SN74ABT245B SN54ABT245A
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SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
Typical VOLP (Output Ground Bounce)
25°C Ioff Power-Up 3-State Support Insertion High-Drive Outputs (-32-mA IOH, 64-mA IOL)
Latch-Up Performance Exceeds
JEDEC Standard JESD Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A)
SN54ABT245B PACKAGE (TOP VIEW)
description/ordering information
These octal transceivers designed asynchronous communication between data buses. devices transmit data from from bus, depending logic level direction-control (DIR) input. output-enable (OE) input used disable device buses effectively isolated. ORDERING INFORMATION
PDIP SOIC -40°C 85°C SSOP TSSOP TVSOP VFBGA VFBGA (Pb-free) CDIP 125°C -55°C Tape reel Tube Tube PACKAGE Tube Tape reel Tube Tape reel Tape reel Tape reel Tube Tape reel Tape reel ORDERABLE PART NUMBER SN74ABT245BN SN74ABT245BRGYR SN74ABT245BDW SN74ABT245BDWR SN74ABT245BNSR SN74ABT245BDBR SN74ABT245BPW SN74ABT245BPWR SN74ABT245BDGVR SN74ABT245BGQNR SN74ABT245BZQNR SNJ54ABT245AJ SNJ54ABT245AW AB245B SNJ54ABT245AJ SNJ54ABT245AW AB245B AB245B ABT245B ABT245B AB245B TOP-SIDE MARKING SN74ABT245BN AB245B
LCCC Tube SNJ54ABT245AFK SNJ54ABT245AFK Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
products compliant 38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters.
Copyright 2005, Texas Instruments Incorporated
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SN54ABT245A PACKAGE SN74ABT245B DGV, PACKAGE (TOP VIEW)
SN74ABT245B PACKAGE (TOP VIEW)
SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
description/ordering information (continued)
ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. This device fully specified hot-insertion applications using Ioff power-up 3-state. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down. power-up 3-state circuitry places outputs high-impedance state during power power down, which prevents driver conflict.
SN74ABT245B PACKAGE (TOP VIEW)
terminal assignments
FUNCTION TABLE INPUTS OPERATION data data Isolation
logic diagram (positive logic)
Seven Other Channels numbers shown DGV, RGY, packages.
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SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (except ports) (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, SN54ABT245A SN74ABT245B Input clamp current, Output clamp current, Package thermal impedance, (see Note package 70°C/W (see Note package 92°C/W (see Note package 58°C/W (see Note GQN/ZQN package 78°C/W (see Note package 69°C/W (see Note package 60°C/W (see Note package 83°C/W (see Note package 37°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with JESD 51-7. package thermal impedance calculated accordance with JESD 51-5.
recommended operating conditions (see Note
SN54ABT245A t/VCC Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Power-up ramp rate Operating free-air temperature SN74ABT245B UNIT ns/V µs/V
NOTE unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
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SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS Vhys Control inputs ports ports Outputs high Outputs high Outputs Outputs disabled -140 ±100 -180 -180 ±100 ±100 -180 0.55 0.55* 0.55 0.55 25°C -1.2 SN54ABT245A -1.2 SN74ABT245B -1.2 UNIT
IOZPU IOZPD IOZH IOZL Ioff ICEX
Data inputs Control inputs Control inputs ports
Outputs enabled input Other inputs Outputs disabled input Other inputs
products compliant MIL-PRF-38535, this parameter does apply. typical values parameters IOZH IOZL include input leakage current. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level, rather than GND.
