ADE407-001H
|
|
|
Top Searches for this datasheet
upilex* - upilex*
stk4231-ll - stk4231-ll
sony lcd drivers - sony lcd drivers
Reliability Test Methods for Packaged Devices - Reliability Test Methods for Packaged Devices
Matrix Crystal - Matrix Crystal
marking code V6 surface mount diode - marking code V6 surface mount diode
marking code V6 33 surface mount diode - marking code V6 33 surface mount diode
lcd driver 1992 tape - lcd driver 1992 tape
lcd cross reference - lcd cross reference
induction cooker - induction cooker
IC 452 in pqc - IC 452 in pqc
hitachi lcdc timing controller - hitachi lcdc timing controller
Hitachi LCD Part Numbering - Hitachi LCD Part Numbering
HITACHI HD44780 DOT MATRIX LCD MODULE - HITACHI HD44780 DOT MATRIX LCD MODULE
HD66206TE - HD66206TE
HD66206 - HD66206
HD64646F - HD64646F
hd64646 - hd64646
HD61830A00* - HD61830A00*
HD61202 - HD61202
display graphic hitachi - display graphic hitachi
data sheet IC 7432 - data sheet IC 7432
color led controller driver - color led controller driver
Capacitive touch screens - Capacitive touch screens
8 x 8 DOT MATRIX DISPLAY driver - 8 x 8 DOT MATRIX DISPLAY driver
7433 7-segment - 7433 7-segment
7 segment 7433 - 7 segment 7433
1.00 INCH 7 SEGMENT LIQUID CRYSTAL DISPLAY - 1.00 INCH 7 SEGMENT LIQUID CRYSTAL DISPLAY
ADE407-001H - ADE407-001H
Hitachi Controller/Driver
ADE407-001H 8/98 Hitachi Ltd. MC-Setsu
GENERAL INFORMATION
Quick Reference Guide. Type Number Order Selection Guide. Differences Between Products Package Information Notes Mounting Information TCP. Chip Shipment Products Reliability Quality Assurance Reliability Test Data Drivers. Flat Plastic Package (QFP) Mounting Methods. Liquid Crystal Driving Methods.
DATA SHEET
Driver HD66100F Driver with 80-Channel Outputs. HD66002 80-Channel General-purpose Driver Middle- Small-sized Liquid Crystal Panel. HD66206 80-Channel Column/Common Driver Middle- Large-sized Liquid Crystal Panel. Character Display Controller/Driver HD44780U (LCD-II) Matrix Liquid Crystal Display Controller/Driver. HD66701 Matrix Liquid Crystal Display Controller/Driver. HD66702 Matrix Liquid Crystal Display Controller/Driver. HD66705U Power Matrix Liquid Crystal Display Controller/Driver HD66710 Matrix Liquid Crystal Display Controller/Driver. HD66712U Matrix Liquid Crystal Display Controller/Driver. HD66717 Power Matrix Liquid Crystal Display Controller/Driver HD66720 Panel Controller/Driver Matrix Liquid Crystal Display with Scan Function HD66724 Matrix Liquid Crystal Display Controller/Driver with Scan Function HD66725 Matrix Liquid Crystal Display Controller/Driver with Scan Function HD66726 Matrix Graphics Liquid Crystal Display Controller/Driver with Scan Function HD66727 Power Matrix Liquid Crystal Display Controller/Driver with Scan Function HD66728 Matrix Graphics Liquid Crystal Display Controller/Driver with Scan Function HD66730 Matrix Liquid Crystal Display Controller/ Driver Supporting Japanese Kanji Display.
Matrix Liquid Crystal Display Controller/Driver Supporting Japanese Kanji Display HD66732 Matrix Liquid Crystal Display Controller/Driver Supporting Japanese Kanji Display Graphic Display Driver Small System HD61202U Matrix Liquid Crystal Graphic Display Column Driver. HD61203U Matrix Liquid Crystal Graphic Display 64-Channel Common Driver. HD66108 RAM-Provided 165-Channel Driver Liquid Crystal Matrix Graphics. HD66410 RAM-Provided 128-Channel Driver Matrix Graphic HD66420 RAM-Provided 160-Channel Driver Matrix Graphic HD66503 240-Channel Common Driver with Internal Timing Circuit HD66520T 160-Channel 4-Level Grayscale Display Column Driver with Internal Bit-Map 1014 HD66522 160-Channel Column Driver with Internal Bit-Map Reflective Color Display Grayscale Display. 1059 HD66523R 240-Channel Common Driver with Internal Timing Circuit 1102 Graphic Display Driver (Positive Power Supply Type) HD66110ST Column Driver 1121 HD66112T 160-Channel Segment Driver Matrix Graphic Liquid Crystal Display (Super-Slim TCP). 1138 HD66113T 120-Channel Common Driver Packaged Slim Tape Carrier Package 1155 HD66115T 160-Channel Common Driver Packaged Slim Tape Carrier Package 1172 HD66120T 240-Channel Segment Driver Matrix Graphic Liquid Crystal Display. 1189 HD66130T 320-Channel HI-FAS Segment Driver Matrix Graphic Display 0000 HD66131ST 240-Channel HI-FAS Common Driver Matrix Graphic Display 0000 HD66132T 240-Channel HI-FAS Segment Driver Matrix Graphic Display. 1205 HD66133T 120-Channel HI-FAS Common Driver Matrix Graphic Display 1221 HD66134ST 240-Channel HI-FAS Segment Driver Matrix Graphic Display 0000 HD66135T 120-Channel HI-FAS Common Driver Matrix Graphic Display 0000
HD66731
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package Extension Driver HD66100F +75* Static 1/16 FP-100 FP-100B HD66002 Latch: Shift: 1/16 1/128 FP-100A TFP-100B HD66206 (80) 1/64 1/240 TFP-100B
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz)
Column Driver HD66110ST +75* 5.5V 5.5V HD66112T HD66120T HD66130T HD66132T HD66134T
Recommend duty Package
1/100 1/480 1/100 1/480 1/100 1/480 1/240 SLIM-TCP Bump SLIM-TCP Bump SLIM-TCP
1/100 1/300 1/100 1/300 H1-FAS SLIM-TCP SLIM-TCP
Note: +80°C (special request). Please contact Hitachi agents.
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Column Driver (within RAM) HD61202U +75* 1/32 1/64 HD66108 0.26 +75* 0-65 100-165 1/32, 1/34, 1/36, 1/48, 1/50, 1/64, 1/66 Bump HD66410 HD66420 +85* HD66520T HD66522 +85*
0.02 1/17 1/33 1/8, 1/32, 1/64, 1/80
1/64 1/240 1/64 1/240
Package
FP-100A TFP-100B
Bump
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
Column Driver HD66321 HD66322T HD66324T HD66326T HD66330T SLIM-TCP
Note: +80°C (special request). Please contact Hitachi agents.
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package Common Driver
HD66523R HD61203U HD66503 21.5 0.08 HD66113T HD66115T 1/100 1/480 SLIM-TCP HD66131ST HD66133T 1/100 1/240 1/100 1/300 Bump HD66135T 1/100 1/300 SLIM-TCP
+75* +75* 1/100 1/240
Master Slave 1/100 1/480 SLIM-TCP
1/48, 1/64, 1/120 1/96, 1/128 1/240 FP-100A TFP-100B Chip
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
Character Display Controller HD44780U (LCD-II) +75* 9920 1/8, 1/11, 1/16 FP-80B TFP-80F Chip HD66701 +75* 7200 1/8, 1/11, 1/16 Chip HD66702R +75* 7200 1/8, 1/11, 1/16 FP-144A Chip HD66705U 0.05 9600 HD66710 9600
0.35 1/10, 1/18 Bump 1/17, 1/33 FP-100A TFP-100B Chip
Note: +80°C (special request). Please contact Hitachi agents.
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) Character Display Controller HD60712U 9600 1/17, 1/33 FP-128 Chip HD66717 0.06 +75* 9600 0.35 1/10, 1/18 1/26, 1/34 Bump HD66720 0.17 9600 0.35 1/9, 1/17 FP-100A TFP-100B Chip HD66724/HD66725 +85* 20,736 0.032 1/2, 1/10, 1/18, 1/26 Bump HD66726 20,736 0.05 1/2, 1/10,1/18, 1/26, 1/34, 1/42 Bump
driver
Common Column
Instruction Operation frequency (MHz) Recommend duty Package
Type Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit)
Character Display Controller HD60727 0.06 9600 1/10, 1/18 1/26, 1/34 Bump HD66728 +85* 20,736 1,120 HD66730 +75* HD66731 +85* 0.55 1/14, 1/27 1/40, 1/53 1/2, 1/15, 1/28, 1/41, 1/54 Slim Chip HD66732 +85*
driver
Common Column
Instruction Operation frequency (MHz) Recommend duty
1/32, 1/40, 1/48, 1/14, 1/27, 1/56, 1/64, 1/72, 1/40, 1/53 1/80 Bump FP-128 Chip
Package
Note:
+80°C (special request). Please contact Hitachi agents.
Quick Reference Guide
Type Graphic Display Controller HD61830 LCDC 7360 Static-1/128 FP-60 HD61830B LCDC +75* 7360 Static-1/128 FP-60 HD64645F HD64646FS LCTC Static-1/512 FP-80 FP-80B HD66841FS LVIC 16/24 (841) Static-1/1024 FP-100A
Type Number Power supply internal circuits Power supply driver circuits Current consumption (mA) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
Note: +80°C (special request). Please contact Hitachi agents.
Type Number Order
Sorted Type Name
Type HD44780U HD61202U HD61203U HD61830 HD61830B HD64645 HD64646 HF66002 HD66100F HD66108 HD66110ST HD66112T HD66113T HF66115T HF66120T HD66130T HD66131ST HF66132T HF66133T HD66134ST HD66135T HD66206 HD66321T HD66322T HD66324T HD66326T HD66330T HD66410 HD66420 HD66503 HD66520T HD66522 HD66523R HD66701 HD66702 HD66705U HD66710 HD66712U HD66717 (LCDC) (LCDC) (LCDC) (LCDC) (LCD-II) Function controller/driver character) 64-channel column driver within 64-channel common driver controller serial driver controller serial driver controller paralel driver contorller paralel driver 80-channel driver 80-channel column driver 165-channel graphics driver within 160-channel column driver (VLCD=40V) 160-channel column driver (VLCD=40V) 120-channel common driver (VLCD=40V) 160-channel common driver (VLCD=40V) 240-channel column driver (VLCD=40V) 320-channel column driver 240-channel common driver 240-channel column driver (VLCD=5V) 120-channel common driver (VLCD=70V) 240-channel column driver 120-channel common driver 80-channel common/column driver 258-channel Gate driver Multiscan Functions 384-channel grayscale driver (VLCD=10V) 384-channel Grayscale driver 384-channel Grayscale driver Multiscan Functions 192-channel grayscale driver (VLCD=5V) graphics driver within graphics driver within 240-channel common driver 160-channel grayscale driver within 160-channel grayscale driver within 240-channel common driver within timing circuit controller/driver character) controller/driver character) controller/driver character) controller/driver character) controller/driver character) controller/driver character) power Page
Quick Reference Guide
Type HD66720 HD66724 HD66725 HD66726 HD66727 HD66728 HD66730 HD66731 HD66732 HD66841 (LVIC) Function controller/driver within keyscan function character) controller/driver with keyscan function character) controller/driver with keyscan function character) controller/driver with keyscan function character) controller/driver within keyscan function character) controller/driver character) controller/driver character) controller/driver character) Graphics controller/driver character Kanji) video interface controller grayscale control) Page
Selection Guide
Hitachi Driver System
controller/driver alpha-numeric display dot)
digit/ line line HD44780U HD66720 HD66720 HD66705U HD66730* (alpha-numeric) HD66712 HD66717 HD66727 HD66724 HD66731 HD44780U HD66720 HD66710 HD66702R (HD44780U HD66002) (HD44780U HD66002) HD66712U
HD66710
(HD66710 HD66002)
Note: HD66730 font dot.
