3,5,7:
Anode, Cathode
2,4,6,8:
1.27
1.27
Cathode, Anode 9,11,13,15: Emitter 10,12,14,16: Collector
1,3,5,7: Anode 2,4,6,8: Cathode 9,11,13,15: Emitter 10,12,14,16: Collector
TLP284 TLP285
TLP284-4 TLP285-4
TLP284-4
TLP285-4
TLP170 Series: Photorelays with Trigger Current
Semiconductor photorelays have long service life, provide high reliability, reduce power consumption save board space. Thus, mechanical relays quickly being replaced photorelays. electric electronic manufacturers, power consumption becoming increasingly important factor energy-saving efforts being promoted preserve global environment. address such situations, TLP170 Series feature trigger current (IFT) only improved output photodiode array. TLP170 Series offered with off-state voltage meet needs wide range applications.
TLP170A TLP170D TLP170G TLP170J Configuration
Control Circuit
Off-State Voltage
On-State Current 0.09
0.25
On-State Resistance
Unit:
Anode Cathode Drain Drain
MOSFET
Package Dimensions
Photo-Diode Array
0.25
0.15
Anode Cathode Drain Drain
2.54 0.25
Products
Photocouplers with Reinforced Insulation Package
Despite same footprint size MFSOP6 package, package provides reinforced insulation, offering clearance creepage distances internal isolation thickness isolation voltage 3750 Vrms. Additionally, features maximum mounted height approximately lower than MFSOP6. This makes photocouplers ideal low-profile applications.
Clearance/creepage: Internal
Faraday shield: Thin package: Isolation voltage: 3750 Vrms (min)
Creepage/clearance distances Internal isolation thickness
Part Number TLP104 TLP109 TLP116A TLP118 TLP2360*
Data rate (typ.)
Output Open-collector Open-collector Totem pole Open-collector Totem pole
-20%
Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative.
TLP2095/TLP2098: Photocouplers with Dual-Polarity Input
TLP2095 TLP2098 additions family photocouplers with 5-Mbit/s output accept input signal positive negative polarities. TLP2095 TLP2098 eliminate need external rectifier devices such bridge diodes, which would otherwise required input signal whose polarity change like from programmable logic controller (PLC).
MFSOP6 input current threshold: (max) Data rate (typ.): Mbit/s Totem-pole output (TLP2095: Buffer logic,TLP2098: Inverter logic)
Package:
Configuration
Package Dimensions
Mbit/s Mbit/s Mbit/s Mbit/s Mbit/s
MFSOP6
Unit:
Input signal
SHIELD
Vout
required
TLP2095 TLP2098
Anode 1/Cathode Cathode 1/Anode (Output
1.27 2.54
0.15
Note: Under development. latest information, please contact your nearest Toshiba sales representative
Dual-Channel High-Speed Photo-IC Couplers Package
Toshiba extending offerings high-speed photo-IC couplers housed package. dual-channel photo-IC couplers package occupy approximately less board space, which helps reduce product size costs.
Data rate (typ.) Supply voltage Single-channel couplers MFSOP Dual-channel couplers
Mbit/s TLP105 TLP2105 TLP108 TLP2108
Mbit/s TLP116 TLP2116 Configuration
Mbit/s TLP2066 TLP2166A Package Dimensions
3.95 0.25
Unit:
Package Size Comparison
1.27 1.27
(mm)
3.95
SHIELD
reduction channel
Anode Cathode Cathode Anode (Output (Output
MFSOP6
TLP2116
0.38
1.27 0.15
0.305
Low-CR Photorelays Semiconductor Testers Measurement Instruments: TLP32xx Series
TLP32xx photorelay series exhibits lower output capacitance (COFF) on-state resistance (RON) than their predecessors. TLP32xx feature values pF., pF., which approximately equivalent those reed relays. These photorelays have been developed meet requirements high-speed operation, high reliability small form factor being demanded testers measuring instruments rapidly evolving semiconductor devices mobile equipment. Besides, TLP32xx Series housed 4-pin SSOP, achieve high-density board assembly devices/inch2.
Part Number
Package
Off-State Voltage VOFF (min)
On-State Current (max)
On-State Resistance (typ.) 0.18
Off-State Capacitance Coff (typ.) 1.65 0.45
Trigger Current (max)
TLP3220 TLP3217 (NEW) TLP3218 (NEW) TLP3219 TLP3212 TLP3213 TLP3214 TLP3215 TLP3216 (NEW) TLP3216A TLP3240 TLP3241 TLP3230 TLP3231 TLP3250 TLP3203
SSOP4
Photo-IC Couplers USOP Package
TLP3312 smallest photorelay Toshiba's coupler portfolio. While functionally identical TLP3212, TLP3312 housed USOP4 package, which reduces board space requirement approximately compared SSOP without compromising COFF characteristics. TLP3312 ideal solution wide variety applications that require size reduction such testers measuring instruments, well size-critical applications.
following shows electrical characteristics TLP3312.
TLP3312 Package USOP4 VOFF (min) (max) (typ.) COFF (typ.) (max)
Ideal low-cost replacement mechanical relay: TLP173A Series
rewards using semiconductor photorelays obvious-they have long service life, increase system reliability, reduce power consumption save board space. Mechanical relays quickly being replaced photorelays electrical electronic manufacturers make greater efforts preserve global environment natural resources. other hand, mechanical relays, which have been pervasively used wide range applications, generally less expensive than photorelays. Therefore, migration photorelays being slow cost-critical applications. TLP173A targeted economical replacement mechanical relay. Designed low-voltage low-current applications because single-chip integration photo-receptor, TLP173A compares more less favorably with mechanical relays terms price. been applied approval under multiple international safety standards such UL/cUL will open application areas.
(New)TLP170A (New)TLP170D (New)TLP170G (New)TLP170J (New)TLP173A
Trigger current(max) 1500 Vrms 2.54SOP4 Normally open 0.09 Off-state voltage(min) Voff On-state current(max) On-state resistance(max) Turn-on time(max) Turn-off time(max) tOFF Isolation voltage(min) Package Function 0.07 3750 Vrms MFSOP6
Photocoupler Product Tree
Photocoupler Product Tree Package
DIP4
DIP4 DIP6
DIP6 DIP16
DIP8 SDIP6
SDIP6
General-purpose packages Lead-forming options surface mounting
7-mm clearance/creepage; 0.4-mm isolation thickness 6-pin package (1.27-mm lead pitch) 5-mm clearance/creepage; 0.4-mm isolation thickness 5-pin package (1.27-mm lead pitch); low-profile 8-pin package (1.27-mm lead pitch)
DIP8
DIP16
SOP4 SOP16
SOP4 SOP16
4-pin package (1.27-mm lead pitch) 16-pin package (1.27-mm lead pitch)
MFSOP6
MFSOP6
package (1.27-mm lead pitch)
2.54SOP4 2.54SOP8
2.54SOP4 2.54SOP6 2.54SOP8 SSOP4
2.54SOP6
package (2.54-mm lead pitch)
SSOP4 USOP4
Ultra-small; package (1.27-mm lead pitch)
USOP4
Ultra-small; package (1.27-mm lead pitch)
Transistor-Output Transistor-Output Photorelays Darlington-Transistor Output
IC-Output Logic Output
Photorelays
Output Choices
Gate Drive Thyristor- Triac-Output Triac Output Thyristor Output Photovoltaic-Output Photovoltaic-Output
Selection Guide
Transistor-Output Darlington-Transistor-Output Photocouplers
Package
Features
SOP4
Isolation Voltage Channel Single
SOP16
Quad
MFSOP6
Single
DIP6
Single
DIP4
Single
DIP8
Dual
DIP16
Quad
TLP281 2500 Vrms TLP285
TLP281-4
TLP531 TLP532 TLP521-1
TLP504A TLP521-2 TLP521-4
3750 Vrms
TLP285-4
TLP131 TLP181 TLP731
General-purpose
4000 Vrms
TLP732 TLP733 TLP734
5000 Vrms TLP124 TLP137
TLP631 TLP632
TLP621 TLP781
TLP621-2
TLP621-4
3750 Vrms
5000 Vrms
High VCEO High
TLP331 TLP332
TLP624
TLP624-2
TLP624-4
5000 Vrms 5000 Vrms 2500 Vrms TLP280 TLP284 TLP280-4 TLP284-4 TLP130 TLP180 TLP630 TLP126
TLP628 TLP629
TLP628-2 TLP629-2
TLP628-4 TLP629-4
input
3750 Vrms 5000 Vrms 3750 Vrms
TLP620
TLP620-2
TLP620-4
5000 Vrms
High
TLP626 TLP330 TLP570 TLP320 TLP523
TLP626-2 TLP320-2 TLP523-2
TLP626-4 TLP320-4 TLP523-4
5000 Vrms
Darlington
2500 Vrms
TLP571 TLP572
2500 Vrms
High VCEO
TLP127 TLP371 TLP627 TLP627-2 TLP627-4
5000 Vrms
TLP372 TLP373
Selection Guide
Products with Reinforced Insulation Small, Surface-Mount Package 5-mm Clearance/Creepage 0.4-mm Internal Isolation Thickness)
Part Number Configuration
Features SOP4 Lead pitch 1.27 Input SEMKO-approved part recm'ed
TLP284(4)
Rank
(%)(3)
@IF,
VCEO
UL/CUL
Safety Standards(2)
3750 Vrms
TLP284-4
SOP16 4-channel version TLP284 Lead pitch 1.27 Input SEMKO-approved
3750 Vrms
TLP285(4)
SOP4 Lead pitch 1.27 SEMKO-approved part recm'ed
3750 Vrms
TLP285-4
SOP16 4-channel version TLP285 Lead pitch 1.27 SEMKO-approved
3750 Vrms
General-Purpose, Transistor-Output Photocouplers
Part Number Configuration
Features
Mini-flat
Rank
(%)(3) 1200 1200 1200 1200
@IF,
VCEO
UL/CUL
Safety Standards(2)
TLP124
MFSOP6 input drive current
3750 Vrms
Mini-flat
TLP131
MFSOP6 Internal base connection
3750 Vrms
Mini-flat
TLP137
MFSOP6 input drive current Internal base connection
3750 Vrms
Mini-flat
TLP181
MFSOP6 SEMKO-approved part recm'ed
3750 Vrms
TLP281(4)
SOP4 Lead pitch 1.27 SEMKO-approved part recm'ed
2500 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative. Note Product manufactured Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] recommended. page detail. Japan product non-promotional item.
General-Purpose, Transistor-Output Photocouplers (continued)
Part Number Configuration
Features SOP16 4-channel version TLP281 Lead pitch 1.27 SEMKO-approved DIP6 input drive current Internal base connection
Rank
(%)(3)
@IF,
VCEO
UL/CUL
Safety Standards(2)
TLP281-4
2500 Vrms
1200 1200 1200 1200
TLP331
5000 Vrms
TLP332
DIP6 input drive current
5000 Vrms
TLP504A
DIP8
2500 Vrms
TLP521-1
DIP4 part recm'ed
2500 Vrms
TLP521-2
DIP8 Dual-channel version TLP521-1 part recm'ed
2500 Vrms
TLP521-4
DIP16 4-channel version TLP521-1
2500 Vrms
TLP531
DIP6 Internal base connection
2500 Vrms
TLP532
DIP6 High immunity
2500 Vrms
TLP621(4) TLP621F(4)
DIP4 UL-approved (double protection) SEMKO-approved part recm'ed DIP8 Dual-channel version TLP621 SEMKO-approved part recm'ed
5000 Vrms
TLP621-2 TLP621F-2(4)
5000 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative. Note Product manufactured Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] recommended. page detail. Japan product non-promotional item.
