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QUARTERLY ASIC RELIABILITY REPORT
This report contains reliability data following application-specific integrated circuit families fabricated assembled Japan BiCMOS-4/4A BiCMOS-5 ECL-2 ECL-3/3A/3B ECL-4/4A CMOS-3 CMOS-4 CMOS-5 CMOS-6 CMOS-6A/V/X CMOS-6S CMOS-7 CMOS-8 CMOS-8L CMOS-8LH CMOS-8LHD CMOS-9 CMOS-9HD CB-C7 CB-C8 CB-C9 CB-C9VX/VM QB-8/8E UC-II
Prepared checked Signature file Howell Electronics Inc. R&QC Department
Approved Signature file Muranaka Electronics Inc. R&QC Department
Please refer inquiries Electronics Inc. Reliability Quality Control Department 7501 Foothills Boulevard Roseville, 95747 Tel: (916) 786-3900
information this document subject change without notice. part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights, other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied, otherwise, granted under patents, copyrights, other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability, semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, antifailure features. devices classified into following three quality grades: "Standard," "Special," "Specific." Specific quality grade applies only devices developed based customer-designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment, industrial robots. Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anticrime systems, safety equipment, medical equipment (not specifically designed life support). Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life-support systems medical equipment life support, etc. quality grade devices Standard unless otherwise specified NEC's data sheets data books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Anti-radioactive design implemented this product.
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Contents
Japan Manufacturing
Page Failure Rate Prediction Philosophy Table Reliability Test Conditions Table Pretreatment Conditions T/H, T/C, Tests Table Life Test Summary Failure Rate Predictions Table Other Life Test Summaries (HTSL, HHSL, T/H) Table Environmental Mechanical Test Summaries (MS, T/C, PCT) Table Environmental Mechanical Test Summaries (LI, Table Failure Summaries Table CMOS-6 Process Family, Quarterly Reliability Data Table CMOS-6A/V/X Process Family, Quarterly Reliability Data Table CMOS-6S Process Family, Quarterly Reliability Data. Table CMOS-8 Process Family, Quarterly Reliability Data. Table CMOS-8L Process Family, Quarterly Reliability Data. Table CMOS-8LH Process Family, Quarterly Reliability Data Table CMOS-8LHD Process Family, Quarterly Reliability Data Table CMOS-9 Process Family, Quarterly Reliability Data Table CMOS-9HD Process Family, Quarterly Reliability Data. Table CB-C7 Process Family, Quarterly Reliability Data. Table CB-C8 Process Family, Quarterly Reliability Data. Table CB-C9VX/VM Process Family, Quarterly Reliability Data Table UC-II Process Family, Quarterly Reliability Data
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This report contains reliability test results ASIC products subjected routine Monitor Reliability Testing (MRT) NEC. products this report were fabricated assembled Japan representative NEC's manufacturing processes ASIC products. This report also contains failure rate predictions, which were calculated using Arrhenius method shown below.
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temperature contribution device's internal power dissipation significant enough that cannot ignored. Therefore, junction temperatures (Tj1 Tj2) used instead ambient temperatures (Ta1 Ta2). thermal resistance device (junction ambient) known, possible calculate junction temperatures follows: Where:
Failure Rate Prediction Philosophy
When predicting failure rate certain temperature from accelerated life test data, various values activation energy corresponding failure mechanisms should considered. This done whenever exact causes failures known performing failure analysis. some cases, however, average activation energy assumed order accomplish quick first-order approximation. case ASIC devices, assumes activation energy such approximations. This value been assessed from extensive reliability test results yields conservative failure rate. Since most semiconductor failures temperature dependent, Arrhenius relationship used normalize failure rate predictions system operation temperature 55°C. Arrhenius model includes effects temperature activation energy failure mechanisms. This model assumes that degradation performance parameter linear with time. temperature dependence taken exponential function that defines probability occurrence. Arrhenius equation high-temperature stress given following: A(T)
Thermal resistance
Power dissipation
With this information, therefore calculate temperature acceleration factor. Having predicted overall acceleration factor high-temperature operating life test, failure rate predicted confidence level using following equation:
Where:
Failure rate %/1000 hours
tabular value chi-squared
distribution given confidence level calculated degrees freedom where number failures) Number equivalent device hours (Number devices) (number test hours) (acceleration factor)
Where: A(T) Temperature acceleration factor Activation energy Junction temperature 55°C Junction temperature 125°C Boltzmann's constant 8.62 10-5 eV/K Exhibit Table:
value confidence level
1.83 4.61 4.04 7.78 6.21 10.6 8.35 13.4
C.L. C.L.
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Exhibit Table: Acceleration factor different with different activation energy (°C)/Tj1 (°C) 0.3eV 125/55 125/70 125/80 125/90 125/100 125/110 125/120 150/55 150/70 150/80 150/90 150/100 150/110 150/120 6.47 4.07 3.05 2.32 1.80 1.41 1.12 10.8 6.82 5.12 3.90 3.01 2.36 1.87 Acceleration Factor 0.5eV (Typ) 22.5 10.4 6.42 4.08 2.66 1.77 1.20 53.2 24.5 15.2 9.66 6.29 4.19 2.85 Example
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0.7eV 78.0 26.4 13.5 7.16 3.93 2.22 1.30 88.2 45.1 24.0 13.1 7.43 4.33
sample devices subjected 1000 hours 125°C burn-in volts. reject observed. Given that acceleration factor calculated 34.6 (using Equation what failure rate, normalized 55°C, using confidence level 60%? Express failure rate FIT. Solution 2(1) confidence level). Then,
4.04 (for
1000 hrs) 2(total device hrs)(accel factor)
(4.04) 0.0061 1000 2(960)(1000)(34.6)
Therefore, 1000
Another method expressing failures (failures time). equal failure hours. Since already expressed %/1000 hours (10-5 failure/hr), easy conversion from %/1000 hours would multiply value 109. conclusion, failure rate whole process family expressed follows: L(FIT)
Where summation taken reliability tests performed process family. Note: Some estimated rates higher than would expected small sample sizes; however, they expected lower reliability monitor data accumulated.
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Table Reliability Test Conditions
Japan Manufacturing
reliability tests performed consist high-temperature bias life (HTB), high-temperature storage life (HTSL), highhumidity storage life (HHSL), high-temperature, high-humidity life (T/H HHSL bias). Additionally, various environmental mechanical tests performed. table below shows conditions various life tests, environmental tests, mechanical tests.
Test Item High-temperature bias life
Symbol HTB1 HTB2
MIL-STD 883C Method 1005
Test Conditions 125°C 150°C max.
Remarks Note
High-temperature storage life
HTSL1 HTSL2 HTSL3 HTSL4
1008
150°C 175°C 200°C 250°C 85°C; 85%; max. Pretreatment specified Table any.