Japanese Kanji, Chinese Korean font dot)
digit/ line line HD66730 HD66108 HD66410 HD66410 (HD61202U HD61203U) HD66410 HD66108 HD61203U HD66731 HD66730 HD66002 (HD61202U HD61203U) HD66108 HD66410 (HD66108 HD61203U)
Note: HD66730 font dot.
Selection Guide
Graphics Display
Horizon Vertical (HD61202U HD61203U) (HD61202U HD61203U) HD66410 HD66410 HD66420 (HD66108 HD61203U) (HD66520 HD66503) (HD66524 HD66523) (HD66520 HD66503) HD66108 HD61203U (HD61202U HD61203U) HD66410 HD66108 (HD66108 HD61203U) HD66420 (HD66520 HD66503) (HD66524 HD66523)
Horizon Black White Vertical HD66110ST HD66113T HD66110ST HD66115T HD66110ST HD66113T HD66120T HD66113T HD66120T HD66115T HD66120T HD66113T HD66110ST HD66113T HD66110ST HD66115T HD66110ST HD66113T HD66120T HD66113T HD66120T HD66115T HD66120T HD66113T HD66120T HD66115T HD66110ST HD66113T HD66110ST HD66115T HD66110ST HD66113T HD66110ST HD66115T HD66110ST HD66115T
Selection Guide
Horizon Color Vertical HD66120T HD66115T HD66120T HD66113T HD66120T HD66115T HD66120T HD66113T 1920 2400 1024 3072
Differences Between Products
HD61830 HD61830B
HD61830 Oscillator Operating frequency (MHz) Display duty Programmable screen size (max) Other Internal Static 1/128 dots (1/64 duty)
HD61830B External Static 1/128 dots (1/64 duty)
Package marking
HD61830A00
JAPAN
Type
HD61830B00
JAPAN
Type
Figure Package Marking
Differences Between Products
Differences between HD64645 HD64646
Figure Figure show relation between display data transfer period, when display data shift clock changes, display data latch clock CL1. Figure shows case without skew function Figure shows case with skew function. Figure high period between HD64645 overlap. HD64646 overlap like HD64645, except this overlap, HD64646 same HD64645 functionally. Also skew function, phase relation between changes. Figure shows, data transfer period high period HD64646 never overlap with skew function.
MCLK DISPTMG (HD64645) (HD64646) (fCL2 fMCLK) (fCL2 2fMCLK)
MCLK
MCLK
Notes: fMCLK Output frequency MCLK fCL2 Output frequency
Figure Differences between HD64645 HD64646 Skew)
Differences Between Products
MCLK
DISPTMG
(HD64645) (HD64646) (fCL2 fMCLK)
MCLK
MCLK
(fCL2 2fMCLK) Character Skew
MCLK
DISPTMG
(HD64645)
MCLK
(HD64646)
MCLK
(fCL2 fMCLK)
(fCL2 2fMCLK) Character Skew
Figure Differences between HD64645 HD64646 (Skew)
Package Information
Package Information
Hitachi driver devices plastic flat packages reduce size equipment which they incorporated provide higher density mounting utilizing features thin liquid crystal display elements.
Package Dimensions
Unit:
25.6 19.6 *0.37 0.08 0.35 0.06 2.70
0.15
3.10 *0.17 0.05 0.15 0.04
Hitachi Code JEDEC EIAJ Weight (reference value) FP-60
*Dimension including plating thickness Base material dimension
Package Information
25.6 Unit:
19.6
*0.37 0.08 0.35 0.06
3.10
0.15 *0.17 0.05 0.15 0.04
2.70
Hitachi Code JEDEC EIAJ Weight (reference value) FP-80
*Dimension including plating thickness Base material dimension
24.8
18.8
Unit:
*0.37 0.08 0.35 0.06
0.15
3.10
*0.17 0.05 0.15 0.04
2.70
0.20 +0.10 -0.20
0.15
*Dimension including plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value) FP-80B
Package Information
25.6 Unit:
19.6
*0.32 0.08 0.30 0.06 0.58
3.10
0.65 0.15 *0.17 0.05 0.15 0.04
0.83
2.70
*Dimension including plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-100
24.8
18.8
Unit:
0.65
*0.32 0.08 0.30 0.06
0.13
3.10
*0.17 0.05 0.15 0.04
0.83
0.58
0.20 +0.10 -0.20
2.70
Hitachi Code JEDEC EIAJ Weight (reference value) FP-100A
0.15
*Dimension including plating thickness Base material dimension
Package Information
Unit: 16.0
16.0
*0.22 0.05 0.20 0.04
3.05
2.70
0.08
*0.17 0.05 0.15 0.04
0.10
0.12 +0.13 -0.12
*Dimension including plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-100B Conforms
22.0
Unit:
16.0
*0.22 0.05 0.20 0.04 0.10 0.75
3.15
*0.17 0.05 0.15 0.04
2.70
0.75
+0.15 -0.10
0.10
0.10
Hitachi Code JEDEC EIAJ Weight (reference value) FP-128
*Dimension including plating thickness Base material dimension
Package Information
22.0
22.0
0.22 0.05 0.20 0.04
1.45
0.08
0.17 0.05 0.15 0.04
1.70
1.25
Hitachi Code JEDEC Code EIAJ Code Weight FP-144A ED-7404A
0.10
0.12 0.08
Unit:
16.0
16.0
*0.32 0.08 0.30 0.06
0.13
0.83
0.65
*0.17 0.05 0.15 0.04
1.20
1.00
0.10
0.10 0.10
Hitachi Code JEDEC EIAJ Weight (reference value)
*Dimension including plating thickness Base material dimension
TFP-80F Conforms
Package Information
Unit: 16.0 16.0
*0.22 0.05 0.20 0.04 0.08
*0.17 0.05 0.15 0.04 1.20
1.00
0.10
0.10 0.10
*Dimension including plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
TFP-100B Conforms
Notes Mounting
Damage from Static Electricity
Semiconductor devices easily damaged static discharges, they should handled mounted with utmost care. Precautions discussed below. Work Environment relative humidity facilitates accumulation static charge. Although surface mounting package devices must stored atmosphere prevent moisture absorption, they should handled mounted work environment with relative humidity greater prevent static buildup. Preventing Static Buildup Handling Avoid insulating materials that easily accumulate static charge workplaces where mounting operations performed. particular, charged objects induce charges semiconductors finished boards even without direct contact. Recommended measures include antistatic work garments, conductive carrier boxes, ionized blowers. Ground instruments, conveyors, work benches, floor mats, tools, soldering irons prevent accumulation static charges. conductive mats (with resistance order 1011 workbenches floors ground them. (See Figure Personnel should wear grounding bracelets their arms legs. prevent electric shocks, insert resistor greater series shown Figure soldering irons used, voltage (12V 24V) soldering irons designed with semiconductors. Ground soldering iron tips shown Figure
Resistor
High resistance conductive (grounded) Personal ground (bracelet) High resistance conductive (grounded) Humidifier Anti-static work clothes Anti-static shoes
Figure Static Electricity Countermeasures Semiconductor Handing
Notes Mounting
Preventing Semiconductor Discharges Semiconductors damaged static charges package chip itself. However, damage will occur lead frame contacts metal object charge dissipates. Grounding metal object does help this situation. following measures should taken. Avoid contact friction between semiconductors easily charged insulators. Avoid handling working with semiconductors metal surfaces. Semiconductors should handled grounded high resistance mats. semiconductor charged, allow that device contact metal objects. Precautions during Mounting
Grounded high resistance mats must used when mounting semiconductors boards. Ground mats before handling semiconductors. Particular caution required following conductivity testing, since capacitors board retain charge. boards also acquire static charge contact, friction, induction. Take precautions prevent discharge through contact with transport boxes other metal objects during transportation. Such precautions include anti-static bags other techniques isolating boards.
Metal conductive material
Insulated wire over
Figure Personal Ground
100V
Soldering iron
Figure Soldering Iron Grounding Example
Notes Mounting
Precautions Prior Reflow Soldering
Surface mount packages that hold large chips weaker than insertion mount packages. Since whole package heated during reflow operation, characteristics described below should considered when determining handling used prior reflow soldering conditions used reflow operation. Package Cracking Mechanism Reflow Soldering Packages that have absorbed moisture thought crack mechanism shown Figure Moisture absorbed during storage diffuses through interior package. When package this state passed through reflow furnace, that moisture rediffuses. Some escapes along boundary between resin frame. This lead boundary separation. pressure this space increases resin warps, finally resulting crack. Fick diffusion model used calculate diffusion moisture resin: D(t) volume moisture absorbed package expressed follows: increase internal pressure calculated from moisture diffusion during reflow heating using function. Figure shows relationships between maximum stresses when packages various moisture absorption states heated, adhesion strength between resin frame various temperatures, strength resin itself. While this model indicates that cracks will result this example when moisture absorption ratio exceeds (vapor phase soldering 215°C) process, actual tests show that cracks result packages with moisture absorption ratio 0.25 wt%. This indicates that model valid. Therefore moisture management should focus moisture content vicinity frame.
Notes Mounting
Storage Moisture absorption Package internal moisture density Water diffusion coefficient Chip Resin
Solder reflow
Vaporization internal moisture content
22.4 /latm fad: Resin bonding strength Generated stress
Frame
Boundary separation Wmax Form coefficient Resin Young's modulus Internal pressure shorter dimension Thickness resin under
Wmax
Expansion
Cracking
Crack
(T): Resin strength Form coefficient
Figure Package Crack Generation Mechanism
Adhesive strength bending strength
Generated stress units/mm2)
units/mm2)
(MLX)SAT
Moisture absorption ratio (85°C 85%RH)
Temperature (°C)
Figure Temperature Dependence Resin Adhesive Strength, Mechanical Strength, Generated Stress
Notes Mounting
Recommended Soldering Conditions
Soldering temperature stipulations must followed moisture sbsorption states plastic packages must carefully monitored prevent degradation reliability surface mount packages thermal chock. This section presents Hitachi's recommended soldering conditions. Recommended Soldering Temperatures Table Table
Method Vapor-phase reflow 215°C Package surface temperature 160°C
Recommended Soldering Temperatures
Recommended Conditions maximum Notes
About 5°C/s Time
Infrared reflow Hot-air reflow Package surface temperature
235°C, maximum 160°C
maximum
About 4°C/s 5°C/s Time
Since TSOP, TQFP, packages whose body thickness less than especially vulnerable thermal shock, recommend limiting soldering conditions maximum temperature 230°C maximum time secondes these packages.
