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NCV33064
Top Searches for this datasheet1n756 - 1n756 NCV33064 - NCV33064 MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit MC34064 undervoltage sensing circuit specifically designed reset controller microprocessor-based systems. offers designer economical solution voltage detection with single external resistor. MC34064 features trimmed-in-package bandgap reference, comparator with precise thresholds built-in hysteresis prevent erratic reset operation. open collector reset output capable sinking excess operation guaranteed down input with standby current. devices packaged 3-pin TO-92, micro size TSOP-5, 8-pin SOIC-8 Micro8surface mount packages. device packaged SOIC-8 TO-92. Applications include direct monitoring MPU/logic power supply used appliance, automotive, consumer industrial equipment. TO-92 SUFFIX CASE Reset Input Ground SOIC-8 SUFFIX CASE Micro8 SUFFIX CASE 846A TSOP-5 SUFFIX CASE Ground Input Reset Trimmed-In-Package Temperature Compensated Reference Comparator Threshold 25°C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable Sinking Excess Internal Clamp Diode Discharging Delay Capacitor Guaranteed Reset Operation with Input Standby Current Economical TO-92, TSOP-5, SOIC-8 Micro8 Surface Mount Packages Prefix Automotive Other Applications Requiring Site Control Changes Pb-Free Packages Available Input Reset CONNECTIONS Reset Input N.C. Ground (Top View) N.C. N.C. N.C. N.C. ORDERING INFORMATION Vref detailed ordering shipping information package dimensions section page this data sheet. DEVICE MARKING INFORMATION Sink Only Positive True Logic general marking information device marking section page this data sheet. This device contains active transistors. Figure Representative Block Diagram Semiconductor Components Industries, LLC, 2005 July, 2005 Rev. Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 MAXIMUM RATINGS Rating Power Input Supply Voltage Reset Output Voltage Reset Output Sink Current (Note Clamp Diode Forward Current, Reset Input (Note Power Dissipation Thermal Characteristics Suffix, Plastic Package Maximum Power Dissipation 25°C Thermal Resistance, Junction-to-Air Suffix, Plastic Package Maximum Power Dissipation 25°C Thermal Resistance, Junction-to-Air Suffix, Plastic Package Maximum Power Dissipation 25°C Thermal Resistance, Junction-to-Air Operating Junction Temperature Operating Ambient Temperature MC34064 MC33064 NCV33064 Storage Temperature Range Symbol ISink Value -1.0 Internally Limited Unit RqJA RqJA RqJA +150 +125 °C/W °C/W °C/W Tstg +150 Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. data available upon request. ELECTRICAL CHARACTERISTICS (For typical values 25°C, min/max values operating ambient temperature range that applies [Notes unless otherwise noted.) Characteristics COMPARATOR Threshold Voltage High State Output (Vin Increasing) State Output (Vin Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (Vin ISink (Vin ISink (Vin ISink Output Sink Current (Vin, Reset Output Off-State Leakage (Vin, Reset Clamp Diode Forward Voltage, Reset Input TOTAL DEVICE Operating Input Voltage Range Quiescent Input Current (Vin ISink 0.46 0.15 0.02 0.01 4.61 4.59 0.02 0.05 Symbol Unit Maximum package power dissipation limits must observed. duty cycle pulse techniques used during test maintain junction temperature close ambient possible. Thigh +70°C MC34064 Tlow MC34064 -40°C MC33064 +85°C MC33064 -40°C NCV33064 +125°C NCV33064 prefix automotive other applications requiring site change control. http://onsemi.com MC34064, MC33064, NCV33064 25°C OUTPUT VOLTAGE OUTPUT VOLTAGE 25°C Vin, INPUT VOLTAGE 4.560 4.580 4.600 Vin, INPUT VOLTAGE 4.620 4.640 Figure Reset Output Voltage versus Input Voltage Figure Reset Output Voltage versus Input Voltage 4.630 THRESHOLD VOLTAGE 4.620 4.610 4.600 4.590 4.580 4.570 Lower Threshold State Output INPUT CURRENT (mA) Upper Threshold High State Output +85°C +25°C +85°C -40°C +25°C -40°C AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE Figure Comparator Threshold Voltage versus Temperature Figure Input Current versus Input Voltage OUTPUT SATURATION 85°C -40°C Reset Reset 25°C 25°C 5.0V 4.0V ISink, SINK CURRENT (mA) ns/DIV Figure Reset Output Saturation versus Sink Current Figure Reset Delay Time http://onsemi.com MC34064, MC33064, NCV33064 FORWARD CURRENT (mA) 25°C FORWARD VOLTAGE Figure Clamp Diode Forward Current versus Voltage Power Supply Input Reset Microprocessor Circuit Vref CDLY time delayed reset accomplished with addition CDLY. systems with extremely fast power supply rise times (<500 recommended that RCDLY time constant greater than Vth(MPU) microprocessor reset input threshold. tDLY RCDLY Vth(MPU) Figure Voltage Microprocessor Reset TEST DATA Power Supply 1.2Vref 0.02 Input Reset (mV) DVth (mV) (kW) Microprocessor Circuit DVth(lower) 10-6 Where: Where: Comparator hysteresis increased with addition resistor hysteresis equation been simplified does account change input current crosses comparator threshold (Figure