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IRFB13N50A
Top Searches for this datasheetIRFB13N50A - IRFB13N50A IRFB13N50A, SiHFB13N50A Power MOSFET RDS(on) (Max.) (nC) (nC) (nC) Configuration Single FEATURES 0.450 Lower Gate Charge Results Simpler Drive Reqirements Improved Gate, Avalanche Dynamic dV/dt Ruggedness Available RoHS* COMPLIANT Fully Characterized Capacitance Avalanche Voltage Lead (Pb)-free Available TO-220 APPLICATIONS Switch Mode Power Supply (SMPS) Uninterruptible Power Supplies N-Channel MOSFET High Speed Power Switching ORDERING INFORMATION Package Lead (Pb)-free SnPb TO-220 IRFB13N50APbF SiHFB13N50A-E3 IRFB13N50A SiHFB13N50A ABSOLUTE MAXIMUM RATINGS unless otherwise noted PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Currenta SYMBOL Energyb Energya dV/dt Tstg 6-32 screw LIMIT 300d W/°C V/ns UNIT Linear Derating Factor Single Pulse Avalanche Avalanche Currenta Repetitive Avalanche Maximum Power Dissipation Peak Diode Recovery dV/dtc Operating Junction Storage Temperature Range Soldering Recommendations (Peak Temperature) Mounting Torque Notes Repetitive rating; pulse width limited maximum junction temperature (see fig. 11). Starting dV/dt V/ns (see fig. 12a). dI/dt A/µs, VDS, from case. containing terminations RoHS compliant, exemptions apply Document Number: 91095 S-81393-Rev. 07-Jul-08 www.vishay.com IRFB13N50A, SiHFB13N50A THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Case-to-Sink, Flat, Greasd Surface Maximum Junction-to-Case (Drain) SYMBOL RthJA RthCS RthJC TYP. 0.50 MAX. 0.50 °C/W UNIT SPECIFICATIONS unless otherwise noted PARAMETER Static Drain-Source Breakdown Voltage Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance Forward Transconductance Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Effective Output Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulsed Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Body Diode Reverse Recovery Current Forward Turn-On Time IRRM dI/dt A/µsb MOSFET symbol showing integral reverse junction diode SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT VDS/TJ VGS(th) IGSS IDSS RDS(on) Ciss Coss Crss Coss Coss eff. td(on) td(off) Reference VGS, 0.55 0.450 V/°C MHz, fig. 1910 2730 fig. fig. Intrinsic turn-on time negligible (turn-on dominated Notes Repetitive rating; pulse width limited maximum junction temperature (see fig. 11). Pulse width duty cycle Coss eff. fixed capacitance that gives same charging time Coss while rising from VDS. www.vishay.com Document Number: 91095 S-81393-Rev. 07-Jul-08 IRFB13N50A, SiHFB13N50A TYPICAL CHARACTERISTICS unless otherwise noted 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V BOTTOM Drain-to-Source Current Drain-to-Source Current 4.5V PULSE WIDTH 0.01 PULSE WIDTH VDS, Drain-to-Source Voltage VGS, Gate-to-Source Voltage Fig. Typical Output Characteristics Fig. Typical Transfer Characteristics Drain-to-Source Current BOTTOM RDS(on), Drain-to-Source Resistance 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V 4.5V (Normalized) PULSE WIDTH VDS, Drain-to-Source Voltage Junction Temperature (°C) Fig. Typical Output Characteristics Fig. Normalized On-Resistance Temperature Document Number: 91095 S-81393-Rev. 07-Jul-08 www.vishay.com IRFB13N50A, SiHFB13N50A 100000 10000 Ciss Cgd, SHORTED Crss Coss Capacitance (pF) Ciss 1000 ISD, Reverse Drain Current Coss Crss 1000 VDS, Drain-to-Source Voltage Fig. Typical Capacitance Drain-to-Source Voltage VSD, Source-to-Drain Voltage Fig. Typical Source-Drain Diode Forward Voltage 1000 400V 250V Drain-to-Source Current OPERATION THIS AREA LIMITED RDS(on) VGS, Gate-to-Source Voltage 100sec 1msec 25°C 150°C Single Pulse 10msec Total Gate Charge (nC) 1000 10000 VDS, Drain-to-Source Voltage Fig. Maximum Safe Operating Area Fig. Typical Gate Charge Gate-to-Source Voltage www.vishay.com Document Number: 91095 S-81393-Rev. 07-Jul-08 IRFB13N50A, SiHFB13N50A D.U.T. Drain Current Pulse width Duty factor Fig. Switching Time Test Circuit Case Temperature (°C) td(on) td(off) Fig. Maximum Drain Current Case Temperature Fig. Switching Time Waveforms 0.50 Thermal Response (ZthJC) 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) Notes: Duty factor Peak ZthJC 0.01 0.001 0.00001 0.001 0.001 0.01 Rectangular Pulse Duration (sec) Fig. Maximum Effective Transient Thermal Impedance, Junction-to-Case Driver D.U.T. 0.01 Fig. Unclamped Inductive Waveforms Fig. Unclamped Inductive Test Circuit Document Number: 91095 S-81393-Rev. 07-Jul-08 www.vishay.com IRFB13N50A, SiHFB13N50A 1150 6.3A 8.9A BOTTOM EAS, Single Pulse Avalanche Energy (mJ) Starting Junction Temperature (°C) Fig. Maximum Avalanche Energy Drain Current Current regulator Same type D.U.T. D.U.T. Charge Current sampling resistors Fig. Basic Gate Charge Waveform Fig. Gate Charge Test Circuit www.vishay.com Document Number: 91095 S-81393-Rev. 07-Jul-08 IRFB13N50A, SiHFB13N50A Peak Diode Recovery dV/dt Test Circuit D.U.T. Circuit layout considerations stray inductance Ground plane leakage inductance current transformer dV/dt controlled Driver same type D.U.T. controlled duty factor D.U.T. device under test Driver gate drive P.W. Period P.W. Period D.U.T. waveform Reverse recovery current Body diode forward current dI/dt D.U.T. waveform Diode recovery dV/dt Re-applied voltage Inductor current Body diode forward drop Ripple logic level devices Fig. N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products manufactured several qualified locations. Reliability data Silicon Technology Package Reliability represent composite qualified locations. related documents such package/tape drawings, part marking, reliability data, Document Number: 91095 S-81393-Rev. 07-Jul-08 www.vishay.com Legal Disclaimer Notice Vishay Disclaimer product specifications data subject change without notice. Vishay Intertechnology, Inc., affiliates, agents, employees, persons acting their behalf (collectively, "Vishay"), disclaim liability errors, inaccuracies incompleteness contained herein other disclosure relating product. 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