Notes Mounting
Moisture Absorption Prevention Conditions
Plastic packages absorb moisture when stored high humidity. devices mounted using solder reflow techniques when they have absorbed moisture they susceptible reflow cracking. Products that particularly susceptible influence absorbed moisture packed moisture-proof packing. These products should handled under following conditions after opening moisture-proof packing. Storage Handling after Opening Moisture-Proof Packing Storage temperature:5°C 30°C Storage humidity: Under relative humidity
Time between unpacking reflow soldering: specified label attached moisture-proof packing, delivery specifications: follow those specifications. specified label attached moisture-proof packing delivery specifications: perform reflow soldering within hours (one week) with product stored under conditions specified above. Baking 4.2.1 Baking Required Following Situations desiccant indicator turned pink. storage period following unpacking exceeds specifications that period. 4.2.2 Recommended Baking Conditions TSOP TQFP: 125°C hours Packages other than TSOP TQFP: 125°C hours hours specified delivery specifications other documentation, follow those specifications. 4.2.3 Other Points
heat-proof trays baking operation.
Notes Mounting
Surface Mounting Package Handling Precautions
Package Temperature Distribution most common method used mounting surface mounting device infrared reflow. Since package made black epoxy resin, portion package directly exposed infrared heat source will absorb heat faster thus rise temperature more quickly than other parts package unless precautions taken. shown example Figure surface directly facing infrared heat source 30°C higher than leads being soldered 40°C 50°C higher than bottom package. soldering performed under these conditions, package cracks occur. avoid this type problem, recommended that aluminum infrared heat shield placed over resin surface package. using 2-mm thick aluminum heat shield, bottom surfaces resin held 175°C when peak temperature leads 240°C.
(Resin)
Infrared rays (Surface)
Temperature (°C)
(Soler)
Time (sec)
Figure Temperature Profile During Infrared Heat Soldering (Example) Package Moisture Absorption epoxy resin used plastic packages will absorb moisture stored high-humidity environment. this moisture absorption becomes excessive, there will sudden vaporization during soldering, causing interface resin lead frame spread apart. extreme cases, package cracks will occur. Therefore, especially thin packages, important that moisture-proof storage used. remove moisture absorbed during transportation, storage, handling, recommended that package baked 125°C hours before soldering.
Notes Mounting
Heating Cooling method soldering electrical parts solder method, compared reflow method, rate heat transmission order magnitude higher. When this method used with plastic items, there thermal shock resulting package cracks deterioration moisture-resistant characteristics. Thus, recommended that solder method used. Even with reflow method, excessive rate heating cooling undesirable. rate temperature change less than 4°C/sec recommended. Package Contaminants recommended that resin-based flux used during soldering. Acid-based fluxes have tendency leaving acid residue which adversely affects product reliability. Thus, acid-based fluxes should used. With resin-based fluxes well, residue left behind, leads other package parts will begin corrode. Thus, flux must thoroughly washed away. cleansing solvents used wash away flux left package extended period time, package markings fade, care must taken. precautions mentioned above general points observed reflow. However, specific reflow conditions will depend such factors package shape, printed circuit board type, reflow method, device type. details surface mounting small thin packages, please consult separate manual available mounting. there additional questions, please contact Hitachi, Ltd.
Information
Features (TAB Technology)
structure materials used Tape Carrier Package (TCP) give following features compared with conventional packages: Thin, Lightweight, Fine Pitch With thickness less than fine-pitch leads, reduced pitch device enables more functionality package equivalent size. Specifically, these features enable: Thin high definition (Liquid Crystal display Module) Lightweight ultra-high count systems
Flexible Design following tailored design system (e.g. mother board design): Pattern layout design
Applications
Thinness, ultra-high count, fine pitch open possibilities applications compact highly functional systems. Figure shows some applications TCP-packaged chips.
Personal computers, word processors
driver
modules
Calculators organizers
Memory
Memory cards
Workstations
Computers
Figure Examples TCP-Packaged Chip Applications
Hitachi Products
Hitachi Driver Hitachi offers tape-carrier-packaged drivers modules ranging from miniature large sizes. Table shows some examples standard tape carrier packages drivers. Hitachi drivers combine device that withstand high voltages provide high definition with tape carrier package that promises excellent reliability, making possible applications that would feasible with conventional QFP. material specifications products Table Table Table TCPs Hitachi Drivers
Function Signal Output Analog Appearance Total Count (Output) Outer Lead Pitch
Application Drive TFT*
Product Code
Remarks
Column only
HD66330TA0 Color STN*2 liquid crystal Color STN*2 liquid crystal Column only Digital
(192)
0.16
HD66110STB2 Column only Digital
(160)
0.092 Outer lead pitch: 0.074 products also available
HD66120TA0 Color STN*2 liquid crystal Small liquid crystal Common Digital only HD66115TA0 Column Digital common
(240)
0.07 Outer lead pitch: 0.250 products also available Built-in controller (on-chip RAM)
(160)
0.18
HD66108T00 Notes: TFT: Thin Film Transistor STN: Super Twist Nematic
(165)
Table TCPs Hitachi Drivers (cont)
Function Signal Output Appearance Total Count (Output) Outer Lead Pitch
Application Drive Small liquid crystal
Product Code
Remarks
Column Digital common HD66712TA0 (94) 0.24 Folding
HD66712TB0
(94)
External View Cross-Sectional Structure
Components
Sprocket hole (perforation)
Wiring
Test
Outer lead output
Resin
Guide pattern
chip
Guide hole
Base film
User area
Cross-Sectional Structure
Base film
Outer lead input Solder resist Outer lead hole Solder resist Resin Copper foil Adhesive chip Bump (Au)
,,,,,,
Materials Features Material Specifications: Table lists Hitachi material specifications. require other materials. this case, ordering manual [ADE-801-001 (O)]. Table lists current material specifications various Hitachi products. Table
Hitachi Material Specifications
Item Base film Adhesive Copper foil Resin Outer lead plating Solder resist Solder resist rear surface folding slit Specifications UPILEX® S-type: thickness KAPTON® V-type: thickness Toray #5900 TOMOEGAWA E-type Rolled copper: thickness Electro-deposited copper: thickness Epoxy resin Epoxy solder resist Polyimide solder resist
Cross-sectional view
,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,,,, ,,,, ,,,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,,,, ,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,, ,,,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,, ,,,,
chip
Note: Folding only.
Table
Material Specifications Hitachi Products
Application Color Color Color Small liquid crystal Small liquid crystal Small liquid crystal Base Film UPILEX® UPILEX® UPILEX® UPILEX® KAPTON® UPILEX® UPILEX® Adhesive TOMOEGAWA E-type TOMOEGAWA E-type TOMOEGAWA E-type TOMOEGAWA E-type Toray #5900 TOMOEGAWA E-type TOMOEGAWA E-type Copper Foil Outer Lead Plating
Product Code HD66330TA0 HD66110STB2 HD66120TA0 HD66115TA0 HD66108T00 HD66712TA0 HD66712TB0
Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Rolled copper
Electro-deposited copper Electro-deposited copper
Properties Materials: Properties Hitachi materials follows. Base film properties base film shown Table Hitachi currently adopts UPILEX® which exhibits high rigidity super dimensional stability with respect temperature changes compared with conventional KAPTON® Copper foil (copper wiring) properties rolled foil electro-deposited foil shown Table Hitachi plans adopt electro-deposited foil excellent elongation properties room temperature (RT) compared with conventional rolled foil. Table
Property Coefficient linear expansion Tensile modules (MPa) 100°C 200°C
Properties Base Film (See references page
UPILEX (Ube Industries, Ltd.) 8826.0 KAPTON® Pont-Toray Co., Ltd.) 3481.4
Table
Properties Copper Foil (See reference page
Sampling Condition foil foil foil foil Rolled Foil (Hitachi Cable, Ltd.) CF-W5-1S-LP 421.7 229.5 Electro- Deposited Foil (Mitsui Mining Smelting Co., Ltd.) 3EC-VLP 538.4 10.1 249.1
Property Tensile strength (MPa) Elongation Tensile strength 180°C (kgf/mm2) Elongation 180°C
Note: Data from film suppliers. Number measured samples: pieces each 1.01972 kgf/mm2
Adhesive relationship between peeling strength (adhesive/electro-deposited foil) lead width shown Figure Hitachi adopts following combinations because their higher peeling strength. Adhesive TOMOEGAWA E-type/electro-deposited foil Adhesive Toray #5900/rolled foil
Adhesive
Copper foil
TOMOEGAWA Electro-deposited E-type foil
Peeling strength (gf/100
Toray #5900 Rolled foil
TOMOEGAWA Rolled foil E-type
40/40 60/60 (120 80/80 (160 100/100 (200
Line width/space (µm) (pattern pitch)
Peeling strength
measure Measuring method: peel
Peeling direction
Copper foil
Measuring condition: 25°C Number measured samples: Five pieces measured each specification, leads measured each piece.
Pattern pitch
Adhesive Base film
Line width
Space
Figure Relationship between Peeling Strength Lead Width
Fine-Pitch Bump Formation Bumps essential products; they foundation technology have excellent corrosion resistance their structure. When current trend toward high-performance chips with ultralarge pin-out began driving counts upward (and reducing pitch), Hitachi quick develop volume production process forming fine-pitch bumps. Figure shows Hitachi bump structure. Figure shows flowchart bump formation process.
Straight-Wall Bumps (Fine-Pitch)
100, Bump (Au) 50*2, 40*3 UBM*1
Passivation Notes: UBM: Under Bump Metal Case 80-µm bump pitch Case 70-µm bump pitch
Unit:
Figure Hitachi Bump Structure
photolithography Passivation Through-hole photolithography evaporation deposition Bump photolithography Bump formation process Gold plating Remove resist etching
Figure Bump Formation Flowchart
Fabrication Flow Tape: tapes purchased from tape manufacturers. many cases, quality products depends critically quality tape, addition evaluating constituent materials, Hitachi strictly controls stability tape fabrication process. Fabrication Process: fabrication process starts from wafers chips) with bumps, patterned tape. After being bonded high-precision inner lead bonder, chips sealed resin. Figure shows standard fabrication process TCPs used Hitachi LCDs.
Bump (gold) Wafer tape Bump formation Silicon chip
Pelletizing
Inner lead bonding
Inner Lead Bonding This step bonds bumps chips inner leads formed patterning. Gang bonding been adopted standard procedure Hitachi. Sealing Chips sealed resin ensure inner lead bonding strength. standard bonding process employs potting liquid resin which seals chip. Resin Inner lead
Sealing
Marking
Inspection chip Shipping packing
Copper foil
Base tape
Figure Standard Fabrication Process TCPs Used Hitachi LCDs
Packing Packing Format: products packed moisture-proof packages. reel wound with tape sealed opaque antistatic sheet with protect product from mechanical shock then packed into carton before delivery ensure solderability lead plating. Labels which indicate product name, quantity, placed reel, antistatic sheet, carton. Figure shows packing format.
