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SL1ICS3001 - SL1ICS3001
SL1ICS3001 I-CODE1 Label
Product specification Supersedes data 2000 2002
Philips Semiconductors
Product specification
I-CODE1 Label
CONTENTS 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 9.2.1 9.2.2 12.1 12.2 13.1 13.2 13.3 13.4 13.5 13.6 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Memory organization Serial number Write access conditions Special functions Family code application identifier User data LIMITING VALUES QUALITY ASSURANCE Electrical acceptance test Visual inspection After wafer final test After sawing (film frame carrier) HANDLING INSTRUCTIONS ELECTRICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS specifications Wafer specifications APPLICATION INFORMATION Protection against visible light Protection against light Resistance X-rays Characterisation inlet label Final test inlet label Coil specification 14.1 14.2 14.3 14.3.1 14.3.2 14.3.3 DELIVERY
SL1ICS3001
Configuration delivered Packing Documentation Delivery documentation Fail-die identification Wafer mapping REFERENCE DOCUMENTS DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2002
Philips Semiconductors
Product specification
I-CODE1 Label
FEATURES
SL1ICS3001
Operating frequency 13.56 512-bit read/write memory Operating range with Electronic Article Surveillance (EAS) detection memory read write Anticollision: simultaneous operation several labels Reliable detection avoids false alarms Data retention years Operating temperature from accordance with standards Federal Communications Commission (FCC part European Telecommunications Standards Institute (ETSI 683) Open communication protocol Application identifier saves time. APPLICATIONS GENERAL DESCRIPTION I-CODE1 label dedicated chip intelligent label applications logistics retail (including EAS) baggage parcel identification airline business mail services. I-CODE system offers possibility operating labels simultaneously field reader antenna (anticollision). designed long range applications. Whenever connected very simple cheap type antenna (due 13.56 carrier frequency) made windings printed, wound, etched punched coil, SL1ICS3001 operates without line sight distance (gate width).
I-CODE(1) system labels.
I-CODE trademark Koninklijke Philips Electronics N.V.
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION unsawn wafer; inked mapped sawn wafer foil (FFC); inked mapped VERSION
SL1ICS3001U SL1ICS3001W
wafer wafer
2002
Philips Semiconductors
Product specification
I-CODE1 Label
BLOCK DIAGRAM
SL1ICS3001
handbook, full pagewidth
Cres DEMODULATOR
ANALOG INTERFACE
MODULATOR
POWER SUPPLY DATA DATA
CLOCK
CLOCK
DIGITAL CONTROL ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL INTERFACE CONTROL
TEST EEPROM bits
SL1ICS3001
MGW339
Fig.1 Block diagram.
PINNING SYMBOL DESCRIPTION bond antenna coil connection bond antenna coil connection test pad; this test electrically neutral sawn wafers electrical connection substrate pad; electrically neutral sawn wafers
handbook, halfpage
TEST
TEST
MGW340
Fig.2 locations.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
FUNCTIONAL DESCRIPTION Memory organization
SL1ICS3001
This specification describes electrical, physical dimensional properties unsawn sawn wafers Film Frame Carrier (FFC) SL1ICS3001 Philips 6C15 IDFW process base delivery tested label ICs. General recommendations given storage, handling, processing wafers assembly labels. This product specification valid VCOL1V0 from mask revision upwards. General
EEPROM memory capacity bits organised blocks consisting bytes each (see Table block smallest access unit. Each block consists bytes block bits). each byte represents Least Significant (LSB) Most Significant (MSB), respectively. higher blocks contain user data lowest blocks contain serial number, write access conditions some configuration bits. values hexadecimal notation) stored EEPROM after wafer production process. contents blocks marked with Table defined delivery.