Selection Guide
(%)(3) 5000 Vrms Safety Standards(2)
General-Purpose, Transistor-Output Photocouplers (continued)
Part Number Configuration
Features
Rank
@IF,
VCEO
UL/CUL
TLP621-4
DIP16 4-channel version TLP621
1200 5000 Vrms
TLP624
DIP4 input drive current
1200
TLP624-2
DIP8 Dual-channel version TLP624
1200 5000 Vrms
1200
TLP624-4
DIP16 4-channel version TLP624
1200 5000 Vrms
1200
DIP4 High VCEO
5000 Vrms
TLP628
TLP628-2
DIP8 Dual-channel version TLP628
5000 Vrms
TLP628-4
DIP16 4-channel version TLP628
5000 Vrms
TLP629
DIP4 High input current
5000 Vrms
TLP629-2
DIP8 Dual-channel version TLP629
5000 Vrms
TLP629-4
DIP16 4-channel version TLP629
5000 Vrms
TLP631
DIP6 Internal base connection
5000 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative.
General-Purpose, Transistor-Output Photocouplers (continued)
Part Number Configuration
Features
Rank
(%)(3) @IF,
VCEO
UL/CUL
Safety Standards(2)
TLP632
DIP6 High immunity
5000 Vrms
TLP731
DIP6 SEMKO-approved Internal base connection
4000 Vrms
TLP732
DIP6 SEMKO-approved
4000 Vrms
TLP733 TLP733F
DIP6 SEMKO-approved Internal base connection
4000 Vrms
TLP734 TLP734F
DIP6 SEMKO-approved
4000 Vrms
TLP781 TLP781F
High isolation voltage UL-approved (double protection)
5000 Vrms
AC-Input, Transistor-Output Photocouplers
Part Number Configuration
Features
Mini-flat
Rank
(%)(3)
@IF,
VCEO
UL/CUL
Safety Standards(2)
TLP126
MFSOP6 input input drive current
1200
3750 Vrms
Mini-flat
TLP130
MFSOP6 input Internal base connection
Mini-flat
3750 Vrms
TLP180(4)
TLP280(4)
MFSOP6 input SEMKO-approved part recm'ed SOP4 Lead pitch 1.27 input SEMKO-approved part recm'ed SOP16 4-channel version TLP280 Lead pitch 1.27 input SEMKO-approved
3750 Vrms
2500 Vrms
TLP280-4
2500 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative. Note Product manufactured Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] recommended. page detail. Japan product non-promotional item. Note safety standard compliance criteria including operating temperature conditions, please contact your nearest Toshiba representative.
Selection Guide
(%)(3) Safety Standards(2)
AC-Input, Transistor-Output Photocouplers (continued)
Part Number Configuration
Features DIP4 High input current input
Rank
@IF,
VCEO
UL/CUL
TLP320
±100
5000 Vrms
TLP320-2
DIP8 Dual-channel version TLP320
±100
5000 Vrms
TLP320-4
DIP16 4-channel version TLP320
±100
5000 Vrms
TLP330
DIP6 High input current input Internal base connection DIP4 input SEMKO-approved part recm'ed
±100
5000 Vrms
TLP620(4) TLP620F(4)
5000 Vrms
TLP620-2 TLP620F-2(4)
DIP8 Dual-channel version TLP620 SEMKO-approved part recm'ed DIP16 4-channel version TLP620
5000 Vrms
TLP620-4
5000 Vrms
TLP626
DIP4 input drive current input
1200
5000 Vrms
TLP626-2
DIP8 Dual-channel version TLP626
1200
5000 Vrms
TLP626-4
DIP16 4-channel version TLP626
1200
5000 Vrms
TLP630
DIP6 input High isolation voltage Internal base connection
5000 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative. Note Product manufactured Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] recommended. page detail. Japan product non-promotional item.
Darlington-Transistor-Output Photocouplers
Part Number Configuration
Features
Mini-flat
(sat) (%)(3) @IF, @IC,
VCEO
UL/CUL
Safety Standards(2)
TLP127
MFSOP6 High VCEO DIP6 High VCEO SEMKO-approved Internal base connection DIP6 High VCEO SEMKO-approved
1000
2500 Vrms
TLP371
1000
5000 Vrms
TLP372
1000
5000 Vrms
TLP373
DIP6 High VCEO Long emitter-collector distance SEMKO-approved
1000
5000 Vrms
TLP523
DIP4
2500 Vrms
TLP523-2
DIP8 Dual-channel version TLP523
2500 Vrms
TLP523-4
DIP16 4-channel version TLP523
2500 Vrms
TLP570
DIP6 High immunity
1000
2500 Vrms
TLP571
DIP6 Internal base connection
1000
2500 Vrms
TLP572
DIP6 Built-in
1000
2500 Vrms
TLP627(4)
DIP4 High VCEO SEMKO-approved part recm'ed DIP8 Dual-channel version TLP627 SEMKO-approved part recm'ed DIP16 4-channel version TLP627
1000
5000 Vrms
TLP627-2
1000
5000 Vrms
TLP627-4
1000
5000 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Note Some ranks limited production quantities. details, please contact your nearest Toshiba sales representative. Note Product manufactured Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] recommended. page detail. Japan product non-promotional item.
Selection Guide
Photocouplers Logic Signal Transmission
Package Features
Data Rate (Typ.)
Output Open-collector (Darlington)
MFSOP6
TLP2403*1
SDIP6
DIP6
DIP8 TLP553
JEDEC 6N138 6N139 6N135 6N136
Mbit/s
(TLP112)*2 (TLP112A)*2 (TLP114A)*2 Mbit/s
TLP109
TLP2409*1
TLP719
TLP512
Open-collector
drive
(TLP114A(IGM))*3 TLP109(IGM) TLP2409(IGM)*1 TLP2404*1 TLP104 TLP105 TLP108 TLP2095 TLP2098 TLP2405*1 TLP2408*1 TLP2105 TLP2108
TLP714*1
TLP550 TLP551 TLP559 TLP651 TLP750 TLP751 TLP759 TLP559(IGM) TLP759(IGM) TLP754*1
TLP2530 TLP2531
Totem-pole
TLP715 TLP718
Mbit/s
Dual polarity input
3-state
Mbit/s
Open-collector Totempole Opencollector Totempole
Mbit/s
(TLP113)*4 (TLP115)*4 (TLP115A)*4 (TLP116)*5 TLP116A TLP2066 TLP2360*1 TLP118 TLP117 TLP2418*1
TLP513
TLP555 TLP558 TLP2200 TLP552 TLP554 TLP2601
TLP2630 TLP2631
6N137
TLP2116 TLP2166A TLP2118
TLP716
TLP708*1
Mbit/s
Under development January 2010. latest information, please contact your nearest Toshiba sales representative. TLP109 recommended TLP109(IGM) recommended TLP118 recommended TLP116A recommended
Photocouplers Logic Signal Transmission Mbit/s (Typ.)
Part Number Configuration
SHIELD
Features
Propagation Delay Time (Max)
Output Form
IFHL (Max)
Safety Standards(2) UL/cUL
Mini-flat
TLP117
MFSOP6 High speed: Mbit/s
Totem pole output (Inverter logic)
3750 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Note IEC: Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photocouplers Logic Signal Transmission Mbit/s (Typ.)
Part Number Configuration
SHIELD
Features
Propagation Delay Time (Max)
Output Form
IFHL (Max)
Safety Standards(2) UL/cUL
Mini-flat
TLP116
MFSOP6 High speed: Mbit/s TLP116A recm'ed (reinforced insulation) High speed: Mbit/s High speed: Mbit/s Dual-channel version SDIP6 High speed: Mbit/s High isolation voltage (reinforced insulation) High speed: Mbit/s Topr 125°C (max)
Totem pole output (Inverter logic)
3750 Vrms
SHIELD
TLP116A
Totem pole output (Inverter logic)
3750 Vrms
SHIELD
TLP2116
Totem pole output (Inverter logic)
2500 Vrms
SHIELD
TLP716 TLP716F
Totem pole output (Inverter logic)
5000 Vrms
SHIELD
TLP118
Open-collector (Inverter logic)
3750 Vrms
SHIELD
TLP2418*
High speed: Mbit/s High speed: Mbit/s Dual-channel version SDIP6 High speed: Mbit/s High isolation voltage
Mini-flat
Open-collector (Inverter logic)
3750 Vrms
SHIELD
TLP2118
Open-collector (Inverter logic)
2500 Vrms
SHIELD
TLP708*
Open-collector (Inverter logic)
5000 Vrms
SHIELD
TLP2066
MFSOP6 High speed: Mbit/s (reinforced insulation) High speed: Mbit/s High speed: Mbit/s Dual-channel version
Totem pole output (Inverter logic)
3750 Vrms
SHIELD
TLP2360*
Totem pole output (Inverter logic)
3750 Vrms
SHIELD
TLP2166A
Totem pole output (Inverter logic)
2500 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Note IEC: Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
Propagation Delay Time (Max) Safety Standards(2) UL/cUL 2500 Vrms
Photocouplers Logic Signal Transmission Mbit/s (Typ.)
Part Number Configuration
Features
Mini-flat
Output Form
IFH, (Max)
TLP113
SHIELD
MFSOP6 Logic output TLP118 recm'ed
Mini-flat
Open-collector (Topr 25°C)
TLP115
SHIELD
MFSOP6 High version TLP113 TLP118 recm'ed
Mini-flat
Open-collector (Topr 25°C)
2500 Vrms
TLP115A
MFSOP6 Highly sensitive version TLP115 TLP118 recm'ed DIP6 6-pin package version TLP552
Open-collector (Topr 25°C)
2500 Vrms
TLP513
Open-collector (Topr 25°C)
2500 Vrms
TLP552
SHIELD
DIP8 Logic output DIP8 High version TLP552 DIP8 High
Open-collector (Topr 25°C)
2500 Vrms
TLP554
Open-collector (Topr 25°C)
2500 Vrms
TLP2601
Open-collector (Topr 25°C)
2500 Vrms
SHIELD
TLP2630
SHIELD
DIP8 Dual-channel version Open-collector 6N137 TLP552 (Topr 25°C) DIP8 High Dual-channel version TLP554
2500 Vrms
TLP2631
Open-collector (Topr 25°C)
2500 Vrms
Photocouplers Logic Signal Transmission Mbit/s (Typ.)