Note
High-temperature/highhumidity bias life
Note
High-humidity storage life Pressure cooker Temperature cycle Lead fatigue Solderability Soldering heat Temperature cycle Thermal shock Mechanical shock Vibration Constant acceleration Notes:
HHSL 1010 2004 2003 Note 1010 1011 2002 2007 2001
85°C; Pretreatment specified Table any. 125°C; Pretreatment specified Table any. -65°C 150°C Pretreatment specified Table any. bends; bends without breaking 230°C; sec; rosin base flux 260°C; sec; rosin base flux cyc; hr/cyc; -65°C 150°C cyc; min/cyc; 100°C 1500 msec; times axes) 10-2000 cycles axes) 20,000 sec; axes
Note Note Note Note Note
Note
Electrical test data sheet performed. Devices that exceed data sheet limits considered rejects. Broken lead considered reject. Less than coverage considered reject. MIL-STD-750A, Method 2031.
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Table Pretreatment Conditions T/H, T/C, Tests
Pretreatment Condition Temp Cycling (-65°C 150°C, cyc) Bake (125°C, hrs) Humidity Storage (30°C/70% days hrs) Temp Cycling Humidity Storage
Japan Manufacturing
Infrared Reflow (230°C Peak) Vapor Phase Soldering (215°C Peak) Bake (125°C, hrs) Bake (125°C, hrs) Bake (125°C, hrs) Bake (125°C, hrs) Lead Soldering (260°C, sec) Infrared Reflow (240°C Peak) time Infrared Reflow (240°C Peak) times Infrared Reflow (240°C Peak) times
(-65°C 150°C, cyc)
(85°C/85% hrs)
Bake time Storage time: Example
with pretreatment 207-2 cyc) Bake hrs) Humidity Storage (178 hrs) Reflow times)
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Table Life Test Summary Failure Rate Predictions
Japan Manufacturing
This section summarizes reliability test results processes extensively used most ASIC products. failure rate predictions based both 125°C 150°C high-temperature bias life test results. Failure rate predictions shown current period available data past periods cumulative data.
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 1.24106 2.74106 8.27105 2.02106 2.20106 1.92105 9.00104 4.80104 5.00104 4.80104 1.20105 1.36105 1.00104 Failures (Note Accel. Factor (Note 13.5 13.5 45.1 13.5 45.1 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 Equiv. Device Hours 1.67108 9.04106 9.79106 3.48107 3.30107 4.09107 1.42106 3.24106 1.26106 1.68107 4.67107 9.06107 Failure Rate 55°C Confidence Level (Note 0.0025%/1000 0.0101%/1000 0.0093%/1000 0.0026%/1000 0.0028%/1000 0.0022%/1000 Note Note Note 0.0055%/1000 0.0020%/1000 0.0034%/1000
BiCMOS-4 BiCMOS-4A BiCMOS-5 ECL-2 ECL-3 ECL-3A ECL-3B ECL-4 ECL-4A CMOS-3 CMOS-4 CMOS-5 D65626GK (80-pin TQFP) D65626GF (80-pin QFP) D65626GC (100-pin TQFP) D65626GF (100-pin QFP) D65630GA (48-pin TQFP D65636GF (100-pin QFP) D65640GC (100-pin D65641GJ (144-pin
88-Sep (cumulative) 89-Sep (cumulative) 89-Sep (cumulative) 88-Sep (cumulative) 88-Sep (cumulative) 88-Sep (cumulative) 89-Sep (cumulative) 89-Sep (cumulative) 89-Sep (cumulative) 88-Sep (cumulative) 88-Sep (cumulative) 88-Sep (cumulative) 94-Dec 97-Jun 93-Dec 97-Dec 90-Dec 90-Dec 97-Jun 97-Jun
125°C 150°C 125°C 125°C 125°C 150°C 150°C 125°C 150°C 125°C 125°C 125°C 125°C 125°C 150°C 125°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C
1726 1100 2358 1515 1516
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 4.80104 4.80104 4.80104 1.08105 1.60104 5.76105 2.40105 4.80104 2.40105 4.80104 4.00104 4.00104 5.40105 4.80104 1.76105 2.43106 5.36105 4.80104 8.00104 4.80104 3.36105 9.60104 4.16105 9.60104 8.00104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2 53.2 53.2 22.5 53.2 22.5 53.2 22.5 53.2 53.2 22.5 53.2 53.2 53.2 53.2 22.5 53.2 22.5 53.2 22.5 53.2 22.5 53.2 22.5
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
D65641GD (160-pin QFP) D65644GD (160-pin QFP) D65646GB (64-pin QFP) D65646GD (136-pin QFP) D65650GD (136-pin QFP) D65650GD (160-pin QFP) D65650GJ (144-pin D65652GD (208-pin D65654R (132-pin PGA) D65654GJ (144-pin D65654GD (160-pin QFP) D65655GD (160-pin QFP) D65655GD (208-pin CMOS-6A/V/X D65611GB (44-pin QFP) D65625GC (100-pin QFP) D65643GD (160-pin QFP) D65653GD (208-pin CMOS-6S D65650GD (160-pin D65650GJ (144-pin
95-Dec 95-Dec 90-Dec 90-Dec 90-Dec 95-Mar 98-Mar 96-Dec 90-Dec 98-Jun 90-Dec 95-Dec 93-Dec 90-Sep (cumulative) 95-Dec 99-Mar 96-Dec 98-Mar 95-Sep (cumulative) 98-Dec 98-Dec
150°C 150°C 150°C 150°C 125°C 150°C 125°C 150°C 125°C 150°C 150°C 125°C 150°C 150°C 150°C 150°C 125°C 150°C 125°C 150°C 125°C 150°C 125°C 150°C 125°C
1865
1.41108
0.00065%/1000
1.45107
0.00632%/1000
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 4.00104 8.00104 1.80105 9.60104 9.60104 8.00104 1.35105 2.81104 4.80104 2.0104 3.60104 9.40104 8.60104 2.88105 Failures (Note
Japan Manufacturing
Accel. Factor (Note 22.5 22.5 53.2 22.5 53.2 53.2 53.2 22.5 53.2 53.2 53.2 53.2 53.2 53.2
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
D65653GD (208-pin D65656GC (100-pin D65658R (132-pin PGA) D65658GC (100-pin D65658GC (100-pin TQFP) D65658GC (120-pin QFP) D65658GD (160-pin QFP) D65658GM (176-pin D65658GD (208-pin D65664GD (160-pin QFP) D65664R (176-pin PGA) D65664GD (208-pin D65664GD (208-pin L/F) D65664GJ (120-pin D65664GL (240-pin QFP) D65664GL (304-pin D65672R (176-pin PGA) D65672GL (304-pin D65672GJ (144-pin D65676GD (256-pin QFP, 0.4mm Pitch)
98-Dec 98-Dec 94-Dec 99-Mar 93-Dec 93-Dec 90-Mar 95-Dec 97-Jun 92-Mar 93-Dec 97-Jun 92-Dec
125°C 125°C 150°C 125°C 150°C 150°C 150°C 125°C 150°C 150°C 150°C 150°C 150°C 150°C
95-Dec 93-Dec 90-Dec 98-Jun 90-Dec 93-Dec
