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AN915
Microwire EEPROM Migration
Author: Dietz Microchip Technology Inc.
WRITE CYCLE TIME
Write cycle time also specification system designers. Many these specifications remained same recommended migration paths, some improved. Differences between families noted Table
INTRODUCTION
Microchip Technology recently introduced family Microwire serial EEPROMs with smaller packaging, faster write times, faster speeds. addition this migration document, recommend that review data sheets each device these changes apply your system requirements. This document intended assist customers with migrating latest Microchip Technology Microwire EEPROMs from older versions products. This document addresses migration 93XX46, 93XX56, 93XX66 devices with selectable 93XX46C, 93XX56C, 93XX66C components, respectively. There topics addressed throughout this text: Speed Compatibility Write Cycle Time Write Cycle Initiation Ready/Busy Operations Noise Immunity Packaging Options
TABLE
Part Number 93CX6 93AAX6 93LCX6
WRITE CYCLE TIME DIFFERENCES
Spec. (Maximum) Part Number 93CX6C 93AAX6C 93LCX6C Spec. (Maximum)
INITIATING WRITE CYCLES
Depending migration path taken, write cycle initiation have also changed. Almost methodologies remained same. However, those that change were limited 93CX6 devices when migrating 93CX6C Family. older devices, 93CX6, write cycle initiated after last data bit. newer devices, write cycle initiates rising edge last data clock. latest waveform shown Figure timing characteristics each symbol found respective data sheets. This change does effect 93AAX6 93LCX6 devices.
FIGURE
RECOMMENDED MIGRATION PATHS
93AAX6C 93LCX6C 93CX6C
93AAX6 93LCX6 93CX6 Kbit 93XX46C Kbit 93X56C Kbit 93XX66C
SPEED COMPATIBILITY
When power supply applied chip below Volts, 93LCX6C devices opposed speed 93LCX6 devices.
2004 Microchip Technology Inc.
DS00915A-page
AN915
FIGURE
93CX6C WRITE CYCLE TIMING
TCSL
READY
HIGH-Z
BUSY
HIGH-Z
READY/BUSY OPERATIONS
Ready/Busy signals have also changed between older newer devices. Microwire EEPROMs three different methods observe Ready/Busy operations. These three methods summarized follows: Chip Select must cycled from low-tohigh prior completion write cycle order observe Ready/Busy transitions. Ready/Busy signal remains high device under test until next Start bit, once this waveform realized. Chip Select must cycled from high-tolow-to-high prior completion write cycle order observe Ready/ Busy transitions. Ready/Busy signal remains high device under test until next Start bit, once this waveform realized. Chip Select must cycled from low-tohigh prior completion write cycle order observe Ready/Busy transitions. Ready/Busy signal remains high-impedance state device under test until next Start bit, once this waveform realized. This property enables designers data-in data-out pins together circuit. Table shows Ready/Busy polling method each device. Ready/Busy operations 93CX6C devices shown Figure Ready/Busy operations 93AAX6C/93LCX6C devices shown Figure These diagrams also provided within respective EEPROM data sheets.
TABLE
READY BUSY OPERATIONAL CHANGES
Ready/ Busy Method Part Number 93CX6C 93AAX6C 93LCX6C Ready/ Busy Method
Part Number 93CX6 93AAX6 93LCX6
DS00915A-page
2004 Microchip Technology Inc.
AN915
FIGURE
93AAX6C/93LCX6C WRITE CYCLE TIMING
TCSL
READY HIGH-Z
HIGH-Z
BUSY
NOISE IMMUNITY
Circuitry been implemented 93XXX6C devices improve noise spike rejection. circuit been added each input CLK.
PACKAGING OPTIONS
With release latest Microwire EEPROMs, Microchip Technology introduced ORGenabled devices small enough into MSOP TSSOP packaging, which translates more memory smaller places. These packages have small footprints only height. sure check individual data sheets specific package dimensions marking information. packages that were previously available 93XX46, 93XX56 93XX66 devices still available 93XX46C, 93XX56C 93XX66C components.
DATA SHEET INFORMATION
following table shows devices migrate from data sheet another accordance with Figure
TABLE
93AA46 93LC46 93C46 93AA56 93LC56 93C56 93AA66 93LC66 93C66
DATA SHEETS
DS20067 DS21712 DS11179 DS20067 DS21712 DS11156 DS20067 DS21712 DS11158 93AA46C 93LC46C 93C46C 93AA56C 93LC56C 93C56C 93AA66C 93LC66C 93C66C DS21749 DS21749 DS21749 DS21794 DS21794 DS21794 DS21795 DS21795 DS21795
2004 Microchip Technology Inc.
DS00915A-page
AN915
NOTES:
DS00915A-page
2004 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, MATE, PowerSmart rfPIC registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2004, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona Mountain View, California October 2003. Company's quality system processes procedures PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2004 Microchip Technology Inc.
DS00915A-page
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