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CY8C24094 CY8C24794 CY8C24894 CY8C24994
Top Searches for this datasheetI2c cy8c29466-24pxi usb - I2c cy8c29466-24pxi usb CY8C24894 - CY8C24894 CY8C24094 - CY8C24094 CY8C24794 - CY8C24794 CY8C24894 - CY8C24894 CY8C24994 - CY8C24994 CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet CY8C24894 includes XRES support In-System Serial Programming (ISSP) external reset control Powerful Harvard Architecture Processor Processor Speeds Multiply, 32-Bit Accumulate Power High Speed 5.25V Operating Voltage Industrial Temperature Range: -40°C +85°C Temperature Range: -10°C +85°C Advanced Peripherals (PSoC Blocks) Rail-to-Rail Analog PSoC Blocks Provide: 14-Bit ADCs 9-Bit DACs Programmable Gain Amplifiers Programmable Filters Comparators Digital PSoC Blocks Provide: 32-Bit Timers, Counters, PWMs Modules Full-Duplex UART Multiple SPIMasters Slaves Connectable GPIO Pins Complex Peripherals Combining Blocks Capacitive Sensing Application Capability Full-Speed Mbps) Four Uni-Directional Endpoints Bi-Directional Control Endpoint Compliant Dedicated Byte Buffer External Crystal Required Flexible On-Chip Memory Flash Program Storage 50,000 Erase/ Write Cycles SRAM Data Storage In-System Serial Programming (ISSP) Partial Flash Updates Flexible Protection Modes EEPROM Emulation Flash Programmable Configurations Sink GPIO Pull Pull down, High Strong, Open Drain Drive Modes GPIO Analog Inputs GPIO Analog Outputs GPIO Configurable Interrupt GPIO Precision, Programmable Clocking Internal 24/48 Oscillator Internal Oscillator Watchdog Sleep .25% Accuracy with External Components Additional System Resources I2CSlave, Master, Multi-Master Watchdog Sleep Timers User-Configurable Voltage Detection Integrated Supervisory Circuit On-Chip Precision Voltage Reference Complete Development Tools Free Development Software (PSoC DesignerTM) Full-Featured, In-Circuit Emulator Programmer Full Speed Emulation Complex Breakpoint Structure 128K Bytes Trace Memory Port Port Port Port Port Port Port Analog Drivers PSoC® Functional Overview PSoC® family consists many Mixed-Signal Array with On-Chip Controller devices. PSoC family devices designed replace traditional MCUs, system ICs, numerous discrete components that surround them. PSoC CY8C24x94 devices unique members PSoC family because includes full-featured, full-speed Mbps) port. Configurable analog, digital, interconnect circuitry enable high level integration host industrial, consumer, communication applications. This architecture allows user create customized peripheral configurations that match requirements each individual application. Additionally, fast CPU, Flash program memory, SRAM data memory, configurable included range convenient pinouts packages. PSoC architecture, illustrated left, comprised four main areas: PSoC Core, Digital System, Analog System, System Resources including full-speed port. Configurable global busing allows device resources combined into complete custom system. PSoC CY8C24x94 devices have seven ports that connect global digital analog interconnects, providing access digital blocks analog blocks. System Global Digital Interconnect Global Analog Interconnect PSoC CORE SRAM Interrupt Controller SROM Flash Sleep Watchdog Core (M8C) ClockSources (Includes ILO) DIGITAL SYSTEM Digital Block Array ANALOG SYSTEM Analog Ref. Analog Block Array Digital Decimator Clocks MACs Type Internal Voltage System Resets Ref. Analog Input Muxing SYSTEM RESOURCES February 2007 Cypress Semiconductor 2004-2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview PSoC Core PSoC Core powerful engine that supports rich feature set. core includes CPU, memory, clocks, configurable GPIO (General Purpose IO). core powerful processor with speeds MHz, providing four MIPS 8-bit Harvard architecture microprocessor. utilizes interrupt controller with vectors, simplify programming real time embedded events. Program execution timed protected using included Sleep Watch Timers (WDT). Memory encompasses Flash program storage, SRAM data storage, EEPROM emulated using Flash. Program Flash utilizes four protection levels blocks bytes, allowing customized software protection. PSoC device incorporates flexible internal clock generators, including (internal main oscillator) accurate over temperature voltage. also doubled digital system. power (internal speed oscillator) provided Sleep timer WDT. clocks, together with programmable clock dividers System Resource), provide flexibility integrate almost timing requirement into PSoC device. systems, will self-tune 0.25% accuracy communication. PSoC GPIOs provide connection CPU, digital analog resources device. Each pin's drive mode selected from eight options, allowing great flexibility external interfacing. Every also capability generate system interrupt high level, level, change from last read. Digital peripheral configurations include those listed below. Full-Speed Mbps) PWMs bit) PWMs with Dead band bit) Counters bit) Timers bit) UART with selectable parity master slave slave multi-master Cyclical Redundancy Checker/Generator bit) IrDA Pseudo Random Sequence Generators bit) digital blocks connected GPIO through series global buses that route signal pin. buses also allow signal multiplexing performing logic operations. This configurability frees your designs from constraints fixed peripheral controller. Digital blocks provided rows four, where number blocks varies PSoC device family. This allows optimum choice system resources your application. Family resources shown table titled PSoC Device Characteristics. Analog System Analog System composed configurable blocks, each comprised opamp circuit allowing creation complex analog signal flows. Analog peripherals very flexible customized support specific application requirements. Some more common PSoC analog functions (most available user modules) listed below. Digital System Digital System composed digital PSoC blocks. Each block 8-bit resource that used alone combined with other blocks form 32-bit peripherals, which called user module references. Digital System Block Diagram Port Port Port Port Port Port Port Analog-to-digital converters with 14-bit resolution, selectable Incremental, Delta Sigma, SAR) Filters pole band-pass, low-pass, notch) Amplifiers with selectable gain 48x) Instrumentation amplifiers with selectable gain 93x) Comparators with selectable thresholds) DACs with 9-bit resolution) Multiplying DACs with 9-bit resolution) High current output drivers (two with drive PSoC Core Resource) 1.3V reference System Resource) DTMF Dialer Modulators Correlators Peak Detectors Many other topologies possible Digital Clocks FromCore System ToAnalog System DIGITAL SYSTEM Digital PSoC Block Array Input Configuration DBB00 DBB01 DCB02 DCB03 Output Configuration GIE[7:0] GIO[7:0] GlobalDigital Interconnect GOE[7:0] GOO[7:0] February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview Analog blocks arranged column three, which includes (Continuous Time) (Switched Capacitor) blocks, shown figure below. Analog System Block Diagram (Except Port P0[7] P0[5] P0[3] P0[1] AGNDIn RefIn Analog P0[6] P0[4] P0[2] P0[0] P2[6] Analog Multiplexer System Analog connect every GPIO ports Pins connected individually combination. also connects analog system analysis with comparators analog-to-digital converters. split into sections simultaneous dual-channel processing. additional analog input multiplexer provides second path bring Port pins analog array. Switch control logic enables selected pins precharge continuously under hardware control. This enables capacitive measurement applications such touch sensing. Other multiplexer applications include: Track pad, finger sensing. Chip-wide that allows analog input from pins. Crosspoint connection between combinations. P2[3] P2[4] P2[2] P2[0] P2[1] When designing capacitive sensing applications, refer latest signal-to-noise signal level requirements Application Notes, which found under http://www.cypress.com DESIGN RESOURCES Application Notes. general, unless otherwise noted relevant Application Notes, minimum signal-to-noise ratio (SNR) CapSense applications 5:1. ACI0[1:0] ACI1[1:0] Array Input Configuration Additional System Resources ACB00 ASC10 ASD20 ACB01 ASD11 ASC21 Block Array System Resources, provide additional capability useful complete systems. Additional resources include multiplier, decimator, voltage detection, power reset. Brief statements describing merits each resource follow. AnalogReference Interface Digital System RefHi RefLo AGND Reference Generators AGNDIn RefIn Bandgap Full-Speed Mbps) with configurable endpoints bytes RAM. external components required except series resistors. Wider than commercial temperature operation (-10°C +85°C). Digital clock dividers provide three customizable clock frequencies applications. clocks routed both digital analog systems. Additional clocks generated using digital PSoC blocks clock dividers. multiply accumulates (MACs) provide fast 8-bit multipliers with 32-bit accumulate, assist both general math well digital filters. Decimator provides custom hardware filter digital signal processing apps. including creation Delta Sigma ADCs. module provides communication over wires. Slave, master, multi-master supported. Voltage Detection (LVD) interrupts signal application falling voltage levels, while advanced (Power Reset) circuit eliminates need system supervisor. internal 1.3V reference provides absolute reference analog system, including ADCs DACs. Versatile analog multiplexer system. Interface (Address Bus, Data Bus, Etc.) February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview PSoC Device Characteristics Depending your PSoC device characteristics, digital analog systems have digital blocks analog blocks. following table lists resources available specific