increase lower threshold DVth(lower) will observed which typically 4.59 equations accurate ±10% with less than between Figure Voltage Microprocessor Reset with Additional Hysteresis http://onsemi.com MC34064, MC33064, NCV33064 1.0k Power Supply 1.2Vref Input Reset Input Reset 1.2Vref Solar Cells Figure Voltage Monitor 25mH 11.5 14.5V 4.7k Input 1N756 Test 1.2k MPSW51A 1N5819 Figure Solar Powered Battery Charger Conditions 11.5 14.5 12.6 12.6 12.6 Results mVpp Line Regulation Reset 1.2Vref Load Regulation Output Ripple Efficiency Figure Power Switching Regulator MTP3055EL 4.6V Input Reset 1.2Vref Overheating logic level power MOSFET insufficient gate voltage prevented with above circuit. When input signal below threshold MC34064, output grounds gate MOSFET. Figure MOSFET Voltage Gate Drive Protection http://onsemi.com MC34064, MC33064, NCV33064 ORDERING INFORMATION Device MC34064D-005 MC34064D-005G MC34064D-5R2 MC34064D-5R2G MC34064DM-5R2 MC34064DM-5R2G MC34064P-005 MC34064P-005G MC34064P-5RA MC34064P-5RAG MC34064P-5RP MC34064P-5RPG MC34064P-5RM MC34064P-5RMG MC34064SN-5T1 MC34064SN-5T1G MC33064D-005 MC33064D-005G MC33064D-5R2 MC33064D-5R2G MC33064DM-5R2 MC33064DM-5R2G MC33064P-005 MC33064P-005G MC33064P-5RA MC33064P-5RAG MC33064P-5RP MC33064P-5RPG -40°C +85°C +70°C Operating Temperature Range Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) Micro8 Micro8 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TSOP-5 TSOP-5 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) Micro8 Micro8 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) 2000 Units Ammo Pack 2000 Units Tape Reel 2000 Units 4000 Units Tape Reel 2500 Units Tape Reel Units Rail 3000 Units Tape Reel 2000 Units Ammo Pack 2000 Units Tape Reel 2000 Units 4000 Units Tape Reel 2500 Units/ Tape Reel Units Rail Shipping http://onsemi.com MC34064, MC33064, NCV33064 ORDERING INFORMATION Device NCV33064D-5R2* NCV33064D-5R2G* NCV33064P-5RA* NCV33064P-5RAG* NCV33064P-5RP* NCV33064P-5RPG* NCV33064DM-5R2* NCV33064DM-5R2G* Micro8 Micro8 (Pb-Free) 4000 Units Tape Reel -40°C +125°C TO-92 2000 Units Ammo Pack 2000 Units Tape Reel Operating Temperature Range Package SOIC-8 SOIC-8 (Pb-Free) 2500 Units Tape Reel Shipping *NCV33064: Tlow -40°C, Thigh +125°C. Guaranteed design. prefix automotive other applications requiring site change control. information tape reel specifications, including part orientation tape sizes, pleaserefer Tape Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS 3x064 ALYW5 TSOP-5 SUFFIX CASE SOIC-8 SUFFIX CASE Micro8 SUFFIX CASE 846A Ly50 MC3x0 64P-5 ALYWW NCV30 64P-5 ALYWW SRBYWG Device Code Assembly Location Wafer Year Work Week Pb-Free Package TO-92 SUFFIX CASE http://onsemi.com MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SUFFIX PLASTIC PACKAGE CASE 29-11 (TO-92) ISSUE SEATING PLANE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CONTOUR PACKAGE BEYOND DIMENSION UNCONTROLLED. LEAD DIMENSION UNCONTROLLED BEYOND DIMENSION MINIMUM. INCHES 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 0.250 0.080 0.105 0.100 0.115 0.135 MILLIMETERS 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 6.35 2.04 2.66 2.54 2.93 3.43 SECTION http://onsemi.com MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SUFFIX PLASTIC PACKAGE CASE 483-02 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. DIMENSIONS INCLUDE MOLD FLASH, PROTRUSIONS, GATE BURRS. MILLIMETERS 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 2.50 3.00 INCHES 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0.0985 0.1181 0.05 (0.002) SOLDERING FOOTPRINT* 0.074 0.95 0.037 0.094 0.039 0.028 SCALE 10:1 inches *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SUFFIX PLASTIC PACKAGE CASE 751-07 (SOIC-8 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. 751-01 THRU 751-06 OBSOLETE. STANDARD 751-07. MILLIMETERS 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 0.10 0.25 0.19 0.25 0.40 1.27 0.25 0.50 5.80 6.20 INCHES 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 0.004 0.010 0.007 0.010 0.016 0.050 0.010 0.020 0.228 0.244 0.25 (0.010) 0.25 (0.010) SEATING PLANE 0.10 (0.004) SOLDERING FOOTPRINT* 1.52 0.060 0.275 0.155 0.024 1.270 0.050 SCALE inches *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SUFFIX PLASTIC PACKAGE CASE 846A-02 (Micro8) ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH, PROTRUSIONS GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. 846A-01 OBSOLETE, STANDARD 846A-02. MILLIMETERS 2.90 3.10 2.90 3.10 1.10 0.25 0.40 0.65 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES 0.114 0.122 0.114 0.122 0.043 0.010 0.016 0.026 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 0.08 (0.003) PLANE 0.038 (0.0015) SEATING SOLDERING FOOTPRINT* 1.04 0.041 0.38 0.015 3.20 0.126 4.24 0.167 5.28 0.208 0.65 0.0256 SCALE inches *For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com MC34064, MC33064, NCV33064 Micro8 trademark International Rectifier. Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. 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