label requires internal power supply (see Fig.1). contactless interface generates power supply system clock resonant circuitry inductive coupling reader. interface also demodulates data which transmitted from reader label modulates electromagnetic field data transmission from label reader. Data stored non-volatile memory (EEPROM). Table EEPROM memory organization BYTE SNR0 SNR4 BYTE SNR1 SNR5 BYTE SNR2 SNR6 BYTE SNR3 SNR7
BLOCK NUMBER
FUNCTION serial number (lower bytes) serial number (higher bytes) write access conditions special functions (EAS QUIET) family code, application identifier user data user data user data user data user data user data user data user data user data user data user data user data
2002
Philips Semiconductors
Product specification
I-CODE1 Label
7.2.1 SERIAL NUMBER
SL1ICS3001
unique 64-bit serial number stored blocks programmed during production process. Byte SNR0 table represents least significant byte byte SNR7 most significant byte, respectively. Table Block with serial number (lower bytes) BYTE Block Name Table SNR0 SNR1 BYTE SNR2 BYTE SNR3 BYTE
Block with serial number (higher bytes) BYTE SNR4 WRITE ACCESS CONDITIONS SNR5 BYTE SNR6 BYTE SNR7 BYTE
Block Name 7.2.2
write access conditions block determine write access each blocks. These bits only logic (and never changed logic therefore, already write protected blocks never written from this moment This also true block this block into write protected state clearing bits byte further changes write access conditions possible. `ones' (11) pairs bits have cleared together corresponding block wanted write protected forever: (11) write access enabled (00) write access disabled. Writing pairs (10) (01) block allowed. Remarks: extremely important particularly careful when clearing write access bits block lose write access blocks case mistake. course, this feature used SL1IC3001 into hardware write protected state. Table Block with write access conditions blocks BYTE Block Write access block number BYTE BYTE BYTE
2002
Philips Semiconductors
Product specification
I-CODE1 Label
7.2.3 SPECIAL FUNCTIONS
SL1ICS3001
special functions block (see Table holds bits (EAS mode) bits (QUIET mode). remaining bits (marked reserved future use. electronic article surveillance mode active (bits 11), then label answers command. QUIET mode enabled (setting bits 11), then label permanently disabled activated again with command RESET QUIET BIT. label activated also disabling QUIET mode setting bits state QUIET mode does influence functionality command. Writing pairs block allowed. Remarks: Changing write access control configuration must done secure environment reading current value block masking values positions that changed. label must moved communication field antenna during writing! recommend label close antenna remove during operation. Table Block with special functions BYTE Block Name 7.2.4 used QUIET used BYTE used BYTE used BYTE
FAMILY CODE APPLICATION IDENTIFIER
I-CODE system offers feature (independently) family codes and/or application identifiers with some reader commands. This allows example creation `label families'. These 8-bit values located beginning block only evaluated bytes reader commands unequal zero. Only both corresponding parameter bytes reader commands ANTICOLLISION/SELECT, UNSELECTED READ respectively, logic then block used user data without restriction. Bytes customer usage. Table Block with family code application BYTE Block Name 7.2.5 family code USER DATA application BYTE user data BYTE user data BYTE
remaining blocks customer usage.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134); notes SYMBOL Tstg Vesd Ii(LA-LB)(p) Notes PARAMETER storage temperature junction temperature electrostatic discharge voltage input current (peak value) note CONDITIONS MIN. TYP.
SL1ICS3001
MAX. +140 +140
UNIT
Stresses above those listed this table cause permanent damage device. This stress rating only functional operation device these conditions other than those described Chapter implied. This product includes circuitry specifically designed protection internal devices from damaging effects excessive static charge. Nonetheless, suggested that conventional precautions taken avoid applying greater than rated maxima. Human Body Model (HBM) accordance with "MIL-STD-883D Method 3015.7". QUALITY ASSURANCE Electrical acceptance test HANDLING INSTRUCTIONS Please refer Philips "General specification wafer" following items: Sawing attach Wire bonding.
electrical acceptance test performed line (`sampling fly') according test specifications. Sampling plan: According document "General quality specification". 9.2.1 Visual inspection AFTER WAFER FINAL TEST
Performed according document "SNW-FQ-627". Sampling plan: According document "General quality specification". 9.2.2 AFTER SAWING (FILM FRAME CARRIER)
Performed according document "PICTOH-QS007". Sampling plan wafers lot): Accept
2002
Philips Semiconductors
Product specification
I-CODE1 Label
ELECTRICAL CHARACTERISTICS Tamb unless otherwise specified. SYMBOL General Tamb Supply Pmin Inputs Cres Rmod Ii(LA-LB)(rms) Vi(LA-LB)(p) capacitance between pads modulator-on resistance input current (RMS value) minimum input voltage (peak value) standard mode; note read write fast mode; note read, write Modulation mmin minimum modulation index voltage demodulator response maximum modulation index voltage demodulator response note VLA-LB (RMS); note ILA-LB 22.3 23.5 minimum operating power VLA-LB (RMS); note ambient temperature junction temperature PARAMETER CONDITIONS MIN. TYP.(1)
SL1ICS3001
MAX.
