TPCA8016-H
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TPCA8016-H* - TPCA8016-H*
TPCA8016-H - TPCA8016-H
TPCA8016-H
TOSHIBA Field Effect Transistor Silicon Channel Type (Ultra-High-Speed U-MOSIII)
TPCA8016-H
High-Efficiency DCDC Converter Applications
0.5±0.1 1.27 0.4±0.1
Unit:
0.05
6.0±0.3
Small footprint small thin package High-speed switching Small gate charge: (typ.) drain-source resistance: (ON) (typ.) High forward transfer admittance: |Yfs| (typ.) leakage current: IDSS (max) (VDS Enhancement mode: (VDS
5.0±0.2
0.15±0.05
5.0±0.2 0.95±0.05
0.595 0.166±0.05
0.05 1.1±0.2
0.6±0.1
4.25±0.2
Characteristic Drain-source voltage Drain-gate voltage (RGS Gate-source voltage Drain current (Note
Symbol VDSS VDGR VGSS
Rating
Unit 1,2,3SOURCE 5,6,7,8DRAIN
0.8±0.1
4GATE
JEDEC JEITA TOSHIBA
2-5Q1A
Pulsed (Note (Note
Drain power dissipation Drain power dissipation
Weight: 0.068 (typ.)
Drain power dissipation
(Note
Circuit Configuration
Single pulse avalanche energy (Note Avalanche current Repetitive avalanche energy (Tc=25) (Note Channel temperature Storage temperature range
Tstg
3.5±0.2
Absolute Maximum Ratings 25°C)
Note: Notes refer next page.
Using continuously under heavy loads (e.g. application high temperature/current/voltage significant change temperature, etc.) cause this product decrease reliability significantly even operating conditions (i.e. operating temperature/current/voltage, etc.) within absolute maximum ratings. Please design appropriate reliability upon reviewing Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept Methods) individual reliability data (i.e. reliability test report estimated failure rate, etc).
This transistor electrostatic-sensitive device. Handle with care.
2006-11-17
TPCA8016-H
Thermal Characteristics
Characteristic Thermal resistance, channel case (Tc=25) Thermal resistance, channel ambient (Note Symbol (ch-c) 2.78 Unit °C/W
(ch-a)
44.6
°C/W
Thermal resistance, channel ambient (Note
(ch-a)
78.1
°C/W
Marking (Note
TPCA 8016-H
Type
Note channel temperature should exceed 150°C during use. Note Device mounted glass-epoxy board Device mounted glass-epoxy board
FR-4 25.4 25.4 (Unit:
FR-4 25.4 25.4 (Unit:
Note 25°C (initial), Note Repetitive rating: pulse width limited channel temperature Note Weekly code: (Three digits) Week manufacture first week year, continuing Year manufacture (The last digit year)
2006-11-17
TPCA8016-H
Electrical Characteristics 25°C)
Characteristic Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON-resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Gate resistance Rise time Turn-on time Switching time Fall time Turn-off time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("Miller") charge Gate switch charge toff Qgs1 Symbol IGSS IDSS (BR) (BR) (ON) |Yfs| Ciss Crss Coss Test Condition VOUT =2.3 Typ. 1375 Unit
Duty
Source-Drain Ratings Characteristics 25°C)
Characteristic Drain reverse current Forward voltage (diode) Pulse (Note Symbol IDRP VDSF Test Condition Typ. -1.2 Unit
2006-11-17
TPCA8016-H
Common source 25°C Pulse test
Common source 25°C Pulse test
Drain current
Drain current
Drain-source voltage
Drain-source voltage
Common source
Common source Pulse test
Pulse test
Drain-source voltage
Drain current
-55°C
Gate-source voltage
Gate-source voltage
Common source Common source 25°C Pulse test -55°C
(ON)
|Yfs|
Drain-source ON-resistance (ON)
Pulse test
Forward transfer admittance
Drain current
Drain current
2006-11-17
TPCA8016-H
(ON)
1000 Common source 25°C Pulse test
Drain-source ON-resistance (ON)
Drain reverse current
Common source Pulse test
-0.2 -0.4 -0.6
-0.8 -1.0
Ambient temperature
(°C)
Drain-source voltage
Capacitance
10000
(pF)
Ciss 1000
Coss Common source 25°C Crss
Gate threshold voltage
Capacitance
Common source Pulse test
Drain-source voltage
Ambient temperature
(°C)
Dynamic input/output characteristics
Common source 25°C Pulse test
Drain-source voltage
Total gate charge
(nC)
Gate-source voltage
2006-11-17
TPCA8016-H
(°C/W)
1000 Device mounted glass-epoxy board (Note Device mounted glass-epoxy board (Note 25°C
Transient thermal impedance
Single pulse 0.001 0.01 1000
Pulse width
Device mounted glass-epoxy board (Note Device mounted glass-epoxy board (Note
Drain power dissipation
Drain power dissipation
Ambient temperature
(°C)
Case temperature
(°C)
Safe operating area
(Pulse) (Continuous)
Drain current
Operation 25°C
Single pulse 25°C
Curves must derated linearly with increase temperature. VDSS
0.01