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SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ tsk(o) FROM (INPUT) (OUTPUT) 25°C SN54ABT245A SN74ABT245B UNIT
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SN54ABT245A, SN74ABT245B OCTAL TRANSCEIVERS WITH STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
From Output Under Test (see Note Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
LOAD CIRCUIT Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP HOLD TIMES Data Input
Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS
Output Control tPZL Output Waveform (see Note tPZH Output Waveform Open (see Note
tPLZ
tPHZ
VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
NOTES: includes probe capacitance. Waveform output with internal conditions such that output low, except when disabled output control. Waveform output with internal conditions such that output high, except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time, with transition measurement. parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
PACKAGING INFORMATION
Orderable Device 5962-9214802Q2A 5962-9214802QRA 5962-9214802QSA SN74ABT245BDBLE SN74ABT245BDBR SN74ABT245BDBRG4 SN74ABT245BDGVR SN74ABT245BDGVRE4 SN74ABT245BDGVRG4 SN74ABT245BDW SN74ABT245BDWG4 SN74ABT245BDWR SN74ABT245BDWRG4 SN74ABT245BGQNR Status ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE NRND Package Type LCCC CDIP SSOP SSOP SSOP TVSOP TVSOP TVSOP SOIC SOIC SOIC SOIC CROSTA JUNI PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP Package Drawing Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish Peak Temp
POST-PLATE Type Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU SNPB Type Type Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-240C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 1000
SN74ABT245BN SN74ABT245BNE4 SN74ABT245BNSR SN74ABT245BNSRE4 SN74ABT245BNSRG4 SN74ABT245BPW SN74ABT245BPWE4 SN74ABT245BPWG4 SN74ABT245BPWLE SN74ABT245BPWR SN74ABT245BPWRE4 SN74ABT245BPWRG4
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE
Pb-Free (RoHS) Pb-Free (RoHS)
NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU NIPDAU
Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Orderable Device SN74ABT245BRGYR SN74ABT245BRGYRG4 SN74ABT245BZQNR
Status ACTIVE ACTIVE ACTIVE
Package Type VQFN VQFN CROSTA JUNI LCCC CDIP
Package Drawing
Pins Package Plan 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU SNAGCU
Peak Temp Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM
SNJ54ABT245AFK SNJ54ABT245AJ SNJ54ABT245AW
ACTIVE ACTIVE ACTIVE
POST-PLATE Type Call Type Type
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis. OTHER QUALIFIED VERSIONS SN54ABT245A, SN74ABT245B Catalog: SN74ABT245A Enhanced Product: SN74ABT245B-EP NOTE: Qualified Version Definitions: product Catalog TI's standard catalogDefense, Aerospace Medical Applications Enhanced Product Supports
Addendum-Page
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
TAPE REEL INFORMATION
*All dimensions nominal
Device
Package Package Pins Type Drawing SSOP TVSOP SOIC CROSTA JUNI TSSOP VQFN CROSTA JUNI
Reel Reel Diameter Width (mm) (mm) (mm) 330.0 330.0 330.0 330.0 16.4 12.4 24.4 12.4 10.8
(mm) 13.0
(mm)
(mm) 12.0 12.0
Pin1 (mm) Quadrant 16.0 12.0 24.0 12.0
SN74ABT245BDBR SN74ABT245BDGVR SN74ABT245BDWR SN74ABT245BGQNR
2000 2000 2000 1000
SN74ABT245BNSR SN74ABT245BPWR SN74ABT245BRGYR SN74ABT245BZQNR
2000 2000 3000 1000
330.0 330.0 180.0 330.0
24.4 16.4 12.4 12.4
6.95
13.0
12.0
24.0 16.0 12.0 12.0
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
*All dimensions nominal
Device SN74ABT245BDBR SN74ABT245BDGVR SN74ABT245BDWR SN74ABT245BGQNR SN74ABT245BNSR SN74ABT245BPWR SN74ABT245BRGYR SN74ABT245BZQNR
Package Type SSOP TVSOP SOIC MICROSTAR JUNIOR TSSOP VQFN MICROSTAR JUNIOR
Package Drawing
Pins
2000 2000 2000 1000 2000 2000 3000 1000
Length (mm) 346.0 346.0 346.0 346.0 346.0 346.0 190.5 346.0
Width (mm) 346.0 346.0 346.0 346.0 346.0 346.0 212.7 346.0
Height (mm) 33.0 29.0 41.0 29.0 41.0 33.0 31.8 29.0
Pack Materials-Page
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
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MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
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MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
(R-PDSO-G**)
PINS SHOWN 0,23 0,13
PLASTIC SMALL-OUTLINE
0,40
0,07
0,16 4,50 4,30 6,60 6,20
Gage Plane
0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,08
PINS
3,70 3,50
3,70 3,50
5,10 4,90
5,10 4,90
7,90 7,70
9,80 9,60
11,40 11,20
4073251/E 08/00 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion, exceed 0,15 side. Falls within JEDEC: 24/48 Pins MO-153 14/16/20/56 Pins MO-194
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