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XP01110


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XP01110 - XP01110  


XP01110
Silicon epitaxial planar type
digital circuits Features
elements incorporated into package (Emitter-coupled transistors with built-in resistor) Reduction mounting area assembly cost half
Package
Code SMini5-G1 Name Base (Tr1) Emitter Base (Tr2)
Basic Part Number
UNR2110
Collector (Tr2) Collector (Tr1)
Absolute Maximum Ratings 25°C
Parameter Symbol VCBO VCEO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current
Marking Symbol: Internal Connection
Rating
Unit
-100
Total power dissipation Junction temperature Storage temperature
Tstg
+150
Electrical Characteristics 25°C
Parameter Symbol VCBO VCEO ICBO ICEO IEBO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open)
Conditions
Unit
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio
0.01
Ratio
hFE(Small
/Large)
0.50
0.99
Collector-emitter saturation voltage Output voltage high-level Output voltage low-level Input resistance Transition frequency
VCE(sat)
0.25
-2.5
-4.9
-30%
+30%
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Ratio between elements
Publication date: 2009
SJJ00122CED
XP01110
-120
25°C -1.0 -100
VCE(sat)
Collector-emitter saturation voltage VCE(sat)
-100
Total power dissipation (mW)
Collector current (mA)
75°C 25°C
-25°C
0.01 -0.1
-100
Ambient temperature (°C)
Collector-emitter voltage
Collector current (mA)
Collector output capacitance (pF) (Common base, input open circuited)
Forward current transfer ratio
25°C
-104
25°C
75°C
Output current (µA)
-103
25°C
-102
-25°C
-100
-100
-1.0
-1.2
-1.4
Collector current (mA)
Collector-base voltage
Input voltage
-100
25°C
Input voltage
0.01
-100
Output current (mA)
SJJ00122CED
SMini5-G1
(0.65)
±0.1
±0.1
0.20 ±0.05
(0.65)
±0.10
±0.1
±0.1
SJJ00122CED
+0.2 -0.1
(0.425) 1.25
0.12
+0.05 -0.02
Unit:
XP01110
±0.1
Request your special attention precautions using technical information semiconductors described this book
products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products. license granted intellectual property right other right owned Panasonic Corporation other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission company.
20080805

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