Part Number Configuration
SHIELD
Features
Mini-flat
Propagation Delay Time (Max)
Output Form
IFH, (Max)
Safety Standards(2) UL/cUL 3750 Vrms
TLP105
SHIELD
MFSOP6 input operation drive
Mini-flat
Totem pole output (Buffer logic)
TLP108
SHIELD
MFSOP6 input operation drive input operation drive
Totem pole output (Inverter logic)
3750 Vrms
TLP2405*
Totem pole output (Buffer logic)
3750 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photocouplers Logic Signal Transmission Mbit/s (Typ.) (Continued)
Part Number Configuration
SHIELD
Features input operation drive DIP8 input current DIP8 Inverting logic version TLP555 SDIP6 drive High SDIP6 drive High
Mini-flat
Propagation Delay Time (Max)
Output Form
IFH, (Max)
Safety Standards(2) UL/cUL
TLP2408*
Totem pole output (Inverter logic)
3750 Vrms
TLP555
(Topr 25°C)
SHIELD
3-state (Buffer logic)
2500 Vrms
SHIELD
TLP558
3-state (Topr 25°C) (Inverter logic)
2500 Vrms
SHIELD
TLP715 TLP715F
Totem pole output (Buffer logic)
5000 Vrms
SHIELD
TLP718 TLP718F
Totem pole output (Inverter logic)
5000 Vrms
SHIELD
TLP2095
SHIELD
MFSOP6 Dual polarity input version TLP105
Mini-flat
Totem pole output (Buffer logic)
3750 Vrms
TLP2098
SHIELD
MFSOP6 Dual polarity input version TLP108 Dual-channel version TLP105 Dual-channel version TLP108 DIP8 input current
Totem pole output (Inverter logic)
3750 Vrms
TLP2105
Totem pole output (Buffer logic)
3750 Vrms
SHIELD
TLP2108
Totem pole output (Inverter logic)
3750 Vrms
SHIELD
TLP2200
3-state (Buffer logic)
2500 Vrms
Photocouplers Logic Signal Transmission Mbit/s (Typ.)
Part Number Configuration
Features (reinforced insulation) Creepage/clearance Isolation thickness
Data Rate (NRZ) (Typ.)
Safety Standards(2) UL/cUL
SHIELD
TLP109
Mbit/s
(min)
3750 Vrms
TLP2409*
Topr 125°C(max) version TLP109
SHIELD
Mbit/s
(min)
3750 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
Data Rate (NRZ) (Typ.) Safety Standards(2) UL/cUL
Photocouplers Logic Signal Transmission Mbit/s (Typ.) (Continued)
Part Number Configuration
Features
Mini-flat
TLP112
MFSOP6 High speed High TLP109 recm'ed
Mini-flat
Mbit/s
(min)
2500 Vrms
TLP112A
SHIELD
MFSOP6 High version TLP112 TLP109 recm'ed
Mini-flat
Mbit/s
(min)
2500 Vrms
TLP114A
MFSOP6 High version TLP112A TLP109 recm'ed DIP6 6-pin package version TLP550
Mbit/s
(min)
3750 Vrms
TLP512
Mbit/s
(min)
2500 Vrms
TLP550
DIP8 High
Mbit/s
(min)
(19% rank
2500 Vrms
TLP551
DIP8 Internal base connection
Mbit/s
(min)
(19% rank
2500 Vrms
TLP2403*
input current version TLP553
kbit/s
400% (min)
3750 Vrms
TLP553
DIP8 input drive current
kbit/s
400% (min)
2500 Vrms
TLP559
DIP8 High version TLP550
SHIELD
Mbit/s
(min)
2500 Vrms
TLP651
SHIELD
DIP8 Internal base connection
Mbit/s
(min)
(19% rank
5000 Vrms
TLP719 TLP719F
SDIP6 High
Mbit/s
(min)
5000 Vrms
TLP750 TLP750F
DIP8 High SEMKO-approved
Mbit/s
(min)
(19% rank
5000 Vrms
TLP751 TLP751F
DIP8 Internal base connection SEMKO-approved
Mbit/s
(min)
5000 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photocouplers Logic Signal Transmission Mbit/s (Typ.) (Continued)
Part Number Configuration
Features DIP8 IEC60950-compliant version TLP559 SEMKO-approved DIP8 Dual-channel version 6N135 TLP550
Data Rate (NRZ) (Typ.)
Safety Standards(2) UL/cUL
TLP759 TLP759F
SHIELD
Mbit/s
(min)
5000 Vrms
TLP2530
Mbit/s
(min)
2500 Vrms
TLP2531
DIP8 Dual-channel version 6N136 TLP550
Mbit/s
(min)
2500 Vrms
IPM-Drive Photocouplers
Part Number Configuration
Features (reinforced insulation) drive Topr 125°C (max)
Data Rate IFH, Output Form/CTR (NRZ) (Typ.) (Max)
Safety Standards(2) UL/cUL
SHIELD
TLP104
Open-collector
3750 Vrms
TLP2404
drive Topr 125°C (max) version TLP104 SDIP6 (reinforced insulation) drive Topr 125°C (max) High isolation voltage
SHIELD
Open-collector (Inverter logic)
3750 Vrms
SHIELD
TLP714 TLP714F
Open-collector (Inverter logic)
5000 Vrms
SHIELD
TLP754* TLP754F*
DIP8 drive
Open-collector
5000 Vrms
TLP109(IGM)
(reinforced insulation) drive High
SHIELD
(min)
3750 Vrms
TLP2409(IGM)*
SHIELD
drive High
Mini-flat
SHIELD
(min)
3750 Vrms
TLP114A(IGM)
MFSOP6 drive High TLP109(IGM) recm'ed
(min)
3750 Vrms
TLP559(IGM)
DIP8 drive High DIP8 drive High SEMKO-approved
SHIELD
(min)
2500 Vrms
TLP759(IGM) TLP759F(IGM)
SHIELD
(min)
5000 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
Data Rate (NRZ) (Typ.) IFH, (Max) Safety Standards(2) UL/cUL
JEDEC-Compliant Photocouplers
Part Number Configuration
Features
6N135
JEDEC-compliant
Mbit/s
(min)
2500 Vrms
6N136
JEDEC-compliant
Mbit/s
(min)
2500 Vrms
6N137
JEDEC-compliant
Mbit/s
700% (Typ.)
2500 Vrms
6N138
JEDEC-compliant High
kbit/s
300% (min)
2500 Vrms
6N139
JEDEC-compliant High
kbit/s
400% (min)
2500 Vrms
Note IEC:
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photocouplers IGBT/MOSFET Gate Drive
Package
Output Peak Current
SDIP6
0.25 0.45 (max) (max) (max) (max) (max)
DIP8 TLP557 TLP351 TLP351H*
TLP705 (High speed) TLP701 TLP701H* TLP700 TLP700H* TLP350 TLP350H* TLP358 TLP358H TLP151* TLP2451*
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative.
Photocouplers IGBT/MOSFET Gate Drive
Part Number Configuration
Features
Propagation Delay Time (Max)
Output
(Max)
Safety Standards UL/cUL
TLP151*
(reinforced Insulation) Creepage/clearance Isolation thickness
Peak output current (max): ±0.6
3750 Vrms
TLP2451*
Topr 125°C (max) Direct drive small-power IGBT/MOSFET High version TLP151 DIP8 Direct drive medium-power IGBT/MOSFET High power dissipation DIP8 Topr 125°C (max) Direct drive medium-power IGBT/MOSFET High DIP8 Direct drive medium-power IGBT/MOSFET power dissipation
Peak output current (max): ±0.6
3750 Vrms
TLP350 TLP350F
Peak output current (max): ±2.5
3750 Vrms
TLP350H* TLP350HF*
Peak output current (max): ±2.5
3750 Vrms
TLP351 TLP351F
Peak output current (max): ±0.6
3750 Vrms
TLP351H* TLP351HF*
DIP8 Topr 125°C (max) Direct drive small-power IGBT/MOSFET High DIP8 Direct drive medium-power IGBT/MOSFET High power dissipation DIP8 Topr 125°C (max) Direct drive medium-power IGBT/MOSFET High
Peak output current (max): ±6.0
3750 Vrms
TLP358 TLP358F
Peak output current (max): ±6.0
3750 Vrms
TLP358H* TLP358HF*
Peak output current (max): ±6.0
3750 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
Propagation Delay Time (Max) (Max) Safety Standards UL/cUL
Photocouplers IGBT/MOSFET Gate Drive (continued)
Part Number Configuration
Features
Output
TLP557
DIP8 Direct drive power transistor
Constant current output 0.25
2500 Vrms
TLP700 TLP700F
SDIP6 Direct drive medium-power IGBT/MOSFET power dissipation SDIP6 Topr 125°C (max) Direct drive medium-power IGBT/MOSFET High SDIP6 Direct drive medium-power IGBT/MOSFET power dissipation
Peak output current (max): ±2.0
5000 Vrms
TLP700H* TLP700HF*
Peak output current (max): ±2.0
5000 Vrms
TLP701 TLP701F
Peak output current (max): ±0.6
5000 Vrms
TLP701H* TLP701HF*
SDIP6 Topr 125°C (max) Direct drive small-power IGBT/MOSFET High SDIP6 Direct drive small-power IGBT/MOSFET High speed (250 kHz) power dissipation
Peak output current (max): ±0.6
5000 Vrms
TLP705 TLP705F
Peak output current (max): ±0.45
5000 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photorelays (1-Form-A 2-Form-A)
Package Features
Off-State Voltage (max) On-State On-State Resistance Current (max) (max)
USOP4
SSOP4 TLP3230 TLP3250 TLP3231 TLP3203
2.54SOP4 TLP3130 TLP3131
2.54SOP6
2.54SOP8
DIP4
DIP6
DIP8
0.22 0.05 0.13
0.16 0.45 0.08 0.12 0.12 0.14 0.25 0.07 0.35 0.04 0.12 0.35 1.25 0.08 0.05 0.11 0.12 0.12 0.15 0.12 0.09
TLP3100 TLP3213 TLP3216 TLP3240 TLP3241 TLP3214 TLP3215 TLP3375 TLP3312 TLP3110 TLP170A TLP172A TLP176A TLP3212 TLP225A TLP222A TLP227A TLP3122 TLP3542 TLP3218 TLP3217 TLP3219 TLP3118 TLP3111 TLP3119 TLP3121 TLP3120 TLP3220 TLP179D TLP170D TLP176D TLP170G TLP172G TLP174G TLP176G TLP176GA TLP199D TLP197D TLP192G TLP209D* TLP200D* TLP202G* TLP222G TLP224G TLP227G TLP222G-2* TLP224G-2* TLP597G TLP227G-2* TLP597GA TLP227GA-2* TLP797GA TLP598GA TLP798GA TLP224GA-2* TLP592G TLP797J TLP170J
Dual-channel MFSOP6
TLP3113 TLP3116
TLP3114 TLP3115 TLP3123 TLP173A**
TLP3275
TLP192A TLP197A
TLP202A* TLP206A*
0.15
TLP598AA TLP592A TLP222A-2* TLP597A TLP227A-2*
TLP206G* TLP197G TLP197GA TLP206GA* TLP227GA
TLP174GA TLP3125
TLP224GA
Selection Guide
(Max) (Max)
MOSFET-Output Photorelays, 1-Form-A USOP4 Package
Part Number Configuration
Features USOP4 COFF: (typ.) USOP4 COFF: (typ.)
