LH3332-PF
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LH3332-PF - LH3332-PF
ROUND TYPE LAMPS
Lead-Free Parts
LH3332-PF
DATA SHEET
DOC. REV. DATE
QW0905- LH3332-PF Apr. 2007
PART LH3332-PF Page
Package Dimensions
1.5MAX 25.0MIN
1.0MIN
2.54TYP
Note 1.All dimension millimeter tolerance ±0.25mm unless otherwise noted. 2.Specifications subject change without notice.
Directivity Radiation
PART LH3332-PF Page
Absolute Maximum Ratings Ta=25
Ratings Parameter Symbol Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current Operating Temperature Storage Temperature Topr Tstg +100 UNIT
Typical Electrical Optical Characteristics (Ta=25
PART
COLOR MATERIAL Emitted Lens
White Diffused
Peak wave length
Spectral halfwidth
Forward voltage @20mA(V)
Luminous intensity
@10mA(mcd)
Viewing angle (deg)
Min.
Max.
Min.
Typ.
LH3332-PF
Note 1.The forward voltage data including ±0.1V testing tolerance. luminous intensity data including testing tolerance.
PART LH3332-PF Page
Typical Electro-Optical Characteristics Curve
CHIP
Fig.1 Forward current Forward Voltage Fig.2 Relative Intensity Forward Current
1000
Forward Current(mA)
Relative Intensity Normalize @20mA
1000
Forward Voltage(V) Fig.3 Forward Voltage Temperature
Forward Current(mA) Fig.4 Relative Intensity Temperature
Forward Voltage@20mA Normalize
Relative Intensity@20mA Normalize
Ambient Temperature(
Ambient Temperature(
Fig.5 Relative Intensity Wavelength
Relative Intensity@20mA
1000
Wavelength (nm)
PART LH3332-PF Page
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Temperature 350°C Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint body)
2.Wave Soldering Profile Soldering Preheat: 120° Preheat time: 60seconds Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° Dipping Time:3 seconds Distance:2mm Min(From solder joint body)
Temp(° 260° C3sec
260°
/sec
120°
/sec Preheat Seconds
Time(sec)
Note: 1.Wave solder should made more than time. 2.You just only select soldering conditions above.
PART LH3332-PF Page
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 (-24hrs, +72hrs)
Description
This test conducted purpose detemining resistance part electrical themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 7021:
Operating Life Test
High Temperature Storage Test
1.Ta=105 2.t=1000 (-24hrs, +72hrs)
purpose this resistance device which laid under condition high temperature hours.
MIL-STD-883:1008 7021: B-10
Temperature Storage Test
1.Ta=-40 2.t=1000 (-24hrs, +72hrs)
purpose this resistance device which laid under condition temperature hours.
7021: B-12
High Temperature High Humidity Test
1.Ta=65 2.RH=90 %~95% 3.t=240hrs ±2hrs
purpose this test resistance device under tropical hours.
MIL-STD-202:103B 7021: B-11
Thermal Shock Test
1.Ta=105 ±5&-40 (10min) (10min) 2.total cycles
purpose this resistance device sudden extreme changes high temperature. This test intended determine thermal characteristic resistance device sudden exposures extreme changes temperature when soldering lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 2.Dwell time= ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 7021:
Solderability Test
1.T.Sol=230 2.Dwell time=5 ±1sec
This test intended soldering well performed not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 7021:
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