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TDA9801


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TDA9801 Single standard VIF-PLL demodulator FM-PLL detector
Product specification Supersedes data 1998 File under Integrated Circuits, IC02 1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
FEATURES Suitable negative vision modulation Applicable frequencies 38.9, 45.75 58.75 Gain controlled wide-band Vision Intermediate Frequency (VIF) amplifier (AC-coupled) True synchronous demodulation with active carrier regeneration (ultra-linear demodulation, good intermodulation figures, reduced harmonics excellent pulse response) Peak sync pulse Video amplifier match sound trap sound filter output voltage tuner with fixed resistor takeover point setting detector without extra reference circuit Alignment-free FM-PLL detector with high linearity ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9801 TDA9801T DIP20 SO20 DESCRIPTION plastic dual in-line package; leads (300 mil) plastic small outline package; leads; body width
TDA9801
Stabilizer circuit ripple rejection achieve constant output signals positive supply voltage range power consumption supply voltage. GENERAL DESCRIPTION TDA9801(T) monolithic integrated circuit vision sound signal processing sets multimedia front-ends.
VERSION SOT146-1 SOT163-1
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
QUICK REFERENCE DATA SYMBOL PARAMETER supply voltage supply current note video output; 38.9 45.75 video output; 38.9 45.75 38.9 45.75 note BLUE BLUE note 1.5% CONDITIONS MIN. TYP.
TDA9801
MAX.
UNIT
Vi(sens)(VIF)(rms) sensitivity input signal (RMS value) Vi(max)(rms) Vo(CVBS)(p-p) Bv(-3dB) S/NW IM(0.92/1.1) IM(2.76/3.3) H(sup) Vo(AF)(max)(rms) Tamb Notes maximum input voltage (RMS value) gain control CVBS output voltage (peak-to-peak value) video bandwidth weighted signal-to-noise ratio intermodulation attenuation 0.92 intermodulation attenuation 2.76 harmonics suppression video signal maximum output signal handling voltage (RMS value) ambient temperature
Values video sound parameters decreased ratio black-to-white amplitude black level noise voltage (RMS value) CVBS. weighted accordance with "CCIR 567" source impedance Measurements taken with filter G1962; modulation; fvideo MHz; loop bandwidth kHz.
1999
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andbook, full pagewidth
1999
INTERNAL REFERENCE VOLTAGE TRAVELLING WAVE DIVIDER TPLL 3-STAGE IF-AMPLIFIER VIF1 FREQUENCY DETECTOR PHASE DETECTOR VIF2
BLOCK DIAGRAM
Philips Semiconductors
Single standard VIF-PLL demodulator FM-PLL detector
2fPC VCO2 VCO1 CDAF FM-PLL DETECTOR VIDEO DEMODULATOR VIDEO AMPLIFIER
DETECTOR
AMPLIFIER
TDA9801
sound mute TUNER DETECTOR
LIMITER AMPLIFIER
takeover point tuner TAGC CAGC MUTE
sound mute switch
BUFFER AMPLIFIER NOISE CLIPPER n.c. SOUND TRAP (p-p)
CVBS (p-p)
SOUND FILTER video intercarrier
MHA879
Product specification
TDA9801
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
PINNING SYMBOL VIF1 VIF2 MUTE TPLL CVBS n.c. TAGC VCO1 VCO2 DESCRIPTION differential input differential input tuner TakeOver Point (TOP) connection phase adjust connection sound mute switch connection time constant connection CVBS (positive) video output connected output amplifier decoupling capacitor connection sound intercarrier input tuner output video sound intercarrier output buffer amplifier video input output VCO1 reference circuit 2fPC VCO2 reference circuit 2fPC ground supply detector capacitor connection supply voltage Fig.2 configuration.
handbook, halfpage
TDA9801
VIF1 VIF2
VCO2 VCO1
MUTE
TDA9801
TPLL CVBS n.c.