UNIT
24.7
mmax
note
Timing foper operating frequency modulation start-pulse length voltage note 10%; note standard mode fast mode EEPROM tret nwrite Notes Typical ratings guaranteed. These values listed Tamb Including losses resonant capacitor rectifier. Measured with HP4285A meter 13.56 MHz. voltage between pads limited on-chip voltage limitation circuitry, corresponding parameter Ii(LA-LB). EEPROM data retention time EEPROM write endurance Tamb 100000 years cycles demodulator response time 3.54 15.34 5.31(8) 17.11(8) 9.44 21.24 13.553 13.560 13.567
2002
Philips Semiconductors
Product specification
I-CODE1 Label
Definition: Bandwidth limitation kHz) according band regulations. given values derived from 13.56 system frequency. Recommended values pulse duration generated read/write device. MECHANICAL CHARACTERISTICS 12.1 specifications PARAMETER Designation Bond location Bond size: Test size: TEST Bond metallization material Metallization thickness dimensions (including scribe line) dimensions (excluding scribe line) Tolerances sawn dies identification side passivation material Passivation thickness Notes Fig.3 AlSiCu 1460 1490 1380 1410 Fig.2 oxynitride; notes VALUE
SL1ICS3001
VCOL1V0; visible each (see Fig.3)
passivation protection active areas against dust (particles), humidity, general contamination (whole surface chip except bond pads). glass-like physical properties careful handling processing required.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
SL1ICS3001
handbook, full pagewidth
144.7
96.5
TEST
582.5
139.7
1490 1410
233.7
VCOL1V0
282.1
141.4
1380 1460
MGW341
Dimensions Including scribe line.
Fig.3 dimensions.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
SL1ICS3001
12.2 Wafer specifications further information, please refer Philips documents: "Dicing process thin wafers" "General specification wafer". case doubt inconsistency mentioned wafer specifications applicable. PARAMETER Designation Wafer diameter separation lane width Electrical connection substrate Geometrically complete dies wafer Orientation dies relatively wafer flat Position test structures Wafer layout Batch size Process Backside treatment Wafer status Notes Wafers delivered with thickness (untreated) with (approximately mil) ground etched backside. There wafer status: unsawn sawn FCC; both tested. Minimum yield 30%. VALUE each wafer laser scribed with batch wafer number (150 (scribe line) potential approximately 7400 Fig.5 Fig.5 Fig.5 wafers 6C15 IDFW note note
2002
Philips Semiconductors
Product specification
I-CODE1 Label
SL1ICS3001
handbook, full pagewidth
13.41
13.14
MGW342
Dimensions
Fig.4 Cluster plan.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
SL1ICS3001
handbook, full pagewidth
MGW358
Dimensions three black areas show position Process Control Module (PCM) structures inch wafer.
Fig.5 Cluster map.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
APPLICATION INFORMATION 13.1 Protection against visible light 13.4
SL1ICS3001
Characterisation inlet label
result ultra power design SL1ICS3001 some analog circuits chip light sensitive. This means that common sunlight impact operation label chip protected against visible light radiation. Measurements have shown that maximum radiation W/m2 (spectrum: 1000 causes reduced operating range plain chip. Measurements direct sunlight summer deliver values W/m2. ensure proper operation expected minimum radiation reduction factor approximately (round must provided encapsulation. That means special care taken ensure sufficient light protection SL1ICS3001 (e.g. translucent encapsulation underfiller) according application requirements. 13.2 Protection against light
parameters recommended characterised inlet label given Table 13.5 Final test inlet label
Basic flow production test: Production wafer Testing dies wafer Writing serial numbers pre-configuration Sawing wafer Assembly inlets labels Final test inlets labels Writing customer data. detect damage EEPROM cells during production inlets labels final test EEPROM after assembly inlet label recommended. This necessary achieve lowest failure rates. 13.6 Coil specification
EEPROM memory, used SL1ICS3001, some principle sensitivity light (applies EEPROM technology general). Thus strong light exposure production inlets labels avoided. light protection ensured using appropriate assembly methods. 13.3 Resistance X-rays
SL1ICS3001 connected pads coil characterised electrical parameters according Philips application note "SL1ICS3001 I-CODE1 Label Coil Design Guide".
