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PUA3273 PUA3173
Top Searches for this datasheetPUA3273 - PUA3273 PUA3173 - PUA3173 PUA3273 (PU3273) Silicon triple diffusion planar type darlington power amplification Complementary PUA3173 (PU3173) Features Uni: 20.2±0.3 4.0±0.2 Solder 5.3±0.5 4.4±0.5 High forward current transfer ratio High-speed switching elements Absolute Maximum Ratings 25°C Parameter Symbol VCBO VCEO VEBO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Collector power dissipation 25°C Junction temperature Storage temperature Electrical Characteristics 25°C Parameter Symbol VCEO ICBO ICEO IEBO hFE2 Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Base-emitter saturation voltage Transition frequency Turn-on time Storage time Fall time Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Rank classification Rank Free Publication date: March 2004 disc 0.8±0.25 0.5±0.15 1.0±0.25 2.54±0.2 0.5±0.15 9.5±0.2 1.65±0.2 8.0±0.2 Rating -150 -100 Unit 2.57 17.78±0.25 1.5±0.5 Emitter Base Collector Base Collector Base Collector Emitter SIP8-A1 Package Tstg +150 Conditions Unit -100 -150 -100 -100 hFE1 -2.5 -2.5 VCE(sat) VBE(sat) 0.32 tstg 1.70 1.05 Note) part number parenthesis shows conventional part number. SJK00030AED PUA3273 Internal Connection Safe operation area -100 repetitve pulse 25°C (per circuit) Collector power dissipation Collector current With heat sink With heat sink Without heat sink 0.01 -100 Ambient temperature (°C) Collector-emitter voltage SJK00030AED Request your special attention precautions using technical information semiconductors described this book products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products, license granted under intellectual property right other right owned company other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd. Other recent searchesTEF6700HL - TEF6700HL TEF6700HL Datasheet SRA-8+ - SRA-8+ SRA-8+ Datasheet SM3030-8 - SM3030-8 SM3030-8 Datasheet SII52003-4 - SII52003-4 SII52003-4 Datasheet LT1632 - LT1632 LT1632 Datasheet LT1633 - LT1633 LT1633 Datasheet Bi20U-CK40-AN6X2-H1141 - Bi20U-CK40-AN6X2-H1141 Bi20U-CK40-AN6X2-H1141 Datasheet
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