MHA880
TAGC
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
FUNCTIONAL DESCRIPTION 3-stage amplifier amplifier consists three AC-coupled differential amplifier stages (see Fig.1). Each differential stage comprises feedback network controlled emitter degeneration. detector, tuner automatic control voltage maintain video output signal constant level generated accordance with transmission standard. Since TDA9801(T) suitable negative modulation only peak sync pulse level detected. detector charges discharges capacitor CAGC amplifier tuner gain. voltage capacitor CAGC transferred internal control signal, tuner generate tuner output current TAGC (open-collector output). tuner takeover point level TOP. This allows tuner matched filter order achieve optimum input level. Frequency detector phase detector amplifier output signal into frequency detector into phase detector. During acquisition frequency detector produces current proportional frequency difference between input signal. After frequency lock-in phase detector produces current proportional phase difference between input signal. current either frequency detector phase detector converted into voltage loop filter which controls frequency. Video demodulator true synchronous video demodulator realized linear multiplier which designed distortion wide bandwidth. vision input signal multiplied with phase' component output. demodulator output signal integrated low-pass filter MHz) suppression carrier harmonics video amplifier. VCO, detector travelling wave divider operates with symmetrically connected reference circuit, operating double vision carrier frequency. Frequency control performed internal variable capacitor diode.
TDA9801
voltage frequency actual double vision carrier frequency also amplified converted output current. signal divided-by-2 with Travelling Wave Divider (TWD) which generates differential output signals with degree phase difference independent frequency. Video amplifier composite video amplifier wide bandwidth operational amplifier with internal feedback. nominal positive video signal (p-p) present VSO. Buffer amplifier noise clipper input impedance wideband CVBS buffer amplifier (with internal feedback) suitable ceramic sound trap filters. CVBS provides positive video signal (p-p). Noise clipping provided internally. Sound demodulation LIMITER AMPLIFIER sound intercarrier signal through limiter amplifier before demodulated. result high sensitivity suppression. limiter amplifier consists stages which internally AC-coupled order minimizing offset. FM-PLL DETECTOR FM-PLL demodulator consists oscillator, loop filter phase detector. oscillator frequency locked intercarrier signal from limiter amplifier. result this locking, oscillator frequency modulated. modulating voltage signal) used control oscillator frequency. this, FM-PLL operates demodulator. AMPLIFIER audio frequency amplifier with internal feedback designed high gain high common-mode rejection. low-level signal output from FM-PLL demodulator amplified buffered low-ohmic audio output stage. external decoupling capacitor CDAF removes voltage from audio amplifier input. using sound mute switch (pin MUTE) amplifier mute state.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER supply voltage CONDITIONS Tamb maximum chip temperature TDA9801 TDA9801T voltage pins VIF1, VIF2, TAGC tsc(max) Tstg Tamb Notes Machine model class µH). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA9801 TDA9801T PARAMETER thermal resistance from junction ambient CONDITIONS free VALUE maximum short-circuit time storage temperature ambient temperature electrostatic handling voltage note ground -300 13.2 +150 +300 MIN. MAX.
TDA9801
UNIT
UNIT
CHARACTERISTICS Tamb Table input frequencies picture-to-sound carrier ratios; Vi(VIF)(rms) (sync pulse level); input from broadband transformer video modulation; residual carrier; video signal accordance with "CCIR, line "NTC-7 Composite"; measurements taken test circuit Fig.12; unless otherwise specified. SYMBOL Supply: supply voltage supply current note Vision input: pins VIF1 VIF2 Vi(sens)(VIF)(rms) sensitivity input voltage (RMS value) video output 38.9 45.75 58.75 Vi(max)(rms) maximum input voltage (RMS value) video output 38.9 45.75 58.75 1999 input voltage PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL Vint PARAMETER internal amplitude difference between picture sound carrier gain control CONDITIONS within range MIN. TYP.
TDA9801
MAX.
UNIT
Fig.6 38.9 45.75 58.75
BIF(-3dB) Ri(dif) Ci(dif)
bandwidth differential input resistance differential input capacitance
upper limit cut-off frequency note note
video demodulator; note fVCO(max) fVCO/T VVCO(rms) maximum frequency frequency variation with temperature voltage swing (RMS value) carrier regeneration; 2fPC free running; IAFC note measured between pins VCO1 VCO2 38.9 45.75 58.75 fcr(PC) tacq Vi(sens)(VIF)(rms) picture carrier capture frequency range acquisition time sensitivity input (RMS value) offset current TPLL negative positive kHz; note still locked; maximum gain; note note Ioffset(TPLL) Vo(VSO)(p-p) note Video amplifier output (sound carrier off): output voltage (peak-to-peak value) Fig.5 Vsync Vv(clu) Vv(cll) Vo(intc)(rms) Ibias sync pulse voltage level upper video clipping voltage level lower video clipping voltage level intercarrier output voltage (RMS value) output resistance bias current sound carrier note note internal emitter-follower 0.90 0.95 1.35 1.25 1.25 ±2.0
10-6
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL Io(sink)(max) Io(source)(max) Bv(-3dB) H(sup) PSRRVSO PARAMETER maximum output sink current maximum output source current video bandwidth harmonics suppression video signal power supply ripple rejection note Fig.7 CONDITIONS MIN. TYP.
