KT-3228QB24ZS-RV

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KT-3228QB24ZS-RV - KT-3228QB24ZS-RV

ATTENTION
OBSERVE PRECAUTIONS HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
Part Number: KT-3228QB24ZS-RV
Blue
Absolute Maximum Ratings 25°C
Parameter Forward Current Peak Forward Current Power dissipation Operating Temperature Storage Temperature Junction temperature[1] Thermal resistance
(Junction/ambient)
Symbol Tstg
Value 0.555 +100 +110
Unit °C/W °C/W
Thermal resistance (Junction/solder point)
Notes: Results from mounting board FR4, mounted board-metal core recommend lowest thermal resistance. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical Optical Characteristics 25°C
Parameter Forward Voltage 150mA [Min.] Forward Voltage 150mA [Typ.] Forward Voltage 150mA [Max.] Luminous Flux 150mA [Typ.] Wavelength peak emission 150mA Dominant Wavelength 150mA [Typ.] peak TCpeak TCdom Symbol Value 0.13 0.10 -3.1 nm/°C nm/°C mV/°C Unit
[Typ.]
Spectral bandwidth 150mA [Typ.] Temperature coefficient peak 150mA, 10°C 100°C [Typ.] Temperature coefficient 150mA, 10°C 100°C [Typ.] Temperature coefficient 150mA, 10°C 100°C [Typ.]
Notes: 1.Wavelength -1nm. Forward Voltage 0.1V.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE Selection Guide
Part Dice Code. KT-3228QB24ZS-RV BLUE (AlGaInN) (lm) 150mA Min. Max. 120° Viewing Angle 21/2
Notes: angle from optical centerline where luminous intensity optical centerline value. Luminous intensity luminous flux: +/-15%.
Package Dimension Materials
package dimension please refer page Material follows: Package Encapsulating resin Electrodes Ceramics Silicone resin plating
Features
1.Dimensions 3.2mm 2.8mm 0.8mm. 2.Higher brightness 3.Small package with high efficiency 4.Surface mount technology 5.ESD protection 6.Moisture sensitivity level level 7.Soldering methods: reflow soldering. 8.RoHS compliant.
Packaging:
1.The LEDs packed cardboard boxes after taping. 2.The label minimum packing unit shows: Part Number, Number, Ranking, Quantity. 3.In order protect LEDs from mechanical shock, pack them cardboard boxes transportation. 4.The LEDs damaged boxes dropped receive strong impact against them, precautions must taken prevent damage. 5.The boxes water resistant therefore must kept away from water moisture. 6.When LEDs transported, recommend that same packing methods Kingbright's.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE
Reliability Test Items Conditions
reliability products shall satisfied with items listed below
Tolerance Percent Defective (LTPD)
Test Item Test Conditions Tested with standard circuit board (note) Tested with standard circuit board (note) High temp: +100 mins mins temp mins mins High temp: +100 mins temp: mins Tsld secs Test Times Cycles 1000 Number Damaged
Continuous Operating Test
0/22
High Temperature Operating Test Temperature Operating Test High Temperature Humidity Storage Operating Test
1000 1000
0/22 0/22
1000
0/22
Temperature Cycling Test
cycles
0/22
Thermal Shock Test
1000 cycles
0/22
Soldering resistance Test
secs
0/22
Note: Thermal resistance with Kingbright circuit board Rthj-a =170°C/W
Failure Criteria
Item Forward Voltage Luminous Flux Symbol Test Conditions 150mA 150mA Criteria Judgement Min. Initial Level Max. Initial Level
Note: test performed after board cooled down room temperature.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE JEDEC Moisture Sensitivity:
Level Time weeks Floor Life Conditions Soak Requirements Standard Time (hours) +5/-0
Accelerated Equivalent Time (hours) +1/-0 Conditions
Conditions
Moisture Sensitivity Levels
Level Time Unlimited year weeks hours hours hours hours Floor Life Conditions Soak Requirements Standard Time (hours) +5/-0 +5/-0 6962 +5/-0 1922 +5/-0 +2/-0 +2/-0 +2/-0 Conditions +1/-0 +1/-0 Accelerated Equivalent1 Time (hours) Conditions
Time Label (TOL)
Notes: 1.CAUTION ``accelerated equivalent'' soak requirements shall used until correlation damage response, including electrical, after soak reflow established with ``standard'' soak requirements known activation energy diffusion 0.48 Accelerated soak times vary material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides method determining diffusion coefficient. 2.The standard soak time includes default value hours semiconductor manufacturer's exposure time (MET) between bake includes maximum time allowed distributor's facility. actual less than hours soak time reduced. soak conditions °C/60% soak time reduced hour each hour less than hours. soak conditions °C/60% soak time reduced hour each five hours less than hours. actual greater than hours soak time must increased. soak conditions °C/60% soak time increased Hour each hour that actual exceeds hours. soak conditions °C/60% soak time increased hour each five Hours that actual exceeds hours. 3.Supplier extend soak times their risk.