(Max)
VOFF
Vrms Vrms
Safety Standards UL/cUL
TLP3312* TLP3375*
MOSFET-Output Photorelays, 1-Form-A SSOP4 Package
Part Number Configuration Features SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.)
(Max)
(Max)
(Max) 0.08 0.25 0.12 0.12 0.04 0.08 0.16 0.45 0.12 0.14
VOFF
1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms
Safety Standards UL/cUL
TLP3203 TLP3212 TLP3213 TLP3214 TLP3215 TLP3216 TLP3217 TLP3218 TLP3219 TLP3220 TLP3230 TLP3231 TLP3240 TLP3241 TLP3250 TLP3275
0.22
SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: 0.45 (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.) SSOP4 COFF: (typ.)
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative.
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
MOSFET-Output Photorelays, 1-Form-A 2.54SOP4 Package
Part Number Configuration 2.54SOP4 Features (Max) (Max)
(Max)
VOFF
1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 3750 Vrms
Safety Standards UL/cUL
TLP170A TLP170D TLP170G TLP170J TLP172A TLP172G
Lead pitch: 2.54 trigger current
2.54SOP4
Lead pitch: 2.54 trigger current
2.54SOP4
Lead pitch: 2.54 trigger current
2.54SOP4
Lead pitch: 2.54 trigger current
0.09
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
Lead pitch: 2.54 COFF: (typ.) Mini-flat
0.11
TLP173A
MFSOP6
trigger current
0.07
2.54SOP4
TLP174G
Lead pitch: 2.54 SEMKO-approved Current-limiting function Limit current:
0.12
1500 Vrms
2.54SOP4
TLP174GA
Lead pitch: 2.54 Current-limiting function Limit current:
0.12
1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms
TLP176A TLP176D
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
TLP176G
Lead pitch: 2.54 SEMKO-approved COFF: (typ.)
0.12
2.54SOP4
TLP176GA TLP179D
Lead pitch: 2.54 COFF: (typ.)
0.12
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.05
2.54SOP4
TLP3110 TLP3111 TLP3113 TLP3114 TLP3115 TLP3116 TLP3118
Lead pitch: 2.54 COFF: (typ.)
0.35
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.08
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.25
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.12
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.04
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
(Max) (Max)
MOSFET-Output Photorelays, 1-Form-A 2.54SOP4 Package (continued)
Part Number Configuration 2.54SOP4 Features (Max) VOFF 1500 Vrms 1500 Vrms 1500 Vrms Safety Standards UL/cUL
TLP3119 TLP3121
Lead pitch: 2.54 COFF: (typ.)
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
0.35
2.54SOP4
TLP3122
Lead pitch: 2.54 ION: (max)@Ta: 50°C COFF: (typ.)
2.54SOP4
TLP3123
Lead pitch: 2.54 ION: (max)@Ta: 50°C COFF: (typ.)
0.13
1500 Vrms 1500 Vrms 1500 Vrms
2.54SOP4
TLP3130 TLP3131
Lead pitch: 2.54 COFF: (typ.)
0.16
2.54SOP4
Lead pitch: 2.54 COFF: (typ.)
MOSFET-Output Photorelays, 1-Form-A 2.54SOP6 2.54SOP8 Package
Part Number Configuration 2.54SOP6 Features (Max) (Max)
(Max)
VOFF
1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms
Safety Standards UL/cUL
TLP192A TLP192G TLP197A TLP197D
Lead pitch: 2.54 COFF: (typ.)
2.54SOP6
Lead pitch: 2.54 COFF: (typ.)
0.11
2.54SOP6
Lead pitch: 2.54 COFF: (typ.)
2.54SOP6
Lead pitch: 2.54 COFF: (typ.)
2.54SOP6
TLP197G
Lead pitch: 2.54 SEMKO-approved
0.12
2.54SOP6
Lead pitch: 2.54 COFF: (typ.)
TLP197GA TLP199D TLP3100 TLP3120
0.12
2.54SOP6
Lead pitch: 2.54 COFF: (typ.)
0.05
0.05
2.54SOP6
Lead pitch 2.54mm ION: (max) @Ta: 50°C
2.54SOP6
Lead pitch 2.54mm ION: 1.25 (max)
0.15
1.25
TLP3125
2.54SOP8
Lead pitch: 2.54 COFF: (typ.)
1500 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
MOSFET-Output Photorelays, 2-Form-A 2.54SOP8 Package
Part Number Configuration 2.54SOP8 Features (Max) (Max)
(Max)
VOFF
1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms 1500 Vrms
Safety Standards UL/cUL
TLP200D TLP202A TLP202G
Lead pitch: 2.54 Dual-channel version TLP176D
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP172A
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP172G
0.11
TLP206A
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP176A
TLP206G TLP206GA TLP209D
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP176G
0.12
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP176GA
0.12
2.54SOP8
Lead pitch: 2.54 Dual-channel version TLP179D
0.05
MOSFET-Output Photorelays, 1-Form-A DIP4 Package
Part Number Configuration DIP4
COFF: (typ.)
Features
(Max)
(Max)
(Max)
VOFF
2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms
Safety Standards UL/cUL
TLP222A TLP222G TLP224G
DIP4
COFF: (typ.)
0.12
DIP4 SEMKO-approved
Current-limiting function Limit current:
0.12
DIP4 modems
TLP224GA
Current-limiting function Limit current:
0.12
TLP227A TLP227G TLP227GA
DIP4 SEMKO-approved
COFF: (typ.)
DIP4
SEMKO-approved COFF: (typ.)
0.12
DIP4
SEMKO-approved
0.12
TLP225A
DIP4
Designed output modules
2500 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
(Max) (Max)
MOSFET-Output Photorelays, 1-Form-A DIP6 Package
Part Number Configuration DIP6
COFF: (typ.)
Features
(Max)
VOFF
2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 5000 Vrms 5000 Vrms 5000 Vrms 2500 Vrms
Safety Standards UL/cUL
TLP592A TLP592G TLP597A TLP597G TLP597GA
DIP6
COFF: (typ.)
0.12
DIP6
SEMKO-approved COFF: (typ.)
DIP6
SEMKO-approved COFF: (typ.)
0.12
DIP6
SEMKO-approved COFF: (typ.)
0.12
TLP598AA
DIP6
COFF: (typ.)
TLP598GA TLP797GA TLP797GAF TLP797J TLP797JF TLP798GA TLP3542
DIP6 DIP6
COFF: (typ.)
0.15
0.12
DIP6
COFF: (typ.)
DIP6 DIP6
High output current: (max) COFF: (typ.)
0.15
MOSFET-Output Photorelays, 2-Form-A DIP8 Package
Part Number Configuration Features DIP8 Dual-channel version TLP222A DIP8 Dual-channel version TLP222G SEMKO-approved DIP8 Dual-channel version TLP224G SEMKO-approved DIP8 Current-limiting function Limit current:
(Max)
(Max)
(Max)
VOFF
2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms 2500 Vrms
Safety Standards UL/cUL
TLP222A-2
TLP222G-2
0.12
TLP224G-2
0.12
TLP224GA-2
0.12
TLP227A-2
DIP8 Dual-channel version TLP227A SEMKO-approved DIP8 Dual-channel version TLP227G SEMKO-approved DIP8 Dual-channel version TLP227GA SEMKO-approved
TLP227G-2
0.12
TLP227GA-2
0.12
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 Note IEC: Approved (supplementary basic insulation) 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photorelays (1-Form-B, 2-Form-B 1-Form-A/1-Form-B)
Package Features
Off-State On-State On-State Voltage Resistance Current (max) (max) (max) 1-Form-B, 2-Form-B 0.09 0.10 0.12 0.15 0.09 0.10 0.12
2.54SOP4 TLP4172G TLP4176G
2.54SOP6 TLP4192G TLP4197G
2.54SOP8 TLP4202G*
DIP4
DIP6
DIP8
TLP4222G TLP4206G* TLP4227G TLP4027G* TLP4026G*
TLP4592G TLP4597G
TLP4222G-2* TLP4227G-2* TLP4007G* TLP4006G*
Dual-channel
MOSFET-Output Photorelays, 1-Form-B
Part Number Configuration
1-Form-A/ 1-Form-B
Features 2.54SOP4
(Max)
(Max)
(Max)
VOFF
Safety Standards UL/cUL
TLP4172G
Lead pitch: 2.54 1-Form-B
0.09
1500 Vrms
2.54SOP6
TLP4192G
Lead pitch: 2.54 1-Form-B
0.09
1500 Vrms
TLP4222G
DIP4
1-Form-B
2500 Vrms
TLP4592G
DIP6
1-Form-B
2500 Vrms
2.54SOP4
TLP4176G
Lead pitch: 2.54 1-Form-B
0.12
1500 Vrms
2.54SOP6
TLP4197G
Lead pitch: 2.54 1-Form-B
0.12
1500 Vrms
DIP4
TLP4227G
1-Form-B SEMKO-approved
0.15
2500 Vrms
DIP6
TLP4597G
1-Form-B SEMKO-approved
0.15
2500 Vrms
Note IEC:
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
MOSFET-Output Photorelays, 2-Form-B
Part Number Configuration 2.54SOP8 Features (Max) (Max)
(Max)
VOFF
Safety Standards UL/cUL
TLP4202G
Lead pitch: 2.54 Dual-channel version TLP4172G 2-Form-B
0.09
1500 Vrms
DIP8
TLP4222G-2
Dual-channel version TLP4222G 2-Form-B
2500 Vrms
2.54SOP8
TLP4206G
Lead pitch: 2.54 Dual-channel version TLP4176G 2-Form-B
0.12
1500 Vrms
DIP8
TLP4227G-2
Dual-channel version TLP4227G 2-Form-B SEMKO-approved
0.15
2500 Vrms
MOSFET-Output Photorelays, 1-Form-A/1-Form-B
Part Number Configuration 2.54SOP8 Features (Max) (Max)
(Max)
VOFF
Safety Standards UL/cUL
TLP4027G
Lead pitch: 2.54 1a1b (N.C. N.O.)
(Form-A) 0.09 (Form-B) (Form-A) (Form-B)
1500 Vrms
TLP4007G
DIP8
1a1b (N.C. N.O.)
2500 Vrms
2.54SOP8
TLP4026G
Lead pitch: 2.54 1a1b (N.C. N.O.)
(Form-A) 0.12 (Form-B) (Form-A) 0.12 (Form-B)
1500 Vrms
TLP4006G
Note IEC:
DIP8
1a1b (N.C. N.O.)
2500 Vrms
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Triac-Output Photocouplers
Package
Features
MFSOP6
VDRM Isolation voltage 2500 Vrms 5000 Vrms
DIP6
DIP4/8/16
TLP160G
TLP161G
TLP560G TLP561G TLP3022(S) TLP3042(S) TLP3023(S) TLP3043(S) TLP560J TLP561J
TLP525G/-2/-4
TLP160J TLP165J
2500 Vrms
TLP161J TLP163J TLP166J TLP261J TLP168J
3000 Vrms 3750 Vrms 4000 Vrms 5000 Vrms
TLP260J
TLP265J* TLP762J TLP3052(S) TLP763J TLP3762(S) TLP3062(S) TLP3063(S) TLP3064(S) TLP3082(S) TLP3782(S) TLP3783(S) TLP360J TLP361J TLP363J
TLP266J*
5000 Vrms
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative.