TDA9801
MAX.
UNIT
Buffer amplifier noise clipper input: Bv(-3dB) Vo(v)(p-p) Vv(clu) Vv(cll) Vsync Ibias Io(sink)(max) Io(source)(max) input resistance input capacitance input voltage connected
Buffer amplifier output: CVBS voltage gain video bandwidth video output voltage (peak-to-peak value) upper video clipping voltage level lower video clipping voltage level sync pulse voltage level output resistance bias current maximum output sink current maximum output source current internal emitter-follower CVBS note sound carrier off; Fig.12 1.35
Measurements from inputs CVBS output (330 connected between pins sound carrier off) Vo(CVBS)(p-p) Vo(CVBS) CVBS output voltage (peak-to-peak value) deviation CVBS output voltage standard gain control gain control Vo(bl) Gdif Bv(-3dB) black level tilt differential gain differential phase video bandwidth gain variation; note
"CCIR, line 330" "NTC-7 Composite" "CCIR, line 330" "NTC-7 Composite"
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL S/NW PARAMETER weighted signal-to-noise ratio CONDITIONS Fig.3; note IM(0.92/1.1) intermodulation attenuation Fig.4; note 0.92 BLUE YELLOW IM(2.76/3.3) intermodulation attenuation Fig.4; note 2.76 BLUE YELLOW Vr(PC)(rms) H(sup) PSRRCVBS residual picture carrier (RMS value) harmonics suppression video signal power supply ripple rejection CVBS fundamental wave harmonics note Fig.7 MIN. TYP.
TDA9801
MAX.
UNIT
detector output: tres response time amplitude step input signal increasing step decreasing step Idch charging current discharging current gain control output voltage Fig.6 maximum gain minimum gain Tuner Vi(VIF)(rms) input voltage (RMS value) onset tuner takeover point minimum level with RTOP maximum level with RTOP QVi(VIF)(rms) Vi(VIF)/T accuracy level tuner RTOP takeover point (RMS value) ITAGC variation tuner takeover point with temperature slip automatic gain control ITAGC tuner gain current from 0.02 0.06 dB/K note 0.82 1.38
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9801
MAX.
UNIT
TUNER OUTPUT: TAGC Vmax Vsat Isink maximum voltage saturation voltage sink current from external source; note ITAGC Fig.6 tuner gain reduction maximum tuner gain reduction detector: AFC; note CRstps control steepness equal IAFC/fVIF Table 38.9 45.75 58.75 frequency variation with temperature output voltage IAFC note without external components; Fig.8 upper limit lower limit output current Fig.8 source current sink current Ir(v)(p-p) residual video modulation current (peak-to-peak value) -0.5 -0.4 -0.3 -0.75 -0.65 -0.55 -1.0 -0.9 -0.8 µA/kHz µA/kHz µA/kHz 13.2
Sound mute switch: MUTE; note mute Voffset(MUTE) LOW-level input voltage HIGH-level input voltage LOW-level input current mute attenuation offset voltage MUTE mute mute VMUTE VMUTE switching mute state (plop) -300 -360
sound limiter amplifier input: note Vi(FM)(rms) input voltage (RMS value)
"CCIR468-4"
Fig.10 kHz;
Vi(FM)(max)(rms)
maximum input handling voltage (RMS value) input voltage
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL fres(-3dB) PARAMETER input resistance suppression frequency response note signal: kHz; 0.3; Fig.9 points lower upper limits sound cut-off frequency CONDITIONS MIN. TYP.
TDA9801
MAX.