Width Products
Width Products
Label
Reel
Label
Reel
Conductive separator
Separator
Lead tape tape Antistatic sheet
Lead tape
Conductive tape
tape Antistatic sheet
Label Silica Silica
Label
Label carton side Shock absorber Carton Label carton side Shock absorber Carton
Figure Packing Format
Tape Specification:
Width Tape tape Lead tape Conductive tape Separator Conductive separator +1/-0.5 added both ends +1/-0.5 added both ends
Note: lengths tape, conductive tape, separator vary slightly depending quantity product tape.
Reel Specification: Figure shows reel dimensions. recycling purpose, would appreciate return reel separator after use.
Units: Material: Styrene Dimensions without tolerance design values.
16.75 ±0.3
Note: width tape.
Figure Reel Dimensions
Winding Direction: Figure shows winding TCPs. combination product directions when pulling from reel placement patterned face either front back tape makes four types winding directions. winding direction essential specification which affects chip punching machine assembly equipment during packaging process. wind direction differs according product, please check delivery specification before using TCP.
Note
Product direction (two types) Patterned face either front back (two types) Four types winding direction
Magnification (example)
Reel
Product (TCP tape)
Figure Example Winding Direction
Mounting Methods
Mounting Structure Typical example structure using TCPs illustrated Figure Basic Mounting Process Figure
panel
PCB*
Note: PCB: Printed circuit board
Figure Structure
ACF* panel Punching Single
applied Prepress Thermocompression bonding Contact inspection Soldering Contact inspection Resin coating Repair
Repair
Lighting test
Note: ACF: Anisotropic conductive film
Figure (Outer Lead Bonding) Basic Flowchart
Process Outline outline assembly process using TCPs given Figure
applied Applies glass panel thermal pressing.
panel
prepress
Aligns panel patterns temporarily connects them temperature pressure.
Thermo-compression bonding
Thermocompresses multiple TCPs panel, which have been temporarily connected, high temperature high pressure either individually together.
Soldering Joins output leads TCPs patterns soldering.
Figure Outline Assembly Process
Mounting Conditions Mounting TCPs Panels (See reference page 28): adhesive film that connect electrodes glass panel with output leads TCPs. There types ACFs: whose thermosetting thermoplastic properties make handling easier (such repair) reduces stresses caused temperature changes. whose thermosetting properties provide connection resistance high thermostability.
Please select depending type application. Selection thickness appropriate thickness must selected depending height, line width space width circuit connected; rough calculation formula obtaining proper thickness shown below.
Electrode
,,,,,,
thickness before connection thickness after connection Circuit height Pitch Space width (top) Space width (bottom) Correction value AC-6073, AC-6103-0.15T AC-7104, AC-7144-0.25T
Glass substrate
Copper foil (circuit) Adhesive Base film
Incomplate filling occur space thickness thin, while thick, connectin reliability becomes poor since conductive paricles flattened out. necessary select apprepriate thickness. Some adjustment thickness controlled bonding conditions (especially pressure).
Laminating bonding conditions necessary optimize bonding conditions according ACF, glass panel specifications. bonding conditions adopted ANISOLM® (Hitachi Chemical Co., Ltd.) shown Table reference. Please determine your optimum bonding conditions based following. Table Bonding Conditions ANISOLM®
Mixture Thermosetting Thermoplastic
Item
Unit
Thermosetting
Remarks
AC-6073 AC-6103 AC-7104 AC-7144 Standard specifications Min. pitch Line Space Thickness Width Length Color Core diameter Bonding Laminating Temperature conditions Pressure Time Bonding Temperature Pressure Time Note: 1.01972 10-1 kgf/mm2 Resolution Line/ 2.5, Transparent (gray) 18.5 2.5, Transparent (gray) 18.5 Temperature ANISOLM® Temperature ANISOLM®
Measuring Method Temperature Profile (example)
Heating head Silicone rubber (0.2 0.3mm) Teflon film 50µm) Base film Adhesive Glass substrate Thermocouple Copper foil Glass plate
ANISOLM temperature (°C)
Final temperature
Time
Temperature after should over final temperature (°C)
Figure Bonding Temperature Profile
Soldering Conditions: Solder TCPs under following conditions. soldering temperature low, solder melt. However, soldering temperature high, solder adequately spread over leads owing their oxidized surfaces, and/or leads plating become attached heating collet. latter case, copper foil leads become exposed. Please determine adequate soldering conditions mass production carefully. Soldering temperature solder joint): 260°C Soldering time: seconds max.
Temperature solder joint (°C)
260°C
seconds (max.)
Time (second)
Note Temperature solder joint normally 50°C lower than heating collet temperature. Soldering temperature agreat impact quality products. Operating conditions should therefore specified after examining temperature relationship between heating collet solder joint. Heating collet Base film Outer lead Solder joint Footprint
Note case soldering quad type TCPs, please using vacuum collets equivalent prevent vase film warpage circuit position misalignment.
Vacuum collet Heating collet Outer lead Base film Footprint Vacuum collet Heating collet
Storage Restrictions Packed products should used within months. products removed from antistatic sheet should stored having point -30°C lower. However, they should used soon possible after removal, because solderability leads plated with solder decreases with time. Handling Precautions Electrical Handling Anti-electrostatic discharge measures products require following care beyond what required non-TCP products. Give special attention ion-blow grounding especially when removing products from reel, since they easily collect static electricity because base film. products become charged, discharge electricity little little using ion-blow; rapid discharge damage devices. Handle product that static electricity applied outer leads. Depending equipment used, this require taking proper anti-electrostatic discharge measures, such allowing tapeguide contact outer leads. Outer lead coating Outer leads should coated with resin other appropriate materials prevent short-circuits disconnections corrosion. Conductive foreign particles easily cause short-circuits since lead spacing products much narrower than that non-TCP products. Disconnections from corrosion also easily occur solder flux similar materials adhering leads while mounting products board. This because product leads formed bonding very thin copper foil base film order attain high-density mounting. prevent electric breakdown when mounting products board, allow electrical contact with die's bottom surface. These types failures easily occur since products have bare monocrystal die's bottom surface order make product thin possible. prevent degradation electrical characteristics, expose products sunlight. Mechanical Handling prevent cracks when mounting products board, allow physical contact with die's bottom surface. These types failures easily occur since products have bare monocrystal die's bottom surface order make product thin possible. Handle products carefully avoid bending leads from base film transformation. bend products since this cause cracks solder resist.
Punching Punching continuous base film extract single products requires following care. Align each product correctly according tape perforations (sprocket holes). metal punching with pressing installation prevent resin cracks reduce cutting stresses outer leads. (Refer Figure 13.) Determine punching position that cutting edge does touch molding area based relationship between maximum molding area (specified design drawing) punching accuracy. Punch products section where outer leads straight (not slanted) prevent short-circuits caused conductive particles. (Refer Figure 14.)
Punching without pressing installation Punching with pressing installation Pressing installation
Cutting edge
Stress
Figure Punching
punching area
Margin area
Punching area
Figure Punching Position
Mounting structure Copper foil easily break even from small physical stress because thinness needed accommodate fine patterns. Large stresses should therefore applied copper foil when mounting products board. Bending stresses When edges aligned, resin cracks occur bending stresses. avoid this problem, locate board closer panel that support molded part package. (Refer Figure 15.) Thermal stresses consists glass, TCPs glass-epoxy substrate having their respective coefficients thermal expansion (CTE). This difference expansion effects cause ,,thermal stresses" that especially concentrate TCPs. joining structure LCMs roughly shown Figure Before beginning mass production, investigate determine joining structure that reduces thermal stresses prevent contact other defects from occurring. stack more than cartons products. subject cartons high physical impact.
Bending stresses
Move closer panel Bending Stresses Applied Bending Stresses Applied
Figure Positioning Mounting TCPs
Glass
Figure Joining Structure
composed various materials having their respective CTEs.
Correction (Indium Oxide) Electrode Pitch: products expand absorbing moisture heat during storage assembly. Pitch correction electrode should performed based dimensions after mounted conductive film. However, pitch correction performed based dimensions before mounting, must based data measured after removing products from package storing temperature 25°C humidity hours. Correct electrode pitch depending bonding equipment conditions used. Miscellaneous heat lead tape separator; they have poor heat-resistivity will expand. subject TCPs high temperature long period time while cleaning other operations; copper foil peel rapid deterioration adhesion between copper foil base film. Carrier tapes have some waviness that cause problems tape transport. tapeguide equivalent secure tape.
18.75 +0.15 Output dimension after joined 18.74 +0.10 18.73 Output dimension (mm) +0.05 18.72 18.71 -0.05 18.70 Measured sample: HD66214TA7 (Base film: UPILEX Number measured samples: pieces Storage conditions: ±5°C, 60%RH hours -0.10 Dimensional change rate
18.69
18.68 Before sealing carton Immediately after unsealing Storage time (hours)
Figure Dimensional Change Output
number folding bending operations that performed before lead breaks shown Figure greater bending angle, sooner lead will break. should mounted such that bending angle each slit does exceed 90°.
42.6
0.15 0.3p Tape cutting position
0.45
Unit:
Folding slit shape Folding with slits Thickness (measured value) Thickness (measured value) Slide glass Folding with slits
Slide glass
Double-bend degrees slit) 99.99
Triple-bend degrees less slit)
Number measured sample: pieces each case HD66712TB0 Polyimide application rear slit Double-bend
Cumulative defect rate
0.01
1.25
slits Triple-bend
1000
Number times folded
Figure Example Number Times Folded Cumulative Defect Rate
Standardization
present, standardization drive TCPs difficult because differences mounting methods customer specifications. However, standardization TCPs (QTP DTP) that correspond shape TQFP TSOP packages been discussed Tape Carrier Package Working Group Semiconductor External Standards Committee (EE-13) EIAJ (Electronics Industries Association Japan). This working group, which composed various semiconductor manufacturers including Hitachi, tape manufacturers, socket manufacturers, taking comprehensive approach. EIAJ adopted metric control standards against JEDEC*'s inch control standards, determined standards based following items: Fixed test layout, variable package size Fixed test layout, variable terminal pitch
Accordingly, users share socket deciding width tape test pitch. JEDEC already agreed metric-control TCP, Hitachi making efforts produce metric-control TCPs. General rules covering outlines that have already been formulated published EE-13 committee shown below. EIAJ ED-7431 EIAJ ED-7432 EIAJ ED-7433 Quad Tape Carrier Package (QTP) Dual Tape Carrier Package (Type (DTP(I)) Dual Tape Carrier Package (Type (DTP(II))
summary these general rules given below. Note that these standards necessarily apply drive TCPS. Note: JEDEC: Joint Electronic Device Engineering Council.
Quad Tape Carrier Package (QTP) EIAJ ED-7431 Tape width: Package size: Test pitch: 0.5, 0.4, 0.3, 0.25 Outer lead pitch: 0.5, 0.4, 0.3, 0.25, 0.2, 0.15 Sprocket-hole type: Super Wide, Super Wide, Super Number test pads: Fixed maximum number test pads, regardless outer lead count. 35-mm tape: pitch; pitch.
