Reliability Report Update Small Outline (SO) Package National Sem
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Reliability Report Update Small Outline (SO) Package
Reliability Report Update Small Outline (SO) Package
National Semiconductor continues conduct reliability tests complete line surface mount components assure highest level reliability performance possible This Reliability Report Update presents additional data recently gathered National's family plastic small outline packages with leadcounts data demonstrates that reliability performance products assembled National's small outline package excellent comparable reliability performance product assembled National's standard dual-in-line package (DIP) INTRODUCTION (Small Outline) package been developed meet customer demand ever-increasing miniaturization component density surface mounting requirements These devices occupy only 30-50% board area required conventional packages These small packages mount directly surface board substate Users should note that boards devices have different design considerations from those typically used traditional insertion-mounted DIPs Several techniques ``high density surface mounting'' have been developed well board substrate materials National's Reliability Department performed series accelerated environmental tests determine reliability this package Descriptions these tests results follow Thermal resistance charcteristics appear this report HIGH TEMPERATURE BIAS Continuous operation rated supply voltage High Temperature Bias most generally accepted accelerated life test elevated temperature along with applied voltage stress accelerates many failure mecha-
National Semiconductor July 1986
nisms associated with packaging system with accelerated environmental tests failures analyzed package related failure mechanisms TEMPERATURE HUMIDITY BIAS Continuous operation rated supply voltage Temperature Humidity Bias standard test plastic package integrity with respect moisture external contaminant penetration combination temperature humidity bias accelerates failure mechanisms that would occur moisture penetrates package AUTOCLAVE Unbiased 100% Autoclave designed accelerate penetration moisture into package order determine resistance packaging system moisture external contaminants TEMPERATURE CYCLE Unbiased minutes cycle Temperature cycle tests thermal expansion coefficient compatibility materials used design packaging systems alternating temperature extremes expected failure mechanisms include cracking encapsulation-leadframe interfaces fractured lifted bond wires addition moisture contaminants tend driven into cracks openings seals seams package expands contracts THERMAL SHOCK Unbiased liquid minutes immersion seconds transfer time cycle This test while similar Temperature cycle designed examine different rates thermal conductivity package materials affect integrity package materials when exposed alternating temperature extremes
Component Size Comparison Dual-In-Line Package Small Outline Package
8685
8685
C1995 National Semiconductor Corporation
8685
RRD-B30M115 Printed
High Temperature Bias Device 54HC245 54HC373 54HC373 54HC373 74HC00 74HC00 74HC00 74HC00 74HC74 74HC74 74HC244 74HC244 74HC373 74HC373 74HC374 74HC374 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM339 LM339 LM358 LM358 LM358 LM358 Package SO-20 DIP-20 SO-20 SO-20 DIP-14 DIP-14 SO-14W SO-14W DIP-14 SO-14W DIP-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-8 SO-8 SO-8 SO-8 Total Total
Note Parametric leakage measurements taken packages board mounted (vapor-phase reflow soldering)
Hours 1000 Hours
Hours
1321
1318
High Temperature Bias Device 74LS08 74LS08 74LS240 74LS240 CD4601 LF347 LF347 LF351 LF351 LF351 LF353 LF353 LF353 LF353 Package DIP-14 SO-14 SO-20 SO-20 SO-14 DIP-14 SO-14W DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 SO-8 Hours
Hours 1000 Hours
High Temperature Bias Device LF411 LF411 LF411 LF412 LF412 LF412 LM111 LM111 LM308 LM308 LM308 LM308 LM311 LM311 LM311 LM311 LM346 LM346 LM348 LM348 LM359 LM359 LM442 LM442 LM592 LM592 LM723 LM723 LM741 LM741 LM741 LM741 LM1496 LM1524 LM1524 LM1558 LM1558 LM1558 LM2903 LM2903 LM3086 LM3086 Package DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 DIP-8 SO-8 SO-8 DIP-8 DIP-8 SO-8 SO-8 DIP-16 SO-16 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 SO-8 SO-8 SO-14 DIP-16 SO-16 DIP-8 SO-8 SO-8 DIP-8 SO-8 DIP-14 SO-14 Total Total
Note Parametric gain bandwidth Note Parametric Note Oxide short-ESD Note Package cracked (handling damage) Note visual defect
(Continued) Hours 1183 1846 1000 Hours 1181 1846
Hours 1185 1852
Note Parametric gain
Note Parametric load regulation Note Parametric VSAT measurements taken packages board mounted (vapor-phase reflow soldering)