UNIT
FM-PLL sound detector amplifier; note fcr(PLL) fhr(PLL) tacq BAF(-3dB) S/NW Vr(SC)(rms) catching range holding range acquisition time audio frequency deviation audio frequency bandwidth total harmonic distortion weighted signal-to-noise ratio residual sound carrier (RMS value) deviation; note 1.5%; note upper limit lower limit upper limit lower limit 0.25
"CCIR 468-4"; Fig.10
fundamental wave harmonics kHz; standard; Fig.10 kHz; standard; Fig.10
AUDIO OUTPUT: Vo(AF)(rms) output voltage (RMS value)
Vo(AF)(max)(rms)
maximum output handling voltage (RMS value) output voltage variation with temperature output resistance load resistance
1.5%
Vo(AF)/T
note AC-coupled Fig.7; note
10-3 10-3
dB/K
Io(sink/source)(max) maximum sink source output current PSRRAF output voltage power supply ripple rejection
DECOUPLING CAPACITOR: VDAF voltage decoupling capacitor voltage depends frequency; note
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9801
MAX.
UNIT
Measurements from input output; notes Fig.13 S/NW weighted signal-to-noise ratio
"CCIR 468-4"
black picture (sync only) white picture colour
Notes Values video sound parameters decreased This parameter tested during production only given application information designing television receiver. Conditions video demodulator: Loop bandwidth: kHz, natural frequency kHz, damping factor calculated with grey level FPLL input level Resonance circuit VCO: Table value external capacitor CVCO loop voltage approximately approximately Temperature coefficient external circuit equal zero. Vi(VIF)(rms) (VCO frequency offset related fPC); white picture video modulation. Vi(VIF) signal nominal video signal. Broadband transformer input (see Fig.12). ratio input `lock-in' defined input signal (RMS value sync pulse level) related superimposed band-limited white noise signal (RMS value). video modulation white picture. offset current measured between TPLL half supply voltage under conditions: input signal inputs amplifier gain minimum (VAGC left open-circuit. intercarrier output signal superimposed video signal calculated following formula:
i(SC) (dB) i(PC)
o(intc)(rms) (p-p) where
(p-p) video output signal reference correction term value i(SC) (dB) sound-to-picture carrier ratio inputs i(PC) correction term internal circuitry tolerance video output intercarrier output amplitude Vo(intc)(rms). Example filter G1962: sound shelf value i(SC) o(intc)(rms) (typical value) i(PC)
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
Measurements taken with filter G1962; modulation; fvideo MHz; loop bandwidth kHz. buffer amplifier gain accounts loss sound trap. buffer output signal typical (p-p). sound trap applied resistor must connected between pins leakage current CAGC should exceed Larger currents will increase tilt. ratio black-to-white amplitude black level noise voltage (RMS value) CVBS. weighted accordance with "CCIR 567" source impedance intermodulation figures defined: (3.58) 0.92 0.92 (1.1) IM(0.92/1.1) value 0.92 1.1) referenced black white signal (3.58) 2.76 2.76 (3.3) IM(2.76/3.3) value 2.76 3.3) referenced colour carrier. match output signal different tuning systems current source output provided (see Fig.8). mute state also valid when MUTE connected. input signal provided external generator with source impedance, AC-coupled with capacitor, fmod (54% deviation) audio reference. input signal permitted. connected supply voltage. Measurements taken de-emphasis standard). allow higher frequency deviation, value resistor (see Fig.13) increased. However, output signal must exceed (nominal value) 0.2%. provides amplification. leakage current decoupling capacitor should exceed measurements used vision modulator meet following specifications: Incidental phase modulation black-to-white jump less than degrees performance, measured with television demodulator AMF2 (audio output, weighted ratio), better than (deviation kHz) white picture video modulation. Input signal according standard Table Input: Vi(VIF)(rms) modulation residual carrier Reference: deviation measurements taken de-emphasis. Table Input frequencies carrier ratios STANDARD SYMBOL PC/SC DESCRIPTION picture carrier frequency sound carrier frequency picture-to-sound carrier ratio 38.9 33.4 45.75 41.25 58.75 54.25 UNIT
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
handbook, halfpage
MHB507
S/NW (dB)
handbook, halfpage
13.2
13.2
BLUE
YELLOW
MED685
0.06
Vi(VIF)(rms)(dB) Vi(VIF)(rms)(mV)
sound carrier level, with respect sync pulse level. chrominance carrier level, with respect sync pulse level. picture carrier level, with respect sync pulse level. Sound shelf attenuation:
Fig.3
Video output weighted signal-to-noise ratio function input voltage.
Fig.4
Input signal conditions intermodulation measurements.
handbook, halfpage
zero carrier level white level
black level sync level
standard
MHA889
Fig.5
Video signal levels output (sound carrier off).