Dual Tape Carrier Package (Type (DTP(I)) Tape width: Package size: Test pitch: Outer lead pitch: 0.5, 0.4, Sprocket-hole type: Super Number test pads:
EIAJ ED-7432
Dual Tape Carrier Package (Type (DTP(II)) Tape width: Package size: mil, mil, mil, mil, mil, mil, (Enom) Test pitch: 1.27 (outer lead pitch: 1.27, 1.0) (outer lead pitch: 0.8, 0.65) Outer lead pitch: 1.27, 1.0, 0.8, 0.65 Sprocket-hole type: Super Number test pads: (test pitch: 1.27 (test pitch:
EIAJ ED-7433
Reference Materials
Mounting Equipment Manufacturer Manufacturer: Hitachi Chemical Co., Ltd.
Area Address Hitachi Chemical Co., America, Ltd. International Drive, Brook, 10573, U.S.A. Hitachi Chemical Europe Immermmstr. D-4000 Germany Hitachi Chemical Asia-Pacific Pte, Ltd. Bras Basah Road, #08-04 Plaza Park, Singapore 0718 Hitachi Chemical Taipei Office Room 1406, Chia Hsim Bldg., Sec. Chung Shang Road Taipei, Taiwan (914) 934-2424 (914) 934-8991
Europe
(211) 35-0366
(211) 16-1634
S.E. Asia
337-2408
337-7132
Taiwan
581-3632, 561-3810
521-7509
Beijing
501-4331 Hitachi Chemical Beijing Office Room 1207, Beijing Fortune Building, Dong, Huan Bei-Lu, Chao Yang District, Beijing, China Hitachi Chemical Co., (Hong Kong) Ltd. Room 912, Houston Centre, Mady Road, Tsimshatsui East, Kowloon, Hong Kong 66-9304
501-4333
Hong Kong
723-3549
Manufacturer: Matsushita Electric Industrial Co., Ltd.
Area (Illinois) Deutschland Asia (Japan) Address Panasonic Factory Automation Company Panasonic Factory Automation Deutchland Matsushita Manufacturing Equipment (708) 452-2500 (040) 8549-2628 (0552) 75-6222
Manufacturer: Shinkawa Co., Ltd.
Area U.S.A. Address MARUBENI INTERNATIONAL ELECTRONICS CORP. U.S.A. 3285 Scott Blvd, Santa Clara, 95054 MARUBENI INTERNATIONAL ELECTRONICS CORP. SINGAPORE Tannery Lane #06-01/02, Lian Teng Building, 1334 MARUBENI HYTECH CORP. Japan 20-22, Koishikawa 4-chome, Bunkyo-ku, Tokyo 112, Japan 408-727-8447 408-727-8370
Singapore, Malaysia, Thailand Korea, Hong Kong, China, Taiwan, Philippine, Brazil Europe
741-2300
741-4870
(03)-3817-4952
(03)-3817-4959
MARUBENI INTERNATIONAL ELECTRONICS EUROPE GMBH Niederrhein STR, 4000 Federal Republic Germany
0211-4376-00
0211-4332-85
Manufacturer: Kyushu Matsushita Electric Co., Ltd.
Area CHICAGO ATLANTA Address 1240 Landmeier Grove Village, 60007 1080 Holcomb Bridge Building 100, Suite Roswell, Georgia 30076 Bovet Road, Suite Mateo, 99402 238/246 King Street, London United Kingdom Scotts Road, #21-10/13 Shaw Centre Singapore 0922 Floor, Donghwa Bldg. 454-5, Dokok-1 Dong, Kangnam-Ku, Seoul, Korea 6TH, FL., 360, HSING ROAD, KWEISHAN, TAOYUAN HSIEN, TAIWAN KUALALUMPUR BRANCH FLOOR, WISMA RUBBER, JAPAN MELAKA, 50100 KUALALUMPUR 20TH FL., Thaniya Plaza Bldg, Silom Road, Bangrak, BANGKOK, 10500 THAILAND (708) 822-7262 (404) 906-1515 (708) 952-8079 (404) 998-9830
JOSE LONDON SINGAPORE SEOUL
(415) 608-0317 (081) 748-2447 7387681 (02) 571-2911
(415) 341-1395 (081) 846-9580 7325238 (02) 571-2910
TAIWAN
(03) 328-7070
(03) 328-7080 (03) 328-7090 (03) 291-8002
MALAYSIA
(03) 291-0066
BANGKOK
(02) 231-2345
(02) 231-2342
Manufacturer: Japan Abionis Co., Ltd.
Area Worldwide Address Overseas Department Contact: Asami, 81-3-3501-7358 81-3-3504-2829
Tape Manufacturers Manufacturer: Hitachi Cable Ltd.
Area U.S.A. Europe Sigapore Hong Kong Address HITACHI CABLE AMERICA INC. HITACHI CABLE INTERNATIONAL, LTD. (LONDON) HITACHI CABLE INTERNATIONAL, (SINGAPORE) HITACHI CABLE INTERNATIONAL, (HONG KONG) 1-914-993-0991 001-44-71-4397223 001-65-2681146 001-852-721-2077 001-1-914-993-0997 001-44-71-494-1956 001-65-2680461 001-852-369-3472
Manufacturer: Mitsui Mining Smelting Co., Ltd.
Area U.S.A. Europe Asia Address MITSUI MINING SMELTING CO., (USA) INC. MITSUI MINING SMELTING CO., LTD. London Office MITSUI MINING SMELTING CO., LTD. MICROCIRCUIT DIVISION 212-679-9300 71-405-7717 03-3246-8079 212-679-9303 71-405-0227 03-3246-8063
Manufacturer: Shindo Company Ltd.
Area U.S.A. Address SHINDO COMPANY LTD., U.S. BRANCH OFFICE 2635 NORTH FIRST ST., STE. JOSE, 95134 U.S.A. 408-435-0808 408-435-0809
Aeolotropy Conductive Film Manufacturers Manufacturer: Hitachi Chemical Co., Ltd.
Area Address Hitachi Chemical Co., America, Ltd. International Drive, Brook, 10573, U.S.A. Hitachi Chemical Europe GmbH. Immermannstr. D-4000 Germany Hitachi Chemical Asia-Pacific Pte, Ltd. Bras Basah Road, #08-04 Plaza Park, Singapore 0718 Hitachi Chemical Taipei Office Room 1406, Chia Hsin Bldg., Sec. Chung Shang Road Taipei, Taiwan Hitachi Chemical Beijing Office Room 1207, Beijing Fortune Building, Dong, Huan Bei-Lu, Chao Yang District, Beijing, China Hitachi Chemical Co., (Hong Kong) Ltd. Room 912, Houston Centre, Mady Road, Tsimshatsui East, Kowloon, Hong Kong (914) 934-2424 (914) 934-8991
Europe
(211) 35-0366
(211) 16-1634
S.E. Asia
337-2408
337-7132
Taiwan
581-3632, 561-3810
521-7509
Beijing
501-4331
501-4333
Hong Kong
66-9304
723-3549
Manufacturer: Sony Chemicals
Area U.S.A. Europe Southeast Asia Address SONY CHEMICALS CORPORATION AMERICA SONY CHEMICALS EUROPE B.V. SONY CHEMICALS SINGAPORE LTD. 1-(708) 616-0070 31-20-658-1850 65-382-1500 1-(708) 616-0073 31-20-659-8481 65-382-1750
References KAPTON Catalog UPILEX Catalog Electro-deposited Foil Comparison List Hitachi Anisotropic Discharge Film Pont-Toray Co., Ltd. Industries, Ltd. Mitsui Mining Smelting Co., Ltd. Electronic Devices Group Hitachi Chemical Co., Ltd. 1992.7.21
Dimension Symbol
Bending- Output Output Lead Output Lead Input Lead Pitch Length Pitch (µm) (mm) (mm) Input Lead User Area User Area Width Length Length (mm) (mm) (mm) Tape Width (mm)
Table
Figure shows structures standard TCP.
Hitach Standard Product Structure
Product
Function
Hitachi provide standard products listed Table
Hitachi Standard Product Specifications
HD66108T00 HD66108TA0 HD66108TA1 HD66108TB0 HD66110STB2 HD66110STB4 HD66110STB5 HD66110STB8 HD66110STC0 HD66110STC1 HD66110STC2 HD66110STC3 HD66112TA2 HD66113TA0 HD66113TA1 HD66115TA0 HD66115TA3 HD66120TA3 HD66120TA4 HD66130TB0 HD66131TB0 HD66132TA3 HD66132TA3 HD66134TA1 HD66135TA1 HD66300T00 HD66322TA0 HD66330TA0 HD66410TA0 HD66410TB0 HD66420TA0 HD66503TA0 HD66503TB0 HD66520TA0 HD66520TB0 HD66522TA0 HD66523TA0 HD66705UxxxTA0 HD66712xxxTA0 HD66717xxxTA0 HD66717xxxTA1 HD66717xxxTA2 HD66724xxxTA0 HD66727xxxTA0 HD66731xxxTA0 HD66731xxxTB0 5.34 2.19 0.65 0.45 0.65 0.65 0.65 0.65 0.65 20.7 20.7 15.6 16.6 35.3 38.17 44.71 17.6 24.5 31.8 32.4 20.08 20.28 55.25 55.8 19.6 24.5 19.6 24.5 32.4 35.3 58.7 38.8 59.73 56.2 38.2 25.2 25.2 26.9 36.4 31.8 23.3 31.8 23.6 10.7 10.85 11.12 11.25 11.4 11.5 10.5 11.6 16.8 17.9 10.5 21.5 33.25 11.7 16.78 21.58 15.15 15.4 19.55 17.8 21.3 12.55 16.13 12.6 17.4 12.55 12.6 12.6 12.75 12.6 16.7 20.6
within driver within driver within driver within driver Column Column Column Column Column Column Column Column Column Common Common Common Common Column Column Column Common Column Common Column Common analog digital gray scale within driver within driver within driver Common Common within driver within driver within driver Common Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver
Product
HD66108T00 HD66108TA0 HD66108TA1 HD66108TB0 HD66110STB2 HD66110STB4 HD66110STB5 HD66110STB8 HD66110STC0 HD66110STC1 HD66110STC2 HD66110STC3 HD66112TA2 HD66113TA0 HD66113TA1 HD66115TA0 HD66115TA3 HD66120TA3 HD66120TA4 HD66130TB0 HD66131TB0 HD66132TA3 HD66133TA0 HD66134TA1 HD66135TA1 HD66300T00 HD66322TA0 HD66330TA0 HD66410TA0 HD66410TB0 HD66420TA0 HD66503TA0 HD66503TB0 HD66520TA0 HD66520TB0 HD66522TA0 HD66523TA0 HD66705UxxxTA0 HD66712xxxTA0 HD66717xxxTA0 HD66717xxxTA1 HD66717xxxTA2 HD66724xxxTA0 HD66727xxxTA0 HD66731xxxTA0 HD66731xxxTB0 Function within driver within driver within driver within driver Column Column Column Column Column Column Column Column Column Common Common Common Common Column Column Column Common Column Common Column Common analog digital gray scale within driver within driver within driver Common Common within driver within driver 160ch column driver 240ch column driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Controller/driver Perforrations Tape* Material Adhesive Toray #5900 TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X Toray #5900 Toray #7100 TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E Toray #7100 TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-E TOMOEGAWA-E TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X TOMOEGAWA-X Copper foil Rolled copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Rolled copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Copper foil thicness (um)
Note: Tape material: Kapton, Upilex "Kapton" trademark Dupont, Ltd. "Upilex" trademark Industries, Ltd.