NZC: Non-zero cross Zero cross
Triac-Output Photocouplers Solid State Relays (SSRs)
Part Number Configuration
Features
Mini-flat
(Max) Rank IFT7 IFT5 IFT7 IFT5 IFT7 IFT7
V(Max) @I
VDRM
UL/c-UL
Safety Standards
TLP160G
MFSOP6
Non-zero cross
2500 Vrms
Mini-flat
TLP161G
MFSOP6
Zero cross
2500 Vrms
TLP160J TLP165J
Mini-flat
MFSOP6
Non-zero cross Mini-flat
2500 Vrms
TLP161J TLP166J TLP168J
MFSOP6
Zero cross Mini-flat
2500 Vrms
MFSOP6
Zero cross trigger current Mini-flat
2500 Vrms
MFSOP6
TLP163J
Zero cross High impulse noise immunity VN=2000 (typ.)
2500 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details.
Note IEC: Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
(Max) Rank V(Max) @ISafety Standards
Triac-Output Photocouplers Solid State Relays (SSRs) (continued)
Part Number Configuration
Features
Mini-flat
VDRM
UL/c-UL
TLP260J
MFSOP6
Non-zero cross
3000 Vrms
Mini-flat
TLP261J
MFSOP6
Zero cross
3000 Vrms
(reinforced insulation)
Non-zero cross version TLP165J
TLP265J*
3750 Vrms
(reinforced insulation)
Zero cross version TLP166J
TLP266J*
3750 Vrms
Triac-Output Photocouplers Office Equipment
Part Number Configuration
Features
(Max) Rank IFT7
V(Max) @I
VDRM
Safety Standards UL/c-UL
TLP360J TLP360JF
DIP4
Non-zero cross
IFT7
5000 Vrms
TLP361J TLP361JF
DIP4
Zero cross
5000 Vrms
DIP4
Zero cross High impulse noise immunity 2000 (typ.)
TLP363J TLP363JF
5000 Vrms
Triac-Output Photocouplers Lines
Part Number Configuration
Features
(Max) Rank
V(Max) @I
VDRM
UL/c-UL
Safety Standards
TLP525G
DIP4
2500 Vrms
DIP8
TLP525G-2
Dual-channel version TLP525G
2500 Vrms
DIP16
TLP525G-4
4-channel version TLP525G
2500 Vrms
DIP6
General-purpose Non-zero cross
2500 Vrms
TLP560G
IFT7 IFT5
*Under development. Specifications subject change without notice. latest information, please contact your nearest Toshiba sales representative. Note IEC: Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Triac-Output Photocouplers Lines (continued)
Part Number Configuration
Features
(Max) Rank
V(Max) @I
VDRM
UL/c-UL
Safety Standards
DIP6
TLP561G
General-purpose Zero cross
IFT7 IFT5
2500 Vrms
DIP6
TLP3022(S) TLP3022F(S)
Direct replacement XXX3020/3021/3022 SEMKO-approved Non-zero cross
5000 Vrms
DIP6
TLP3023(S) TLP3023F(S)
Direct replacement XXX3023 SEMKO-approved Non-zero cross
5000 Vrms
DIP6
TLP3042(S) TLP3042F(S)
Direct replacement XXX3040/3041/3042 SEMKO-approved Zero cross
5000 Vrms
DIP6
TLP3043(S) TLP3043F(S)
Direct replacement XXX3043 SEMKO-approved Zero cross
5000 Vrms
Triac-Output Photocouplers Line
Part Number Configuration
Features DIP6
(Max) Rank
V(Max) @I
VDRM
UL/c-UL
Safety Standards
TLP560J
General-purpose Non-zero cross
IFT7 IFT7
2500 Vrms
DIP6
TLP561J
General-purpose Zero cross
2500 Vrms
DIP6
TLP762J TLP762JF
Internal creepage: (min) SEMKO-approved Non-zero cross-on
4000 Vrms
TLP763J TLP763JF
DIP6
Internal creepage: (min) SEMKO-approved Zero cross
4000 Vrms
DIP6
TLP3052(S) TLP3052F(S)
High VDRM SEMKO-approved Non-zero cross-on
5000 Vrms
Note IEC:
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
(Max) Rank V(Max) @I3V Safety Standards
Triac-Output Photocouplers Line (continued)
Part Number Configuration DIP6 Features VDRM UL/c-UL
TLP3062(S) TLP3062F(S) TLP3063(S) TLP3063F(S) TLP3064(S) TLP3064F(S) TLP3762(S) TLP3762F(S)
SEMKO-approved High VDRM Zero cross
5000 Vrms
DIP6
SEMKO-approved High VDRM Zero cross
5000 Vrms
DIP6
SEMKO-approved trigger current Zero cross
5000 Vrms
DIP6
Zero cross High impulse noise immunity 2000 (typ.)
5000 Vrms
TLP3082(S) TLP3082F(S) TLP3782(S) TLP3782F(S) TLP3783(S) TLP3783F(S)
Note IEC:
DIP6
Zero cross
5000 Vrms 5000 Vrms 5000 Vrms
DIP6
High impulse noise immunity 1500 (typ.) Zero cross
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Thyristor-Output Photocouplers
Package Features
VDRM Isolation voltage 2500 Vrms 2500 Vrms 4000 Vrms
Replacement Devices
Device Discontinued Devices
MFSOP6 TLP148G
DIP6
DIP8
TLP148G TLP548J TLP549J TLP748J
TLP141G TLP541J TLP545J TLP542G TLP543J TLP641G/J TLP741G/J
TLP747G/J
TLP548J TLP748J
TLP549J
discontinued devices exactly identical terms electrical characteristics. device replacement, hardware evaluation must performed real-world environment. V(Max) @ISafety Standards
Part Number
Configuration
Features
(Max)
VDRM
UL/cUL
Mini-flat
TLP148G
MFSOP6
1.45
2500 Vrms
TLP548J
DIP6
trigger current
1.45
2500 Vrms
DIP8
Long anode-cathode distance (SCR)
TLP549J
1.45
2500 Vrms
TLP748J TLP748JF
DIP6
SEMKO-approved
1.45
4000 Vrms
Note IEC:
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Photovoltaic-Output photocouplers
Package
Features
Short-Circuit Current
*Built-in shunt resistor
Open Voltage
SSOP4
1500 Vrms
MFSOP6
2500 Vrms
DIP6
TLP3904 TLP3914
TLP3902 TLP190B TLP191B*
TLP590B TLP591B*
TLP3924
Part Number
Configuration
Features
Short-Circuit Current (Min) Rank
Open-Circuit Voltage (Min)
Safety Standards UL/cUL
TLP190B
Mini-flat MFSOP6
2500 Vrms
TLP191B
Mini-flat MFSOP6 Built-in shunt resistor
2500 Vrms
DIP6
2500 Vrms
TLP590B
DIP6 Built-in shunt resistor
2500 Vrms
TLP591B
TLP3902
Mini-flat MFSOP6
2500 Vrms
TLP3904
SSOP4
1500 Vrms
TLP3914
SSOP4
1500 Vrms
TLP3924
SSOP4 High open-circuit voltage
1500 Vrms
Note IEC:
Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative.
Selection Guide
Products Manufactured Toshiba Semiconductor (Thailand) Co., Ltd. (TST)
Part Number Configuration
Features
Mini-flat
VCEO
Minute 3750 Vrms
c-UL
Safety Standards
TLP180
MFSOP6
input SEMKO-approved Mini-flat
TLP181
MFSOP6
Transistor output General-purpose
3750 Vrms
SOP4
TLP280
Lead pitch 1.27 input
2500 Vrms
SOP4
Lead pitch 1.27 General-purpose SEMKO-approved
TLP281
2500 Vrms
SOP4 (reinforced insulation)
Lead pitch 1.27 Creepage/clearance Isolation thickness input
TLP284
3750 Vrms
SOP4 (reinforced insulation)
Lead pitch 1.27 Creepage/clearance Isolation thickness SEMKO-approved
TLP285
3750 Vrms
DIP4
TLP521-1
Transistor output General-purpose
2500 Vrms
DIP8
TLP521-2
Dual-channel version TLP521-1(T)
2500 Vrms
DIP4
Transistor output input SEMKO-approved
TLP620
5000 Vrms
DIP8
Dual-channel version TLP620(T) SEMKO-approved
TLP620-2
5000 Vrms
DIP4
Transistor output High isolation voltage SEMKO-approved
TLP621
5000 Vrms
DIP8
Dual-channel version TLP621(T) SEMKO-approved
TLP621-2
5000 Vrms
DIP4
Darlington transistor output High VCEO SEMKO-approved
TLP627
5000 Vrms
DIP8
Dual-channel version TLP627(T) SEMKO-approved
TLP627-2
5000 Vrms
Note EN60747-5-2 safety standard compact packages different from that standard packages. Since mini-flat package compact package, please contact your nearest Toshiba sales representative more details. Note IEC: Approved (supplementary basic insulation) Approved (reinforced insulation) Design which meets safety standard/approval pending January 2010 60065- 60065-approved, 60950- 60950-approved Design which meets safety standard/approval pending January 2010 VDE: Approved 60747-5-2-approved with option latest information, please contact your nearest Toshiba sales representative. Some photocouplers with triac output also manufactured Toshiba Semiconductor Thailand Co.,Ltd. detailed information, please contact your nearest Toshiba sales representative.
Part Naming Conventions
Transistor-Output, Darlington-Transistor-Output IC-Output Photocouplers
Part number
RoHS COMPATIBLE Revision code revision code added identify revision device. details, contact your nearest Toshiba sales representative. Lead form option packages Select lead form options shown page Carrier tape option Select carrier tape options shown pages
Wide-spaced leads Specify this option, necessary.
Safety standard option Specify either "D4" "V4" EN60747-5-2-approved devices.
rank respective datasheets.
Example TLP781(D4-GB-TP6,F Example TLP781F(GR,F) [D4] EN60747-5-2 option Wide-spaced leads [GB] rank [GR] rank [TP6] lead form [,F] RoHS COMPATIBLE* Tape-and-reel packing [,F] RoHS COMPATIBLE* right parenthesis omitted limit number characters.
Triac-Output Thyristor-Output Photocouplers
Part number VDRM Wide-spaced leads Safety standard option
RoHS COMPATIBLE* Revision code Lead form option packages Carrier tape option
Example TLP361J(D4-IFT7-TP1,S,F)
TLP361J(D4T7TP1S,F)
rank character: rank specified IFTx: example, IFT5 denotes 5-mA rank. available ranks differ from product product. datasheets. (Abbreviated limit number characters.) VDRM: [D4] EN60747-5-2 option
[IFT7] [T7] [TP1] lead form Tape-and-reel packing [,S] Revision code: [,F] RoHS COMPATIBLE*
Photorelays
Part number VOFF Some photorelays have VOFF code their names. respective datasheets. Wide-spaced leads Safety standard option
RoHS COMPATIBLE* Revision code Lead form option packages Carrier tape option
Example TLP3110(TP,F) Example TLP227A(TP1,F) [TP] Tape-and-reel packing VOFF: [TP1] lead form [,F] RoHS COMPATIBLE* Tape-and-reel packing [,F] RoHS COMPATIBLE*
identifies indication product Labels with "[[G]]/RoHS COMPATIBLE".