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
handbook, full pagewidth
MHB510
(dB) TAGC (mA)
VAGC
gain control). RTOP RTOP RTOP
Fig.6 gain control tuner output current function tuner detector voltage.
handbook, full pagewidth
TDA9801 (fripple
MHA884
Fig.7 Power supply ripple rejection condition.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
handbook, halfpage
handbook, halfpage
TDA9801
IAFC VAFC
MHA887
TDA9801
IAFC VAFC
MHA888
handbook, halfpage
MHB508
IAFC (µA)
handbook, halfpage
MHB509
VAFC 3.75 (source current)
IAFC (µA)
(source current)
(sink current)
1.25 -100
(sink current) -150 -225 39.5 (MHz)
38.3
38.6
38.9
-150 39.2 39.5 (MHz)
38.3
38.6
38.9
39.2
Fig.8 measurement conditions typical characteristics.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
handbook, full pagewidth
MHA885
(dB)
-100 10-1
Vi(SI) (mV)
Fig.9 suppression (typical value) limiter amplifier function input voltage.
MHA886
handbook, full pagewidth
Vo(AF)(rms) (mV)
S/NW (dB)
10-1 Signal-to-noise ratio (weighted). output signal (typical value).
Vi(SI) (mV)
Fig.10 output signal signal-to-noise ratio function input voltage.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
handbook, full pagewidth
gain range (<70)
antenna input (dBµV) insertion loss
video (p-p) 10-1 signals (RMS value)
tuner gain control range
slip
10-2
10-3 0.66 10-3
insertion loss gain
10-4 0.66 10-4
10-5 0.66 10-5
VHF/UHF tuner
filter
amplifier, demodulator video TDA9801
MHA883
Depends TOP.
Fig.11 Front-end level diagram.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
INTERNAL CIRCUITRY SYMBOL VIF1 VIF2 VOLTAGE
TDA9801
EQUIVALENT CIRCUIT (WITHOUT PROTECTION CIRCUIT)
MHB511
MHB512
MHB513
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL MUTE VOLTAGE
TDA9801
EQUIVALENT CIRCUIT (WITHOUT PROTECTION CIRCUIT)
mute
MHB514
TPLL
MHB515
CVBS
sync pulse level: 1.35
MHB516
n.c.
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL VOLTAGE
TDA9801
EQUIVALENT CIRCUIT (WITHOUT PROTECTION CIRCUIT)
MHB517
MHB518
MHB519
TAGC
13.2
MHB520
sync pulse level:
11.5
MHB521
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL VOLTAGE
TDA9801
EQUIVALENT CIRCUIT (WITHOUT PROTECTION CIRCUIT)
MHB522
MHB523
VCO1 VCO2
MHB524
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SYMBOL VOLTAGE
TDA9801
EQUIVALENT CIRCUIT (WITHOUT PROTECTION CIRCUIT)
13.5
MHB525
MHB526
13.5
MHB525
1999
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1999
TEST APPLICATION INFORMATION
Philips Semiconductors
Single standard VIF-PLL demodulator FM-PLL detector
VCO1 TAGC (p-p)
video intercarrier tuner
VCO2
TDA9801
VIF1 vision sound mute
MHA881
VIF2
MUTE
TPLL
CVBS
n.c.
takeover point
CVBS (p-p)
Product specification
TDA9801
Table
Fig.12 Test circuit.
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ndbook, full pagewidth
1999
Philips Semiconductors
Single standard VIF-PLL demodulator FM-PLL detector
sound trap sound filter VCO1 TAGC (p-p)
video intercarrier tuner R1(2) R2(2) V)(2)
VCO2
TDA9801
VIF1 vision filter G1962 takeover point VIF2 input Table Depends tuner. note Chapter "Characteristics".
MUTE
TPLL
CVBS
n.c.
R3(3) CVBS (p-p)
sound mute
MHA882
Product specification
TDA9801
Fig.13 Application circuit.