HD66108T00 only
Figure Structures standard
Chip Shipment Products
(chip board) (chip glass) products form only small percentage thin form miniature mounting products shipped. However, these products, which referred here ,,chip shipment products", involve shipping unmounted chips from factory. Since chip shipment products treated semi-finished products, there will differences between their quality guarantee ranges electrical characteristics items those published packaged (i.e., complete) products. differences quality guarantee ranges, electrical characteristics items, visual inspection described (customer approval specifications). Product functionality operation completely identical complete (packaged) product. This section describes standard shipment specifications chip shipment products. actual shipment stipulations will those mentioned stipulated individual products.
Electrical Characteristics Quality Level
mentioned above, quality guarantee ranges electrical characteristics chip shipment products differ from those standard products. Refer individual products specific details. basic differences follows. Electrical Characteristics electrical characteristics chip shipment products guaranteed single point 75°C. Quality Level Electrical characteristics: 4.0% Visual inspection: 4.0% (The specific details visual inspection other items contained CAS.)
Chip Packing Specifications
Delivery Units Delivery unit counts (lot size) range from minimum units 10,000 units. Packing Specifications Trays vacuum packed sealed with trays single pack. chip products given pack will from same production lot. Figure shows chip shipment product packing. Chip products stored trays protected sheet protective paper.
Chip Shipment Products
Markings following items will marked each tray. Product number number Count Inspection certification seal
following items will marked each pack. Product number Disbursement number Count Inspection certification seal
following items will marked outer packing. Product number Disbursement number Count Inspection certification seal
possible, please return empty trays your Hitachi sales representative.
Storage Specifications
After delivery after opening transport packaging, chip shipment products must stored manner that does cause their electrical, physical, mechanical properties degrade humidity reactive contamination. recommend following storage conditions these products. When Stored Packed State Storage conditions: Nitrogen, -30°C degrees below zero, Celsius) Storage period: months date inspection certification seal shall used start storage period.
Chip Shipment Products
When Stored after Bonding Wire Bonding Temperature: under 30°C, Humidity: under 70%, Airborne particles: less than 5000 cubic foot Storage period Seven days Storage conditions Nitrogen, -30°C Storage period days
Cardboard (cover)
Storage condition
Product
Urethane foam Product
Product
Silica
Vacuum pack
Urethane foam
Cardboard
Chip tray
(Unit:
Figure Chip Packing
Chip Shipment Products
Chip Shape Specifications
Figure
Products Available Chip Shipment Products
Hitachi, Ltd. currently provides products listed Table chip shipment products. Refer each data sheet their respective chip sizes bonding layouts. Table
Product HCD44780Uxxx HCD61202U HCD61203U HCD66002 HCD66206 HCD66110SBP HCD66113BP HCD66116BP HCD66120BP HCD66130BP HCD66131BP HCD66132BP HCD66133BP HCD66134BP HCD66135BP HCD66410BP HCD66420BP HCD66503BP HCD66520BP HCD66522BP HCD66523BP HCD66524BP HCD66321 HCD66702Rxxx HCD66705UxxxBP HCD66710xxx HCD66712Uxxx
Chip Shipment Product Table
Base Product HD44780UxxxFS HD61202UFS HD61203UFS HD66002FS HD66206TE HD66110ST HD66113T HD66115T HD66120T HD66130T HD66131T HD66132T HD66133T HD66134T HD66135T HD66410T HD66420 HD66503 HD66520 HD66522 HD66523 HD66524 HD66321 HD66702RxxxF HD66705Uxxx HD66710xxx HD66712Uxxx
Chip Shipment Products
Table
Product HCD66717xxx HCD66717xxxBP HCD66720xxx HCD66724xxx HCD66727xxx HCD66727xxxBP HCD66730xxx HCD66731xxx HCD66731xxxBP HCD66100D HCD66108BP
Chip Shipment Product Table (cont)
Base Product HD66717xxx HD66717xxx HD66720xxx HD66724xxx HD66727xxx HD66727xxx HD66730xxx HD66731xxx HD66731xxx HD66100 HD66108
Min. Max.
Surface shape maximum values
direction: direction: chip dimensions) (unit:
Figure Chip Cross-Section
Reliability Quality Assurance
Views Quality Reliability
Hitachi's basic quality aims meet individual user's purchase purpose quality required, satisfactory quality level considering general marketability. Quality required users specifically clear contract specification provided. not, quality required always definite. both cases, Hitachi tries assure reliability that semiconductor devices delivered perform their function actual operating circumstances. realize this quality manufacturing process, points should establish quality control system process enhance quality ethic. addition, quality required users semiconductor devices going toward higher levels performance electronic system market increasing expanding size application fields. cover situation, Hitachi performing following: Building reliability design stage product development. Building quality sources manufacturing process. Executing stricter inspection reliability confirmation final products. Making quality levels higher with field data feedback. Cooperating with research laboratories higher quality reliability.
With views methods mentioned above, utmost efforts made meet users' requirements.
Reliability Design Semiconductor Devices
Reliability Targets reliability target important factor manufacture sales well performance price. practical rate reliability targets with failure rates under certain common test conditions. reliability target determined corresponding character equipment taking design, manufacture, inner process quality control, screening test method, etc. into consideration, considering operating circumstances equipment semiconductor device used reliability target system, derating applied design, operating condition, maintenance, etc.
Reliability Quality Assurance
Reliability Design achieve reliability required based reliability targets, timely study execution design standardization, device design (including process design, structure design), design review, reliability test essential. 2.2.1 Design Standardization Establishment design rules, standardization parts, material process necessary. establish design rules, critical quality reliability items always studied circuit design, device design, layout design, etc. Therefore, long standardized process, material, etc. used, reliability risk extremely small even newly developed devices, except cases where special functions needed. 2.2.2 Device Design important device design consider total balance process design, structure design, circuit layout design. Especially when processes materials employed, careful technical study executed prior device development. 2.2.3 Reliability Evaluation Test Site Test site sometimes called test pattern. useful method design process reliability evaluation LSIs which have complicated functions. Purposes test site are: Marking fundamental failure mode clear Analysis relation between failure mode manufacturing process condition Search failure mechanism analysis Establishment point manufacturing
Evaluation test site effective because: Common fundamental failure mode failure mechanism devices evaluated. Factors dominating failure mode picked comparison made with processes that have been experienced field. Relation between failure causes manufacturing factors analyzed. Easy tests. Etc.
Reliability Quaity Assurance
Design Review Design review organized method confirm that design satisfies required performance (including users') that design work follows specified methods, whether improved technical items accumulated test data individual major fields field data effectively built addition, from standpoint enhancement competitive power products, major purpose design review ensure quality reliability products. Hitachi, design reviews preformed from planning stage products even design changed products. Items discussed determined design review follows: Description products based specified design documents. From standpoint specialties individual participants, design documents studied, unclear matter found, calculation, experiments, investigation, etc. will carried out. Determine contents reliability methods, etc. based design documents drawings. Check process ability manufacturing line achieve design goal. Discussion about preparation production. Planning execution subprograms design changes proposed individual specialists, tests, experiments calculation confirm design changes. Reference past failure experiences with similar devices, confirmation methods prevent them, planning execution test programs confirmation them. These studies decisions made using check lists made individually depending objects.
Quality Assurance System Semiconductor Devices
Activity Quality Assurance General views overall quality assurance Hitachi are: Problems individual process should solved process. Therefore, final product stage, potential failure factors have been already removed. Feedback information should used ensure satisfactory level process capability. assure required reliability result items mentioned above purpose quality assurance. following discusses device design, quality approval mass production, inner process quality control, product inspection reliability tests.
Reliability Quality Assurance
Quality Approval ensure required quality reliability, quality approval carried trial production stage device design mass production stage based reliability design described section Hitachi's views quality approval are: third party must perform approval objectively from standpoint customers. Fully consider past failure experiences information from field. Approval needed design change work change. Intensive approval executed parts material process. Study process capability variation factor, control points mass production stage.
Considering views mentioned above, Figure shows quality approval performed. Quality Reliability Control Mass Production quality assurance products mass production, quality control execution divided organically function between manufacturing department quality assurance department, other related departments. total function flow shown Figure main points described below. 3.3.1 Quality Control Parts Material performance reliability semiconductor devices improve, importance quality control material parts (crystal, lead frame, fine wire wire bonding, package) build products, materials needed manufacturing process (mask pattern chemicals) increases. Besides quality approval parts materials stated section 3.2, incoming inspection also quality control parts materials. incoming inspection performed based incoming inspection specification, following purchase specification drawings, sampling inspection executed based mainly MIL-STD-105D. other activities quality assurance follows: Outside vendor technical information meeting Approval outside vendors, guidance outside vendors Physical chemical analysis test typical check points parts materials shown Table
Reliability Quaity Assurance
Step
Target specification Design trial production
Contents
Design review
Purpose
Materials, parts approval
Characteristics materials parts Appearance Dimension Heat resistance Mechanical Electrical Others Electrical characteristics Function Voltage Current Temperature Others Appearance, dimension Reliability test Life test Thermal stress Moisture resistance Mechanical stress Others Reliabilty test Process check (same quality approval (1))
Confirmation characteristics reliability materials parts
Characteristics approval
Confirmation target spec. (mainly electrical characteristics)
Quality approval
Confirmation quality reliability design
Quality approval Mass production
Confirmation quality reliability mass production
Fiture Quality Approval Flowchart
Reliability Quality Assurance
3.3.2 Inner Process Quality Control Inner process quality control performs very important function quality assurance semiconductor device. following description control semifinal products, final products, manufacturing facilities, measuring equipments, circumstances submaterials. quality control manufacturing process shown Figure corresponding manufacturing process. Quality control semifinal products final production products Potential failure factors semiconductor devices should removed manufacturing process. achieve this, check points setup each process, products that have potential failure factors transferred next process. high reliability semiconductor devices, especially manufacturing line carefully selected, quality control manufacturing process tightly executed: Strict check each process each lot, 100% inspection remove failure factor caused manufacturing variation, necessary screening, such high temperature aging temperature cycling. Contents inner process quality control are:
Process
Quality control
Method
Material, parts Material, parts
Inspection material parts
Inspection material parts semiconductor devices
sampling confirmation quality level
Manufacturing
Manufacturing equipment, environment, submaterial, worker control
Confirmation quality level
Screening
Inner process quality control
sampling confirmation quality level
100% inspection
100% inspection appearance electrical characteristics
Testing inspection
Products Products inspection
Sampling inspection appearance electrical characteristics
sampling
assurance test
Reliability test
Confirmation quality level, sampling
Receiving Feedback information Shipment Quality information Claim Field experience General quality Information
Customer
Figure Flowchart quality Control Manufacturing Process
Reliability Quaity Assurance
Condition control individual equipment workers, sampling check semifinal products Proposal carrying-out work improvement Education workers Maintenance improvement yield Detection quality problems, execution countermeasures Transmission information about quality
Quality control manufacturing facilities measuring equipment Equipment manufacturing semiconductor devices been developing extraordinarily, with required high performance devices production improvements. They important factors determine quality reliability. Hitachi, automation manufacturing equipment promoted improve manufacturing variation, controls maintain proper operation function high performance equipment. Maintenance inspection quality control performed daily based related specifications, also periodical inspections. inspection, inspection points listed specification checked avoid omissions. During adjustment maintenance measuring equipment, maintenance number specifications checked maintain improve quality. Quality control manufacturing circumstances submaterials Quality reliability semiconductor devices greatly affected manufacturing process. Therefore, manufacturing circumstances (temperature, humidity, dust) control submaterials (gas, pure water) used manufacturing process intensively controlled. Dust control described more detail below. Dust control essential realize higher integration higher reliability devices. Hitachi, maintenance improvement cleanness manufacturing site cleanness executed paying close attention buildings, facilities, airconditioning systems, packaging materials, clothes, work, etc., periodical inspection floating dust room, falling dust, floor dust. 3.3.3 Final product Inspection Reliability Assurance Final product inspection inspection done quality assurance department products that were judged 100% good tests, which final process manufacturing department. Though 100% good products expected, sampling inspection executed prevent inclusion failed products mistake, etc. inspection executed only confirm that products meet users' requirements, consider potential trouble factors. inspection executed based MIL-STD-105D. Reliability assurance tests assure reliability semiconductor devices, periodical reliability tests reliability tests individual manufacturing lots required user performed.
