ULN2003 ULN2003APG ULN2003AFWG ULN2004APG ULN2004AFWG
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ULN2003,04APG/AFWG
ULN2003APG,ULN2003AFWG ULN2004APG,ULN2004AFWG
7-ch Darlington Sink Driver
ULN2003APG/AFWG Series high-voltage, high-current darlington drivers comprised seven darlington pairs. units feature integral clamp diodes switching inductive loads. Applications include relay, hammer, lamp display (LED) drivers. suffix appended part number represents Lead (Pb)-Free product.
ULN2003APG ULN2004APG
Features
Output current (single output): High sustaining voltage output: Output clamp diodes Inputs compatible with various types logic Package Type-APG: DIP-16pin Package Type-AFWG: SOL-16pin
ULN2003AFWG ULN2004AFWG
Weight DIP16-P-300-2.54A 1.11 (typ.) SOL16-P-150-1.27A: 0.15 (typ.)
Type ULN2003APG/AFWG ULN2004APG/AFWG Input Base Resistor 10.5 Designation TTL, CMOS PMOS, CMOS
Connection (top view)
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ULN2003,04APG/AFWG
Schematics (each driver)
ULN2003APG/AFWG ULN2004APG/AFWG
Note: input output parasitic diodes cannot used clamp diodes.
Absolute Maximum Ratings 25°C)
Characteristic Output sustaining voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Power dissipation Operating temperature Storage temperature AFWG Symbol (SUS) IOUT Topr Tstg Rating -0.5 -0.5 1.47 1.25 (Note) Unit mA/ch
Note: (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Recommended Operating Conditions 85°C)
Characteristic Output sustaining voltage Output current AFWG Input voltage Input voltage (output Input voltage (output off) ULN2003A ULN2004A ULN2003A ULN2004A (ON) IOUT 85°C 85°C (Note) IOUT Symbol (SUS) Circuits 85°C 120°C Test Condition Duty Duty Duty Duty Typ. 0.76 0.65 mA/ch Unit
(OFF)
Clamp diode reverse voltage Clamp diode forward current Power dissipation AFWG
Note: (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Electrical Characteristics 25°C unless otherwise noted)
Characteristic Output leakage current Symbol ICEX Test Circuit Test Condition 25°C 85°C IOUT Collector-emitter saturation voltage (sat) IOUT IOUT Current transfer ratio Input current (output ULN2003A ULN2004A (ON) (OFF) IOUT IOUT IOUT IOUT 85°C IOUT (ON) ULN2004A IOUT IOUT IOUT tOFF 25°C 85°C VOUT VOUT 1000 Typ. Unit
Input current (output off) ULN2003A Input voltage (output
Clamp diode reverse current Clamp diode forward voltage Input capacitance Turn-on delay Turn-off delay
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Test Circuit
ICEX (sat), (ON)
(OFF)
(ON)
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ULN2003,04APG/AFWG
tON, tOFF
Note Pulse width duty cycle Output impedance Note below Input Condition
Type Number ULN2003A ULN2004A
Note includes probe capacitance.
Precautions Using
This does include built-in protection circuits excess current overvoltage. this subjected excess current overvoltage, destroyed. Hence, utmost care must taken when systems which incorporate this designed. Utmost care necessary design output line, COMMON line since destroyed short-circuit between outputs, contamination fault, fault improper grounding.
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ULN2003,04APG/AFWG
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ULN2003,04APG/AFWG
2.00 Type-APG free 1.75 Type-AFWG (Test Board: JEDEC 2s2p)
1.50 1.25 1.00 0.75 0.50 0.25
Power dissipation
Ambient temperature (°C)
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ULN2003,04APG/AFWG
Package Dimensions
Weight: 1.11 (typ.)
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ULN2003,04APG/AFWG
Package Dimensions
Weight: 0.15 (typ.)
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ULN2003,04APG/AFWG
Notes Contents
Equivalent Circuits
equivalent circuit diagrams simplified some parts them omitted explanatory purposes.
Test Circuits
Components test circuits used only obtain confirm device characteristics. These components circuits guaranteed prevent malfunction failure from occurring application equipment.
Usage Considerations
Notes Handling
absolute maximum ratings semiconductor device ratings that must exceeded, even moment. exceed these ratings. Exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. appropriate power supply fuse ensure that large current does continuously flow case over current and/or failure. will fully break down when used under conditions that exceed absolute maximum ratings, when wiring routed improperly when abnormal pulse noise occurs from wiring load, causing large current continuously flow breakdown lead smoke ignition. minimize effects flow large current case breakdown, appropriate settings, such fuse capacity, fusing time insertion circuit location, required. your design includes inductive load such motor coil, incorporate protection circuit into design prevent device malfunction breakdown caused current resulting from inrush current power negative current resulting from back electromotive force power OFF. breakdown cause injury, smoke ignition. stable power supply with with built-in protection functions. power supply unstable, protection function operate, causing breakdown. breakdown cause injury, smoke ignition. insert devices wrong orientation incorrectly. Make sure that positive negative terminals power supplies connected properly. Otherwise, current power consumption exceed absolute maximum rating, exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. addition, device that applied current with inserting wrong orientation incorrectly even just time. Carefully select external components (such inputs negative feedback capacitors) load components (such speakers), example, power regulator. there large amount leakage current such input negative feedback condenser, output voltage will increase. this output voltage connected speaker with input withstand voltage, overcurrent failure cause smoke ignition. (The over current cause smoke ignition from itself.) particular, please attention when using Bridge Tied Load (BTL) connection type that inputs output voltage speaker directly.