Please contact your TOSHIBA sales representative details environmental matters such RoHS compatibility Product. RoHS Directive 2002/95/EC European Parliament Council January 2003 restriction certain hazardous substances
electrical electronic equipment. Note: length part names limited characters. Longer names abbreviated omitting character and/or using shorthand symbols. However, sure give full part names when have inquiries. details, please contact your nearest Toshiba sales representative.
Package Information
Lead Form Options Packages
DIP4, DIP6, DIP8 DIP16 packages offer three surface-mount lead form options wide-spaced lead form option. electrical characteristics identical, regardless these options.
Lead Form Surface-Mount Wide-Spaced
Appearance
Lead Form Code Carrier Tape Code
(LF1) (TP1)
4-pin 8-pin
(LF4) (TP4)
(LF5) (TP5)
(LF2) available*
10.16
6-pin
16-pin
Package Outlines
Dimensions
Version Dimension (LF1) 10.0 (LF4) 12.0
Unit: (LF5) 10.0
(0.35 typ.)
(0.25 typ.)
other package dimensions same each standard package specification.
Tape-and-reel packing available with (LF2).
Example Standard part: TLP621(F) Surface-mount option: TLP621(LF1,F): Packed stick magazines (see page 49). Surface-mount tape-and-reel options: TLP621(TP1,F): Packed tape-and-reel (see page 51). Standard part names should used when applying safety standard approval. package dimensions lead form options TLP781 differ from those shown above. TLP781 datasheet.
Package Dimensions (4-Pin DIP)
Standard
0.25
DIP4
Unit:
DIP4 (LF1) (TP1)
Unit:
0.25
3.65 +0.15 -0.25
4.58 0.25
7.62 0.25
7.62 0.25 3.65 +0.15 -0.25 -0.20
Unit:
+0.25
4.58 0.25 0.25
0.15 2.54 0.25
0.25 -0.05
+0.1
0.15 7.85 8.80 2.54 0.25
10.0
DIP4 (LF2)
Unit:
DIP4 (LF4) (TP4)
0.25
3.65 -0.25
+0.15
4.58 0.25 3.65 +0.15 -0.25
7.62 0.25
0.15 2.54 0.25
0.25
2.54 0.25
12.0
DIP4 (LF5) (TP5)
0.25
Unit:
+0.15
3.65 -0.25
4.58 0.25
7.62 0.25 0.25 -0.05
+0.1
2.54 0.25
0.15
10.0
3.85 -0.2
+0.25
+0.1
0.75 0.25
0.25 -0.05
0.25 -0.05
+0.1
0.15
0.15
+0.25 -0.2
4.58 0.25
10.16 0.25 7.62 0.25
0.25
Package Information
Package Dimensions (6-Pin DIP)
Standard
0.25
DIP6
Unit:
DIP6 (LF1) (TP1)
Unit:
0.25
3.65 -0.25
+0.15
7.62 0.25
+0.15
3.65 -0.25
7.12 0.25
7.12 0.25
7.62 0.25
0.25
0.25 -0.05
7.85 8.80 2.54 0.25 0.15 10.0
+0.1
2.54 0.25
0.15
DIP6 (LF2)
Unit:
DIP6 (LF4) (TP4)
Unit:
0.25
0.25
3.65 -0.25
+0.15
3.65 -0.25
+0.15
7.12 0.25
7.62 0.25 0.25 -0.05
+0.1
0.25
0.25 -0.05
+0.1
2.54 0.25 0.15
0.75 0.25 12.0
2.54 0.25
0.15
DIP6 (LF5) (TP5)
Unit:
0.25
3.65 -0.25
+0.15
7.12 0.25
7.62 0.25
+0.1 0.25 -0.05
2.54 0.25 0.15
10.0
3.85 -0.2
+0.25
-0.2
7.12 0.25
+0.25
10.16 0.25 7.62 0.25
-0.20
+0.25
Package Dimensions (8-Pin DIP)
Standard
0.25
DIP8
Unit:
DIP8 (LF1) (TP1)
Unit:
0.25
+0.15 -0.25
7.62 0.25
+0.15 -0.25
9.66 0.25
0.15 2.54 0.25
0.25
0.25 -0.05
+0.1
3.65
9.66 0.25
7.62 0.25
2.54 0.25 0.15 10.0
7.85 8.80
DIP8 (LF2)
0.25
Unit:
DIP8 (LF4) (TP4)
Unit:
0.25
3.65
3.65
9.66 0.25
7.62 0.25 0.25 -0.05
+0.1
0.25
0.75 0.25 0.25 -0.05 2.54 0.25
+0.1
2.54 0.25 0.15
0.15
12.0
DIP8 (LF5) (TP5)
Unit:
0.25
3.65 -0.25
+0.15
9.66 0.25
7.62 0.25 0.25 -0.05
+0.1
2.54 0.25 0.15 10.0
3.85 +0.25 -0.20
-0.2
9.66 0.25
10.16 0.25 7.62 0.25
+0.15 -0.25
+0.15 -0.25
+0.25
+0.25 -0.20
3.65
Package Information
Package Dimensions (Other Packages)
5-pin DIP6
0.25
Unit:
5-pin DIP6 (LF2)
0.25
Unit:
3.65 -0.25
+0.15
0.25
0.25 -0.05
7.85 8.80 2.54 0.25 0.15
+0.1
0.25
3.65 -0.25
7.12 0.25
+0.15
7.12 0.25
7.62 0.25
10.16 0.25 7.62 0.25
2.54 0.25
0.15
0.25 -0.05
+0.1
5-pin (with Cut)
0.25
Unit:
DIP16
0.25
Unit:
3.65 -0.25
7.62 0.25 19.82 0.25
3.65 -0.25
+0.15
7.12 0.25
+0.15
7.62 0.25
0.25
0.25 -0.05
7.85 8.80 2.54 0.25 0.15
+0.1
0.25
0.25 -0.05
+0.1
2.54 0.25
0.15
7.85 8.80
Package Dimensions (Surface Mount)
Unit:
3.95 0.25
Unit:
4.55 0.25 0.15
0.25 0.15 0.15
1.27 2.54
1.27 0.15 0.38
0.305
Package Dimensions (Surface Mount)
SDIP6
4.58 0.25
Unit:
(continued) SDIP6 type)
4.58 0.25
Unit:
+0.15 -0.25
+0.25 -0.20
+0.15 -0.25
3.65
3.65
7.62 0.25 0.25 -0.05
+0.10
7.62 0.25 -0.05
+0.10
1.27
1.25
1.27
0.75 0.25 11.7
4-pin MFSOP6
Unit:
5-pin MFSOP6
Unit:
0.15
0.15
2.54
1.27 2.54
4-pin MFSOP6 (with Cut)
Unit:
SOP4
Unit:
0.15
0.25 0.15
1.27 2.54
1.27
0.25
+0.25 -0.20
Package Information
Package Dimensions (Surface Mount) (continued)
2.54SOP4
Unit:
2.54SOP6
Unit:
0.25
0.25
0.25
0.15
0.25
0.15
2.54 0.25
2.54 0.25
2.54SOP8
Unit:
SOP16
Unit:
0.25
0.15 0.15 1.27
0.25
10.3 0.25
2.54 0.25
SSOP4
Unit:
USOP4
Unit:
3.65 0.15
3.25
0.25
2.05 1.65
1.27 2.04
0.35
1.27
0.46
Unless Otherwise Specified, Tolerance ±0.2
Rank Marking
Transistor-output photocouplers ranked according their ranges, whereas thyristor-output triac-output photocouplers ranked according their maximum value. following gives rank classifications rank marks printed packages. Note that rank classifications differ from product product. details, please refer relevant technical datasheets.
Rank Name Rank Marking
Available Rank Selection Available, Contact Toshiba)
Part Number Rank Name None Rank Marking Group
TLP180 TLP181 TLP280 TLP280-4 TLP281 TLP281-4 TLP521-1 TLP521-2 TLP521-4 TLP531/532 TLP620 TLP620-2 TLP620-4 TLP621 TLP621-2 TLP621-4 TLP630 TLP631/632 TLP731/732 TLP733F/734F
Part Marking when Rank Specified
Rank Name Rank Other than TLP421 TLP421 right-side tables Blank,Y,Y+,YE, G,G+,GR,B,B+, BL,GB Part Number None Rank Marking Group Part Number None Rank Marking Group
None
600% 150% 300% 600% 600% 200% 300%
TLP180 TLP280 TLP521-2 TLP531/532 TLP620 TLP621-2 TLP630 TLP181 TLP281 TLP521-1 TLP531 TLP621 TLP631 TLP632 TLP731 TLP732 TLP733F TLP734F
Blank, Blank,
TLP280-4 TLP281-4 TLP521-4 TLP620-2 TLP620-4 TLP621-4
Blank,
Package Information
Trigger Current (IFT) Ranking Marking
Rank Name None Rank Marking Blank, (only photorelays)
Marking Examples
4-pin mini-flat 1-channel type
Part number minus "TL" rank marking
Example: TLP626: P626
TLP521-1: P521 TLP181: P181
P521
TLP521-1
TLP421, TLP421F
(Monthly code) P421F
Part number (P421 P421F)
rank marking TLP280, TLP281 rank marking
P280
Part number (P280 P281)
Others
Examples: TLP521-2: TLP521-2
Part number rank marking
TLP521-2
TLP666GF: TLP666GF
TLP521-2
Note: When ordering standard photocoupler, rank parentheses standard part number. Examples: TLP521-1(GB) TLP532(GR) standard part number when applying safety standard approval. Example Part number TLP621(GR) this part number TLP621
Packing Information
Photocoupler Magazine Packing Specifications
Standard
Unit:
DIPs with LF1, LF2, Lead Forming
Unit:
10.3
10.3 11.3
Magazine Dimensions
Length Thickness
Length Thickness
Device Quantities Magazine
Package Count Quantity (pcs)
Packing Dimensions
Number Magazines
Dimensions
Label Position
Number Magazines
Dimensions
Label Position
Packing Information
Mini-Flat Coupler (MFP)
Unit: 10.5
Photocoupler
Unit: (0.8)
10.5
Magazine Dimensions
Length Thickness
Length Thickness
Package Count
(SOP4) (2.54SOP4)
(SOP16) (2.54SOP6) (2.54SOP8)
Device Quantities Magazine
Package Count Quantity (pcs)
(MFSOP6)
Quantity (pcs) Package Count Quantity (pcs)
Packing Dimensions
Number Magazines
Dimensions
Label Position
Photocoupler Package Type
Typical Devices
MFSOP6 SOP4 SOP16
TLP114A, TLP160J, TLP180, TLP190B TLP280, TLP281 TLP280-4, TLP281-4, TLP270D, TLP270G TLP176G, TLP176A TLP197G TLP206G, TLP206A
2.54SOP4 2.54SOP6 2.54SOP8
Tape-and-Reel Specifications
tape specifications differ photocouplers manufactured Thailand.
