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XP01110
Top Searches for this datasheetXP01110 - XP01110 XP01110 Silicon epitaxial planar type digital circuits Features elements incorporated into package (Emitter-coupled transistors with built-in resistor) Reduction mounting area assembly cost half Package Code SMini5-G1 Name Base (Tr1) Emitter Base (Tr2) Basic Part Number UNR2110 Collector (Tr2) Collector (Tr1) Absolute Maximum Ratings 25°C Parameter Symbol VCBO VCEO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current Marking Symbol: Internal Connection Rating Unit -100 Total power dissipation Junction temperature Storage temperature Tstg +150 Electrical Characteristics 25°C Parameter Symbol VCBO VCEO ICBO ICEO IEBO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Conditions Unit Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio 0.01 Ratio hFE(Small /Large) 0.50 0.99 Collector-emitter saturation voltage Output voltage high-level Output voltage low-level Input resistance Transition frequency VCE(sat) 0.25 -2.5 -4.9 -30% +30% Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Ratio between elements Publication date: 2009 SJJ00122CED XP01110 -120 25°C -1.0 -100 VCE(sat) Collector-emitter saturation voltage VCE(sat) -100 Total power dissipation (mW) Collector current (mA) 75°C 25°C -25°C 0.01 -0.1 -100 Ambient temperature (°C) Collector-emitter voltage Collector current (mA) Collector output capacitance (pF) (Common base, input open circuited) Forward current transfer ratio 25°C -104 25°C 75°C Output current (µA) -103 25°C -102 -25°C -100 -100 -1.0 -1.2 -1.4 Collector current (mA) Collector-base voltage Input voltage -100 25°C Input voltage 0.01 -100 Output current (mA) SJJ00122CED SMini5-G1 (0.65) ±0.1 ±0.1 0.20 ±0.05 (0.65) ±0.10 ±0.1 ±0.1 SJJ00122CED +0.2 -0.1 (0.425) 1.25 0.12 +0.05 -0.02 Unit: XP01110 ±0.1 Request your special attention precautions using technical information semiconductors described this book products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products. license granted intellectual property right other right owned Panasonic Corporation other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission company. 20080805 Other recent searchesSCHS317 - SCHS317 SCHS317 Datasheet PBTC-3GW - PBTC-3GW PBTC-3GW Datasheet FAN4822 - FAN4822 FAN4822 Datasheet DFA50BA80 - DFA50BA80 DFA50BA80 Datasheet AS1542 - AS1542 AS1542 Datasheet APX9142 - APX9142 APX9142 Datasheet 74FCT273 - 74FCT273 74FCT273 Datasheet 1N5817 - 1N5817 1N5817 Datasheet
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