125°C 150°C 125°C 150°C 150°C 125°C 150°C 150°C
4.0104 1.44105 4.80104 4.80104 4.0104 8.0104 4.80104 4.00104
22.5 53.2 22.5 53.2 53.2 22.5 53.2 53.2
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 1.80105 9.00104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 22.5
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
D65676GM (160-pin D65676GN (184-pin QFP, L/F) D65676GL (304-pin L/F) D65676R (176-pin PGA) D65676R (364-pin PGA) D65676R (528-pin PGA) CMOS-6 (44-pin QFP) (160-pin QFP) (120-pin QFP) (120-pin QFP, DEVICE (64-pin QFP, DEVICE (64-pin QFP, DEVICE (304-pin QFP, DEVICE (144-pin DEVICE (144-pin QFP, DEVICE (100-pin DEVICE (208-pin DEVICE (208-pin QFP,
91-Dec 91-Dec
150°C 125°C
93-Dec
150°C
1.17105
53.2
90-Dec 90-Dec 90-Dec 90-Sep (cumulative) 91-Dec 91-Dec 92-Dec 92-Dec 91-Dec 92-Dec 92-Dec 92-Dec
150°C 125°C 125°C 125°C 150°C 125°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C
1178
9.60104 1.20105 3.00104 9.00104 1.936106 1.18106 4.80104 3.28105 2.40104 4.80104 4.80104 2.40104 1.60105 1.44105
53.2 22.5 22.5 22.5 53.2 22.5 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 1.30108 0.00071%/1000
93-Dec 93-Dec
150°C 150°C
1.50104 2.00104
53.2 53.2
94-Dec
150°C
2.64105
53.2
92-Dec
150°C
4.80104
53.2
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 2.88105 4.80104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
DEVICE (44-pin QFP, DEVICE (120-pin TQFP, DEVICE (44-pin QFP, DEVICE (100-pin QFP, DEVICE (144-pin LQFP, DEVICE (160-pin QFP) DEVICE (176-pin QFP) DEVICE (176-pin DEVICE (64-pin QFP) DEVICE (160-pin QFP) DEVICE (240-pin QFP, H/S) DEVICE (160-pin QFP) DEVICE (64-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (100-pin QFP) DEVICE QFP) DEVICE (240-pin QFP, HSP) DEVICE (64-pin QFP) DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP)
92-Dec 92-Dec
150°C 150°C
96-Dec 95-Dec 96-Dec
150°C 150°C 125°C 150°C
4.80104 4.80104 4.80104 2.16105
53.2 53.2 22.5 53.2
96-Dec 96-Dec 97-Jun 97-Jun 97-Jun 97-Dec 97-Nov 97-Dec 97-Nov
150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C
4.80104 4.80104 4.80104 4.80104 4.80104 1.68105 4.80104 1.92105 1.20105
53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2
98-Mar 98-Mar 98-Mar
150°C 150°C 150°C
1.50105 9.60104 2.10104
53.2 53.2 53.2
150°C 125°C 150°C 125°C
4.80104 9.60104 9.60104 4.80104
53.2 22.5 53.2 22.5
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Japan Manufacturing
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 3.51106 1.92105 9.60104 8.0104 1.76105 4.80104 4.80104 1.44105 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 22.5 22.5 22.5 22.5 22.5 53.2 53.2
Equiv. Device Hours 1.91108
CB-C7 CMOS-7 D67824 (208-pin QFP) D67874 (208-pin QFP) QB-8/8E D65800GF (80-pin QFP) D65801GD (208-pin QFP) D65801GD (208-pin LQFP) D65801GM (160-pin D65802GC (100-pin D65802GD (208-pin D65802GJ (144-pin QFP) D65802GJ (144-pin D65802GN (140-pin QFP) D65802R (132-pin PGA) D65803GM (160-pin LQFP) D65804GD (208-pin D65804GD (208-pin LQFP) D65804GN (240-pin LQFP) D65806GN (240-pin QFP) D65808GD (208-pin
91-Sep (cumulative) 98-Mar 98-Mar 98-Sep (cumulative) 94-Dec 94-Dec 96-Dec
150°C 125°C 125°C 125°C 125°C 125°C 150°C 150°C
2155
Failure Rate 55°C Confidence Level (Note 0.00048%/1000
3.96106
Note
97-Mar 96-Dec -Mar 94-Dec 94-Dec 94-Dec 94-Dec 97-Dec 98-Mar 97-Sep
150°C 125°C 150°C 125°C 150°C 150°C 125°C 150°C 150°C 125°C 125°C 125°C
3.84105 4.80104 4.80104 6.16105 4.80104 9.60104 4.80104 9.60104 4.80104 2.00104 4.00104 1.00104
53.2 22.5 53.2 22.5 53.2 53.2 22.5 53.2 53.2 22.5 22.5 22.5
97-Sep
125°C
1.00104
22.5
98-Mar 98-Mar
125°C 150°C 125°C
2.40105 4.00104 1.92105
22.5 53.2 22.5
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 2.40104 1.60105 1.09106 1.32106 5.00104 4.80104 3.12105 2.40104 2.80105 6.29104 4.80104 1.87105 3.36105 3.00104 1.64105 1.04105 4.80104 9.60104 5.52105 4.80104 2.40105 2.24104 2.39106 5.27105 4.80104 9.60104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2 53.2 22.5 53.2 53.2 53.2 22.5 53.2 22.5 53.2 53.2 22.5 53.2 53.2 22.5 53.2 53.2 53.2 53.2 53.2 53.2 53.2 22.5 22.5 53.2
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
D65810GD (160-pin D65810GD (208-pin CMOS-8 D65818GN (240-pin D65840GJ (144-pin D65841GC (100-pin D65843GJ (120-pin D65843GM (120-pin D65845GD (208-pin D65846GN (240-pin QFP) D65848GN (240-pin D65848S1 (256-pin PBGA) D65850GD (100-pin D65850GD (208-pin D65850GD (100-pin D65855GD (208-pin D65866GM (160-pin D65875GD (208-pin CMOS-8L D66343GM (160-pin D66355GD (208-pin
96-Dec 94-Dec 94-Sep (cumulative) 97-Sep 97-Jun 94-Dec 94-Dec 96-Dec 97-Mar 94-Dec 97-Sep -Sep 95-Dec 94-Dec 94-Dec 94-Dec 94-Dec 94-Dec 94-Sep (cumulative) 99-Mar 96-Dec
150°C 150°C 150°C 125°C 150°C 150°C 150°C 125°C 150°C 125°C 150°C 150°C 125°C 150°C 150°C 125°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 125°C 125°C 150°C
1311 1297 1707
8.77107
0.00104%/1000
1.39108
0.00066%/1000
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 9.60104 4.80104 6.00104 1.44105 4.93105 4.80104 6.00104 6.85105 1.92105 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 22.5 53.2 22.5 22.5 22.5 53.2 22.5 53.2
Equiv. Device Hours 6.19106
Failure Rate 55°C Confidence Level (Note Note
CMOS-8LH D8LHDGD (208-pin D66565GC (100-pin QFP) D66565GD (208-pin D66571S1 (256-pin PBGA) CMOS-8LHD (208-pin HSP) (208-pin HSP) (208-pin (208-pin (120-pin QFP) (208-pin (304-pin (208-pin (304-pin (304-pin DEVICE (100-pin TQFP) DEVICE (100-pin TQFP) DEVICE (208-pin DEVICE (304-pin
