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DA2J107 DA3X107K
Top Searches for this datasheetDA2J107 - DA2J107 DA3X107K - DA3X107K DA2J107 Silicon epitaxial planar type speed switching circuits DA3X107K SMini2 type package Features High reverse voltage Small reverse current Contributes miniaturization sets, reduction component count. Eco-friendly Halogen-free package Package Code SMini2-F5-B Name Cathode Anode Packaging Embossed type (Thermo-compression sealing): 3000 reel (standard) Marking Symbol: Absolute Maximum Ratings 25°C Parameter Reverse voltage Repetitive peak reverse voltage Forward current (Average) Repetitive peak forward current Non-repetitive peak forward surge current Junction temperature Storage temperature Note) Symbol VRRM IF(AV) IFRM IFSM Tstg Rating +150 Unit Electrical Characteristics 25°C±3°C Parameter Forward voltage Reverse current Terminal capacitance Reverse recovery time Symbol 0.25 Conditions Unit Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7031 measuring methods diodes. Absolute frequency input output measurement circuit Bias Application Unit (N-50BU) Input Pulse Output Pulse Wave Form Analyzer (SAS-8130) 0.35 0.05 Pulse Generator (PG-10N) 0.25 Publication date: June 2010 ZKF00155AED DA2J107 DA2J107_ IF-VF DA2J107_ IR-VR DA2J107_Ct-VR 25°C 10-3 150°C 100°C 85°C 25°C 150°C 125°C 100°C 85°C 25°C -30°C Terminal capacitance (pF) 125°C Forward current (mA) 10-1 10-2 10-3 Reverse current (mA) 10-5 10-7 -30°C 10-9 Forward voltage Reverse voltage Reverse voltage ZKF00155AED DA2J107 SMini2-F5-B Unit: 1.25 ±0.10 0.35 ±0.05 0.13 -0.02 +0.05 0.05 0.50 ±0.05 ±0.1 ±0.1 (0.15) ±0.1 ±0.2 ZKF00155AED Request your special attention precautions using technical information semiconductors described this book products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products. license granted intellectual property right other right owned Panasonic Corporation other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used general applications (such office equipment, communications equipment, measuring instruments household appliances), specific applications expressly stated this book. Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. understood that company shall held responsible damage incurred result connection with your using products described this book special application, unless company agrees your using products this book special application. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission company. 20100202 Other recent searchesUMH9N - UMH9N UMH9N Datasheet STPS5L25B - STPS5L25B STPS5L25B Datasheet Si2309DS - Si2309DS Si2309DS Datasheet RSU002P03 - RSU002P03 RSU002P03 Datasheet PC60Q04N - PC60Q04N PC60Q04N Datasheet MB39A104 - MB39A104 MB39A104 Datasheet AN1516 - AN1516 AN1516 Datasheet
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