X-ray exposure comparable Philips (with even smaller feature size) caused neither long term influence behaviour data retention EEPROMs. Table Inlet label parameters PARAMETER resonant frequency threshold value field strength command UNSELECTED READ (standard mode) threshold value field strength command WRITE (standard mode) CONDITIONS Tamb HTH; note command UNSELECTED READ
SYMBOL fres
Note
command WRITE (and verifying read)
command transmitted inlet label, then label generates response there modulation.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
DELIVERY 14.1 Configuration delivered 14.3.2 FAIL-DIE IDENTIFICATION
SL1ICS3001
SL1ICS3001 delivered with following configuration Philips: Serial number unique read only Write access conditions allow change blocks (with exception both serial number blocks) Status mode defined Status QUIET mode defined Family code application identifier defined User data memory defined. Remark: status QUIET mode defined delivery, first command executed SL1ICS3001 should command RESET QUIET BIT. 14.2 Packing
Every electrically tested according data sheet. Identification chips which confirm with electrical parameters data sheet done inking and/or wafer mapping (all dies wafer periphery identified `FAIL'). 14.3.3 WAFER MAPPING
Wafer mapping failed identification available floppy-disk (format 3.5", Electroglas ESC-ASCEND). Remark: wafer refers unsawn wafers. sawn wafers FFC) additional might inked (marked `FAIL') damaged during sawing process (compared wafer map). Fig.6 example screen shot wafer map.
packing shipment wafers protect wafers against shock, severe impact, dust electrostatic discharge. packing unsawn wafers sawn wafers done according Philips "General Specification wafer". 14.3 14.3.1 Documentation DELIVERY DOCUMENTATION
Each wafer container each larger shipment container individually marked with identification information follows. Diffusion batch number (wafer number) Part designation (type) with revision number Ordering code Date code acceptance Good quantity. print final test results attached packing contains good quantity related every wafer number.
2002
Philips Semiconductors
Product specification
I-CODE1 Label
SL1ICS3001
Fig.6 Screen shot wafer map.
handbook, full pagewidth
MGW359
2002
Philips Semiconductors
Product specification
I-CODE1 Label
Table file this example
SL1ICS3001
ELECTROGLAS APPLICATIONS WAFER TEST DATA FILE COPYRIGHT ASCEND DEVICE PRODUCT WAFER READER XSTEP YSTEP XREF YREF XDELTA YDELTA FLAT XFRST YFRST PRQUAD COQUAD DIAM DATE TIME OPERATOR SET-UP FILE TEST SYSTEM TEST DATA PROBE CARD PROBER 09397 VCOL1HE2 VCOL\4020 09397-05-B6 UNITS UNITS 16891 UNITS -261 UNITS 6000 UNITS 2000-01-23 15:30:00 4020 M:\SET\VCOL1HE2.SET VCOL\4020 PIWP105
(0.1)MIL (0.1)MIL (0.1)MIL (0.1)MIL
:### shortening X40Y3 X41Y3 X42Y3 X43Y3 X44Y3 X45Y3 X46Y3 X47Y3 X48Y3 X49Y3 X50Y3 X51Y3 X52Y3 X53Y3 X54Y3 :### shortening EDATE ETIME
file
file
REFERENCE DOCUMENTS CATEGORY Standard Standard MISD standard MISD standard Data sheet Application note Application note NUMBER TITLE
"MIL-STD 883D Method 3023" "MIL-STD-883D Method 3015.7" "SNW-FQ-627" "PICTOH-QS007" "General quality specification" "General Specification Wafer" "SL1ICS3001 I-CODE1 Label Coil Design Guide" "Dicing process thin wafers"
2002
Philips Semiconductors
Product specification
I-CODE1 Label
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
SL1ICS3001
This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet DEFINITIONS Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification. DISCLAIMERS Life support applications These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes, without notice, products, including circuits, standard cells, and/or software, described contained herein order improve design and/or performance. Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
2002
Philips Semiconductors worldwide company
Contact information additional information please visit Fax: 24825 sales offices addresses send e-mail
Koninklijke Philips Electronics N.V. 2002
SCA74
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
613502/02/pp20
Date release: 2002
Document order number:
9397 08396
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