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
Table Oscillator circuit different standards EUROPE 38.9 77.8
TDA9801
PARAMETER frequency frequency Oscillator circuit
45.75 91.5
JAPAN 58.75 117.5
MGG099
MGG099
MGG099
CVCO ±0.25
CVCO ±0.25
CVCO ±0.25
Toko coil Philips ceramic capacitor
369SNS-2010Z 2222 51828
5KMC V369SCS-2370Z inside coil
MC139 NE545SNAS100108 (SMD; size: 0805)
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
PACKAGE OUTLINES DIP20: plastic dual in-line package; leads (300 mil)
TDA9801
SOT146-1
seating plane
index
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches Note Plastic metal protrusions 0.25 maximum side included. OUTLINE VERSION SOT146-1 REFERENCES JEDEC EIAJ SC603 EUROPEAN PROJECTION max. 0.17 min. 0.51 0.020 max. 0.13 1.73 1.30 0.068 0.051 0.53 0.38 0.021 0.015 0.36 0.23 0.014 0.009
2.54 0.10
7.62 0.30
3.60 3.05 0.14 0.12
8.25 7.80 0.32 0.31
10.0 0.39 0.33
0.254 0.01
max. 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
ISSUE DATE 92-11-17 95-05-24
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
TDA9801
SO20: plastic small outline package; leads; body width
SOT163-1
index detail
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches max. 2.65 0.10 0.30 0.10 2.45 2.25 0.25 0.01 0.49 0.36 0.32 0.23 13.0 12.6 0.51 0.49 0.30 0.29 1.27 0.050 10.65 10.00 0.043 0.039 0.25 0.01 0.25 0.01 0.004
0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
Note Plastic metal protrusions 0.15 maximum side included. OUTLINE VERSION SOT163-1 REFERENCES 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
SOLDERING Introduction This text gives very brief insight complex technology. more in-depth account soldering found "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 90011). There soldering method that ideal packages. Wave soldering often preferred when through-hole surface mount components mixed printed-circuit board. However, wave soldering always suitable surface mount ICs, printed-circuit boards with high population densities. these situations reflow soldering often used. Through-hole mount packages SOLDERING DIPPING SOLDER WAVE maximum permissible temperature solder solder this temperature must contact with joints more than seconds. total contact time successive solder waves must exceed seconds. device mounted seating plane, temperature plastic body must exceed specified maximum storage temperature (Tstg(max)). printed-circuit board been pre-heated, forced cooling necessary immediately after soldering keep temperature within permissible limit. MANUAL SOLDERING Apply soldering iron less) lead(s) package, either below seating plane more than above temperature soldering iron less than remain contact seconds. temperature between contact seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist reflowing; example, infrared/convection heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method.
TDA9801
Typical reflow peak temperatures range from top-surface temperature packages should preferable kept below WAVE SOLDERING Conventional single wave soldering recommended surface mount devices (SMDs) printed-circuit boards with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used following conditions must observed optimal results: double-wave soldering method comprising turbulent wave with high upward pressure followed smooth laminar wave. packages with leads sides pitch (e): larger than equal 1.27 footprint longitudinal axis preferred parallel transport direction printed-circuit board; smaller than 1.27 footprint longitudinal axis must parallel transport direction printed-circuit board. footprint must incorporate solder thieves downstream end. packages with leads four sides, footprint must placed angle transport direction printed-circuit board. footprint must incorporate solder thieves downstream side corners. During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time seconds mildly-activated flux will eliminate need removal corrosive residues most applications. MANUAL SOLDERING component first soldering diagonally-opposite leads. voltage less) soldering iron applied flat part lead. Contact time must limited seconds When using dedicated tool, other leads soldered operation within seconds between
1999
Philips Semiconductors
Product specification
Single standard VIF-PLL demodulator FM-PLL detector
Suitability packages wave, reflow dipping soldering methods
TDA9801