Protection During Production
Electric static discharge result when static-sensitive products come contact with operator other conductors. following procedures decrease possibility damage: 1.Minimize friction between product surroundings avoid static buildup. 2.All production machinery test instruments must electrically grounded. 3.Operators must wear anti-static bracelets. 4.Wear anti-static suit when entering work areas with conductive machinery. 5.Set protection areas using grounded metal plating component handling. 6.All workstations that handle ESD-sensitive components must maintain electrostatic potential 150V less. 7.Maintain humidity level higher production areas. 8.Use anti-static packaging transport storage. 9.All anti-static equipment procedures should periodically inspected evaluated proper functionality.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE Handling Precautions
Compare epoxy encapsulant that hard brittle, silicone softer flexible. Although characteristic significantly reduces thermal stress, more susceptible damage external mechanical force. result, special handling precautions need observed during assembly using silicone encapsulated products. Failure comply might leads damage premature failure LED. Handle component along side surfaces using forceps appropriate tools.
directly touch handle silicone lens surface. damage internal circuitry.
stack together assembled PCBs containing exposed LEDs. Impact scratch silicone lens damage internal circuitry.
outer diameter pickup nozzle should exceed size prevent leaks. inner diameter nozzle should large possible. pliable material suggested nozzle avoid scratching damaging surface during pickup. dimensions component must accurately programmed pick-and-place machine insure precise pickup avoid damage during production.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE Designing Position Board.
1.No twist/warp/bent/or other stress shall applied board after mounting with solder avoid crack package. Refer following recommended position direction LED.
Appropriate mounting place perpendicularly against stress affected side. 2.Depending position direction LED,the mechanical stress package changed. Refer following figure.
3.Do split board hand.Split with exclusive special tool. 4.If aluminum circuit board used,a large stress thermal shock might cause solder crack. this reason,it recommended appropriate verification should taken before use.
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE Reflow soldering recommended soldering profile shown below. Other soldering methods recommended they might cause damage product.
Heat Generation:
1.Thermal design product paramount importance.Please consider heat generation when making system design. coefficient temperature increase input electric power affected thermal resistance circuit board density placement board well other components. necessary avoid intense heat generation operate within maximum ratings given this specification. 2.Please determine operating current with consideration ambient temperature local refer plot Permissible Forward current Ambient temperature CHARACTERISTICS this specification. Please also take measures remove heat from area near improve operational characteristics LED. 3.The equation indicates correlation between ,and equation indicates correlation between Rthj-a Rthj-s
dice junction temperature: ambient temperature: solder point temperature: Rthj-a heat resistance from dice junction temperature ambient temperature Rthj-s heat resistance from dice junction temperature measuring point inputting power (IFx
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE Blue KT-3228QB24ZS-RV
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE
Package Dimensions
Notes: dimensions millimeters (inches). Tolerance ±0.25(0.01") unless otherwise noted. Specifications subject change without notice. device single mounting surface. device must mounted according specifications.
Recommended Soldering Pattern (Units Tolerance: 0.1)
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE
Tape Dimensions (Units
Reel Dimension
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056
3.2x2.8mm WITH CERAMIC SUBSTRATE
Packing Label Specifications
KT-3228QB24ZS-RV
SPEC DSAI8161 APPROVED: WYNEC
CHECKED: Allen
DATE: MAY/04/2009 DRAWN: Ting.Li
PAGE: ERP: 1212000056

KT-3228QB24ZS-RV

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