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ULN2003,04APG/AFWG
Points Remember Handling
Heat Radiation Design using with large current flow such power amp, regulator driver, please design device that heat appropriately radiated, exceed specified junction temperature (Tj) time condition. These generate heat even during normal use. inadequate heat radiation design lead decrease life, deterioration characteristics breakdown. addition, please design device taking into considerate effect heat radiation with peripheral components. Back-EMF When motor rotates reverse direction, stops slows down abruptly, current flow back motor's power supply effect back-EMF. current sink capability power supply small, device's motor power supply output pins might exposed conditions beyond absolute maximum ratings. avoid this problem, take effect back-EMF into consideration system design.
About solderability, following conditions were confirmed Solderability Sn-37Pb solder Bath solder bath temperature 230°C dipping time seconds number times once R-type flux Sn-3.0Ag-0.5Cu solder Bath solder bath temperature 245°C dipping time seconds number times once R-type flux
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ULN2003,04APG/AFWG
RESTRICTIONS PRODUCT
Toshiba Corporation, subsidiaries affiliates (collectively "TOSHIBA"), reserve right make changes information this document, related hardware, software systems (collectively "Product") without notice. This document information herein reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction permissible only reproduction without alteration/omission. Though TOSHIBA works continually improve Product's quality reliability, Product malfunction fail. Customers responsible complying with safety standards providing adequate designs safeguards their hardware, software systems which minimize risk avoid situations which malfunction failure Product could cause loss human life, bodily injury damage property, including data loss corruption. Before creating producing designs using, customers must also refer comply with latest versions relevant TOSHIBA information, including without limitation, this document, specifications, data sheets application notes Product precautions conditions forth "TOSHIBA Semiconductor Reliability Handbook" instructions application that Product will used with for. Customers solely responsible aspects their product design applications, including limited determining appropriateness this Product such design applications; evaluating determining applicability information contained this document, charts, diagrams, programs, algorithms, sample application circuits, other referenced documents; validating operating parameters such designs applications. TOSHIBA ASSUMES LIABILITY CUSTOMERS' PRODUCT DESIGN APPLICATIONS. Product intended general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots home electronics appliances) specific applications expressly stated this document. Product neither intended warranted equipment systems that require extraordinarily high levels quality and/or reliability and/or malfunction failure which cause loss human life, bodily injury, serious property damage serious public impact ("Unintended Use"). Unintended includes, without limitation, equipment used nuclear facilities, equipment used aerospace industry, medical equipment, equipment used automobiles, trains, ships other transportation, traffic signaling equipment, equipment used control combustions explosions, safety devices, elevators escalators, devices related electric power, equipment used finance-related fields. Product Unintended unless specifically permitted this document. disassemble, analyze, reverse-engineer, alter, modify, translate copy Product, whether whole part. Product shall used incorporated into products systems whose manufacture, use, sale prohibited under applicable laws regulations. information contained herein presented only guidance Product use. responsibility assumed TOSHIBA infringement patents other intellectual property rights third parties that result from Product. license intellectual property right granted this document, whether express implied, estoppel otherwise. ABSENT WRITTEN SIGNED AGREEMENT, EXCEPT PROVIDED RELEVANT TERMS CONDITIONS SALE PRODUCT, MAXIMUM EXTENT ALLOWABLE LAW, TOSHIBA ASSUMES LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, INCIDENTAL DAMAGES LOSS, INCLUDING WITHOUT LIMITATION, LOSS PROFITS, LOSS OPPORTUNITIES, BUSINESS INTERRUPTION LOSS DATA, DISCLAIMS EXPRESS IMPLIED WARRANTIES CONDITIONS RELATED SALE, PRODUCT, INFORMATION, INCLUDING WARRANTIES CONDITIONS MERCHANTABILITY, FITNESS PARTICULAR PURPOSE, ACCURACY INFORMATION, NONINFRINGEMENT. otherwise make available Product related software technology military purposes, including without limitation, design, development, use, stockpiling manufacturing nuclear, chemical, biological weapons missile technology products (mass destruction weapons). Product related software technology controlled under Japanese Foreign Exchange Foreign Trade U.S. Export Administration Regulations. Export re-export Product related software technology strictly prohibited except compliance with applicable export laws regulations. Please contact your TOSHIBA sales representative details environmental matters such RoHS compatibility Product. Please Product compliance with applicable laws regulations that regulate inclusion controlled substances, including without limitation, RoHS Directive. TOSHIBA assumes liability damages losses occurring result noncompliance with applicable laws regulations.
2008-07-29
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