Embossed Tape Specifications Surface-Mount Lead Form Options
Photocoupler Package Types MFSOP6, SOP4 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 SDIP6 DIP(LF1, LF5) DIP(LF4) Tape Option Symbol (TPL) (TPR) (TP) (TP) (TP) (TP) (TP) (TP15) (TP) (TP1) (TP5) (TP4) Typical Devices
TLP114A, TLP165J, TLP181, TLP190B TLP280, TLP281 TLP280-4, TLP281-4 TLP176G, TLP176A, TLP176D TLP197G TLP200D,TLP206A,TLP206G TLP3212 3217, TLP3230 TLP3250 TLP701, TLP705, TLP719 TLP550, TLP560G, TLP421 TLP560G
Tape Dimensions
Unit:
Unit: Photocoupler Package Type Tape Option Symbol (See figure above) Typical devices DIP4 DIP6 (short package) DIP8 3.15 0.05 Dimensions
MFSOP6
(TP)
SOP4 (TP)
SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 (TP) (TP)
SDIP6 (TP)
SDIP6 type (TP)
DIP(LF1, LF5) DIP(LF4) (TP1), (TP5)
10.4
(TPL), (TPR) (TPL), (TPR)
(TP)
(TP)
(TP15)
(TP4)
12.3
10.5
10.5
2.35 10.4 12.3 12.0
12.0
16.0 12.0
16.0 1.75
16.0
12.0
12.0
12.0 16.0
12.0
16.0
4.55 0.05
TLP620 TLP631, TLP734, TLP747G TLP555, TLP2601
10.1 (TP4) available
Packing Information
Reel Dimensions
Unit: Photocoupler Package Type Tape Option Symbol (See figure above) Dimensions
MFSOP, (TPL), (TPR)
SOP4 (TP)
SOP16 (TP)
2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 (TP) (TP15)
17.5 21.5 15.4
SDIP6 (TP)
SDIP6 type DIP(LF1, LF5) DIP(LF4) (TP) (TP1), (TP5)
17.5 21.5
(TP4)
13.5 17.5
17.5 21.5
13.5 17.5
Photocouplers Manufactured Thailand
Photocoupler Package Type Tape Option Symbol (See figure above) Dimensions
MFSOP (TPL), (TPR)
DIP6(LF1,LF5,LF4) (TP1), (TP5), (TP4)
DIP4(LF1,LF5,LF4) (TP1), (TP5), (TP4)
DIP8(LF1,LF5) (TP1), (TP5)
13.5 17.5
17.5 21.5
Other Packing Information
Device orientation tape
Photocouplers oriented cavity, shown below.
User direction feed
Photocoupler Package Type
Tape Option
MFSOP6,
Photocoupler Package Type
Tape Option TP15
MFSOP6, SOP4, 2.54SOP4 SSOP4
Photocoupler Package Type
Tape Option TP1,
SOP16, 2.54SOP6/8 SDIP6 DIP(LF1, LF5) DIP(LF4)
Tape Specifications
Quantities Reel
Photocoupler Package Type Quantity (pcs)
MFSOP6, SOP4.
3000 2500
SOP16
2500
2.54SOP4/6/8
2500
SSOP4
1500
SDIP6
1500
SDIP6 type DIP(LF1, LF5) DIP(LF4)
1000 1500 1000
Photocouplers Manufactured Thailand
Photocoupler Package Type Quantity (pcs)
MFSOP
3000
DIP4/6(LF1,LF5)
1500
DIP4/6(LF4)
1000
DIP8(LF1,LF5)
1000
Empty Cavities
Item Consecutive empty cavities Non-consecutive empty cavities Specification Zero 0.2% max/reel Note 40-mm portion tape except leader trailer. Except leader trailer.
max/reel SDIP packages
Packing boxes
five reels five reels photocouplers manufactured Thailand
Purchase order
Specify part number, tape quantity follows.
Example
TLP181(GB-TPR, 3000 units
Quantity
Label
reel label includes following information: Part number Tape type Quantity number
RoHS COMPATIBLF
Tape option rank Photocoupler part number
Must multiple quantity per-reel. identifies indication product Labels with "[[G]]/RoHS COMPATIBLE". Please contact your TOSHIBA sales representative details environmental matters such RoHS compatibility Product. RoHS Directive 2002/95/EC European Parliament Council January 2003 restriction certain hazardous substances
electrical electronic equipment.
Board Assembly
Example Land Patterns
Below example land patterns surface-mount packages.
Mini-flat couplers
Unit:
1.27 0.95 Unit: 1.27 1.27 10.4
1.27
1.27
3.73
SSOP4 [e.g., TLP3213] 2.54 MFSOP6 (4-Pin) [e.g., TLP181] 2.54SOP4 [e.g., TLP197G] (4-Pin) [e.g., TLP265J] 2.54 MFSOP6 (5-Pin) [e.g., TLP114A] 1.27 SOP4 [e.g., TLP280]
1.27
1.27
1.27
1.27
1.27
2.54 (5-Pin) [e.g., TLP109]
[e.g., TLP2105]
Surface-Mount Lead-Formed Photocouplers
Example: 6-pin package
Unit:
Example: 6-pin SDIP package
1.27 1.27 SDIP6 [e.g., TLP719]
2.54
2.54 2.54 2.54
(LF1)&(LF5) [e.g., TLP734(LF1)]
(LF4) [e.g., TLP734(LF4)]
10.4
SDIP6 type) [e.g., TLP719F]
example land patterns TLP781, datasheet.
Board Assembly Considerations
Soldering
When using soldering iron medium infrared ray/hot reflow, avoid rise device temperature much possible observing following conditions. 1.1) Using soldering iron Solder once within seconds lead temperature 260°C. Solder once within seconds lead temperature 350°C. 1.2) Using medium infrared ray/hot reflow Complete infrared ray/hot reflow process once within seconds package surface temperature between 210°C 240°C. Example temperature profile lead (Pb) solder
(°C) Package surface temperature
Flux Cleaning
When cleaning circuit boards remove flux, make sure that residual reactive ions such sodium(Na+) chloride(Cl-) ions remain. Note that organic solvents react with water generate hydrogen chloride other corrosive gases, which degrade device performance. Washing devices with water will cause problems. However, make sure that reactive ions such sodium(Na+) chloride(Cl-) ions left residue. Also, sure devices sufficiently after washing. device markings with brush with your hand during cleaning while devices still from cleaning agent. Doing markings. cleaning, shower cleaning steam cleaning processes involve chemical action solvent. only recommended solvents these cleaning methods. When immersing devices solvent steam bath, make sure that temperature liquid 50°C below that circuit board removed from bath within minute. device package allows ultrasonic cleaning, keep duration ultrasonic cleaning short possible, since long hours ultrasonic cleaning degrade adhesion between mold resin frame material.
seconds
seconds less
Time
following ultrasonic cleaning conditions recommended.
Frequency: Ultrasonic output power: less (0.25 W/cm2 less) Cleaning time: seconds less
Suspend circuit board solvent bath during ultrasonic cleaning such that ultrasonic vibrator does come into direct contact with circuit board device. Conventional cleaning solvents that contain freon recommended adverse effection earth's ozone layer. Alternative freon-free products available market. Some these alternative cleaning agents listed table below. Contact Toshiba Toshiba distributor regarding cleaning conditions other relevant information each product type.
Example temperature profile lead (Pb) solder
Example temperature profile lead (Pb)-free solder profile below shows only typical temperature profile conditions, which might apply Toshiba photocouplers. Temperature profiles conditions differ from product product. Refer relevant technical datasheets databooks when mounting device.
(°C) Package surface temperature
Examples Alternative Cleaning Agents
Technocare Asahi Clean
seconds seconds Time
FRW-1, FRW-17, FRV-100 AK-225AES 750H ST-100S, ST-100SX
Toshiba Silicon Asahi Glass Co., Co., Ltd. Arakawa Chemical Co., Ltd.
Clean Through Pine Alpha
Example temperature profile lead (Pb)-free solder
Precautions heating Keeping packages high temperature long period time degrade quality reliability devices. Soldering time kept short possible avoid rise package temperature. When using halogen lamp infrared heater, avoid direct irradiation packages, since this cause rise package temperature. 1.3) soldering (flow soldering) thermal shock soldering increases thermal stress devices. avoid stress, soldering iron medium infrared ray/hot reflow recommended. want soldering, contact your nearest Toshiba sales representative.
Device Degradation
Projected Operating Life Based Light Output Degradation
Toshiba photocouplers three types LEDs projection operating life been made each LED. table page shows types used photocouplers figures pages show projections long-term light output performance operating life. Note that these operating life data estimates extrapolated from long-term light output degradation over single wafer shown reference only.
Projected Operating Life 40°C, failure criteria: degradation rate -50% F50% operating life F0.1% operating life Mainly phototransistor output devices 1,300,000 260,000 phototriac output devices
Photocouplers
GaAs
As(SH)
540,000
100,000
Mainly photo-IC couplers
As(DH)
1,000,000
200,000
Mainly photorelays (MOSFET output), photovoltaic couplers photo-IC couplers
F50% (cumulative failure rate 50%) operating life: Time period until projected long-term light output degradation curve average light output change shown pages reaches failure criteria. F0.1% (cumulative failure rate 0.1%) operating life: Time period until projected long-term light output degradation curve shown pages reaches failure criteria. relationship between light output degradation optical coupling characteristics shown below. relationship between light output degradation current transfer ratio (CTR)/short circuit current (ISC) 1:1.
relationship between reciprocal value light output degradation FT/I FLH/I FHL/I change 1:1.