PSoC device groups. device covered this data sheet shown highlighted table PSoC Device Characteristics Analog Columns Analog Outputs Analog Inputs Analog Blocks Digital Blocks Digital Digital Rows SRAM Size PSoC Part Number Flash Size Getting Started quickest path understanding PSoC silicon reading this data sheet using PSoC Designer Integrated Development Environment (IDE). This data sheet overview PSoC integrated circuit presents specific pin, register, electrical specifications. in-depth information, along with detailed programming information, reference PSoC Mixed-Signal Array Technical Reference Manual. up-to-date Ordering, Packaging, Electrical Specification information, reference latest PSoC device data sheets http://www.cypress.com/psoc. determine which PSoC device meets your requirements, navigate through PSoC Decision Tree Application Note AN2209 http://www.cypress.com select Application Notes under Design Resources. CY8C29x66 CY8C27x43 CY8C24x94 CY8C24x23A CY8C21x34 CY8C21x23 CY8C20x34 Bytes Bytes Bytes Bytes Bytes Development Kits Development Kits available from following distributors: Digi-Key, Avnet, Arrow, Future. Cypress Online Store contains development kits, compilers, accessories PSoC development. Cypress Online Store site http://www.cypress.com, click Online Store shopping cart icon bottom page, click PSoC (Programmable System-on-Chip) view current list available items. Limited analog functionality. analog blocks CapSense. Technical Training Modules Free PSoC technical training modules available users PSoC. Training modules cover designing, debugging, advanced analog CapSense. http:// www.cypress.com/techtrain. Consultants Certified PSoC Consultants offer everything from technical assistance completed PSoC designs. contact become PSoC Consultant http://www.cypress.com, click Design Support located left side page, select CYPros Consultants. Technical Support PSoC application engineers take pride fast accurate response. They reached with 4-hour guaranteed response Application Notes long list application notes will assist every aspect your design effort. view PSoC application notes, http://www.cypress.com site select Application Notes under Design Resources list located center page. Application notes listed date default. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview Development Tools PSoC Designer Microsoft® Windows-based, integrated development environment Programmable System-onChip (PSoC) devices. PSoC Designer application runs Windows 4.0, Windows 2000, Windows Millennium (Me), Windows (Reference PSoC Designer Functional Flow diagram below.) PSoC Designer helps customer select operating configuration PSoC, write application code that uses PSoC, debug application. This system provides design database management project, integrated debugger with In-Circuit Emulator, in-system programming support, CYASM macro assembler CPUs. PSoC Designer also supports high-level language compiler developed specifically devices family. PSoC Designer Subsystems PSoC Designer Graphical Designer Interface Context Sensitive Help Commands Results Importable Design Database Device Database Application Database Project Database User Modules Library PSoC Configuration Sheet PSoC Designer Core Engine Manufacturing Information File Emulation In-Circuit Emulator Device Programmer February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview PSoC Designer Software Subsystems Device Editor Device Editor subsystem allows user select different onboard analog digital components called user modules using PSoC blocks. Examples user modules ADCs, DACs, Amplifiers, Filters. device editor also supports easy development multiple configurations dynamic reconfiguration. Dynamic configuration allows changing configurations time. PSoC Designer sets power-on initialization tables selected PSoC block configurations creates source code application framework. framework contains software operate selected components and, project uses more than operating configuration, contains routines switch between different sets PSoC block configurations time. PSoC Designer print configuration sheet given project configuration during application programming conjunction with Device Data Sheet. Once framework generated, user application-specific code flesh framework. It's also possible change selected components regenerate framework. Debugger PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing designer test program physical system while providing internal view PSoC device. Debugger commands allow designer read program read write data memory, read write registers, read write registers, clear breakpoints, provide program run, halt, step control. debugger also allows designer create trace buffer registers memory locations interest. Online Help System online help system displays online, context-sensitive help user. Designed procedural quick reference, each functional subsystem context-sensitive help. This system also provides tutorials links FAQs Online Support Forum designer getting started. Hardware Tools In-Circuit Emulator Design Browser Design Browser allows users select import preconfigured designs into user's project. Users easily browse catalog preconfigured designs facilitate time-to-design. Examples provided tools include 300-baud modem, master slave, controller, magnetic card reader. cost, high functionality (In-Circuit Emulator) available development support. This hardware capability program single devices. emulator consists base unit that connects port. base unit universal will operate with PSoC devices. Emulation pods each device family available separately. emulation takes place PSoC device target board performs full speed MHz) operation. Application Editor Application Editor edit your language Assembly language source code. also assemble, compile, link, build. Assembler. macro assembler allows assembly code merged seamlessly with code. link libraries automatically absolute addressing compiled relative mode, linked with other software modules absolute addressing. Language Compiler. language compiler available that supports PSoC family devices. Even have never worked language before, product quickly allows create complete programs PSoC family devices. embedded, optimizing compiler provides features tailored PSoC architecture. comes complete with embedded libraries providing port operations, standard keypad display support, extended math functionality. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview Designing with User Modules development process PSoC device differs from that traditional fixed function microprocessor. configurable analog digital hardware blocks give PSoC architecture unique flexibility that pays dividends managing specification change during development lowering inventory costs. These configurable resources, called PSoC Blocks, have ability implement wide variety user-selectable functions. Each block several registers that determine function connectivity other blocks, multiplexers, buses pins. Iterative development cycles permit adapt hardware well software. This substantially lowers risk having select different part meet final design requirements. speed development process, PSoC Designer Integrated Development Environment (IDE) provides library pre-built, pre-tested hardware peripheral functions, called "User Modules." User modules make selecting implementing peripheral devices simple, come analog, digital, mixed signal varieties. standard User Module library contains over common peripherals such ADCs, DACs Timers, Counters, UARTs, other not-so common peripherals such DTMF Generators Bi-Quad analog filter sections. Each user module establishes basic register settings that implement selected function. also provides parameters that allow tailor precise configuration your particular application. example, Pulse Width Modulator User Module configures more digital PSoC blocks, each bits resolution. user module parameters permit establish pulse width duty cycle. User modules also provide tested software your development time. user module application programming interface (API) provides highlevel functions control respond hardware events run-time. also provides optional interrupt service routines that adapt needed. functions documented user module data sheets that viewed directly PSoC Designer IDE. These data sheets explain internal operation user module provide performance specifications. Each data sheet describes each user module parameter documents setting each register controlled user module. development process starts when open project bring Device Editor, graphical user interface (GUI) configuring hardware. pick user modules need your project them onto PSoC blocks with point-and-click simplicity. Next, build signal chains interconnecting user modules each other pins. this stage, also configure clock source connections enter parameter values directly selecting values from drop-down menus. When ready test hardware configuration move developing code project, perform "Generate Application" step. This causes PSoC Designer generate source code that automatically configures device your specification provides high-level user module functions. User Module/Source Code Development Flows Device Editor User Module Selection Placement Parameter -ization Source Code Generator Generate Application Application Editor Project Manager Source Code Editor Build Manager Build Debugger Interface Storage Inspector Event Breakpoint Manager next step write your main program, sub-routines using PSoC Designer's Application Editor subsystem. Application Editor includes Project Manager that allows open project source code files (including generated code files) from hierarchal view. source code editor provides syntax coloring advanced edit features both assembly language. File search capabilities include simple string searches recursive "grep-style" patterns. single mouse click invokes Build Manager. employs professional-strength "makefile" system automatically analyze file dependencies compiler assembler necessary. Project-level options control optimization strategies used compiler linker. Syntax errors displayed console window. Double clicking error message takes directly offending line source code. When correct, linker builds file image suitable programming. last step development process takes place inside PSoC Designer's Debugger subsystem. Debugger downloads image In-Circuit Emulator (ICE) where runs full speed. Debugger capabilities rival those systems costing many times more. addition traditional single-step, run-to-breakpoint watch-variable features, Debugger provides large trace buffer allows define complex breakpoint events that include monitoring address data values, memory locations external signals. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet PSoC® Overview Document Conventions Acronyms Used following table lists acronyms that used this document. Acronym Description Table Contents depth discussion more information your PSoC device, obtain PSoC Mixed-Signal Array Technical Reference Manual. This document encompasses organized into following chapters sections. Information EEPROM GPIO IPOR PPOR PSoC® SRAM alternating current analog-to-digital converter application programming interface central processing unit continuous time digital-to-analog converter direct current external crystal oscillator electrically erasable programmable read-only memory full scale range general purpose graphical user interface human body model in-circuit emulator internal speed oscillator internal main oscillator input/output imprecise power reset least-significant voltage detect most-significant program counter phase-locked loop power reset precision power reset Programmable System-on-Chippulse width modulator switched capacitor static random access memory 56-Pin Part Pinout 56-Pin Part Pinout (with XRES) 68-Pin Part Pinout 68-Pin Part Pinout (On-Chip Debug) 100-Ball VFBGA Part Pinout 100-Ball VFBGA Part Pinout (On-Chip Debug) 100-Pin Part Pinout (On-Chip Debug) Register Reference Register Conventions 2.1.1 Abbreviations Used Register Mapping Tables Electrical Specifications Absolute Maximum Ratings Operating Temperature Electrical Characteristics 3.3.1 Chip-Level Specifications 3.3.2 General Purpose Specifications 3.3.3 Full-Speed Specifications 3.3.4 Operational Amplifier Specifications 3.3.5 Power Comparator Specifications 3.3.6 Analog Output Buffer Specifications 3.3.7 Analog Reference Specifications 3.3.8 Analog PSoC Block Specifications 3.3.9 Specifications 3.3.10 Programming Specifications Electrical Characteristics 3.4.1 Chip-Level Specifications 3.4.2 General Purpose Specifications 3.4.3 Full-Speed Specifications 3.4.4 Operational Amplifier Specifications 3.4.5 Power Comparator Specifications 3.4.6 Digital Block Specifications 3.4.7 External Clock Specifications 3.4.8 Analog Output Buffer Specifications 3.4.9 Programming Specifications 3.4.10 Specifications Packaging Information Packaging Dimensions Thermal Impedance Solder Reflow Peak Temperature Development Tool Selection Software 5.1.1 PSoC Designer 5.1.2 PSoC Express 5.1.3 PSoC Programmer 5.1.4 CY3202-C iMAGEcraft Compiler Development Kits 5.2.1 CY3215-DK Basic Development 5.2.2 CY3210-ExpressDK Development Evaluation Tools 5.3.1 CY3210-MiniProg1 5.3.2 CY3210-PSoCEval1 5.3.3 CY3214-PSoCEvalUSB Device Programmers 5.4.1 CY3216 Modular Programmer 5.4.2 CY3207ISSP In-System Serial Programmer (ISSP) Accessories (Emulation Programming) 3rd-Party Tools Build PSoC Emulator into Your Board Ordering Information Ordering Code Definitions Sales Company Information Revision History Copyrights Code Protection Units Measure units measure table located Electrical Specifications section. Table page lists abbreviations used measure PSoC devices. Numeric Naming Hexidecimal numbers represented with letters uppercase with appended lowercase (for example, `14h' `3Ah'). Hexidecimal numbers also represented `0x' prefix, coding convention. Binary numbers have appended lowercase (e.g., 01010100b' `01000011b'). Numbers indicated decimal. February 2007 Document 38-12018 Rev. Feedback Information This chapter describes, lists, illustrates CY8C24x94 PSoC device family pins pinout configuration. CY8C24x94 PSoC devices available following packages, which shown following pages. Every port (labeled with "P") capable Digital However, Vss, Vdd, XRES capable Digital 56-Pin Part Pinout Name Description Table 1-1. 56-Pin Part Pinout (QFN**) LEGEND details footnotes Table page Type Digital Analog Power Power CY8C24794 56-Pin PSoC Device P2[5],M P2[7],M P0[1], P0[3], P0[5], P0[7], P0[6], P0[4], P0[2], P0[0], P2[6],M P2[4],M P2[3] P2[1] M,P4[7] M,P4[5] M,P4[3] M,P4[1] M,P3[7] M,P3[5] M,P3[3] M,P3[1] M,P5[7] M,P5[5] M,P5[3] M,P5[1] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] DVdd P7[7] P7[0] P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] P3[6] P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] Direct switched capacitor block input. Direct switched capacitor block input. Serial Clock (SCL). Serial Data (SDA). Serial Clock (SCL), ISSP SCLK*. Ground connection. Supply voltage. Serial Data (SDA), ISSP SDATA*. Type Digital Analog Power Power Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. Name P2[6] P0[0] P0[2] P0[4] P0[6] P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] February 2007 Document 38-12018 Rev. SCL, P1[7] SDA, P1[5] M,P1[3] SCL, P1[1] DVdd P7[7] P7[0] SDA, P1[0] M,P1[2] M,P1[4] M,P1[6] (Top View P2[2], P2[0], P4[6],M P4[4],M P4[2],M P4[0],M P3[6],M P3[4],M P3[2],M P3[0],M P5[6],M P5[4],M P5[2],M P5[0],M Description External Voltage Reference (VREF) input. Analog column input. Analog column input. Analog column input VREF. Analog column input. Supply voltage. Ground connection. Analog column input,. Analog column input column output. Analog column input column output. Analog column input. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 56-Pin Part Pinout (with XRES) Name Description Table 1-2. 56-Pin Part Pinout (QFN**) Type Digital Analog Power Power CY8C24894 56-Pin PSoC Device P0[5], P0[7], P0[6], P0[4], P0[2], P0[0], P2[6], P2[4], P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] DVdd P7[7] P7[0] P1[0] P1[2] P1[4] P1[6] Direct switched capacitor block input. Direct switched capacitor block input. P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] P3[7] P2[5], P2[7], P0[1], P0[3], (Top View) Serial Clock (SCL). Serial Data (SDA). Serial Clock (SCL), ISSP SCLK*. Ground connection. P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P2[2], P2[0], P4[6], P4[4], P4[2], P4[0], XRES P3[4], P3[2], P3[0], P5[6], P5[4], P5[2], P5[0], P1[3] SCL, P1[1] DVdd P7[7] SCL, P1[7] SDA, P1[5] Serial Data (SDA), ISSP SDATA*. Input P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] Type Digital Analog Active high external reset with internal Power pull down. Power Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. Name Description P2[6] P0[0] P0[2] P0[4] P0[6] P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] External Voltage Reference (VREF) input. Analog column input. Analog column input. Analog column input VREF. Analog column input. Supply voltage. Ground connection. Analog column input,. Analog column input column output. Analog column input column output. Analog column input. LEGEND Analog, Input, Output, Analog Input. These ISSP pins, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. center package should connected ground (Vss) best mechanical, thermal, electrical performance. connected ground, should electrically floated connected other signal. February 2007 Document 38-12018 Rev. SDA, P7[0] P1[0] P1[2] P1[4] P1[6] Supply voltage. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 68-Pin Part Pinout 68-pin part table drawing below CY8C24994 PSoC device. Table 1-3. 68-Pin Part Pinout (QFN**) Type Digital Analog Power Power Power Name Description CY8C24994 68-Pin PSoC Device Ext. VREF Ext. AGND P4[7] P4[5] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] DVdd P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] P3[6] XRES connection. connection. Ground connection. P4[7] P4[5] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] SCL, SDA, P5[3] P5[1] P1[7] P1[5] P0[7], P0[6], P0[4], P0[2], P0[0], P2[6], P2[4], P2[2], P2[1], P2[3], P2[5], P2[7], P0[1], P0[3], P0[5], Serial Clock (SCL). Serial Data (SDA). Serial Clock (SCL) ISSP SCLK*. Ground connection. (Top View) P2[0], P4[6], P4[4], P4[2], P4[0], XRES P3[6], P3[4], P3[2], P3[0], P5[6], P5[4], P5[2], P5[0], P1[6], P1[3] SCL, P1[1] DVdd P7[7] P7[6] P7[5] P7[4] Supply voltage. Type Digital Analog Serial Data (SDA), ISSP SDATA*. Optional External Clock Input (EXT53 CLK). Power Power IO,M Name P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] P2[3] P2[1] Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. External Voltage Reference (VREF) input. Analog column input. Analog column input column output. Analog column input column output. Analog column input. Supply voltage. Ground connection. Analog column input, integration input Analog column input column output, integration input Analog column input column output. Analog column input. Input connection. connection. Active high reset with internal pull down. IO,M P4[0] P4[2] P4[4] Direct switched capacitor block input. Direct switched capacitor block input. LEGENDA Analog, Input, Output, Connection, Analog Input. These ISSP pins, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. center package should connected ground (Vss) best mechanical, thermal, electrical performance. connected ground, should electrically floated connected other signal. February 2007 Document 38-12018 Rev. P7[3] P7[2] P7[1] P7[0] SDA, P1[0] P1[2] P1[4] Description Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 68-Pin Part Pinout (On-Chip Debug) 68-pin part table drawing below CY8C24094 On-Chip Debug (OCD) PSoC device. Note This part only used in-circuit debugging. available production. Table 1-4. 