Temperature Humidity Bias Device 74HC00 74HC00 74HC00 74HC00 74HC74 74HC74 74HC244 74HC244 74HC245 54HC373 54HC373 54HC373 74HC373 74HC373 74HC374 74HC374 74LS08 74LS08 74LS240 74LS240 CD4601 LF347 LF347 LF351 LF351 LF351 LF353 LF353 LF353 LF353 LF411 LF411 LF411 LF412 LF412 LM111 LM111 LM308 LM308 LM311 LM311 LM311 LM311 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM346 LM346 Package DIP-14 SO-14 DIP-14 SO-14 DIP-14 SO-14 DIP-20 SO-20 SO-20 DIP-20 SO-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 DIP-14 SO-14 SO-20 SO-20 SO-14 DIP-14 SO-14W DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 DIP-16 SO-16 Hours
Hours 1000 Hours
Temperature Humidity Bias Device LM348 LM348 LM358 LM358 LM358 LM359 LM359 LM442 LM442 LM592 LM592 LM723 LM723 LM741 LM741 LM832 LM1496 LM1496 LM1524 LM1524 LM1558 LM1558 LM1558 LM1902 LM1902 LM2903 LM2903 LM3086 LM3086 Package DIP-14 SO-14 SO-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 SO-14 DIP-14 SO-14 DIP-16 SO-16 DIP-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 Total Total
Note Short Note Parametric (Max Note Marginal parametric (PSRR)-Tested good Note Open metallization-ECR Note Parametric VOUT High (Min 26V) Note Parametric VOUT High (Min 26V)
Hours (10) 1000 Hours
Hours
(10) (10)
1674 3193
Note Parametric
1426 2937
1742 3202
Note Parametric Note Parametric gain Note Parametric MAXDCY measurements taken packages board mounted (vapor-phase reflow soldering)
Autoclave 100% Device 74HC244 74HC244 74HC245 74HC373 74HC373 74HC373 74HC373 74HC374 74HC374 Package DIP-20 SO-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 DIP-20 SO-20 Total Total
Note Parametric leakage measurements taken
Hours
Hours
Hours
Autoclave 100% Device 74LS240 74LS240 CD4601 LF351 LF351 LF351 LF353 LF353 LF353 LF353 LF411 LF411 LF411 LF412 LF412 LF412 LM308 LM308 LM308 LM308 LM308 LM308 LM311 LM311 LM311 LM311 LM311 LM311 LM324 LM324 LM324 LM324 LM324 LM348 LM348 LM359 LM359 Package SO-20 SO-20 SO-14 DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-8 SO-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 DIP-8 SO-8 SO-14 DIP-14 SO-14 SO-14 SO-14 DIP-14 SO-14 DIP-14 SO-14 Hours Hours 1000 Hours
Autoclave 100% (Continued) Device LM442 LM442 LM592 LM592 LM723 LM723 LM741 LM741 LM741 LM741 LM832 LM1496 LM1496 LM1524 LM1524 LM1558 LM1558 LM1558 LM1902 LM1902 LM2903 LM2903 LM3086 LM3086 Package DIP-8 SO-8 DIP-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 SO-8 SO-8 SO-14 DIP-14 SO-14 DIP-16 SO-16 DIP-8 SO-8 SO-8 DIP-14 SO-14 DIP-8 SO-8 DIP-14 SO-14 Total Total
Note ECR-open metallization measurements taken
Hours 1395 2443
Hours 1395 2343
1000 Hours
1133
Temperature Cycle Device LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM324 LM339 LM339 LM358 LM358 LM358 LM358 Package SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-14 SO-8 SO-8 SO-8 SO-8 Total
Note Parametric swing failure measurements taken packages board mounted (vapor-phase reflow soldering)
Cycles 1000 Cycles 2000 Cycles
Temperature Cycle Device 74HC74 74HC244 74HC373 74HC374 74LS08 74LS08 74LS240 74LS240 CD4601 DS75451 LM324 LM324 LM332 LM1902 LM1902 LM2903 LM2903 Package SO-14 SO-20 SO-20 SO-20 DIP-14 SO-14 SO-20 SO-20 SO-14 SO-14 DIP-14 SO-14 SO-14 DIP-14 SO-14 DIP-8 SO-8 Total Total
measurements taken packages board mounted (vapor-phase reflow soldering)
Cycles
1000 Cycles
2000 Cycles
Thermal Shock Device CD4601 DS75451 LM111 LM111 LM308 LM308 LM324 LM324 LM324 LM832 LM1902 LM1902 Package SO-14 SO-14 SO-14 DIP-14 DIP-8 SO-8 DIP-14 SO-14 SO-14 SO-14 DIP-14 SO-14 Total Total Cycles
Cycles
Cycles
Cycles
packages board mounted (vapor-phase reflow soldering)
CONCLUSION Data presented this report demonstrate that reliability performance product assembled National's Small Outline (SO) Package excellent comparable reliability performance product assembled National's Standard DualIn-Line (DIP) Package
Thermal Resistance Packages (Board Mount)
Body Width Narrow inches) Wide inches)
8685
Flow
When high power situation exists ambient-temperature cannot reduced next best thing provide flow vicinity package graph below illustrates impact this thermal resistance This graph plots relative reduction thermal resistance normalized still condition National's 14-pin molded small outline package thermal ratings National's data sheets relate still environment 14-Pin Molded Small Outline Package
8685
Reliability Report Update Small Outline (SO) Package
980045
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT NATIONAL SEMICONDUCTOR CORPORATION used herein Life support devices systems devices systems which intended surgical implant into body support sustain life whose failure perform when properly used accordance with instructions provided labeling reasonably expected result significant injury user
National Semiconductor Corporation 1111 West Bardin Road Arlington 76017 1(800) 272-9959 1(800) 737-7018
critical component component life support device system whose failure perform reasonably expected cause failure life support device system affect safety effectiveness
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National does assume responsibility circuitry described circuit patent licenses implied National reserves right time without notice change said circuitry specifications
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