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PUA3273 PUA3173


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PUA3273 - PUA3273  
PUA3173 - PUA3173  

PUA3273 (PU3273)
Silicon triple diffusion planar type darlington
power amplification Complementary PUA3173 (PU3173) Features
Uni:
20.2±0.3 4.0±0.2
Solder 5.3±0.5 4.4±0.5
High forward current transfer ratio High-speed switching elements
Absolute Maximum Ratings 25°C
Parameter Symbol VCBO VCEO VEBO Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current
Peak collector current
Collector power dissipation
25°C
Junction temperature Storage temperature
Electrical Characteristics 25°C
Parameter Symbol VCEO ICBO ICEO IEBO hFE2 Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
Collector-emitter saturation voltage
Base-emitter saturation voltage Transition frequency Turn-on time Storage time Fall time
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Rank classification Rank Free
Publication date: March 2004
disc
0.8±0.25 0.5±0.15 1.0±0.25 2.54±0.2 0.5±0.15
9.5±0.2 1.65±0.2 8.0±0.2
Rating -150 -100
Unit
2.57 17.78±0.25
1.5±0.5
Emitter Base Collector Base Collector Base Collector Emitter SIP8-A1 Package
Tstg
+150
Conditions
Unit
-100
-150
-100 -100
hFE1
-2.5 -2.5
VCE(sat) VBE(sat)
0.32
tstg
1.70
1.05
Note) part number parenthesis shows conventional part number.
SJK00030AED
PUA3273
Internal Connection
Safe operation area
-100 repetitve pulse 25°C (per circuit)
Collector power dissipation
Collector current
With heat sink With heat sink Without heat sink
0.01
-100
Ambient temperature (°C)
Collector-emitter voltage
SJK00030AED
Request your special attention precautions using technical information semiconductors described this book
products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products, license granted under intellectual property right other right owned company other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd.

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