96-Sep (cumulative) 96-Oct 99-Mar 97-Mar -Sep 96-Sep (cumulative) 94-Dec
150°C 125°C 150°C 125°C 125°C 125°C 150°C 125°C 150°C
1.86107
0.00492%/1000
94-Dec
150°C
4.80104
53.2
95-Dec 95-Dec 95-Dec 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 95-Dec 95-Dec 95-Dec 95-Dec
150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C
4.80104 4.80104 4.80104 4.80104 4.80104 4.80104 4.80104 4.80104 4.00104 4.00104 4.80104 9.60104
53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 2.40104 2.40105 2.40105 4.80104 1.44105 2.40105 4.80104 2.40105 1.36105 8.00104 4.80104 2.40105 4.20104 2.40105 9.60104 2.88105 9.60104 1.92105 4.8104 4.8104 9.6104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2 22.5 22.5 22.5 22.5 22.5 22.5 22.5 22.5 22.5 22.5 53.2 22.5 22.5 22.5 22.5 22.5 22.5 22.5 22.5
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
DEVICE (144-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (176-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (100-pin DEVICE (208-pin DEVICE (225-pin PBGA)
96-Dec 96-Dec 97-Jun 97-Jun 97-Nov 97-Nov 97-Dec 97-Dec 97-Dec 97-Dec 98-Mar 98-Mar 98-Mar -Jun -Jun -Jun -Sep -Sep -Dec -Dec -Dec
150°C 150°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C 150°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C 125°C
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Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 4.8104 2.4104 1.36105 4.0104 4.80104 1.92105 4.80104 4.80104 4.80104 9.60104 1.39106 3.25106 2.40104 1.20104 4.80104 4.00104 4.00104 4.80104 2.40104 4.80104 4.80104 8.80104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 22.5 22.5 22.5 22.5 22.5 22.5 53.2 22.5 22.5 22.5 53.2 22.5 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2 53.2
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
DEVICE (208-pin DEVICE (208-pin (225-pin PBGA) (225-pin PBGA) DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (160-pin QFP) DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) CB-C8 (304-pin QFP) (304-pin QFP) DEVICE (208-pin QFP) DEVICE (160-pin QFP) DEVICE (160-pin QFP) DEVICE (160-pin QFP) DEVICE (208-pin QFP) (304-pin QFP) (304-pin QFP) (304-pin QFP)
-Dec -Dec 98-Mar 99-Mar 99-Mar 99-Mar 99-Jun 99-Jun 99-Jun 94-Sep (cumulative) 96-Jun 96-Jun 96-Jun 96-Jun 96-Jun 96-Dec 96-Dec 96-Dec 96-Dec 97-Jun
125°C 125°C 125°C 125°C 125°C 125°C 150°C 125°C 125°C 125°C 150°C 125°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C 150°C
3272
1.47108
0.00062%/1000
Electronics Inc.
Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 4.80104 2.40104 2.40104 2.40104 4.80104 2.40104 2.40104 4.50104 4.80104 2.40104 9.60104 6.09105 2.40105 4.80104 4.80104 4.80104 6.80104 4.80104 6.40104 2.40104 2.76105 7.20104 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2 22.5 22.5 53.2 53.2 22.5 53.2 22.5 22.5 22.5 53.2 22.5 22.5 53.2 53.2 53.2 53.2 53.2 22.5 53.2 22.5
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
(304-pin QFP) (160-pin QFP) (225-pin PBGA) (225-PIN PBGA) DEVICE (304-pin DEVICE (304-pin QFP) DEVICE (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (225-pin PBGA) DEVICE (272-pin PBGA) DEVICE (225-pin PBGA) CB-C9 D65906GD (208-PIN D65907GL (304-pin D65933 (304-pin QFP) D65933 (364-pin PGA) D65935GL (304-pin D65935 (696-pin TBGA) D65945GD (208-pin CMOS-9
97-Jun 97-Jun 97-Nov 97-Jun 97-Jun 97-Sep 98-Mar -Sep 96-Sep (cumulative) 98-Dec 96-Jun 97-Jun 96-Sep 96-Jun 98-Sep 98-Sep 96-Sep (cumulative)
150°C 150°C 125°C 125°C 150°C 150°C 125°C 150°C 125°C 125°C 125°C 150°C 125°C 125°C 150°C 150°C 150°C 150°C 150°C 125°C 150°C 125°C
3.78107
0.00242%/1000
1.63107
0.00561%/1000
Electronics Inc.
Table Life Test Summary (continued)
Process Type Process Period Ambient Temp. Number Devices Accum. Device Hours 1.44105 2.40104 4.80104 4.80104 4.80104 4.80104 4.80104 3.12105 9.60104 4.32105 8.80104 2.40104 9.40104 9.60104 5.20105 2.14105 4.56105 1.32105 5.88105 Failures (Note
Japan Manufacturing
Accel. Factor (Note 53.2 53.2 53.2 53.2 22.5 22.5 53.2 53.2 22.5 53.2 53.2 22.5 22.5 22.5 53.2 22.5 53.2 53.2 53.2
Equiv. Device Hours
Failure Rate 55°C Confidence Level (Note
(240-pin QFP) (240-pin QFP) (240-pin QFP) (208-pin QFP) D65943GM (160-pin QFP) D65946GD (208-pin D65958 (304-pin QFP) CMOS-9HD DEVICE (304-pin QFP) DEVICE (304-pin QFP) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) CB-C9VX/VM (208-pin QFP) (304-pin QFP) UC-II
98-Jun 98-Jun 98-Jun 99-Mar 99-Mar 98-Jun 98-Sep (cumulative) 98-Jun 98-Jun 98-Jun 98-Sep 98-Dec 98-Sep (cumulative) 98-Jun 98-Dec 98-Sep (cumulative)
150°C 150°C 150°C 150°C 125°C 125°C 150°C 150°C 125°C 150°C 150°C 125°C 125°C 125°C 150°C 125°C 150°C 150°C 150°C
1.88107
0.00488%/1000
3.25107
0.00282%/1000
3.13107
0.00293%/1000
Notes:
Details failures given Table acceleration factor calculated using Arrhenius mathematical model shown page derived from data available time periods (devices included this previous ASIC reports issued Electronics Japan-made devices). Some rates were calculated small sample sizes. these cases, rates would meaningful. expects rate less than ASIC device types (target exceed 150).
Electronics Inc.
Table Other Life Test Summaries (HTSL, HHSL, T/H)
Japan Manufacturing
This table summarizes reliability test results different process types during 150°C storage 85°C/85% storage bias tests. data summarized current period available data past periods cumulative data.