68-Pin Part Pinout (QFN**) Type Digital Analog Power Power Power Name Description CY8C24094 68-Pin PSoC Device P2[6], Ext. VREF P2[4], Ext. AGND P2[2], P4[7] P4[5] P4[3] P4[1] OCDE OCDO P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] DVdd P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] P3[6] HCLK CCLK XRES P2[3], P2[5], P2[7], P0[1], P0[3], P0[5], P2[1], Serial Clock (SCL). Serial Data (SDA). Serial Clock (SCL), ISSP SCLK*. Ground connection. P4[7] P4[5] P4[3] P4[1] OCDE OCDO P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] SCL, P1[7] SDA, P1[5] even data data output. Ground connection. P0[7], P0[6], P0[4], P0[2], P0[0], P1[3] SCL, P1[1] DVdd Supply voltage. Type Digital Analog Serial Data (SDA), ISSP SDATA*. Optional External Clock Input (EXT53 CLK). Power Power IO,M Name Description P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] P2[3] P2[1] Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. External Voltage Reference (VREF) input. Analog column input. Analog column input column output. Analog column input column output. Analog column input. Supply voltage. Ground connection. Analog column input, integration input Analog column input column output, integration input Analog column input column output. Analog column input. Input high-speed clock output. clock output. Active high reset with internal pull down. IO,M P4[0] P4[2] P4[4] Direct switched capacitor block input. Direct switched capacitor block input. LEGENDA Analog, Input, Output, Analog Input, On-Chip Debugger. These ISSP pins, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. center package should connected ground (Vss) best mechanical, thermal, electrical performance. connected ground, should electrically floated connected other signal. February 2007 Document 38-12018 Rev. SDA, P1[0] P1[2] P1[4] P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] (Top View) P2[0], P4[6], P4[4], P4[2], P4[0], XRES CCLK HCLK P3[6], P3[4], P3[2], P3[0], P5[6], P5[4], P5[2], P5[0], P1[6], Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 100-Ball VFBGA Part Pinout 100-ball VFBGA part CY8C24994 PSoC device. Table 1-5. 100-Ball Part Pinout (VFBGA) Analog Name Description Analog Digital Digital Name Description Power Power Power Power Power P2[1] P0[1] P0[7] Power P0[2] P2[2] Power Power P4[1] P4[7] P2[7] IO,M P0[5] P0[6] P0[0] P2[0] P4[2] P3[7] P4[5] P2[5] IO,M P0[3] P0[4] P2[6] P4[6] P4[0] P4[3] P2[3] Power Power P2[4] P4[4] P3[6] Power Power Analog column input column output. Analog column input. Analog column input. Direct switched capacitor block input. connection. connection. Analog column input column output. Analog column input. External Voltage Reference (VREF) input. connection. connection. connection. Direct switched capacitor block input. Ground connection. Ground connection. External Analog Ground (AGND) input. connection. Ground connection. Ground connection. connection. connection. connection. Supply voltage. connection. connection. Ground connection. Ground connection. Ground connection. Ground connection. Direct switched capacitor block input. Analog column input. Analog column input. Supply voltage. Analog column input. Direct switched capacitor block input. Ground connection. Ground connection. connection. Power Power Power Power Power Power Power Power Power Power Power Power P5[7] P3[5] P5[1] P5[0] P3[0] XRES P7[1] P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2] P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3] DVdd P7[7] P7[0] P5[2] P7[6] P7[5] P7[4] connection. Ground connection. Ground connection. Active high reset with internal pull down. connection. Serial Clock (SCL). Serial Clock (SCL), ISSP SCLK*. Serial Data (SDA), ISSP SDATA*. connection. Serial Data (SDA). Ground connection. Ground connection. Supply voltage. Ground connection. Ground connection. Ground connection. Ground connection. connection. connection. Supply voltage. Ground connection. Ground connection. LEGEND Analog, Input, Output, Analog Input, Connection. This ISSP pin, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information CY8C24994 P2[1] P0[1] P0[7] P0[2] P2[2] P4[1] P4[7] P2[7] P0[5] P0[6] P0[0] P2[0] P4[2] P3[7] P4[5] P2[5] P0[3] P0[4] P2[6] P4[6] P4[0] P4[3] P2[3] P2[4] P4[4] P3[6] P5[7] P3[5] P5[1] P5[0] P3[0] XRES P7[1] P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2] P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3] P7[7] P7[0] P5[2] P7[6] P7[5] P7[4] (Top View) February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 100-Ball VFBGA Part Pinout (On-Chip Debug) 100-pin VFBGA part table drawing below CY8C24094 On-Chip Debug (OCD) PSoC device. Note This part only used in-circuit debugging. available production. Table 1-6. 100-Ball Part Pinout (VFBGA) Analog Name Description Analog Digital Digital Name Description Power Power Power Power Power P2[1] P0[1] P0[7] Power P0[2] P2[2] Power Power P4[1] P4[7] P2[7] IO,M P0[5] P0[6] P0[0] P2[0] P4[2] P3[7] P4[5] P2[5] IO,M P0[3] P0[4] P2[6] P4[6] P4[0] CCLK P4[3] P2[3] Power Power P2[4] P4[4] P3[6] HCLK Power Power Ground connection. Ground connection. connection. connection. connection. Supply voltage. connection. connection. Ground connection. Ground connection. Ground connection. Ground connection. Direct switched capacitor block input. Analog column input. Analog column input. Supply voltage. Analog column input. Direct switched capacitor block input. Ground connection. Ground connection. connection. Analog column input column output. Analog column input. Analog column input. Direct switched capacitor block input. connection. connection. Analog column input column output. Analog column input. External Voltage Reference (VREF) input. clock output. connection. connection. Direct switched capacitor block input. Ground connection. Ground connection. External Analog Ground (AGND) input. high-speed clock output. Power Power Power Power Power Power Power Power Power Power Power Power OCDE P5[7] P3[5] P5[1] P5[0] P3[0] XRES P7[1] OCDO P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2] P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3] DVdd P7[7] P7[0] P5[2] P7[6] P7[5] P7[4] even data Ground connection. Ground connection. Active high reset with internal pull down. data output. Serial Clock (SCL). Serial Clock (SCL), ISSP SCLK*. Serial Data (SDA), ISSP SDATA*. connection. Serial Data (SDA). Ground connection. Ground connection. Supply voltage. Ground connection. Ground connection. Ground connection. Ground connection. connection. connection. Supply voltage. Ground connection. Ground connection. LEGEND Analog, Input, Output, Analog Input, Connection, On-Chip Debugger. This ISSP pin, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information CY8C24094 P2[1] P0[1] P0[7] P0[2] P2[2] P4[1] P4[7] P2[7] P0[5] P0[6] P0[0] P2[0] P4[2] P3[7] P4[5] P2[5] P0[3] P0[4] P2[6] P4[6] P4[0] CClk P4[3] P2[3] P2[4] P4[4] P3[6] HClk ocde P5[7] P3[5] P5[1] P5[0] P3[0] XRES P7[1] ocdo P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2] P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3] P7[7] P7[0] P5[2] P7[6] P7[5] P7[4] (Top View) Production February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information 100-Pin Part Pinout (On-Chip Debug) 100-pin TQFP part CY8C24094 On-Chip Debug (OCD) PSoC device. Note This part only used in-circuit debugging. available production. Table 1-7. 100-Pin Part Pinout (TQFP) Analog Name Description Analog Digital Digital Name Description P0[1] P2[7] P2[5] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] OCDE OCDO Power P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] DVdd P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] P1[0] P1[2] P1[4] connection. connection. Analog column input. Direct switched capacitor block input. Direct switched capacitor block input. even data data output. connection. Ground connection. Serial Clock (SCL). connection. connection. connection. Serial Data (SDA) Crystal (XTALin), Serial Clock (SCL), ISSP SCLK*. connection. Ground connection. Input Power P1[6] P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] P3[6] HCLK CCLK XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] high-speed clock output. clock output. Active high reset with internal pull down. Ground connection. Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. connection. External Voltage Reference (VREF) input. connection. Analog column input. connection. connection. Analog column input column output. connection. Analog column input column output. connection. Analog column input. Supply voltage. connection. Ground connection. connection. connection. connection. connection. connection. connection. connection. connection. connection. connection. Analog column input. connection. Analog column input column output. connection. Analog column input column output. connection. Power Power Supply voltage. connection. connection. connection. connection. Crystal (XTALout), Serial Data (SDA), ISSP SDATA*. Optional External Clock Input (EXTCLK). P0[6] Power Power P0[7] P0[5] P0[3] LEGEND Analog, Input, Output, Connection, Analog Input, On-Chip Debugger. These ISSP pins, which High POR. PSoC Mixed-Signal Array Technical Reference Manual details. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Information CY8C24094 P0[3], P0[5], P0[7], P0[6], P0[4], P0[1] P2[7] P2[5] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] OCDE OCDO P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] SCL, P1[7] M,P1[2] M,P1[4] P0[2], P0[0], P2[6], External VREF P2[4], External AGND P2[2], P2[0], P4[6], P4[4], P4[2], P4[0], XRES CCLK HCLK P3[6], P3[4], P3[2], P3[0], P5[6], P5[4], P5[2], P5[0], P1[6], TQFP P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] February 2007 SDA, P1[5] M,P1[3] SCL, P1[1] DVdd Production Document 38-12018 Rev. P7[1] P7[0] SDA, P1[0] Feedback Register Reference This chapter lists registers CY8C24x94 PSoC device family. detailed register information, reference PSoC Mixed-Signal Array Technical Reference Manual. 2.1.1 Register Conventions Abbreviations Used Register Mapping Tables register conventions specific this section listed following table. Convention Description PSoC device total register address space bytes. register space referred space divided into banks. Flag register (CPU_F) determines which bank user currently When user Bank Note following register mapping tables, blank fields Reserved should accessed. Read register bit(s) Write register bit(s) Logical register bit(s) Clearable register bit(s) Access specific February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Register Reference Register Bank Table: User Space Access Access Access Access Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Name Name Name Name PMA0_DR PMA1_DR PMA2_DR PMA3_DR PMA4_DR PMA5_DR PMA6_DR PMA7_DR USB_SOF0 USB_SOF1 USB_CR0 USBIO_CR0 USBIO_CR1 EP1_CNT1 EP1_CNT EP2_CNT1 EP2_CNT EP3_CNT1 EP3_CNT EP4_CNT1 EP4_CNT EP0_CR EP0_CNT EP0_DR0 EP0_DR1 EP0_DR2 EP0_DR3 EP0_DR4 PRT7DR EP0_DR5 PRT7IE EP0_DR6 PRT7GS EP0_DR7 PRT7DM2 DBB00DR0 AMX_IN DBB00DR1 AMUXCFG DBB00DR2 DBB00CR0 ARF_CR DBB01DR0 CMP_CR0 DBB01DR1 ASY_CR DBB01DR2 CMP_CR1 DBB01CR0 DCB02DR0 DCB02DR1 DCB02DR2 DCB02CR0 DCB03DR0 TMP_DR0 DCB03DR1 TMP_DR1 DCB03DR2 TMP_DR2 DCB03CR0 TMP_DR3 ACB00CR3 ACB00CR0 ACB00CR1 ACB00CR2 ACB01CR3 ACB01CR0 ACB01CR1 ACB01CR2 Blank fields Reserved should accessed. PRT0DR PRT0IE PRT0GS PRT0DM2 PRT1DR PRT1IE PRT1GS PRT1DM2 PRT2DR PRT2IE PRT2GS PRT2DM2 PRT3DR PRT3IE PRT3GS PRT3DM2 PRT4DR PRT4IE PRT4GS PRT4DM2 PRT5DR PRT5IE PRT5GS PRT5DM2 ASD20CR0 ASD20CR1 ASD20CR2 ASD20CR3 ASC21CR0 ASC21CR1 ASC21CR2 ASC21CR3 MUL1_X MUL1_Y MUL1_DH MUL1_DL ACC1_DR1 ACC1_DR0 ACC1_DR3 ACC1_DR2 RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1 Access specific. ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK3 INT_MSK2 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_DH DEC_DL DEC_CR0 DEC_CR1 MUL0_X MUL0_Y MUL0_DH MUL0_DL ACC0_DR1 ACC0_DR0 ACC0_DR3 ACC0_DR2 CPU_F DAC_D CPU_SCR1 CPU_SCR0 February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Register Reference Register Bank Table: Configuration Space Access Access Access Access Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Name Name Name Name PMA0_WA PMA1_WA PMA2_WA PMA3_WA PMA4_WA PMA5_WA PMA6_WA PMA7_WA PMA0_RA PMA1_RA PMA2_RA PMA3_RA PMA4_RA PMA5_RA PMA6_RA PMA7_RA PRT7DM0 PRT7DM1 PRT7IC0 PRT7IC1 DBB00FN CLK_CR0 DBB00IN CLK_CR1 DBB00OU ABF_CR0 AMD_CR0 DBB01FN CMP_GO_EN DBB01IN CMP_GO_EN1 DBB01OU AMD_CR1 ALT_CR0 DCB02FN DCB02IN DCB02OU DCB03FN TMP_DR0 DCB03IN TMP_DR1 DCB03OU TMP_DR2 TMP_DR3 ACB00CR3 ACB00CR0 ACB00CR1 ACB00CR2 ACB01CR3 ACB01CR0 ACB01CR1 ACB01CR2 Blank fields Reserved should accessed. PRT0DM0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 PRT2DM0 PRT2DM1 PRT2IC0 PRT2IC1 PRT3DM0 PRT3DM1 PRT3IC0 PRT3IC1 PRT4DM0 PRT4DM1 PRT4IC0 PRT4IC1 PRT5DM0 PRT5DM1 PRT5IC0 PRT5IC1 ASD20CR1 ASD20CR2 ASD20CR3 ASC21CR0 ASC21CR1 ASC21CR2 ASC21CR3 RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1 Access specific. ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 USBIO_CR2 USB_CR1 EP1_CR0 EP2_CR0 EP3_CR0 EP4_CR0 GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU MUX_CR0 MUX_CR1 MUX_CR2 MUX_CR3 OSC_GO_EN OSC_CR4 OSC_CR3 OSC_CR0 OSC_CR1 OSC_CR2 VLT_CR VLT_CMP IMO_TR ILO_TR BDG_TR ECO_TR MUX_CR4 MUX_CR5 CPU_F DAC_CR CPU_SCR1 CPU_SCR0 February 2007 Document 38-12018 Rev. Feedback Electrical Specifications This chapter presents electrical specifications CY8C24x94 PSoC device family. most date electrical specifications, confirm that have most recent data sheet going http://www.cypress.com/psoc. Specifications valid -40oC 85oC 100oC, except where noted. Specifications devices running greater than valid -40oC 70oC 82oC. Figure 3-1. Voltage versus Frequency 5.25 4.75 Voltage rati 3.00 CPUFrequency following table lists units measure that used this chapter. Table 3-1: Units Measure Symbol Unit Measure Symbol Unit Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts picoampere picofarad peak-to-peak parts million picosecond samples second sigma: standard deviation volts Kbit µVrms February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications Symbol Absolute Maximum Ratings Description Units Table 3-2. Absolute Maximum Ratings Notes TSTG Storage Temperature +100 Higher storage temperatures will reduce data retention time. Recommended storage temperature +25oC 25oC. Extended duration storage temperatures above 65oC will degrade reliability. VIO2 IMIO IMAIO Ambient Temperature with Power Applied Supply Voltage Relative Input Voltage Voltage Applied Tri-state Maximum Current into Port Maximum Current into Port Configured Analog Driver Electro Static Discharge Voltage Latch-up Current -0.5 2000 +6.0 Human Body Model ESD. Symbol Operating Temperature Description Units Table 3-3. Operating Temperature Notes TAUSB Ambient Temperature Ambient Temperature using Junction Temperature +100 temperature rise from ambient junction package specific. "Thermal Impedance" page user must limit power consumption comply with this requirement. 3.3.1 Electrical Characteristics Chip-Level Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-4. Chip-Level Specifications Symbol Description Units Notes IDD5 Supply Voltage Supply Current, (5V) 5.25 specifications, Table page Conditions 5.0V, MHz, SYSCLK doubler disabled, MHz, 93.75 kHz, 93.75 kHz, analog power off. Conditions 3.3V, MHz, SYSCLK doubler disabled, MHz, 93.75 kHz, 0.367 kHz, analog power off. Conditions with internal slow speed oscillator, 3.3V, analog power off. Conditions with internal slow speed oscillator, 3.3V, analog power off. IDD3 Supply Current, (3.3V) Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT.a Sleep (Mode) Current with POR, LVD, Sleep Timer, high temperature.a ISBH Standby current includes functions (POR, LVD, WDT, Sleep Time) needed reliable system operation. This should compared with devices that have similar functions enabled. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.2 General Purpose Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-5. GPIO Specifications Symbol Description Units Notes Pull-Up Resistor Pull-Down Resistor High Output Level 4.75 5.25V total loads, even port pins (for example, P0[2], P1[4]), port pins (for example, P0[3], P1[5])). maximum combined budget. 4.75 5.25V total loads, even port pins (for example, P0[2], P1[4]), port pins (for example, P0[3], P1[5])). maximum combined budget. 5.25. 5.25. Gross tested Package dependent. Temp 25oC. Package dependent. Temp 25oC. Output Level 0.75 COUT Input Level Input High Level Input Hysterisis Input Leakage (Absolute Value) Capacitive Load Pins Input Capacitive Load Pins Output 3.3.3 Full-Speed Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -10°C 85°C, 3.0V 3.6V -10°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-6. Full-Speed Mbps) Specifications Symbol Interface Description Units Notes REXT VUOH VUOHI VUOL VCRS Differential Input Sensitivity Differential Input Common Mode Range Single Ended Receiver Threshold Transceiver Capacitance High-Z State Data Line Leakage External Series Resistor Static Output High, Driven Static Output High, Idle Static Output Driver Output Impedance D+/D- Crossover Voltage (D+) (D-) 3.3V. series with each pin. Ground. Internal pull-up enabled. Ground. Internal pull-up enabled. Ground. Internal pull-up enabled. Including REXT Resistor. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.4 Operational Amplifier Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Operational Amplifier component both Analog Continuous Time PSoC blocks Analog Switched Capacitor PSoC blocks. guaranteed specifications measured Analog Continuous Time PSoC block. Table 3-7. Operational Amplifier Specifications Symbol Description Units Notes VOSOA Input Offset Voltage (absolute value) Power Low, Opamp Bias High Power Medium, Opamp Bias High Power High, Opamp Bias High 35.0 µV/oC TCVOSOA IEBOA CINOA VCMOA Average Input Offset Voltage Drift Input Leakage Current (Port Analog Pins) Input Capacitance (Port Analog Pins) Common Mode Voltage Range Common Mode Voltage Range (high power high opamp bias) Gross tested Package dependent. Temp 25oC. common-mode input voltage range measured through analog output buffer. specification includes limitations imposed characteristics analog output buffer. GOLOA Open Loop Gain Power Low, Opamp Bias High Power Medium, Opamp Bias High Power High, Opamp Bias High VOHIGHOA High Output Voltage Swing (internal signals) Power Low, Opamp Bias High Power Medium, Opamp Bias High Power High, Opamp Bias High 1200 2400 4600 1000 1600 3200 6400 VOLOWOA Output Voltage Swing (internal signals) Power Low, Opamp Bias High Power Medium, Opamp Bias High Power High, Opamp Bias High ISOA Supply Current (including associated AGND buffer) Power Low, Opamp Bias Power Low, Opamp Bias High Power Medium, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias Power High, Opamp Bias High PSRROA Supply Voltage Rejection Ratio (Vdd 2.25) (Vdd 1.25V) Vdd. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications Table 3-8. 