MADP-042405-130600 MADP-042505-130600 MADP-042905-130600 MADP-042005
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MADP-042405-130600 - MADP-042405-130600
MADP-042505-130600 - MADP-042505-130600
MADP-042905-130600 - MADP-042905-130600
MADP-042005 - MADP-042005
SURMOUNT Diodes-MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Surface Mount, I-Region Length Device Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Parasitic Capacitance Inductance Higher Average Peak Power Handling
MADP-042005 Series
Absolute Maximum Ratings1 (unless otherwise specified)
Parameter Part Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature C.W. Incident Power (dBm) Mounting Temperature Absolute Maximum +125 +150 +175
Description Applications
This device Silicon-Glass diode chip fabricated with M/A-COM's patented HMICprocess. This device features silicon pedestals embedded loss, dispersion glass. diode formed pedestal connections backside device facilitated making pedestal sidewalls electrically conductive. Selective backside metallization applied producing surface mount device. This Vertical Topology provides Exceptional Heat Transfer. topside fully encapsulated with silicon nitride additional polymer layer scratch impact protection. These protective coatings prevent damage junction anode air-bridge during handling assembly. These packageless devices suitable usage Moderate Incident Power C.W. 0.01 Duty Cycle, Peak Power, Series, Shunt, Series-Shunt Switches. Smaller Parasitic Inductance, Excellent Constant, make devices ideal Higher Frequency Switch Elements compared their Plastic Device Counterparts.
+300 seconds
Operation this device above these parameters cause permanent damage.
Case Style ODS-1306
Bottom Side Contacts Circuit Side
M/A-COM Inc. affiliates reserve right make changes product(s) information contained herein without notice. M/A-COM makes warranty, representation guarantee regarding suitability products particular purpose, does M/A-COM assume liability whatsoever arising application product(s) information.
Inches Min. Max. 0.040 0.042 0.021 0.004 0.013 0.011 0.013 0.019 0.023 0.008 0.015 0.013 0.015 0.021
Millimeters Min. Max. 1.025 1.075 0.525 0.102 0.325 0.275 0.325 0.475 0.575 0.203 0.375 0.325 0.375 0.525
Backside Metal: 0.1microns thick. Shaded Areas Indicate Backside Ohmic Gold Contacts. Both Devices have Same Outline Dimensions
North America Tel: 800.366.2266 Fax: 978.366.2266 Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Visit www.macom.com additional data sheets product information.
SURMOUNT Diodes-MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Electrical Specifications
Parameter Symbol Conditions Units MADP-042305
MADP-042005 Series
MADP-042505
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
-80V 1000MHz 1010MHz Input Power +20dBm bias IH=0.5A, IL=10
0.14 0.15 0.13 0.14 1.32 1.18 0.87
0.22 0.22
1.00
0.28 0.28 0.27 0.27 0.83 0.76 0.84
0.40 0.40
1.00
IIP3
°C/W
MADP-042405
MADP-042905
Parameter
Symbol
Conditions
Units
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
-80V 1000MHz 1010MHz Input Power +20dBm bias IH=0.5A, IL=10
0.61 0.61 0.57 0.58 0.62 0.58 0.82
0.75 0.75
1.00
0.06 0.06 0.06 0.06 3.14 2.60 0.93
0.18 0.18
1.00
IIP3
°C/W
Total capacitance, equivalent Junction Capacitance ,Cj, Parasitic Capacitance, Cpar. Series resistance equivalent total diode resistance Junction Resistance) Ohmic Resistance) measured HP4291A Impedance Analyzer with mounted ODS-1134 package with 60/Pb Solder Steady-state measured with mounted ODS-1134 package with 60/Pb Solder.
M/A-COM Inc. affiliates reserve right make changes product(s) information contained herein without notice. M/A-COM makes warranty, representation guarantee regarding suitability products particular purpose, does M/A-COM assume liability whatsoever arising application product(s) information.
North America Tel: 800.366.2266 Fax: 978.366.2266 Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Visit www.macom.com additional data sheets product information.
SURMOUNT Diodes-MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Handling Procedures
MADP-042005 Series
semiconductor chips should handled with care avoid damage contamination from perspiration skin oils. plastic tipped tweezers vacuum pickups strongly recommended individual components. Bulk handling should insure that abrasion mechanical shock minimized.
Bonding Techniques
Attachment circuit board made simple through surface mount technology. Mounting pads conveniently located bottom surface these devices removed from active junction locations. These devices well suited solder attachment onto hard soft substrates. solder recommended. Conductive silver epoxy attachment also used lower Incident power Average Power applications. When soldering these devices hard substrate, bonding preferred. re-commend utilizing vacuum force to100 grams applied normal surface device. When soldering soft substrates, recommended lead-tin interface circuit board mounting pads. Position that mounting pads aligned with circuit board mounting pads reflow solder heating circuit trace near mounting while applying grams force perpendicular surface die. solder joint must made time, creating un-equal heat flow thermal stress. Solder reflow should performed causing heat flow through surface die. Since HMIC glass transparent, edges mounting pads closest each other visually inspected through after attach completed. typical profile Soldering process provided Application Note, M538 Surface Mounting Instructions MA-COM website www.macom.com
M/A-COM Inc. affiliates reserve right make changes product(s) information contained herein without notice. M/A-COM makes warranty, representation guarantee regarding suitability products particular purpose, does M/A-COM assume liability whatsoever arising application product(s) information.
North America Tel: 800.366.2266 Fax: 978.366.2266 Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Visit www.macom.com additional data sheets product information.
SURMOUNT Diodes-MADP-042305-130600, MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series Typical Performance Curves
1GHz 0.800 0.700 0.600 0.500 (pF) 0.400 0.300 0.200 0.100 0.000 Bias 042505 042305 042905 0.100 0.001 042405 10.000
MADP-042005 Series
1GHz
042905 042305 1.000 042505 042405
(ohm)
0.010 Bias
0.100
0.700 042405 0.600 0.500 (pF)
0.700 042405 0.600 0.500 (pF) 0.400 0.300 0.200 0.100 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ Freq (Hz) 042505
0.400 0.300 0.200 0.100 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ Freq (Hz) 042505
042305
042305
10mA 4.50E+00 042905 4.00E+00 3.50E+00 3.00E+00 (ohm) 2.50E+00 2.00E+00 1.50E+00 042505 1.00E+00 5.00E-01 042405 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ Freq (Hz) 042305
20mA 4.00E+00 042905 3.50E+00 3.00E+00 (ohm) 2.50E+00 2.00E+00 1.50E+00 1.00E+00 042305 042505
5.00E-01 042405 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ Freq (Hz)
M/A-COM Inc. affiliates reserve right make changes product(s) information contained herein without notice. M/A-COM makes warranty, representation guarantee regarding suitability products particular purpose, does M/A-COM assume liability whatsoever arising application product(s) information.
North America Tel: 800.366.2266 Fax: 978.366.2266 Europe Tel: 44.1908.574.200 Fax: 44.1908.574.300 Asia/Pacific Tel: 81.44.844.8296 Fax: 81.44.844.8298 Visit www.macom.com additional data sheets product information.
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