Process Type BiCMOS-4 BiCMOS-4A BiCMOS-5 ECL-2 ECL-3 ECL-3A ECL-3B ECL-4 ECL-4A CMOS-3 CMOS-4 CMOS-5 D65626GF (80-pin QFP) D65626GC (100-pin TQFP) D65630GA (48-pin TQFP D65636GF (100-pin QFP) D65640GC (100-pin D65644GD (160-pin QFP) D65646GB (64-pin TQFP) Process Period 88-Sep (cumulative) 89-Sep (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) 97-Jun 93-Dec 90-Dec 90-Dec 97-Jun 95-Dec 90-Dec96 1161 4682 3869 HTSL Failures Hours 1000 HHSL Failures Hours 1000 3349 1840 1372 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D65646GD (136-pin QFP) D65647GD (160-pin QFP) D65650GD (136-pin QFP) D65650GD (160-pin QFP) D65650GJ (144-pin D65654GD (160-pin QFP) D65654GJ (144-pin D65654R (132-pin PGA) D65655GD (160-pin QFP) D65655GD (208-pin CMOS-6A/V/X D65611GS (44-pin QFP) D65625GC (100-pin QFP) D65653GD (208-pin CMOS-6S D65650GD (160-pin D65650GJ (144-pin D65653GD (208-pin D65656GC (100-pin D65658R (132-pin PGA) D65658GC (100-pin D65658GC (100-pin TQFP) Process Period 90-Dec 93-Dec 90-Dec 95-Mar 97-Mar 90-Dec 98-Jun 90-Dec 95-Dec 93-Dec (cumulative) 95-Dec 99-Mar 98-Mar 95-Sep (cumulative) 98-Dec 98-Dec 98-Dec 98-Dec 94-Dec 93-Mar 93-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D65658GC (120-pin TQFP) D65658GD (160-pin QFP) D65658GD (176-pin D65664GD (160-pin QFP) D65664GD (208-pin D65664GD (208-pin L/F) D65664GD (208-pin LQFP) D65664GJ (120-pin D65664GL (304-pin D65664GM (160-pin D65664GM (160-pin LQFP D65664GN (240-pin D65664R (176-pin PGA) D65672GJ (144-pin HSP) D65672GL (304-pin D65676GD (208-pin LQFP) D65676GD (208-pin HSP) D65676GD (256-pin QFP, Pitch) D65676GL (304-pin L/F) D65676GL (304-pin HSP) Process Period 93-Dec 90-Dec 95-Dec 92-Dec 92-Jun 92-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
94-Dec 98-Jun 93-Dec 93-Dec 94-Dec 95-Dec 93-Dec 92-Dec
98-Sep 92-Dec 92-Dec
93-Dec
93-Dec
93-Dec
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D65676GM (160-pin LQFP) D65676GM (160-pin D65676GM (160-pin HSP) D65676GM (176-pin D65676GN (184-pin QFP, L/F) D65676GP (272-pin D65676R (176-pin PGA) D65676R (364-pin PGA) D65676R (528-pin PGA) CMOS-6 (44-pin QFP) (160-pin QFP) (120-pin QFP) (120-pin QFP, DEVICE (64-pin QFP, DEVICE (304-pin QFP, DEVICE (144-pin DEVICE (144-pin QFP, DEVICE (100-pin FP,HD) DEVICE (208-pin DEVICE (208-pin QFP, DEVICE (225-pin PBGA, Process Period 91-Dec 91-Dec 91-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
91-Dec 91-Dec
93-Dec 90-Dec 90-Dec 90-Dec (cumulative) 91-Dec 91-Dec 92-Dec 92-Dec 91-Dec 92-Dec 92-Dec
1921
93-Dec 93-Dec
94-Dec
92-Dec 94-Dec
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type DEVICE (144-pin LQFP FP,HD) DEVICE (120-pin TQFP, DEVICE (44-pin QFP, DEVICE (144-pin LQFP, DEVICE (160-pin QFP) DEVICE (176-pin QFP) DEVICE (176-pin DEVICE (64-pin QFP) DEVICE (160-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (64-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (100-pin QFP) DEVICE (64-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP) CB-C7 CMOS-7 Process Period 94-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
92-Dec 94-Dec 94-Dec 94-Dec 96-Dec 97-Jun 97-Jun 97-Jun 97-Dec 97-Dec 97-Nov 98-Mar 98-Mar 98-Mar 98-Jun 98-Dec 99-Mar 99-Mar 99-Jun 91-Sep (cumulative)
1035
1382
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D67824 (208-pin QFP) QB-8/8E D65800GF (80-pin QFP) D65801GD (208-pin QFP) D65801GM (160-pin D65801R (176-pin PGA) D65802GC (100-pin QFP) D65802GD (208-pin D65802GJ (144-pin D65802GL (304-pin QFP) D65802GN (240-pin QFP) D65804GD (208-pin D65806GN (240-pin QFP) D65808GD (208-pin D65810GL (304-pin D65810R (364-pin PGA) D65813GL (376-pin CMOS-8 D65840GJ (144-pin D65841GC (100-pin D65841GM (160-pin D65843GJ (144-pin Process Period 98-Mar 98-Sep (cumulative) 94-Dec 94-Dec 97-Mar 94-Dec 96-Dec 98-Mar 94-Dec 94-Dec 94-Dec 97-Mar 98-Mar 97-Mar 94-Dec 94-Dec 94-Dec 94-Sep (cumulative) 97-Sep 94-Dec 98-Sep 94-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D65843GJ (120-pin D65843GM (120-pin D65845GD (256-pin QFP) D65845GD (208-pin D65846GD (208-pin D65846GN (240-pin QFP) D65848GN (240-pin D65848S1 (256-pin PBGA) D65850GC (100-pin D65850GD (208-pin D65855GD (208-pin D65866GM (160-pin QFP) D65875GD (208-pin D65875NT (TCP) CMOS-8L D66343GM (160-pin D66355GD (208-pin CMOS-8LH D8LHDGD (208-pin D66565GC (100-pin QFP) D66565GD (208-pin D66571S1 (256-pin PBGA) Process Period 94-Dec 94-Dec 94-Dec 97-Mar 94-Dec 94-Sep 97-Sep 98-Mar 94-Dec 94-Dec 94-Dec 94-Dec 94-Dec 94-Dec 94-Sep (cumulative) 99-Mar 96-Dec 96-Sep (cumulative) 96-Oct 99-Mar 97-Mar 98-Sep HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type CMOS-8LHD (208-pin HSP) (208-pin HSP) (208-pin (120-pin QFP) (208-pin (208-pin QFP) (304-pin (304-pin DEVICE (100-pin TQFP) DEVICE (100-pin TQFP) DEVICE (208-pin DEVICE (304-pin DEVICE (144-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208 DEVICE (208-pin Process Period 96-Sep (cumulative) 94-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
94-Dec
95-Dec 95-Dec 96-Dec 96-Dec 96-Dec 96-Dec 95-Dec 95-Dec 95-Dec 95-Dec 96-Dec 96-Dec 96-Dec 97-Jun 97-Jun 97-Jun 97-Nov 97-Nov 97-Dec