3.3V Operational Amplifier Specifications Symbol Description Units Notes VOSOA Input Offset Voltage (absolute value) Power Low, Opamp Bias High Power Medium, Opamp Bias High High Power Volts Only 1.65 1.32 35.0 µV/oC TCVOSOA IEBOA CINOA VCMOA Average Input Offset Voltage Drift Input Leakage Current (Port Analog Pins) Input Capacitance (Port Analog Pins) Common Mode Voltage Range Gross tested Package dependent. Temp 25oC. common-mode input voltage range measured through analog output buffer. specification includes limitations imposed characteristics analog output buffer. GOLOA Open Loop Gain Power Low, Opamp Bias Power Medium, Opamp Bias Power High, Opamp Bias VOHIGHOA High Output Voltage Swing (internal signals) Power Low, Opamp Bias Power Medium, Opamp Bias Power High only 1200 2400 4600 1000 1600 3200 6400 VOLOWOA Output Voltage Swing (internal signals) Power Low, Opamp Bias Power Medium, Opamp Bias Power High, Opamp Bias ISOA Supply Current (including associated AGND buffer) Power Low, Opamp Bias Power Low, Opamp Bias High Power Medium, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias Power High, Opamp Bias High PSRROA Supply Voltage Rejection Ratio (Vdd 2.25) (Vdd 1.25V) Vdd. 3.3.5 Power Comparator Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, 2.4V 3.0V -40°C 85°C, respectively. Typical parameters apply 25°C design guidance only. Table 3-9. Power Comparator Specifications Symbol Description Units Notes VREFLPC ISLPC VOSLPC power comparator (LPC) reference voltage range supply current voltage offset February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.6 Analog Output Buffer Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-10. Analog Output Buffer Specifications Symbol Description Units Notes VOSOB TCVOSOB VCMOB ROUTOB Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power Power High µV/°C VOHIGHOB High Output Voltage Swing (Load ohms Vdd/2) Power Power High VOLOWOB Output Voltage Swing (Load ohms Vdd/2) Power Power High ISOB Supply Current Including Bias Cell Load) Power Power High (0.5 1.3) VOUT (Vdd 2.3). PSRROB Supply Voltage Rejection Ratio Table 3-11. 3.3V Analog Output Buffer Specifications Symbol Description Units Notes VOSOB TCVOSOB VCMOB ROUTOB Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power Power High µV/°C VOHIGHOB High Output Voltage Swing (Load ohms Vdd/2) Power Power High VOLOWOB Output Voltage Swing (Load ohms Vdd/2) Power Power High ISOB Supply Current Including Bias Cell Load) Power Power High (0.5 1.0) VOUT (0.5 0.9). PSRROB Supply Voltage Rejection Ratio February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.7 Analog Reference Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. guaranteed specifications measured through Analog Continuous Time PSoC blocks. power levels AGND refer power Analog Continuous Time PSoC block. power levels RefHi RefLo refer Analog Reference Control register. limits stated AGND include offset error AGND buffer local Analog Continuous Time PSoC block. Reference control power high. Table 3-12. Analog Reference Specifications Symbol Description Units Bandgap Voltage Reference AGND Vdd/2a AGND BandGap 1.28 Vdd/2 0.04 0.048 1.30 Vdd/2 0.01 0.030 P2[4] 0.008 0.010 0.000 1.32 Vdd/2 0.007 0.024 P2[4] 0.011 0.016 0.018 0.034 AGND P2[4] (P2[4] AGND BandGapa Vdd/2)a P2[4] 0.011 0.009 AGND BandGap 0.022 -0.034 AGND Block Block Variation (AGND Vdd/2) RefHi Vdd/2 BandGap RefHi BandGap RefHi BandGap P2[6] (P2[6] 1.3V) RefHi P2[4] BandGap (P2[4] Vdd/2) Vdd/2 0.10 0.06 P2[6] 0.113 P2[4] 0.130 P2[4] P2[6] 0.133 0.112 Vdd/2 P2[6] 0.018 P2[4] 0.016 P2[4] P2[6] 0.016 Vdd/2 0.10 0.06 P2[6] 0.077 P2[4] 0.098 P2[4] P2[6]+ 0.100 0.076 RefHi P2[4] P2[6] (P2[4] Vdd/2, P2[6] 1.3V) RefHi BandGap RefLo Vdd/2 BandGap RefLo BandGap RefLo BandGap P2[6] (P2[6] 1.3V) RefLo P2[4] BandGap (P2[4] Vdd/2) RefLo P2[4]-P2[6] (P2[4] Vdd/2, P2[6] 1.3V) Vdd/2 0.04 0.06 P2[6] 0.084 P2[4] 0.056 P2[4] P2[6] 0.057 Vdd/2 0.024 P2[6] 0.025 P2[4] 0.026 P2[4] P2[6] 0.026 Vdd/2 0.04 0.06 P2[6] 0.134 P2[4] 0.107 P2[4] P2[6] 0.110 AGND tolerance includes offsets local buffer PSoC block. Bandgap voltage 1.3V 0.02V. Table 3-13. 3.3V Analog Reference Specifications Symbol Description Units Bandgap Voltage Reference AGND Vdd/2a AGND BandGapa AGND P2[4] (P2[4] Vdd/2) AGND BandGapa AGND BandGapa AGND Column Column Variation (AGND Vdd/2) RefHi Vdd/2 BandGap RefHi BandGap RefHi BandGap P2[6] (P2[6] 0.5V) RefHi P2[4] BandGap (P2[4] Vdd/2) RefHi P2[4] P2[6] (P2[4] Vdd/2, P2[6] 0.5V) RefHi BandGap RefLo Vdd/2 BandGap RefLo BandGap RefLo BandGap P2[6] (P2[6] 0.5V) RefLo P2[4] BandGap (P2[4] Vdd/2) RefLo P2[4]-P2[6] (P2[4] Vdd/2, P2[6] 0.5V) 1.28 Vdd/2 0.03 Allowed P2[4] 0.008 0.009 0.027 -0.034 Allowed Allowed Allowed Allowed P2[4] P2[6] 0.075 Allowed Allowed Allowed Allowed Allowed P2[4] P2[6] 0.048 1.30 Vdd/2 0.01 1.32 Vdd/2 0.005 P2[4] 0.001 0.005 0.010 0.000 P2[4] 0.009 0.015 0.018 0.034 P2[4] P2[6] 0.009 P2[4] P2[6] 0.057 P2[4]- P2[6] 0.022 P2[4] P2[6] 0.092 AGND tolerance includes offsets local buffer PSoC block. Bandgap voltage 1.3V 0.02V. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.8 Analog PSoC Block Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-14. Analog PSoC Block Specifications Symbol Description Units Notes Resistor Unit Value (Continuous Time) Capacitor Unit Value (Switched Capacitor) 12.2 3.3.9 Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Note bits PORLEV table below refer bits VLT_CR register. PSoC Mixed-Signal Array Technical Reference Manual more information VLT_CR register. Table 3-15. Specifications Symbol Description Units Notes Value PPOR Trip (positive ramp) VPPOR0R VPPOR1R VPPOR2R VPPOR0 VPPOR1 VPPOR2 VPH0 VPH1 VPH2 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 PORLEV[1:0] PORLEV[1:0] PORLEV[1:0] Value PPOR Trip (negative ramp) PORLEV[1:0] PORLEV[1:0] PORLEV[1:0] PPOR Hysteresis PORLEV[1:0] PORLEV[1:0] PORLEV[1:0] Value Trip VM[2:0] 000b VM[2:0] 001b VM[2:0] 010b VM[2:0] 011b VM[2:0] 100b VM[2:0] 101b VM[2:0] 110b VM[2:0] 111b 2.86 2.96 3.07 3.92 4.39 4.55 4.63 4.72 2.92 3.02 3.13 4.00 4.48 4.64 4.73 4.81 2.98a 3.08 3.20 4.08 4.57 4.74b 4.82 4.91 2.82 4.39 4.55 2.91 4.39 4.55 Always greater than above PPOR (PORLEV falling supply. Always greater than above PPOR (PORLEV falling supply. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.3.10 Programming Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-16. Programming Specifications Symbol Description Units Notes IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashENT FlashDR Supply Current During Programming Verify Input Voltage During Programming Verify Input High Voltage During Programming Verify Input Current when Applying Vilp P1[0] P1[1] During Programming Verify Input Current when Applying Vihp P1[0] P1[1] During Programming Verify Output Voltage During Programming Verify Output High Voltage During Programming Verify Flash Endurance (per block) Flash Endurance (total) Flash Data Retention 50,000 1,800,000 0.75 Years Erase/write cycles block. Erase/write cycles. Driving internal pull-down resistor. Driving internal pull-down resistor. maximum 50,000 block endurance cycles allowed. This balanced between operations 36x1 blocks 50,000 maximum cycles each, 36x2 blocks 25,000 maximum cycles each, 36x4 blocks 12,500 maximum cycles each limit total number cycles 36x50,000 that single block ever sees more than 50,000 cycles). full industrial range, user must employ temperature sensor user module (FlashTemp) feed result temperature argument before writing. Refer Flash APIs Application Note AN2015 http://www.cypress.com under Application Notes more information. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.1 Electrical Characteristics Chip-Level Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-17. Chip-Level Specifications Symbol Description Units Notes FIMO245V FIMO243V FIMOUSB5V FIMOUSB3V FCPU1 FCPU2 FBLK5 FBLK3 F32K1 Jitter32k Step24M Fout48M Jitter24M1 FMAX TRAMP Internal Main Oscillator Frequency (5V) Internal Main Oscillator Frequency (3.3V) Internal Main Oscillator Frequency with (5V) Frequency locking enabled traffic present. Internal Main Oscillator Frequency with (3.3V) Frequency locking enabled traffic present. Frequency Nominal) Frequency (3.3V Nominal) Digital PSoC Block Frequency Nominal) Digital PSoC Block Frequency (3.3V Nominal) Internal Speed Oscillator Frequency Period Jitter Trim Step Size Output Frequency Period Jitter (IMO) Peak-to-Peak Maximum frequency signal input output. Supply Ramp Time 23.04 22.08 23.94 23.94 0.93 0.93 46.08 48.0 24.96 Trimmed operation using factory trim values. Trimmed 3.3V operation using factory trim values. -10°C 85°C 4.35 5.15 -0°C 70°C 3.15 3.45 25.92b,c 24.06b 24.06b 24.96a,b 12.96 49.92a,b,d 25.92 Refer Digital Block Specifications. 49.92a,c Trimmed. Utilizing factory trim values. 12.96 4.75V 5.25V. Accuracy derived from Internal Main Oscillator with appropriate trim range. 3.0V 3.6V. Application Note AN2012 "Adjusting PSoC Microcontroller Trims Dual Voltage-Range Operation" information trimming operation 3.3V. individual user module data sheets information maximum frequencies user modules. Figure 3-2. Period Jitter (IMO) Timing Diagram Jitter24M1 F24M February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.2 General Purpose Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-18. GPIO Specifications Symbol Description Units Notes FGPIO TRiseF TFallF TRiseS TFallS GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload Fall Time, Normal Strong Mode, Cload Rise Time, Slow Strong Mode, Cload Fall Time, Slow Strong Mode, Cload Normal Strong Mode 5.25V, 5.25V, 5.25V, 5.25V, Figure 3-3. GPIO Timing Diagram GPIO TFallF 3.4.3 Full-Speed Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -10°C 85°C, 3.0V 3.6V -10°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-19. Full-Speed Mbps) Specifications Symbol Description Units Notes TRFS TFSS TRFMFS Transition Rise Time Transition Fall Time Rise/Fall Time Matching: (TR/TF) 0.25% load. load. load. TDRATEFS Full-Speed Data Rate 0.25% Mbps February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.4 Operational Amplifier Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Settling times, slew rates, gain bandwidth based Analog Continuous Time PSoC block. Power High Opamp Bias High supported 3.3V. Table 3-20. Operational Amplifier Specifications Symbol Description Units Notes TROA Rising Settling Time from 0.1% load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias High 0.72 0.62 TSOA Falling Settling Time from 0.1% load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias High 0.15 0.01 0.75 0.92 0.72 SRROA Rising Slew Rate (20% 80%)(10 load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias High V/µs V/µs V/µs V/µs V/µs V/µs nV/rt-Hz SRFOA Falling Slew Rate (20% 80%)(10 load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias High BWOA Gain Bandwidth Product Power Low, Opamp Bias Power Medium, Opamp Bias High Power High, Opamp Bias High ENOA Noise (Power Medium, Opamp Bias High) Table 3-21. 