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Design manufacturing facilities meet international quality standards. Space, Avionic Military Projects, production screenings qualification compliant either with ESCC 9000 MIL-PRF-38535. Atmel fully DSCC qualified level (military) (space), effective December 1999. Qualification granted 0.18 CMOS technology based products. (Radiation Hardness Assurance) certification valid from October 2000. Atmel ESCC qualified MH1RT asic's according ESCC 2549000 (ESCC QML) begun certification qualification process ATC18RHA asic's.
Aerospace Products Quality Flows
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Quality Management System (QMS)
Space Quality Flow
Level (SLA) Compliant with Atmel Compliant with ESCC System Compliant with MIL-PRF-38535 System Screening compliant ESCC 9000 Screening compliant MIL-PRF-38535 QML-V Procurement specification ESCC Detail specification Level (SLB) Compliant with Atmel Screening equivalent ESCC 9000 Screening equivalent MIL-PRF-38535 QML-V Procurement specification Atmel Product Specification (PS)
Military Quality Flow
Level (MLA) Compliant with Atmel Compliant with MIL-PRF-38535 System Screening compliant MIL-PRF-38535 QML-Q Procurement specification Level (MLB) Compliant with Atmel Screening equivalent MIL-PRF-38535 QML-Q Procurement specification Atmel Product Specification (PS) Level (MLC) Compliant with Atmel Screening Atmel Military Temperature Range flow Procurement specification Atmel Datasheet
Quality Flows
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Quality Flows
Table 2-1. Prototype Offering
Standard Product Reference Document Procurement specification Wafer Standard processes Tolerant processes Probe Go-no-go Assembly Package type Test Test Go-no-go
Notes:
ASIC Design Review Document Multilayer
Datasheet Multilayer
Samples manufactured according engineering flow only. Wafers electrically tested room tem-
perature only, inspection performed during assembly, which means that these prototypes suitable kind qualification flight use. Atmel denies right will accept responsibility prototypes used outside stated conditions cannot provide device failure analysis event such issues occurring.
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Space Projects
These flows apply devices built with Radiation Tolerant Radiation Hardened wafer fabrication processes.
Table 2-2.
Space Projects
Compliance QML-Q flow
Atmel QML-V flow
SMD(
ESCC flow
Detail Spec
ESCC flow
Detail Spec
Atmel
Atmel Product Spec
Reference Document
MIL-PRF 38535 ESCC 9000 Procurement specification Atmel Product Spec
Traceability
Process traceability traceability Part traceability
Wafer
Radiation Tolerant process Process monitoring review Probe Go-no-go
Assembly
Package type Multilayer Multilayer Multilayer Multilayer Multilayer Multilayer
inspection
MIL-STD 2010 cond MIL-STD 2010 cond ESCC 2049000
Acceptance -Sem -Wafer acceptance -Precap
ESCC 21400 MIL-STD TM2018
MIL-STD TM1008 MIL-STD TM1010 Cond MIL-STD TM2001 Cond MIL-STD TM2020 Cond
High temperature stabilization bake Thermal Cycling Constant acceleration Pind Test
Quality Flows
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Quality Flows
Table 2-2. Space Projects
Compliance
MIL-STD TM1014 cond MIL-STD TM1014 Cond
Atmel
QML-V flow
ESCC flow
QML-Q flow
ESCC flow
Atmel
Fine leak Gross leak Serialisation
MIL-STD TM2012
Test
Test 25°C go-nogo Test 25°C with record Burn-in 125° 160h, +10% Burn-in 125° 240h, +10%(7) Test -55, 125° go-nogo Test 25°C with record drift Test -55°C, +125°C with record Fine leak Gross leak MIL-STD TM1014 cond MIL-STD TM1014 Cond MIL-STD TM2009 ESCC 2059000 MIL-STD TM1015 MIL-STD TM1015 -(20) -(20
qualification
electrical test (10) assembly test (11) life test package test Radiation test (10, MIL-STD 1019 ESCC 22900 MI-PRF 38535 ESCC 9000 0/116 (12) (10) 0/45 (14) 0/53 (14)
0/116 (12) 0/4(10) 0/45 (14) 0/53 (14)
0/116 (12) 0/4(10) 0/45 (10,
(10, 0/15(10, 0/30
(10,
(14, 0/15 (14) 0/30
0/116 (12) (10) 0/45 (10,
0/53
(14)
0/53 (14) 0/22
0/22
0/22
0/22
delivery (18,
Certificate Conformity Data package
Note:
Alternative methods could introduced after Space Agencies approval, Customer will notified ESCC qualified products according ESCC 2549000 ASIC devices, dedicated procurement specification ((AID Asic Sheet) approved latest Prototypes Approval
4288D-AERO-06/08
Wafer Acceptance includes Wafer thickness, Metallization thickness, SEM, Glassivation thickness, (charge oxide), Parametric tests Review radiation test report applicable. Precap carried Atmel Quality representative Fine leak done with `fixed' method, according MIL-STD TM1014 Alternative temperature time combinations MIL-STD method 1015 permissible Rejects room temperature taken account. Limit with functional Rejects three temperatures taken account. Limit 10.lot test solderability test, lead packages, lead untested avoid bridging during testt 12.Alternative method introduced according MIL-STD 5005 13.If required Purchase Order 14.Periodic test 15.Solderability performed parts. 16.Test performed with parts 1000 hours parts during 2000 hours 125°C.For less than equal parts, number devices shall greater lot, results (from previous months) shall supplement devices result sample parts. ASIC, sample fixed parts with balance being made SEC. 17.Alternative temperature time combinations MIL-STD method 1005 permissible 18.Parts packing compliant with ESCC 20600 19.Parts held period exceeding months re-screening minimum versus Mil-M-38510
Quality Flows
4288D-AERO-06/08
Quality Flows
Military Projects
These flows apply devices built with standard fabrication processes. Table 2-3. Military Projects
Compliance Reference Document
MIL-PRF 38535 Procurement specification Atmel Product Spec Datasheet
Atmel
QML-Q flow
Traceability
Process traceability traceability Part traceability
Wafer
Standard processes Process monitoring review Probe Go-no-go
Assembly
Package type inspection Atmel spec MIL-STD TM2010 Cond Thermal Cycling Constant acceleration Pind Test Fine leak
Multilayer
Multilayer
Multilayer Seal glass
0.4%
MIL-STD TM1010 Cond MIL-STD TM2001 Cond MIL-STD TM2020 Cond MIL-STD TM1014 cond MIL-STD TM1014 Cond
Gross leak
Test
Test 25°C Go-no-go Burn-in 125° 160h, +10% Test 25°C Go-no-go Test -55°C, +125°C Go-no-go Fine leak Gross leak MIL-STD TM1014 Cond MIL-STD TM1014 Cond MIL-STD TM2009
MIL-STD TM1015
qualification
electrical test assembly test life test
0/116 MIL-PRF 38535 0/45 0/53
0/116 0/45 0/53
package test
Delivery
Certificate Conformity
4288D-AERO-06/08
Note:
Alternative methods could introduced after DSCC Agency approval, Customer will notified ASIC devices, dedicated approved latest Prototypes Approval Fine leak done with `fixed' method, according MIL-STD TM1014 Alternative temperature time combinaisons MIL-STD method 1015 permissible test Alternative method introduced according MIL-STD 5005 Periodic test solderability test, lead packages, lead untested avoid bridging during test Parts held period exceeding months re-screening minimum versus Mil-M-38510
Document Revision History
06/08
Update compliance with Mil-Prf 38535 Correction flow: Test three temperatures added.
Quality Flows
4288D-AERO-06/08
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