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (176-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (208-pin (225-pin PBGA) (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (100-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (208-pin Process Period 97-Dec 97-Dec 97-Dec -Mar -Mar -Mar 98-Jun 98-Jun 98-Jun 98-Jun 98-Jun -Mar 98-Jun 98-Sep 98-Sep 98-Sep 98-Sep 98-Sep 98-Dec 98-Dec 98-Dec 98-Dec HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) CB-C8 (304-pin QFP) (304-pin (160-pin QFP) (225-pin PBGA) (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (208-pin CSP) DEVICE (160-pin QFP) DEVICE (208-pin QFP) DEVICE (304-pin DEVICE (304-pin QFP) Process Period 99-Mar 99-Mar 99-Mar 99-Mar 99-Mar 99-Mar 99-Jun 99-Jun 99-Jun 94-Sep (cumulative) 96-Dec 97-Jun 97-Jun 97-Nov 98-Jun 96-Jun 96-Jun 96-Jun 96-Dec 97-Jun 97-Jun 1851 HTSL Failures Hours 1000 HHSL Failures Hours 1000 1793 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type DEVICE (225-pin PBGA) DEVICE (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (208-pin QFP) DEVICE (225-pin PBGA) DEVICE (225-pin PBGA) DEVICE (208-pin QFP) DEVICE (225-pin PBGA) DEVICE (272-pin PBGA) DEVICE (208-pin QFP) DEVICE (225-pin PBGA) DEVICE (225-pin PBGA) CB-C9 D65906GD (208-pin D65907GL (304-pin D65909 (480-pin TBGA) D65933 (304-pin QFP) D56935GL (304-pin D65935N7 (696-pin TBGA) Process Period 97-Nov 97-Dec 97-Dec 98-Mar 98-Mar 98-Mar 98-Mar 98-Jun 98-Jun 98-Jun 98-Jun 98-Dec 98-Dec 98-Dec 96-Sep (cumulative) 98-Dec 96-Mar 98-Sep 97-Jun 96-Jun 98-Sep HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Other Life Test Summaries (HTSL, HHSL, T/H) (continued)
Process Type D65945GD (208-pin CMOS-9 (240-pin QFP) (208-pin QFP) D65943GM (160-pin QFP) D65945GD (208-pin D65946GD (208-pin D65958 (304-pin QFP) CMOS-9HD DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) DEVICE (256-pin TBGA) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) CB-C9VX/VM (208-pin QFP) UC-II Process Period 98-Sep 96-Sep (cumulative) 98-Jun 99-Mar 99-Mar 99-Mar 99-Mar 98-Jun 98-Sep (cumulative) 98-Jun 98-Sep 98-Sep 98-Dec (cumulative) 98-Sep (cumulative) HTSL Failures Hours 1000 HHSL Failures Hours 1000 Failures Hours 1000
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT)
This section summarizes environmental mechanical test results different process types. data summarized current period past periods cumulative data.
Process Type BiCMOS-4 BiCMOS-4A BiCMOS-5 ECL-3A ECL-3B ECL-4 ECL-4A CMOS-3 CMOS-4 CMOS-5 D65626GF (80-pin QFP) D65626GF (100-pin QFP) D65626GK (80-pin TQFP) D65626GC (100-pin TQFP) D65630GA (48-pin TQFP D65636GF (100-pin QFP) D65640GC (100-pin D65641GD (144-pin D65641GD (160-pin QFP) D65644GD (160-pin QFP) Process Period 88-Sep (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) 97-Jun 97-Dec 94-Jun 93-Dec 90-Dec 90-Dec 97-Jun 97-Jun 95-Dec 95-Dec Fail 4531 1090 3672 4546 Failures Cycles 3917 5479 5144 Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type D65646GB (64-pin TQFP) D65646GD (136-pin QFP) D65647GD (160-pin QFP) D65650GD (136-pin QFP) D65650GD (160-pin QFP) D65650GJ (144-pin D65652GD (208-pin D65654GD (160-pin QFP) D65654GJ (144-pin D65654GM (144-pin D65654R (132-pin PGA) D65655GD (160-pin QFP) D65655GD (208-pin CMOS-6A/V/X D65611GS (44-pin QFP) D65625GC (100-pin QFP) D65643GD (160-pin QFP) D65653GD (208-pin CMOS-6S D65650GD (160-pin D65650GJ (144-pin D65653GD (208-pin Process Period 90-Dec 90-Dec 93-Dec 90-Dec 95-Mar 96-Dec 90-Dec 98-Jun 98-Jun 90-Dec 95-Dec 93-Dec (cumulative) 95-Dec 96-Dec 98-Mar (cumulative) Fail 1676 Failures Cycles 1167 Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type D65656GC (100-pin D65658R (132-pin PGA) D65658GC (100-pin D65658GC (100-pin TQFP) D65658GC (120-pin TQFP) D65658GD (160-pin QFP) D65658GD (176-pin D65658GD (208-pin D65664GD (160-pin QFP) D65664GD (208-pin D65664GD (208-pin L/F) D65664GD (208-pin LQFP) D65664GJ (120-pin D65664GL (304-pin D65664GM (160-pin D65664GM (160-pin LQFP D65664GN (240-pin QFP) D65672GJ (144-pin HSP) D65672GL (304-pin D65672R (176-pin PGA) D65676GD (256-pin QFP, pitch) D65676GD (208-pin HSP) D65676GD (208-pin LQFP) Process Period 94-Dec 93-Mar 93-Dec 93-Dec 90-Dec 95-Dec 97-Jun 92-Dec 92-Jun 92-Dec 94-Dec 98-Sep 93-Dec 93-Dec 94-Dec 95-Dec 92-Dec 98-Sep 90-Dec 93-Dec Fail Failures Cycles Failures Hours
92-Dec 92-Dec
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type D65676GL (304-pin D65676GL (304-pin L/F) D65676GL (304-pin HSP) D65676GM (160-pin D65676GM (160-pin HSP) D65676GM (176-pin D65676GM (160-pin LQFP) D65676GN (184-pin QFP, L/F) D65676R (176-pin PGA) D65676R (364-pin PGA) D65676R (528-pin PGA) D65676GP (272-pin CMOS-6 (44-pin QFP) (160-pin QFP) (20-pin QFP) (120-pin QFP, DEVICE (64-pin QFP, DEVICE (64-pin QFP, DEVICE (304-pin QFP, DEVICE (100-pin QFP, DEVICE (144-pin DEVICE (144-pin QFP, DEVICE (100-pin Process Period 93-Dec 93-Dec 93-Dec 91-Dec 91-Dec 91-Dec 91-Dec 91-Dec 90-Dec 90-Dec 90-Dec 93-Dec 90-Sep (cumulative) 91-Dec 91-Dec 92-Dec 92-Dec 91-Dec 92-Dec 92-Dec 92-Dec 92-Dec 93-Dec 93-Dec Fail 2450 Failures Cycles Failures Hours
2367