Reliability Quality Assurance
Table Quality Control Check Points Material Parts (Example)
Important Control Items Appearance Dimension Sheet resistance Defect density Crystal axis Appearance Dimension Registration Gradation Appearance Dimension Purity Elongation ratio Appearance Dimension Processing accuracy Plating Mounting characteristics Appearance Dimension Leak resistance Plating Mounting characteristics Electrical characteristics Mechanical strength Composition Electrical characteristics Thermal characteristics Molding performance Mounting characteristics Points Check Damage contamination surface Flatness Resistance Defect numbers Defect numbers, scratch Dimension level Uniformity gradation Contaminatin, scratch, bend, twist Purity level Mechanical strength Contamination, scratch Dimension level Bondability, solderability Heat resistance Contamination, scratch Dimension level Airtightness Bondability, solderability Heat resistance Mechanical strength Characteristics plastic material
Material, Parts wafer
Mask
Fine wire wire bonding
Frame
Ceramic package
Plastic
Molding performance Mounting characteristics
Reliability Quaity Assurance
Process
Purchase material Wafer Surface oxidation Inspection surface oxidation Photo resist Inspection photo resist level check Diffusion Inspection diffusion level check Evaporation Inspection evaporation level check Wafer inspection Inspection chip electrical characteristics Chip scribe Inspection chip appearance judgement Frame Assembling Assembling Appearance after chip bonding Appearance after wire bonding Pull strength, compression width, shear strength Appearance after assembling Quality check chip bonding Quality check wire bonding Prevention open short Wafer Chip Thickness, characteristics Prevention cracks, quality assurance scribe Electrical characteristics Appearance chip Evaporation Diffusion Diffusion depth, sheet resistance Gate width Characteristics oxide film, breakdown voltage Thickness vapor film, scratch, contamination Photo resist Dimension, appearance Dimension level Check photo resist Diffusion status Control basic parameters (VTH, etc.) cleanness surface Prior check Breakdown voltage check Assurance standard thickness Wafer Oxidation Appearance, thickness oxide film Characteristics, appearance Scratch, removal crystal defect wafer Assurance resistance Pinhole, scratch
Control Point
Purpose Control
level check Inspection after assembling judgement Package Sealing level check Final electrical inspection Failure analysis Appearance inspection Sampling inspection products Receiving Shipment Sealing Marking
Appearance after sealing Outline, dimension Marking strength
Guarantee appearance dimension
Analysis failures, failure mode, mechanism
Feedback analysis information
Figure Example Inter Process Quality Control
Reliability Quality Assurance
Customer Claim (failures, information) Sales dept. Sales engineering dept.
Failure analysis Quality assurance dept.
Manufacturing dept.
Design dept.
Countermeasures, execution countermeasures
Report
Quality assurance dept.
Follow-up confirmation countermeasure execution
Report
Sales engineering dept. Reply
Customer
Figure Process Flowchart Field Failure
Reliability Test Data Drivers
Introduction
liquid crystal displays with microcomputer application systems been increasing, because their power consumption, freedom display pattern design, thin shape. power consumption high density packaging have been achieved through CMOS process flat plastic packages, respectively. This chapter describes reliability quality assurance data Hitachi driver LSIs based test data failure analysis results.
Chip Package Structure
Hitachi driver family uses power CMOS technology flat plastic package. Sigate process used high reliability high density. Chip structure basic circuit shown Figure package structure shown Figure
Gate
P-Well SiO2 Source FET2
Drain
FET1 FET2 N-channel EMOS P-channel EMOS
Figure Chip Structure Basic Circuit
Chip Bonding wire
Plastic
Lead
Figure Package Structure
Reliability Test Data Drivers
Reliability Test Results
test results driver family shown Tables Table
Device HD44780 HD66100F HD61202U HD61203U HD64646F HD66841 HD61830 HD61830B
Test Result High Temperature Operation 125°C, 5.5V)
Sample Size Component Hour 90,000 45,000 50,000 40,000 32,000 45,000 40,000 40,000 Failure
Table
Test Item
Test Result
Test Condition 150°C, 1000h -55°C, 1000h 65°C, 100h 85°C, 1000h 121°C, atm. 100h Sample Size Component Hour Failure 180,000 140,000 860,000 170,000 20,000
High temp, storage temp, storage Steady state humidity Steady state humidity, biased Pressure cooker Note: Aluminum corrosion
Reliability Test Data Driver
Table
Test Items Thermal chock Temperature cycling Soldering heat Resistance Solderability
Test Results
Test Condition 100°C cycles -55°C 150°C cycles 260°C, seconds 215°C, seconds 230°C, seconds Sample Size Failure
Quality Data from Field
Field failure rate estimated advance through production process evaluation reliability tests. Past field data similar devices provides basis this estimation. Quality information from users indispensable improvement product quality. Therefore, field data products delivered users followed carefully. basis information furnished user, failure analysis conducted results quickly back design production divisions. Failure analysis results LSIs returned Hitachi shown Figure
Damaged excessive voltage and/or current (26.7%) Good devices (38.8%) Sample size 3,873
Assembly (3.1%) Marginal 14.5% Poor functional test pattern (3.1%)
Others 13.8%
Figure Failure Analysis Result
Reliability Test Data Drivers
Precautions
Storage preferable store semiconductor devices following ways prevent deterioration their electrical characteristics, solderability, appearance, breakage. Store ambient temperature 30°C, relative humidity 60%. Store clean environment, free from dust reactive gas. Store container that does induce static electricity. Store without physical load. semiconductor devices stored long time, store them unfabricated form. their lead wires formed beforehand, bent parts corrode during storage. chips unsealed, store them cool, dry, dark, dustless place. Assemble them within days after unpacking. Storage nitrogen desirable. They stored days less nitrogen with point -30°C lower. Unpackaged devices must stored over months. Take care allow condensation during storage rapid temperature changes. Transportation with storage methods, general precautions other electronic component parts applicable transportation semiconductors, semiconductor-incorporating units other similar systems. addition, following considerations must taken, too: containers jugs which will induce static electricity result vibration during transportation. desirable electrically conductive container aluminium foil. Prevent device breakage from clothes-induced static electricity. When transporting printed circuit boards which semiconductor devices mounted, suitable preventive measures against static electricity induction must taken; example, voltage built-up prevented shorting terminal circuit. When conveyor belt used, prevent conveyor belt from being electrically charged applying some surface treatment. When transporting semiconductor devices printed circuit boards, minimize mechanical vibration shock.
Reliability Test Data Driver
Handling Measurement Avoid static electricity, noise, surge voltage when measuring semiconductor devices measured. possible prevent breakage shorting their terminal circuits equalize electrical potential during transportation. However, when devices measured mounted, their terminals left open providing possibility that they accidentally touched worker, measuring instrument, work bench, soldering iron, conveyor belt, etc. device will fail touches something that leaks current static charge. Take care allow curve tracers, synchroscopes, pulse generators, D.C. stabilizing power supply units, etc. leak current through their terminals housings. Especially, while testing devices, take care apply surge voltage from tester, attach clamping circuit tester, apply abnormal voltage through contact from current source. During measurement, avoid miswiring short-circuiting. When inspecting printed circuit board, make sure that there soldering bridge foreign matter before turning power switch. Since these precautions depend upon types semiconductor devices, contact Hitachi further details.
Flat Plastic Package (QFP) Mounting Methods
Surface Mounting Package Handling Precautions
Package Temperature Distribution most common method used mounting surface mounting device infrared reflow. Since package made black epoxy resin, portion package directly exposed infrared heat source will absorb heat faster thus rise temperature more quickly than other parts package unless precautions taken. shown example Figure surface directly facing infrared heat source 30°C higher than leads being soldered 50°C higher than bottom package. soldering performed under these conditions, package cracks occur. avoid this type problem, recommended that aluminum infrared heat shield placed over resin surface package. using 2-mm thick aluminum heat shield, bottom surfaces resin held 175°C when peak temperature leads 240°C. Package Moisture Absorption epoxy resin used plastic packages will absorb moisture stored high-humidity environment. this moisture absorption becomes excessive, there will sudden vaporization during soldering, causing interface resin lead frame spread apart. extreme cases, package cracks will occur. Therefore, especially thin packages, important that moisture-proof storage used. remove moisture absorbed during transportation, storage, handling, recommended that package baked 125°C hours before soldering. Heating Cooling method soldering electrical parts solder method, compared reflow method, rate heat transmission order magnitude higher. When this method used with plastic items, there thermal shock resulting package cracks deterioration moisture-resistant characteristics. Thus, recommended that solder method used. Even with reflow method, excessive rate heating cooling undesirable. rate temperature change less than 4°C/sec recommended.
Flat Plastic Package (QFP) Mounting Methods
Package Contaminants recommended that resin-based flux used during soldering. Acid-based fluxes have tendency leaving acid residue which adversely affects product reliability. Thus, acid-based fluxes should used. With resin-based fluxes well, residue left behind, leads other package parts will begin corrode. Thus, flux must thoroughly washed away. cleansing solvents used wash away flux left package extended period time, package markings fade, care must taken. precautions mentioned above general points observed reflow. However, specific reflow conditions will depend such factors package shape, printed circuit board type, reflow method, device type. reference purposes, example reflow conditions infrared reflow furnace given Figure values given figure refer temperature package resin, leads must also limited maximum 260°C seconds less. reflow methods, infrared reflow most common. addition, there also paper phase reflow method. recommended conditions paper phase reflow furnace given Figure details surface mounting small thin packages, please consult separate manual available mounting. there additional questions, please contact Hitachi, Ltd.