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, PLCC(4), LQFP, QFP, TQFP SSOP, TSSOP, Notes surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer Drypack information "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". SDIP packages, longitudinal axis must parallel transport direction printed-circuit board. These packages suitable wave soldering solder joint between printed-circuit board heatsink bottom version) achieved, solder stick heatsink version). wave soldering considered, then package must placed angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering only suitable LQFP, TQFP packages with pitch equal larger than definitely suitable packages with pitch equal smaller than 0.65 Wave soldering only suitable SSOP TSSOP packages with pitch equal larger than 0.65 definitely suitable packages with pitch equal smaller than DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. 1999 This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications. suitable(2) suitable suitable(3) suitable recommended(4)(5) recommended(6) REFLOW(1) DIPPING suitable suitable suitable suitable suitable suitable
Philips Semiconductors worldwide company
Argentina: South America Australia: Figtree Drive, HOMEBUSH, 2140, Tel. 9704 8141, Fax. 9704 8139 Austria: Computerstr. A-1101 WIEN, P.O. 213, Tel. 1248, Fax. 1210 Belarus: Hotel Minsk Business Center, Bld. 1211, Volodarski Str. 220050 MINSK, Tel. +375 0733, Fax. +375 0773 Belgium: Netherlands Brazil: South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, James Bourchier Blvd., 1407 SOFIA, Tel. +359 9211, Fax. +359 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. 7381, Fax. 0087 China/Hong Kong: Hong Kong Industrial Technology Centre, Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: South America Czech Republic: Austria Denmark: Sydhavnsgade 1780 COPENHAGEN Tel. 3333, Fax. 3905 Finland: Sinikalliontie FIN-02630 ESPOO, Tel. +358 800, Fax. +358 6158 0920 France: Carnot, BP317, 92156 SURESNES Cedex, Tel. 4099 6161, Fax. 4099 6427 Germany: D-20097 HAMBURG, Tel. 2353 Fax. 2353 6300 Hungary: Austria India: Philips INDIA Ltd, Band Building, floor, 254-D, Annie Besant Road, Worli, MUMBAI 025, Tel. 8541, Fax. 0966 Indonesia: Philips Development Corporation, Semiconductors Division, Gedung Philips, Buncit Raya Kav.99-100, JAKARTA 12510, Tel. 0040 ext. 2501, Fax. 0080 Ireland: Newstead, Clonskeagh, DUBLIN Tel. +353 7640 000, Fax. +353 7640 Israel: RAPAC Electronics, Kehilat Saloniki 18053, AVIV 61180, Tel. +972 0444, Fax. +972 1007 Italy: PHILIPS SEMICONDUCTORS, Casati, 20052 MONZA (MI), Tel. 6838, 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. 3740 5130, Fax. 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. 1412, Fax. 1415 Malaysia: Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. 5214, Fax. 4880 Mexico: 5900 Gateway East, Suite 200, PASO, TEXAS 79905, Tel. +9-5 7381, +9-5 0087 Middle East: Italy Netherlands: Postbus 90050, 5600 EINDHOVEN, Bldg. Tel. 82785, Fax. 88399 Zealand: Wagener Place, C.P.O. 1041, AUCKLAND, Tel. 4160, Fax. 7811 Norway: Manglerud 0612, OSLO, Tel. 8000, Fax. 8341 Pakistan: Singapore Philippines: Philips Semiconductors Philippines Inc., Valero Salcedo Village, P.O. 2108 MCC, MAKATI, Metro MANILA, Tel. 6380, Fax. 3474 Poland: Lukiska 04-123 WARSZAWA, Tel. 2831, Fax. 2327 Portugal: Spain Romania: Italy Russia: Philips Russia, Usatcheva 35A, 119048 MOSCOW, Tel. 6918, Fax. 6919 Singapore: Lorong Payoh, SINGAPORE 319762, Tel. 2538, Fax. 6500 Slovakia: Austria Slovenia: Italy South Africa: S.A. PHILIPS Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 58088 Newville 2114, Tel. 5401, Fax. 5398 South America: Vicente Pinzon, 173, floor, 04547-130 PAULO, Brazil, Tel. 2333, Fax. 2382 Spain: Balmes 08007 BARCELONA, Tel. 6312, Fax. 4107 Sweden: Kottbygatan Akalla, S-16485 STOCKHOLM, Tel. 5985 2000, Fax. 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 Tel. 2741 Fax. 3263 Taiwan: Philips Semiconductors, Chien Rd., Sec. TAIPEI, Taiwan Tel. +886 2134 2886, Fax. +886 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. 4090, Fax. 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. 81260 Umraniye, ISTANBUL, Tel. 1500, Fax. 1813 Ukraine: PHILIPS UKRAINE, Patrice Lumumba str., Building Floor 252042 KIEV, Tel. +380 2776, Fax. +380 0461 United Kingdom: Philips Semiconductors Ltd., Bath Road, Hayes, MIDDLESEX 5BX, Tel. 5000, Fax. 8421 United States: East Arques Avenue, SUNNYVALE, 94088-3409, Tel. 7381, Fax. 0087 Uruguay: South America Vietnam: Singapore Yugoslavia: PHILIPS, Pasica 5/v, 11000 BEOGRAD, Tel. +381 5344, Fax.+381 5777
other countries apply Philips Semiconductors, International Marketing Sales Communications, Building BE-p, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax. 24825 Philips Electronics N.V. 1999
Internet:
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
545004/02/pp32
Date release: 1999
Document order number:
9397 05292

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