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type DEVICE (160-pin DEVICE (208-pin DEVICE (208-pin QFP, DEVICE (225-pin PBGA, DEVICE (144-pin LQFP DEVICE (44-pin QFP, DEVICE (120-pin TQFP, DEVICE (44-pin QFP, DEVICE (144-pin LQFP, DEVICE (160-pin QFP) DEVICE (176-pin QFP) DEVICE (176-pin DEVICE (64-pin QFP) DEVICE (160-pin QFP) DEVICE (240-pin QFP, H/S) DEVICE (64-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (100-pin QFP) DEVICE (64-pin QFP) DEVICE (240-pin QFP, HSP) DEVICE (64-pin QFP) DEVICE (160-pin Process Period 93-Dec 94-Dec 92-Dec 94-Dec 94-Dec 92-Dec 92-Dec 95-Dec 95-Dec 96-Dec 96-Dec 97-Jun 97-Jun 97-Jun 97-Dec 97-Dec 97-Nov 98-Mar 98-Mar 98-Mar 98-Dec Fail Failures Cycles Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP) CB-C7 CMOS-7 D67824 (208-pin QFP) D67831 (304-pin QFP) QB-8/8E D65800GF (80-pin QFP) D65801R (176-pin PGA) D65801GD (208-pin QFP) D65801GD (208-pin LQFP) D65801GM (160-pin D65802GC (100-pin QFP) D65802GD (208-pin D65802GJ (144-pin QFP) D65802GJ (144-pin D65802GN (240-pin QFP) D65802GL (304-pin QFP) D65803GM (160-pin LQFP) D65804GD (208-pin D65804GM (176-pin LQFP) D65806GN (240-pin QFP) Process Period 99-Mar 99-Mar 99-Jun 91-Sep (cumulative) 98-Mar 98-Mar 98-Sep (cumulative) 94-Dec 94-Dec 94-Dec 96-Dec 97-Mar 96-Dec 98-Mar 94-Dec 94-Dec 94-Dec 94-Dec 97-Dec 97-Mar 97-Sep 98-Mar Fail 2220 Failures Cycles 1778 Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type D65808GD (208-pin D65810GD (208-pin D65810R (364-pin PGA) D65813GL (376-pin CMOS-8 D65840GJ (144-pin D65841GC (100-pin D65841GJ (144 D65841GM (160-pin D65843GJ (120-pin D65843GM (120-pin D65845GD (256-pin QFP) D65845GD (208-pin D65846GD (208-pin QFP) D65846GN (240-pin QFP) D65848GN (240-pin D65848S1 (256-pin PBGA) D65850GD (208-pin D65850GC (100-pin D65851GD (208-pin complex
L/F)
Process Period 97-Mar 94-Dec 95-Dec 95-Dec 94-Sep (cumulative) 97-Sep 94-Dec 94-Dec 98-Sep 94-Dec 96-Dec 94-Dec 97-Mar 96-Dec 94-Sep 97-Sep 98-Sep 94-Dec 94-Dec 94-Dec
Fail 2067
Failures Cycles
1165
Failures Hours
D65855GD (208-pin D65860GJ (144-pin
94-Dec 98-Dec
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type D65866GM (160-pin D65875GD (208-pin D65875 (352-pin TBGA) D65875NT (TCP) D65895GL (304-pin QFP) CMOS-8L D66343GM (160-pin D66355GD (208-pin CMOS-8LH D8LHDGD (208-pin D66565GC (100-pin QFP) D66565GD (208-pin D66571S1 (256-pin PBGA) CMOS-8LHD (208-pin HSP) (208-pin HSP) (208-pin (208-pin (120-pin QFP) (208-pin (208-pin (304-pin (304-pin Process Period 94-Dec 94-Dec 98-Sep 94-Dec 97-Sep 94-Sep (cumulative) 96-Dec96 96-Sep (cumulative) 96-Oct 99-Mar 97-Mar 98-Sep 96-Sep (cumulative) 94-Dec 94-Dec 95-Dec 95-Dec 95-Dec 96-Dec 96-Dec 96-Dec 96-Dec Fail 1809 Failures Cycles 1243 Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type DEVICE (100-pin TQFP) DEVICE (100-pin TQFP) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (176-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin (225-pin PBGA) Process Period 95-Dec 95-Dec 95-Dec 96-Dec 97-Jun 97-Jun 97-Jun 97-Nov 97-Dec 97-Dec 97-Dec 97-Dec 98-Mar 98-Mar 98-Mar 98-Jun 98-Jun 98-Jun 98-Jun 98-Jun 98-Jun 98-Mar Fail Failures Cycles Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (100-pin DEVICE (208-pin DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) CB-C8 (304-pin QFP) (304-pin QFP) Process Period 98-Sep 98-Sep 98-Sep 98-Sep 98-Sep 94-Sep (cumulative) 96-Dec 96-Dec Fail 2632 Failures Cycles 1959 Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type (304-pin (304-pin QFP) (304-pin QFP) DEVICE (208-pin QFP) DEVICE (208-pin CSP) DEVICE (208-pin CSP) DEVICE (208-pin CSP) DEVICE (208-pin CSP) DEVICE (160-pin QFP) DEVICE (160-pin QFP) DEVICE (160-pin QFP) DEVICE (304-pin DEVICE (304-pin DEVICE (304-pin QFP) DEVICE (225-pin PBGA) DEVICE (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (225-pin PBGA) DEVICE (208-pin CSP) DEVICE (208 QFP) DEVICE (225-pin PBGA) DEVICE (225-pin PBGA) Process Period 97-Jun 97-Jun 97-Nov 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 96-Dec 97-Jun 97-Jun 97-Nov 97-Dec 97-Dec 98-Mar 98-Mar 98-Mar 98-Mar 98-Jun Fail Failures Cycles Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type DEVICE (208-pin QFP) DEVICE (225-pin PBGA) DEVICE (272-pin PBGA) DEVICE (208-pin QFP) DEVICE (225-pin PBGA) CB-C9 D65906GD (208-pin D65907GL (304-pin D65909 (480-pin TBGA) D65915GL (304-pin D65933 (304-pin QFP) D65935GL (304-pin D65935N7 (696-pin TBGA) D65945GD (208-pin CMOS-9 (240-pin QFP) (240-pin QFP) (240-pin QFP) (208-pin QFP) D65945GD (208-pin D65946GD (208-pin D65958 (304-pin QFP) Process Period 98-Jun 98-Jun 98-Jun 98-Dec 98-Dec 96-Sep (cumulative) 98-Dec 96-Mar 98-Sep 96-Jun 97-Jun 96-Jun 98-Sep 98-Sep 96-Sep (cumulative) 98-Jun 98-Jun 98-Jun 98-Jun Fail Failures Cycles Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (MS, T/C, PCT) (continued)
Process Type CMOS-9HD DEVICE (304-pin QFP) DEVICE (304-pin QFP) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) DEVICE (320-pin PBGA) DEVICE (256-pin TBGA) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) CB-C9VX/VM (208-pin QFP) (304-pin QFP) UC-II Process Period 98-Sep (cumulative) 98-Jun 98-Jun 98-Jun 98-Sep 98-Sep 98-Sep 98-Dec 98-Dec 98-Sep (cumulative) 98-Jun 98-Dec 98-Sep (cumulative) Fail Failures Cycles Failures Hours
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (LI,
This section summarizes environmental mechanical test results different process types. data summarized current period past periods cumulative data.