3.3V Operational Amplifier Specifications Symbol Description Units Notes TROA Rising Settling Time from 0.1% load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High 3.92 0.72 TSOA Falling Settling Time from 0.1% load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High 0.31 0.24 0.67 5.41 0.72 SRROA Rising Slew Rate (20% 80%)(10 load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High V/µs V/µs V/µs V/µs nV/rt-Hz SRFOA Falling Slew Rate (20% 80%)(10 load, Unity Gain) Power Low, Opamp Bias Power Medium, Opamp Bias High BWOA Gain Bandwidth Product Power Low, Opamp Bias Power Medium, Opamp Bias High ENOA Noise (Power Medium, Opamp Bias High) February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications When bypassed capacitor P2[4], noise analog ground signal distributed each block reduced factor dB). This frequencies above corner frequency defined on-chip 8.1k resistance external capacitor. Figure 3-4. Typical AGND Noise with P2[4] Bypass dBV/rtHz 10000 0.01 1000 0.001 0.01 Freq (kHz) frequencies, opamp noise proportional 1/f, power independent, determined device geometry. high frequencies, increased power level reduces noise spectrum level. Figure 3-5. Typical Opamp Noise nV/rtHz 10000 PH_BH PH_BL PM_BL PL_BL 1000 0.001 0.01 Freq (kHz) February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.5 Power Comparator Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, 2.4V 3.0V -40°C 85°C, respectively. Typical parameters apply 25°C design guidance only. Table 3-22. Power Comparator Specifications Symbol Description Units Notes overdrive comparator reference within VREFLPC. TRLPC response time 3.4.6 Digital Block Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-23. Digital Block Specifications Function Description Units Notes Timer Capture Pulse Width Maximum Frequency, Capture Maximum Frequency, With Capture 49.92 25.92 49.92 25.92 4.75V 5.25V. 4.75V 5.25V. Counter Enable Pulse Width Maximum Frequency, Enable Input Maximum Frequency, Enable Input Dead Band Kill Pulse Width: Asynchronous Restart Mode Synchronous Restart Mode Disable Mode Maximum Frequency 49.92 49.92 24.6 24.6 24.6 Maximum data rate 3.08 over clocking. Maximum data rate 3.08 over clocking. Maximum data rate over clocking. 4.75V 5.25V. 4.75V 5.25V. CRCPRS Maximum Input Clock Frequency (PRS Mode) CRCPRS Maximum Input Clock Frequency (CRC Mode) SPIM SPIS Maximum Input Clock Frequency Maximum Input Clock Frequency Width Negated Between Transmissions Transmitter Receiver Maximum Input Clock Frequency Maximum Input Clock Frequency minimum input pulse width based input synchronizers running nominal period). 3.4.7 External Clock Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-24. External Clock Specifications Symbol Description Units Notes FOSCEXT Frequency Applications Duty Cycle Power Switch 23.94 24.06 February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.8 Analog Output Buffer Specifications following tables list guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-25. Analog Output Buffer Specifications Symbol Description Units Notes TROB Rising Settling Time 0.1%, Step, 100pF Load Power Power High 0.65 0.65 0.65 0.65 TSOB Falling Settling Time 0.1%, Step, 100pF Load Power Power High SRROB Rising Slew Rate (20% 80%), Step, 100pF Load Power Power High V/µs V/µs V/µs V/µs SRFOB Falling Slew Rate (80% 20%), Step, 100pF Load Power Power High BWOBSS Small Signal Bandwidth, 20mVpp, 100pF Load Power Power High BWOBLS Large Signal Bandwidth, 1Vpp, 100pF Load Power Power High Table 3-26. 3.3V Analog Output Buffer Specifications Symbol Description Units Notes TROB Rising Settling Time 0.1%, Step, 100pF Load Power Power High TSOB Falling Settling Time 0.1%, Step, 100pF Load Power Power High SRROB Rising Slew Rate (20% 80%), Step, 100pF Load Power Power High V/µs V/µs V/µs V/µs SRFOB Falling Slew Rate (80% 20%), Step, 100pF Load Power Power High BWOBSS Small Signal Bandwidth, 20mVpp, 100pF Load Power Power High BWOBLS Large Signal Bandwidth, 1Vpp, 100pF Load Power Power High February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.9 Programming Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-27. Programming Specifications Symbol Description Units Notes TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK TDSCLK3 Rise Time SCLK Fall Time SCLK Data Time Falling Edge SCLK Data Hold Time from Falling Edge SCLK Frequency SCLK Flash Erase Time (Block) Flash Block Write Time Data Delay from Falling Edge SCLK Data Delay from Falling Edge SCLK February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Electrical Specifications 3.4.10 Specifications following table lists guaranteed maximum minimum specifications voltage temperature ranges: 4.75V 5.25V -40°C 85°C, 3.0V 3.6V -40°C 85°C, respectively. Typical parameters apply 3.3V 25°C design guidance only. Table 3-28. Characteristics Pins Standard Mode Symbol Description Fast Mode Units Notes FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C Clock Frequency Hold Time (repeated) START Condition. After this period, first clock pulse generated. Period Clock HIGH Period Clock Set-up Time Repeated START Condition Data Hold Time Data Set-up Time Set-up Time STOP Condition Free Time Between STOP START Condition Pulse Width spikes suppressed input filter. Fast-Mode I2C-bus device used Standard-Mode I2C-bus system, requirement tSU;DAT must then met. This will automatically case device does stretch period signal. such device does stretch period signal, must output next data line trmax tSU;DAT 1000 1250 (according Standard-Mode I2C-bus specification) before line released. Figure 3-6. Definition Timing Fast/Standard Mode TLOWI2C TSUDATI2C THDSTAI2C TSPI2C TBUFI2C THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C TSUSTOI2C February 2007 Document 38-12018 Rev. Feedback Packaging Information This chapter illustrates package specification CY8C24x94 PSoC devices, along with thermal impedance package solder reflow peak temperatures. Important Note Emulation tools require larger area target than chip's footprint. detailed description emulation tools' dimensions, refer document titled PSoC Emulator Dimensions Packaging Dimensions Figure 4-1. 56-Lead (8x8 001-12921 February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Packaging Information Figure 4-2. 68-Lead (8x8 0.89 51-85214 Important Note information preferred dimensions mounting packages, following Application Note Important Note Pinned vias thermal conduction required low-power PSoC device. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Packaging Information Figure 4-3. 100-Ball (6x6 VFBGA 51-85209 Figure 4-4. 100-Lead (14x14 TQFP 51-85048 February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Packaging Information Thermal Impedance Package Typical Table 4-1. Thermal Impedance Package QFN** QFN** VFBGA POWER 12.93 oC/W 13.05 oC/W oC/W achieve thermal impedance specified package, center thermal should soldered ground plane. Solder Reflow Peak Temperature Following minimum solder reflow peak temperature achieve good solderability. Table 4-2. Solder Reflow Peak Temperature Package Minimum Peak Temperature* Maximum Peak Temperature VFBGA 240oC 240oC 260oC 260oC 260oC *Higher temperatures required based solder melting point. Typical temperatures solder with Sn-Pb with Sn-Ag-Cu paste. Refer solder manufacturer specifications. February 2007 Document 38-12018 Rev. Feedback Development Tool Selection This chapter presents development tools available current PSoC device families including CY8C24x94 family. 5.1.1 Software PSoC Designer Development Kits development kits purchased from Cypress Online Store. core PSoC development software suite PSoC Designer. Utilized thousands PSoC developers, this robust software been facilitating PSoC designs half decade. PSoC Designer available free charge http:// www.cypress.com under DESIGN RESOURCES Software Drivers. 