Drain-source voltage
2006-11-17
TPCA8016-H
RESTRICTIONS PRODUCT
Toshiba Corporation, subsidiaries affiliates (collectively "TOSHIBA"), reserve right make changes information this document, related hardware, software systems (collectively "Product") without notice. This document information herein reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction permissible only reproduction without alteration/omission. Though TOSHIBA works continually improve Product's quality reliability, Product malfunction fail. Customers responsible complying with safety standards providing adequate designs safeguards their hardware, software systems which minimize risk avoid situations which malfunction failure Product could cause loss human life, bodily injury damage property, including data loss corruption. Before creating producing designs using, customers must also refer comply with latest versions relevant TOSHIBA information, including without limitation, this document, specifications, data sheets application notes Product precautions conditions forth "TOSHIBA Semiconductor Reliability Handbook" instructions application that Product will used with for. Customers solely responsible aspects their product design applications, including limited determining appropriateness this Product such design applications; evaluating determining applicability information contained this document, charts, diagrams, programs, algorithms, sample application circuits, other referenced documents; validating operating parameters such designs applications. TOSHIBA ASSUMES LIABILITY CUSTOMERS' PRODUCT DESIGN APPLICATIONS. Product intended general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots home electronics appliances) specific applications expressly stated this document. Product neither intended warranted equipment systems that require extraordinarily high levels quality and/or reliability and/or malfunction failure which cause loss human life, bodily injury, serious property damage serious public impact ("Unintended Use"). Unintended includes, without limitation, equipment used nuclear facilities, equipment used aerospace industry, medical equipment, equipment used automobiles, trains, ships other transportation, traffic signaling equipment, equipment used control combustions explosions, safety devices, elevators escalators, devices related electric power, equipment used finance-related fields. Product Unintended unless specifically permitted this document. disassemble, analyze, reverse-engineer, alter, modify, translate copy Product, whether whole part. Product shall used incorporated into products systems whose manufacture, use, sale prohibited under applicable laws regulations. information contained herein presented only guidance Product use. responsibility assumed TOSHIBA infringement patents other intellectual property rights third parties that result from Product. license intellectual property right granted this document, whether express implied, estoppel otherwise. ABSENT WRITTEN SIGNED AGREEMENT, EXCEPT PROVIDED RELEVANT TERMS CONDITIONS SALE PRODUCT, MAXIMUM EXTENT ALLOWABLE LAW, TOSHIBA ASSUMES LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, INCIDENTAL DAMAGES LOSS, INCLUDING WITHOUT LIMITATION, LOSS PROFITS, LOSS OPPORTUNITIES, BUSINESS INTERRUPTION LOSS DATA, DISCLAIMS EXPRESS IMPLIED WARRANTIES CONDITIONS RELATED SALE, PRODUCT, INFORMATION, INCLUDING WARRANTIES CONDITIONS MERCHANTABILITY, FITNESS PARTICULAR PURPOSE, ACCURACY INFORMATION, NONINFRINGEMENT. otherwise make available Product related software technology military purposes, including without limitation, design, development, use, stockpiling manufacturing nuclear, chemical, biological weapons missile technology products (mass destruction weapons). Product related software technology controlled under Japanese Foreign Exchange Foreign Trade U.S. Export Administration Regulations. Export re-export Product related software technology strictly prohibited except compliance with applicable export laws regulations. Please contact your TOSHIBA sales representative details environmental matters such RoHS compatibility Product. Please Product compliance with applicable laws regulations that regulate inclusion controlled substances, including without limitation, RoHS Directive. TOSHIBA assumes liability damages losses occurring result noncompliance with applicable laws regulations.
2006-11-17
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