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DRA9124T DRC9124T
Top Searches for this datasheetDRA9124T - DRA9124T DRC9124T - DRC9124T DRA9124T Silicon epitaxial planar type digital circuits Complementary DRC9124T Features Contributes miniaturization sets, reduction component count. Eco-friendly Halogen-free package Package Code SSMini3-F3-B Name Base Emitter Collector Unit Resistance value Packaging Embossed type (Thermo-compression sealing): 3000 reel (standard) Absolute Maximum Ratings 25°C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO Tstg Rating -100 +150 Marking Symbol: Internal Connection Electrical Characteristics 25°C±3°C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Input voltage (ON) Input voltage (OFF) Input resistance Symbol VCBO VCEO ICBO ICEO IEBO VCE(sat) VI(on) VI(off) Conditions -100 -30% -1.8 +30% 0.01 0.25 Unit Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Publication date: January 2010 ZJH00461AED DRA9124T DRA9124T_PT-Ta DRA9124T_IC-VCE DRA9124T_hFE-IC -120 25°C -800 Total power dissipation (mW) Forward current transfer ratio -100 -700 -600 Collector current (mA) 85°C -500 -400 -300 -200 -100 25°C -30°C -100 Ambient temperature (°C) DRA9124T_VCEsat-IC Collector-emitter voltage DRA9124T_IO-VIN Collector current (mA) DRA9124T_VIN-IO VCE(sat) -100 Collector-emitter saturation voltage VCE(sat) Output current (mA) 85°C 25°C Input voltage -30°C 25°C 85°C -10-1 85°C 25°C -30°C -30°C -10-2 0.01 -100 -10-3 -1.2 -100 Collector current (mA) Input voltage Output current (mA) ZJH00461AED DRA9124T SSMini3-F3-B Unit: 1.60 -0.03 +0.05 +0.05 0.26 -0.02 0.85 -0.03 1.60 ±0.05 +0.05 (0.50) (0.50) 0.13 -0.02 +0.05 1.00 ±0.05 (5°) 0.375 ±0.05 (5°) 0.10 0.70 -0.03 +0.05 (0.45) ZJH00461AED Request your special attention precautions using technical information semiconductors described this book products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products. license granted intellectual property right other right owned Panasonic Corporation other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. 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