5.2.1 CY3215-DK Basic Development 5.1.2 PSoC Express CY3215-DK prototyping development with PSoC Designer. This supports in-circuit emulation software interface allows users run, halt, single step processor view content specific memory locations. Advance emulation features also supported through PSoC Designer. includes: PSoC Designer Software ICE-Cube In-Circuit Emulator Flex-Pod CY8C29x66 Family Cat-5 Adapter Mini-Eval Programming Board 240V Power Supply, Euro-Plug Adapter iMAGEcraft Compiler (Registration Required) ISSP Cable Cable Blue Cat-5 Cable CY8C29466-24PXI 28-PDIP Chip Samples newest addition PSoC development software suite, PSoC Express first visual embedded system design tool that allows user create entire PSoC project generate schematic, BOM, data sheet without writing single line code. Users work directly with application objects such LEDs, switches, sensors, fans. PSoC Express available free charge 5.1.3 PSoC Programmer Flexible enough used bench development, suitable factory programming, PSoC Programmer works either standalone programming application operate directly from PSoC Designer PSoC Express. PSoC Programmer software compatible with both PSoC ICE-Cube InCircuit Emulator PSoC MiniProg. PSoC programmer available free ofcharge 5.1.4 CY3202-C iMAGEcraft Compiler CY3202 optional upgrade PSoC Designer that enables iMAGEcraft compiler. purchased from Cypress Online Store. http://www.cypress.com, click Online Store shopping cart icon bottom page, click PSoC (Programmable System-on-Chip) view current list available items. February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Development Tool Selection 5.2.2 CY3210-ExpressDK PSoC Express Development 5.3.3 CY3214-PSoCEvalUSB CY3210-ExpressDK advanced prototyping development with PSoC Express (may used with ICE-Cube In-Circuit Emulator). provides access buses, voltage reference, switches, upgradeable modules more. includes: PSoC Express Software Express Development Board Modules Proto Modules MiniProg In-System Serial Programmer MiniEval Evaluation Board Jumper Wire Cable Serial Cable (DB9) 240V Power Supply, Euro-Plug Adapter CY8C24423A-24PXI 28-PDIP Chip Samples CY8C27443-24PXI 28-PDIP Chip Samples CY8C29466-24PXI 28-PDIP Chip Samples CY3214-PSoCEvalUSB evaluation features development board CY8C24794-24LFXI PSoC device. Special features board include both capacitive sensing development debugging support. This evaluation board also includes module, potentiometer, LEDs, enunciator plenty bread boarding space meet your evaluation needs. includes: PSoCEvalUSB Board Module MIniProg Programming Unit Mini Cable PSoC Designer Example Projects Getting Started Guide Wire Pack Device Programmers device programmers purchased from Cypress Online Store. 5.4.1 CY3216 Modular Programmer Evaluation Tools evaluation tools purchased from Cypress Online Store. CY3216 Modular Programmer features modular programmer MiniProg1 programming unit. modular programmer includes three programming module cards supports multiple Cypress products. includes: Modular Programmer Base Programming Module Cards MiniProg Programming Unit PSoC Designer Software Getting Started Guide Cable 5.3.1 CY3210-MiniProg1 CY3210-MiniProg1 allows user program PSoC devices MiniProg1 programming unit. MiniProg small, compact prototyping programmer that connects provided cable. includes: MiniProg Programming Unit MiniEval Socket Programming Evaluation Board 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample PSoC Designer Software Getting Started Guide Cable 5.4.2 CY3207ISSP In-System Serial Programmer (ISSP) 5.3.2 CY3210-PSoCEval1 CY3207ISSP production programmer. includes protection circuitry industrial case that more robust than MiniProg production-programming environment. Note: CY3207ISSP needs special software compatible with PSoC Programmer. includes: CY3207 Programmer Unit PSoC ISSP Software 240V Power Supply, Euro-Plug Adapter Cable CY3210-PSoCEval1 features evaluation board MiniProg1 programming unit. evaluation board includes module, potentiometer, LEDs, plenty breadboarding space meet your evaluation needs. includes: Evaluation Board with Module MiniProg Programming Unit 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample PSoC Designer Software Getting Started Guide Cable February 2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Development Tool Selection Accessories (Emulation Programming) Package Flex-Pod Kita Foot Kitb Adapterc Table 5-1. Emulation Programming Accessories Part CY8C24794 -24LFXI CY8C24894 -24LFXI CY325024X94QFN CY325024X94QFN CY325056QFN-FK CY325056QFN-FK AS-56-28 AS-28-28-02SS6ENG-GANG Flex-Pod includes practice flex-pod practice PCB, addition flex-pods. Foot includes surface mount feet that soldered target PCB. Programming adapter converts non-DIP package footprint. Specific details ordering information each adapters found http://www.emulation.com. 3rd-Party Tools Several tools have been specially designed following 3rd-party vendors accompany PSoC devices during development production. Specific details each these tools found http://www.cypress.com under DESIGN RESOURCES Evaluation Boards. Build PSoC Emulator into Your Board details emulate your circuit before going volume production using on-chip debug (OCD) non-production PSoC device, Application Note "Debugging Build PSoC Emulator into Your Board AN2323" http://www.cypress.com/ an2323. February 2007 Document 38-12018 Rev. Feedback Ordering Information following table lists CY8C24x94 PSoC device's package features ordering codes. Table 6-1. CY8C24x94 PSoC Device's Features Ordering Information Analog Outputs Analog Blocks Digital Pins Analog Inputs Digital Blocks Temperature Range (8x8 (8x8 (Tape Reel) (8x8 (8x8 (Tape Reel) (8x8 QFNa (8x8 (8x8 (Tape Reel) Ball (6x6 VFBGAa Ball (6x6 VFBGA TQFPa CY8C24794-24LFXI CY8C24794-24LFXIT CY8C24894-24LFXI CY8C24894-24LFXIT CY8C24094-24LFXI CY8C24994-24LFXI CY8C24994-24LFXIT CY8C24094-24BVXI CY8C24994-24BVXI CY8C24094-24AXI -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C -40C +85C This part used in-circuit debugging. available production. Ordering Code Definitions Package Type: Thermal Rating: PDIP Pb-Free Commercial SOIC Pb-Free Industrial SSOP Pb-Free Extended LFX/LKX Pb-Free TQFP Pb-Free VFBGA Pb-Free Speed: Part Number Family Code Technology Code: CMOS Marketing Code: Cypress PSoC Company Cypress xxx-SPxx February 2007 Document 38-12018 Rev. XRES Ordering Code Package Flash (Bytes) SRAM (Bytes) Feedback Sales Company Information obtain information about Cypress Semiconductor PSoC sales technical support, reference following information. Cypress Semiconductor Champion Court Jose, 95134 408.943.2600 Sites: Company Information http://www.cypress.com Sales Technical Support Revision History CY8C24094, CY8C24794, CY8C24894 CY8C24994 PSoC® Mixed-Signal Array Final Data Sheet Table 6-1. CY8C24x94 Data Sheet Revision History Document Title: Document Number: 38-12018 Revision Issue Date Origin Change Description Change 133189 251672 289742 335236 01.27.2004 silicon document Advance Data Sheet. First Preliminary Data Sheet. Changed title encompass only CY8C24794 because CY8C24494 CY8C24694 being offered Cypress MicroSystems. standard items from memo. Analog Input pinouts. MACs. Change bytes SRAM dimension package. Remove HAPI. Update diagrams, registers specs. logo. Update copyright. Update CY.com URLs. Re-add ISSP programming pinout notation. Reflow Temp. table. Update features (MAC, Oscillator, voltage range), registers (INT_CLR2/MSK2, second MAC), specs. (Rext, IMO, analog output buffer.). color logo. Expand analog arch. diagram. Update Electrical Specifications. temperature specifications. Make data sheet Final. Remove logo. preferred dimensions mounting packages. device, CY8C24894 56-pin with XRES pin. Fimousb3v char. specs. Upgrade Perform logo update corporate address copyright. ISSP note pinout tables. Update typical recommended Storage Temperature industrial specs. Update Output Level maximum budget. FLS_PR1 Register Bank users specify which Flash bank should used SROM operations. devices 68-pin 100-ball VFBGA under RPNs: CY8C24094 CY8C24994. packages 68-pin QFN. non-production pinouts package diagrams. Update branding convention. Dev. Tool section. Update copyright trademarks. Power Comparator (LPC) AC/DC electrical spec. tables. CY8C20x34 PSoC Device Characteristics table. detailed dimensions 56-pin package diagram update revision. Secure package diagram/manufacturing QFN. Update emulation pod/feet part numbers. pinout type-o TestTrack. CapSense requirement reference. Update figure standards. Update Technical Training paragraphs. package clarifications dimensions. Update ECN-ed Amkor dimensioned package diagram revisions. Reword reference. 56-pin spec. Posting: None 344318 346774 349566 393164 469243 561158 728238 Distribution: External/Public February 2007 Cypress Semiconductor 2004-2007 Document 38-12018 Rev. Feedback CY8C24094, CY8C24794, CY8C24894, CY8C24994 Final Data Sheet Sales Company Information Copyrights Code Protection Cypress Semiconductor Corporation. 2004-2007. rights reserved. PSoC DesignerTM, Programmable System-on-ChipTM, PSoC Expressare trademarks PSoC® registered trademark Cypress Semiconductor Corp. other trademarks registered trademarks referenced herein property respective corporations. information contained herein subject change without notice. Cypress Semiconductor assumes responsibility circuitry other than circuitry embodied Cypress Semiconductor product. does convey imply license under patent other rights. Cypress Semiconductor does authorize products critical components life-support systems where malfunction failure reasonably expected result significant injury user. inclusion Cypress Semiconductor products life-support systems application implies that manufacturer assumes risk such doing indemnifies Cypress Semiconductor against charges. Cypress Semiconductor products warranted intended used medical, life-support, life-saving, critical control safety applications, unless pursuant express written agreement with Cypress Semiconductor. Note following details Flash code protection features Cypress Semiconductor PSoC devices. Cypress Semiconductor products meet specifications contained their particular Cypress Semiconductor Data Sheets. Cypress Semiconductor believes that family products most secure families kind market today, regardless they used. There methods, unknown Cypress Semiconductor, that breach code protection features. these methods, knowledge, would dishonest possibly illegal. Neither Cypress Semiconductor other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable." Cypress Semiconductor willing work with customer concerned about integrity their code. Code protection constantly evolving. Cypress Semiconductor committed continuously improving code protection features products. February 2007 Document 38-12018 Rev. 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