estimate operating life from graph
Example: Estimate operating life from GaAs projected operating life data (failure criteria -50%) page ambient temperature 25°C Calculate absolute temperature. 25°C Calculate reciprocal value calculated value. 1/298 3.36 10-3 Read data from graph. Projected operating life 25°C, (failure criteria: light output degradation -50%) F50% (cumulative failure rate 50%) operating life: Approximately 200,000 (reference value) F0.1% (cumulative failure rate 0.1%) operating life: Approximately 40,000 (reference value)
LEDs Used Photocouplers
LED: GaAs
Photocouplers
(SH)
Photocouplers
(DH)
Photocouplers Photocouplers Photocouplers
4N25 (SHORT) 4N25A (SHORT) 4N26 (SHORT) 4N27 (SHORT) 4N28 (SHORT) 4N29 (SHORT) 4N29A (SHORT) 4N30 (SHORT) 4N31 (SHORT) 4N32 (SHORT) 4N32A (SHORT) 4N33 (SHORT) 4N35 (SHORT) 4N36 (SHORT) 4N37 (SHORT) 4N38 (SHORT) 4N38A (SHORT) 6N135 6N136 6N137 6N138 6N139 TLP102 TLP106 TLP112 TLP112A TLP113 TLP114A TLP115 TLP115A TLP116 TLP117 TLP124 TLP126 TLP127 TLP130 TLP131 TLP137
TLP148G TLP160 Series TLP161 Series TLP163 TLP165J TLP166J TLP168J TLP172 Series TLP174G TLP176 Series TLP180 TLP181 TLP190B TLP191B TLP192 Series TLP197 Series TLP200D TLP202 Series TLP206 Series TLP222 Series TLP224G Series TLP225A TLP227 Series TLP260J TLP270 Series TLP280 Series TLP281 Series TLP296G TLP320 Series TLP330 TLP331 TLP332 TLP350 TLP351 TLP351A TLP360 Series TLP361 Series TLP363 Series
TLP371 TLP372 TLP373 TLP504A TLP512 TLP513 TLP521-1 TLP521-2 TLP521-4 TLP523 Series TLP525G Series TLP531 TLP532 TLP550 TLP551 TLP552 TLP553 TLP554 TLP555 TLP557 TLP558 TLP559 TLP560 Series TLP561 Series TLP570 TLP571 TLP572 TLP590B TLP591B TLP592 Series TLP594 Series TLP597 Series TLP598 Series TLP599 Series TLP620 Series TLP621 Series TLP624 Series TLP626 Series
TLP627 Series TLP628 Series TLP629 Series TLP630 TLP631 TLP632 TLP641 Series TLP651 TLP700 TLP701 TLP705 TLP716 TLP719 TLP731 TLP732 TLP733 Series TLP734 Series TLP747 Series TLP750 Series TLP751 Series TLP759 Series TLP762J Series TLP763J Series TLP797 Series TLP798GA TLP2066 TLP2200 TLP2530 TLP2531 TLP2601 TLP2630 TLP2631 TLP3022(S) Series TLP3042(S) Series TLP3063(S) Series TLP31xx Series TLP32xx Series TLP3230
TLP3231 TLP3240 TLP3241 TLP3250 TLP3762(S) Series TLP3904 TLP3914 TLP3924 TLP4xxx Series
Device Degradation
GaAs Projected Light Output Degradation Data
Test conditions: 40°C Light output (PO) relative change Light output (PO) relative change
1000 10000 100000
Test conditions: 40°C
1000
10000
100000
Test time
Test time
Test conditions: 40°C Light output (PO) relative change
1000 10000 100000
Test time
GaAs Projected Operating Life Data
Failure criteria light output degradation -50% Failure criteria light output degradation -30%
10000000 100000
10000000
Projected operating life
100000
10000
Projected operating life
1000000
1000000
10000
1000
Projected F50% operating life Projected F0.1% operating life
1000
Projected F50% operating life Projected F0.1% operating life
(x10-3)
(x10-3)
Ambient Temperature (°C)
Ambient Temperature (°C)
above operating life data estimates extrapolated from long-term light output degradation over single wafer shown reference only. Operating conditions exceeding maximum ratings guaranteed.
(SH) Projected Light Output Degradation Data
Test conditions: 40°C Light output (PO) relative change Light output (PO) relative change
1000 10000 100000
Test conditions: 40°C
1000
10000
100000
Test time
Test time
Test conditions: 40°C Light output (PO) relative change
1000 10000 100000
Test time
(SH) Projected Operating Life Data
Failure criteria light output degradation -30%
10000000
Failure criteria light output degradation -50%
10000000
Projected operating life
Projected operating life
1000000
1000000 100000
100000
10000
10000
1000
Projected F50% operating life Projected F0.1% operating life
1000
Projected F50% operating life Projected F0.1% operating life
(x10-3)
(x10-3)
Ambient Temperature (°C)
Ambient Temperature (°C)
above operating life data estimates extrapolated from long-term light output degradation over single wafer shown reference only. Operating conditions exceeding maximum ratings guaranteed.
Device Degradation
(DH) Projected Light Output Degradation Data
Test conditions: 40°C Light output (PO) relative change Light output (PO) relative change
1000 10000 100000
Test conditions: 40°C
1000
10000
100000
Test time
Test time
Test conditions: 40°C Light output (PO) relative change
1000 10000 100000
Test time
(DH) Projected Operating Life Data
Failure criteria light output degradation -50%
10000000 1000000 10000000 100000
Failure criteria light output degradation -30%
Projected operating life
100000
10000
Projected operating life
1000000
10000
1000
Projected F50% operating life Projected F0.1% operating life
1000
Projected F50% operating life Projected F0.1% operating life
Ambient Temperature (°C)
Ambient Temperature (°C)
above operating life data estimates extrapolated from long-term light output degradation over single wafer shown reference only. Operating conditions exceeding maximum ratings guaranteed.
Safety Standard Approvals
Toshiba offers wide selection photocouplers with transistor output, output, thyristor output triac output, well photorelays certified (USA), (Canada), (Germany), (Britain) SEMKO (Sweden).
Safety Standard Approvals Photocouplers (DIN EN60747-5-2)
Mechanical Construction Reflective Photocouplers Single-Molded Packages Coupling Medium (Window) Package (Body) Photo Detector Chip Transmissive Photocouplers Single-Molded Packages
Coupling Medium (Window) Package (Body)
Internal Construction
Lead
Lead
Chip
Photo Detector Chip
Chip
Package
Isolation Creepage Path (mm) Construction Isolation Clearance (mm) Mechanical Ratings Isolation Thickness (min) (mm) Internal Creepage Path (mm) Max. VDE/TUV Working Insulation Voltage (Viorm) Highest Allowable Overvoltage 60747-5-2 (Viotm)
SOP4/SOP16 4000 6000
MFSOP6 6000
MFSOP6 4000
2.54SOP 4/6/8 2500
6.4/7.0 6.4/7.0 (0.4) /890 4000 TLP350 TLP351
type)
4000 TLP2105 TLP2108 TLP2166A TLP2116
(0.4) 1140 6000 TLP350F TLP351F
Output
Transistor Output
TLP280 TLP280-4 TLP281 TLP281-4
TLP284 TLP284-4 TLP285 TLP285-4
TLP180 TLP181
TLP127
Certified Devices Triac/Thyrsitor Output
TLP260J TLP261J
TLP160G TLP160J TLP161G TLP161J TLP176A TLP176D TLP176G TLP197G TLP206G
TLP560G TLP560J TLP561G TLP561J TLP227G TLP227G-2 TLP597G
Photorelay
table above lists photocouplers photorelays that have already been approved January 2010. information herein subject change. latest information, please contact your nearest Toshiba sales representative.
Safety Standard Approvals
Safety Standard Approvals Photocouplers (DIN EN60747-5-2) (Continued)
Mechanical Construction Transmissive Photocouplers with Insulating Film Single-Molded Packages
Coupling Medium (Window)
Transmissive Photocouplers Double-Molded Packages
Coupling Medium (Window)
Photo Detector Chip
Photo Detector Chip
Internal Construction
Package (Body)
Package (Body)
Lead
Lead
Chip
Film
Chip
Package Isolation Creepage Path (mm) Construction Isolation Clearance (mm) Mechanical Ratings Isolation Thickness (min) (mm) Internal Creepage Path (mm) VDE/TUV 60747-5-2 Max. Working Insulation Voltage (Viorm) Highest Allowable Overvoltage (Viotm)
6000
SDIP6
8000
SDIP6
type) 1140 8000
6.4/7.0 6.4/7.0 0.4/0.5 6000 /8000
type) 0.4/0.5 1140 6000 /8000
MFSOP6
4000 /6000
6000
6.5/7.0 6.5/7.0 0.4/0.5 /1130 6000 /8000
type) 0.4/0.5 /1130 6000 /8000
Output
TLP701 TLP705 TLP715 TLP716 TLP718 TLP719
TLP701F TLP705F TLP715F TLP716F TLP718F TLP719F
TLP350H TLP351H TLP750 TLP751 TLP759 TLP620 TLP620-2 TLP620-4 TLP621 TLP621-2 TLP621-4 TLP627 TLP627-2 TLP627-4 TLP731 TLP732 TLP360J TLP361J TLP363J TLP3022(S) TLP3023(S) TLP3042(S) TLP3043(S) TLP3052(S) TLP3062(S) TLP3063(S) TLP3064(S) TLP3082(S) TLP3762(S) TLP3782(S) TLP3783(S)
TLP350HF TLP351HF TLP750F TLP751F TLP759F TLP620F TLP620F-2 TLP621F TLP621F-2
TLP105 TLP108 TLP114A TLP116 TLP117 TLP2066
TLP109 TLP116A TLP104 TLP151
TLP733 TLP734 TLP781
TLP733F TLP734F TLP781F
Certified Devices
Transistor Output
Triac/Thyrsitor Output
TLP360JF TLP165J TLP361JF TLP166J TLP363JF TLP3022F(S) TLP3023F(S) TLP3042F(S) TLP3043F(S) TLP3052F(S) TLP3062F(S) TLP3063F(S) TLP3064F(S) TLP3082F(S) TLP3762F(S) TLP3782F(S) TLP3783F(S)
TLP265J TLP266J
TLP762J TLP763J TLP748J
TLP762JF TLP763JF TLP748JF
table above lists photocouplers photorelays that have already been approved January 2010. information herein subject change. latest information, please contact your nearest Toshiba sales representative.
Photocoupler Application Circuit Examples
Digital Interface Applications
High Speed
TLP2061 TLP118 mini-flat package) allows high-speed data transmission approximately MHz. Data rate left-side circuit
LSTTL
TLP118, TLP2601
(typ.): Mbit/s (duty cycle 1/2)
LSTTL
Input Current Drive
high-CTR (current transfer ratio) TLP553 allows operation with input current (0.5 direct driving with CMOS signal. Data rate left-side circuit (typ.): kbit/s (duty cycle 1/2)
TLP553
CMOS LSTTL
Pull-up Resistor Required
When TLP2200 with 3-state output used, next-stage logic gate actuated without using pull-up resistor. Data rate left-side circuit
LSTTL
TLP2200
(typ.): Mbit/s (duty cycle 1/2)
LSTTL
High Tolerance
TLP558
LSTTL CMOS
using TLP558 which tolerates CMOS logic gates other components driven without design restrictions VCC. Data rate left-side circuit (typ.): Mbit/s (duty cycle 1/2)
Photocoupler Application Circuit Examples
Inverter AC-DC Servo Applications
[Photo-IC couplers: high-speed base/gate drive applications] Direct Drive TLP109 TLP2409 TLP550 TLP559 TLP759 IGBT Power Direct Drive High-Speed TLP557
(for medium-power IGBTs): TLP350/ TLP358/ TLP700 (for small-power IGBTs): TLP351 TLP701 TLP705
TLP118 TLP554
Servo (Numerical control, Robotics)
Servo Inverter (PWM)
Base/Gate Drive Circuit
Base/Gate Drive Circuit
Driving Base 15-A-Class (Giant Transistor) Module
TLP557
TLP557 drives base directly. external resistor, Rex, connected between pins This resistor causes base current become constant stabilizes drive.
LSTTL
Driving Base 100-A-Class Module
TLP557
TLP557 photo-IC coupler booster transistors drive high-power GTR.
LSTTL
Driving Gat
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