Process Type BiCMOS-4 BiCMOS-4A BiCMOS-5 ECL-3B ECL-4 CMOS-3 CMOS-4 CMOS-5 D65647GD (160-pin QFP) D65654R (132-pin PGA) CMOS-6A D65658R (132-pin PGA) D65664R (176-pin PGA) D65672R (176-pin PGA) D65676R (176-pin PGA) D65676R (176-pin PGA) D65676R (528-pin PGA) CMOS-6 (44-pin QFP) (160-pin QFP) Process Period (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) (cumulative) 93-Dec 90-Dec 90-Sep (cumulative) 94-Dec 93-Dec 90-Dec 90-Dec 90-Dec 90-Dec (cumulative) 91-Dec 91-Dec Fail Fail 1074 Fail
Electronics Inc.
Japan Manufacturing
Table Environmental Mechanical Test Summaries (LI, (continued)
Process Type (120-pin QFP) DEVICE (64-pin QFP, DEVICE (304-pin QFP, DEVICE (208-pin DEVICE (225-pin PBGA, DEVICE (144-pin LQFP DEVICE (44-pin QFP, DEVICE (120-pin TQFP, DEVICE (100-pin QFP, DEVICE (144-pin LQFP, CB-C7 CMOS-7 D65801R (176-pin PGA) CMOS-8 Process Period 92-Dec 91-Dec 92-Dec 94-Dec 94-Dec 94-Dec 92-Dec 92-Dec 95-Dec 95-Dec (cumulative) 94-Dec (cumulative) Fail Fail Fail
Note: Details failures given Table
Electronics Inc.
Table Failure Summaries
BiCMOS-4
Test Item Duration 1000 1000 1000 Period 89-Jun 88-Mar 90-Sep
Japan Manufacturing
Failure Description Functional Failure Functional Failure Functional Failure
CMOS-4
Test Item HTSL HTSL Duration 1000 Test 1000 1000 1000 Period 88-Mar 88-Mar 88-Mar 88-Mar 88-Mar 91-Sep 91-Sep 88-Sep 88-Mar 88-Sep 88-Sep 90-Sep Failure Description Functional Failure Failure Functional Failure Failure Failure Failure Functional Failure Functional Failure Functional Failure Functional Failure Failure Leakage Failure
CMOS-5
Test Item HTSL HTSL Duration 2000 1000 Test 2000 1000 1000 Period 88-Mar 90-Sep 88-Mar 88-Mar 88-Mar 89-Jun 88-Mar 89-Jun 89-Sep 90-Sep 91-Dec 89-Jun 90-Sep 90-Sep 91-Dec 90-Jun 89-Dec 89-Dec 91-Sep 89-Jun 89-Jun Failure Description Failure Failure Failure Functional Failure Failure Functional Failure Functional Failure Failure Failure Functional Failure Functional Failure Functional Failure Input Leakage Functional Failure Functional Failures Failure Functional Failure Failure Failure Failure Failure
Electronics Inc.
Table Failure Summaries (continued)
CMOS-6
Test Item HTSL Duration Period 91-Sep
Japan Manufacturing
Failure Description Failures
CMOS-7
Test Item HTSL Duration Period 93-Mar Failure Description Failure
CB-C8
Test Item Duration Period 96-Dec Failure Description Failure
Electronics Inc.
Japan Manufacturing
Table CMOS-6 Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-6 process family:
Failures (Hours) Device Type D65658GC (100-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65658GC (100-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Table CMOS-6A/V/X Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-6A/V/X process family:
Failures (Hours) Device Type D65650GD (160-pin QFP) D65650GJ (144-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65650GD (160-pin QFP) D65650GJ (144-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CMOS-6S Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-6S process family:
Failures (Hours) Device Type D65625GC (100-pin QFP) D65653GD (208-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65625GC (100-pin QFP) D65653GD (208-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Table CMOS-8 Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-8 process family:
Failures (Hours) Device Type D65801GM (160-pin D65802GD (208-pin D65806GN (240-pin QFP) D65808GD (208-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65801GM (160-pin D65802GD (208-pin D65806GN (240-pin QFP) D65808GD (208-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CMOS-8L Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-8L process family:
Failures (Hours) Device Type D65845GD (208-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65845GD (208-pin D65848S1 (256-pin PBGA) Time Period
Failures (Cycles)
Failures (Hours) 1000
Table CMOS-8LH Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-8LH process family:
Failures (Hours) Device Type D66343GM (160-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D66343GM (160-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Table CMOS-8LHD Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-8LHD process family:
Failures (Hours) Device Type D66565GD (208-pin D66565GC (100-pin QFP) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D66565GD (208-pin D66565GC (100-pin QFP) Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CMOS-9 Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-9 process family:
Failures (Hours) Device Type D65907GL (304-pin QFP) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type D65907GL (304-pin QFP) Time Period
Failures (Cycles)
Failures (Hours) 1000
Table CMOS-9HD Process Family, Quarterly Reliability Data (Jan
following device types package types covered CMOS-9HD process family:
Failures (Hours) Device Type (208-pin QFP) D65943GM (160-pin QFP) D65945GD (208-pin D65946GD (208-pin Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type (208-pin QFP) D65943GM (160-pin QFP) D65945GD (208-pin D65946GD (208-pin Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CB-C7 Process Family, Quarterly Reliability Data (Jan
following device types package types covered CB-C7 process family:
Failures (Hours) Device Type DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type DEVICE (64-pin QFP) DEVICE (160-pin DEVICE (64-pin QFP) Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CB-C8 Process Family, Quarterly Reliability Data (Jan
following device types package types covered CB-C8 process family:
Failures (Hours) Device Type DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type DEVICE (225-pin PBGA) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) DEVICE (208-pin DEVICE (208-pin DEVICE (208-pin DEVICE (160-pin QFP) Time Period
Failures (Cycles)
Failures (Hours) 1000
Electronics Inc.
Japan Manufacturing
Table CB-C9VX/VM Process Family, Quarterly Reliability Data (Jan
following device types package types covered CB-C9VX/VM process family:
Failures (Hours) Device Type DEVICE (272-pin PBGA) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type DEVICE (272-pin PBGA) DEVICE (272-pin PBGA) Time Period
Failures (Cycles)
Failures (Hours) 1000
Table UC-II Process Family, Quarterly Reliability Data (Oct
following device types package types covered UC-II process family:
Failures (Hours) Device Type (304-pin QFP) Time Period 1000 HTSL Failures (Hours) 1000
Failures (Hours) Device Type (304-pin QFP) Time Period
Failures (Cycles)
Failures (Hours) 1000
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