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ULN2003 ULN2003APG ULN2003AFWG ULN2004APG ULN2004AFWG
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7-ch Darlington Sink Driver
ULN2003APG/AFWG Series high-voltage, high-current darlington drivers comprised seven darlington pairs. units feature integral clamp diodes switching inductive loads. Applications include relay, hammer, lamp display (LED) drivers. suffix appended part number represents Lead (Pb)-Free product.
Output current (single output): High sustaining voltage output: Output clamp diodes Inputs compatible with various types logic Package Type-APG: DIP-16pin Package Type-AFWG: SOL-16pin
Weight DIP16-P-300-2.54A 1.11 (typ.) SOL16-P-150-1.27A: 0.15 (typ.)
Type ULN2003APG/AFWG ULN2004APG/AFWG Input Base Resistor 10.5 Designation TTL, CMOS PMOS, CMOS
Connection (top view)
Schematics (each driver)
Note: input output parasitic diodes cannot used clamp diodes.
Absolute Maximum Ratings 25°C)
Characteristic Output sustaining voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Power dissipation Operating temperature Storage temperature AFWG Symbol (SUS) IOUT Topr Tstg Rating -0.5 -0.5 1.47 1.25 (Note) Unit mA/ch
Note: (Test Board: JEDEC 2s2p)
Recommended Operating Conditions 85°C)
Characteristic Output sustaining voltage Output current AFWG Input voltage Input voltage (output Input voltage (output off) ULN2003A ULN2004A ULN2003A ULN2004A (ON) IOUT 85°C 85°C (Note) IOUT Symbol (SUS) Circuits 85°C 120°C Test Condition Duty Duty Duty Duty Typ. 0.76 0.65 mA/ch Unit
Clamp diode reverse voltage Clamp diode forward current Power dissipation AFWG
Note: (Test Board: JEDEC 2s2p)
Electrical Characteristics 25°C unless otherwise noted)
Characteristic Output leakage current Symbol ICEX Test Circuit Test Condition 25°C 85°C IOUT Collector-emitter saturation voltage (sat) IOUT IOUT Current transfer ratio Input current (output ULN2003A ULN2004A (ON) (OFF) IOUT IOUT IOUT IOUT 85°C IOUT (ON) ULN2004A IOUT IOUT IOUT tOFF 25°C 85°C VOUT VOUT 1000 Typ. Unit
Input current (output off) ULN2003A Input voltage (output
Clamp diode reverse current Clamp diode forward voltage Input capacitance Turn-on delay Turn-off delay
ICEX (sat), (ON)
Note Pulse width duty cycle Output impedance Note below Input Condition
Type Number ULN2003A ULN2004A
Note includes probe capacitance.
This does include built-in protection circuits excess current overvoltage. this subjected excess current overvoltage, destroyed. Hence, utmost care must taken when systems which incorporate this designed. Utmost care necessary design output line, COMMON line since destroyed short-circuit between outputs, contamination fault, fault improper grounding.
2.00 Type-APG free 1.75 Type-AFWG (Test Board: JEDEC 2s2p)
1.50 1.25 1.00 0.75 0.50 0.25
Ambient temperature (°C)
Weight: 1.11 (typ.)
Weight: 0.15 (typ.)
equivalent circuit diagrams simplified some parts them omitted explanatory purposes.
Components test circuits used only obtain confirm device characteristics. These components circuits guaranteed prevent malfunction failure from occurring application equipment.
absolute maximum ratings semiconductor device ratings that must exceeded, even moment. exceed these ratings. Exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. appropriate power supply fuse ensure that large current does continuously flow case over current and/or failure. will fully break down when used under conditions that exceed absolute maximum ratings, when wiring routed improperly when abnormal pulse noise occurs from wiring load, causing large current continuously flow breakdown lead smoke ignition. minimize effects flow large current case breakdown, appropriate settings, such fuse capacity, fusing time insertion circuit location, required. your design includes inductive load such motor coil, incorporate protection circuit into design prevent device malfunction breakdown caused current resulting from inrush current power negative current resulting from back electromotive force power OFF. breakdown cause injury, smoke ignition. stable power supply with with built-in protection functions. power supply unstable, protection function operate, causing breakdown. breakdown cause injury, smoke ignition. insert devices wrong orientation incorrectly. Make sure that positive negative terminals power supplies connected properly. Otherwise, current power consumption exceed absolute maximum rating, exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. addition, device that applied current with inserting wrong orientation incorrectly even just time. Carefully select external components (such inputs negative feedback capacitors) load components (such speakers), example, power regulator. there large amount leakage current such input negative feedback condenser, output voltage will increase. this output voltage connected speaker with input withstand voltage, overcurrent failure cause smoke ignition. (The over current cause smoke ignition from itself.) particular, please attention when using Bridge Tied Load (BTL) connection type that inputs output voltage speaker directly.
Points Remember Handling
Heat Radiation Design using with large current flow such power amp, regulator driver, please design device that heat appropriately radiated, exceed specified junction temperature (Tj) time condition. These generate heat even during normal use. inadequate heat radiation design lead decrease life, deterioration characteristics breakdown. addition, please design device taking into considerate effect heat radiation with peripheral components. Back-EMF When motor rotates reverse direction, stops slows down abruptly, current flow back motor's power supply effect back-EMF. current sink capability power supply small, device's motor power supply output pins might exposed conditions beyond absolute maximum ratings. avoid this problem, take effect back-EMF into consideration system design.
About solderability, following conditions were confirmed Solderability Sn-37Pb solder Bath solder bath temperature 230°C dipping time seconds number times once R-type flux Sn-3.0Ag-0.5Cu solder Bath solder bath temperature 245°C dipping time seconds number times once R-type flux
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