(Resin)
Infrared rays (Surface)
Temperature (°C)
(Soler)
Time (sec)
Figure Temperature Profile During Infrared Heat Soldering (Example)
Flat Plastic Package (QFP) Mounting Methods
sec. max. Temperature 235°C 160°C 5°C/sec Time 4°C/sec.
Figure Recommended Reflow Conditions
sec. max. 215°C
Temperature
190°C
5°C/sec
Time
Figure Example Vapor-Phase Reflow Conditions
Flat Plastic Package (QFP) Mounting Methods
Soldering Iron Method Reflow Method (Spare Solder) Reflow Method (Solder Paste)
Board Parts Solder
Board Solder paste
Board
Solder
Tacking
Flux
Spare solder
Spare solder parts
Printing
Soldering ~260°C seconds)
Flux applying
Tacking
Tacking
Preheating 150°C seconds)
Washing Preheating 150°C seconds) Reflow 235°C seconds) Reflow 235°C seconds)
(Resin coating)
Washing
Washing
(Resin coating)
(Resin coating)
Figure Recommended Paper Phase Reflow Conditions
Liquid Crystal Driving Methods
Liquid Crystal Driving Methods
Driving liquid crystal direct current triggers electrode reaction inside liquid cell, degrading display quality rapidly. liquid crystal must driven alternating current. driving method includes static driving method multiplex driving method, each which features different applications. Hitachi developed different driver devices corresponding static driving method multiplex driving method. following sections describe features each driving method, driving waveforms, apply bias.
Static Driving Method
Figure shows driving waveforms static driving method example which ,,4" displayed segment method. static driving method most basic method which good display quality obtained. However, suitable liquid displays with many segments because liquid crystal driver circuit required segment. static driving method uses frame frequency (1/tf) several tens several hundreds
Liquid crystal display terminal connection
COM0 COM0 SEGn
SEGn+7 SEGn+6 SEGn+5
COMn+1
SEGn SEGn+1
SEGn+2
SEGn+3
SEGn+4
COM0-SEGn+1 Selected waveform
frame COM0-SEGn+1 Non-selected waveform
Figure Example Static Drive Waveforms (Example HD61302R/HD61603R)
Liquid Crystal Dribing Methods
Multiplex Driving Method
multiplex driving method effective reducing number driver circuits, number connections between circuit display cell, cost when driving many display picture elements. Figure shows comparison static drive with multiplex drive (1/3 duty cycle) 8digit numeric display. number liquid crystal driver circuits required former latter. multiplex drive reduces number driver circuits. However, greater multiplexing reduces driving voltage tolerance. Thus, there limits extent multiplexing. There types multiplex drive waveforms: type type. type, shown Figure used alternation frame. type used alternation between frames (Figure type better display quality than type high multiplex drive.
1b1g
Static driving method
Common
Multiplex driving method (1/3 duty cycle) Com1 Com2 Com3
1D.P 2D.P
8D.P
S4S5
Figure Example Comparison Static Drive wipth Multiplex Drive
Liquid Crystal Driving Methods
Common
Segment
Common-segment
frame
Figure Type Waveforms (1/3 Duty Cycle, Bias)
Common
Segment
Common-segment
frame
Figur Type Waveforms (1/3 Duty Cycle, Bias)
Liquid Crystal Dribing Methods
Bias, Duty Drive duty drive method, driver circuit drives segments. Figure shows example connection display liquid crystal display 7-segment type, output waveforms.
Liquid crystal display terminal connection COM0
COM1 COM1 COM0
SEGn
SEGn+1 SEGn+1 SEGn+2 SEGn+3 SEGn
COM0-SEGn (selected waveform)
COM0-SEGn+1 (non-selected waveform) frame
Figure Example Waveforms Duty Cycle Drive Type) (Example HD61602R)
Liquid Crystal Driving Methods
Bias, Duty Cycle Drive duty cycle drive, segments driven segment output driver. Figure shows example connection display liquid crystal display 7-segment type, output waveforms.
Liquid crystal display terminal connection
COM0
frame
COM2
COM1
COM1 COM2 COM0
SEGn
SEGn+1
SEGn+2
SEGn SEGn+1 SEGn+2
COM0-SEGn (selected waveform)
COM0-SEGn+1 (non-selected waveform)
Figure Example Waveforms Duty Cycle Drive Type) (Example HD61602R)
Liquid Crystal Dribing Methods
Bias, Duty Cycle Drive duty cycle drive, segments driven segment output driver. Figure shows example connection display liquid crystal display 7-segment type, output waveforms.
COM0 Liquid crystal display terminal connection
COM3 COM2
COM1
COM2 COM1 COM0
COM3
SEGn
SEGn+1 COM0-SEGn (non-selected waveform) frame
SEGn
SEGn+1
COM3-SEGn (selected waveform)
Figure Example Waveforms Duty Cycle Drive Type) (Example HD61602R)
Liquid Crystal Driving Methods
Bias, Duty Cycle Drive
Liquid crystal display COM1 COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 SEG1 SEG2 SEG3 SEG4 SEG5 SEG1
V2(V3) (V3) (V3) (V3) VLCD
COM2
1/4VLCD V2(V3) 1/2VLCD 3/4VLCD VLCD Example same voltage
SEG2
1/4VLCD -1/4VLCD
COM1-SEG1 (selected waveform)
-VLCD
1/2VLCD 1/4VLCD COM2-SEG1 (non-selected waveform) -1/4VLCD -1/2VLCD frame
Figure Example Waveforms Duty Cycle Drive Type) (Example LCD-II)
Liquid Crystal Dribing Methods
Bias, Duty Cycle Drive
2345
Common
duty, bias
Segment Common Common Data Segment Segment
Common
Common Liquid crystal display waveforms
Segment
Between segment common (display off) frame
Between segment common (display
Figure Example Waveforms Duty Cycle Drive Type) (Example HD66002)
Liquid Crystal Driving Methods
Bias, 1/16 Duty Cycle Drive
Liquid crystal display COM1 COM2 SEG1 SEG2 SEG1 SEG2 SEG3 SEG4 SEG5 VLCD
COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8
COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
COM1-SEG1 (selected waveform) 1/5VLCD 2/5VLCD 3/5VLCD 4/5VLCD VLCD
1/5VLCD -1/5VLCD
-VLCD VLCD 3/5VLCD 1/5VLCD
COM1-SEG1 (non-selected waveform)
-1/5VLCD -3/5VLCD -VLCD frame
Figure Example Waveforms 1/16 Duty Cycle Drive Type) (Example LCD-II)
Liquid Crystal Dribing Methods
Bias, 1/32 Duty Cycle Drive
COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM17 COM18 COM19 COM20 COM21 COM22 COM23 COM24 COM25 COM26 COM27 COM28 COM29 COM30 COM31 COM32 COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM17 COM18 COM19 COM1 COM2 SEG1 SEG2 VLCD 3/5VLCD 1/5VLCD
-1/5VLCD COM1 SEG1 (non-selected waveform) -3/5VLCD -VLCD VLCD
COM1 SEG8 1/5VLCD (selected waveform) -1/5VLCD
-VLCD frame
Figure Example Waveforms 1/32 Duty Cycle Drive (Example HD66108)
Liquid Crystal Driving Methods
Power Supply Circuit Liquid Crystal Drive
Table shows relationship between number driving biases display duty cycle ratios. Resistive Dividing Driving bias generally generated resistive divider (Figure 12). resistance value settings determined considering operating margin power consumption. Since liquid crystal display load capacitive, drive waveform itself distorted charge/discharge current when liquid crystal display drive waveform applied. reduce distortion, resistance value should decreased this increases power consumption because increase current through dividing resistors. Since larger liquid crystal display panels have larger capacitance, resistance value must decreased proportionally. Table Relationship between Number Display Duty Cycle Ratio Numver Driving Biases
Static 1/11 1/12 1/14 1/16 1/24 1/32 1/64
Display Duty Ratio Number driving biases
(1/2 bias) (1/3 bias)
(1/4 bias)
(1/5 bias)
(+5V) bias (1/8, 1/11 duty cycle) VLCD
(+5V) bias (1/16 duty cycle) VLCD
Figure Example Driving Voltage Supply
Liquid Crystal Dribing Methods
efficient connect capacitor resistors parallel shown Figure order improve charge/discharge distortion. However, effect limited. Even attempted reduce power consumption with large resistor improve waveform distortion with large capacitor, level shift occurs operating margin improved. Since liquid crystal display load matrix configuration, path charge/discharge current through load complicated. Moreover, varies depending display condition. Thus, value resistance cannot simply determined from load capacitance liquid crystal display. must experimentally determined according demand power consumption equipment which liquid crystal display incorporated. Generally, capacitor required. capacitor usually used necessary.
(+5V) contrast adjustment Common/segment selected high level Common non-selected high level Segment non-selected high level Segment non-selected level Common non-selected level Common/segment selected level
With
Large cause level shift. Without
Figure Example Capacitor Connection Improvement Liquid Crystal Display Drive Waveform Distortion (1/5 Bias) (Example LCD-II)
Liquid Crystal Driving Methods
Drive Operational Amplifier graphic displays, size liquid crystal becomes larger display duty ratio becomes smaller, stability liquid crystal drive level more important than small display system. Since liquid crystal graphic displays large many picture elements, load capacitance becomes large. high impedance power supply liquid crystal drive produces distortion drive waveforms, degrades display quality. this reason, liquid crystal drive level impedance should reduced with operational amplifiers. Figure shows example operational amplifier configuration. load current flows through dividing resistors because high input impedance operational amplifiers. high resistance used. Generation Liquid Crystal Drive Levels power supply circuit liquid crystal drive level incorporated LSI, such portable calculator with liquid crystal display. HD61602R, HD61603R small display systems built-in power supply circuit liquid crystal drive levels. Precaution Power Supply Circuits driver types power supplies: logical circuits other liquid crystal display drive circuit. power supply system complicated because several liquid crystal drive levels. this reason, power supply design, take care deviate from voltage range assured maximum rating rise power supply from potential sequence each power supply. input terminal level indefinite, through current flows power consumption increases because CMOS process driver. Simultaneously, potential sequence each power supply becomes wrong, which cause latch-up.
(+5V)
Common/segment selected high level Common non-selected high level Segment non-selected high level Segment non-selected level Common selected level Common/segment selected level
(-5V)
Contrast adjustment
liquid crystal drive logic circuits Operational amplifier voltage follower
Figure Drive Operational Amplifier (1/5 Bias)
Hitachi Controller/Driver Data Book
Publication Date: Edition, September 1994 Edition, August1998 Published Semiconductor Div. Hitachi, Ltd. Technical Documentation Center Edited Hitachi Microcomputer System Ltd. Copyright Hitachi, Ltd., 1995. rights reserved. Printed Japan.
Other recent searches
Way-0 - Way-0 Way-0 Datasheet
SCN-2-15+ - SCN-2-15+ SCN-2-15+ Datasheet
SD1732 - SD1732 SD1732 Datasheet
SCP25C60 - SCP25C60 SCP25C60 Datasheet
RXE017-2 - RXE017-2 RXE017-2 Datasheet
MC7800 - MC7800 MC7800 Datasheet
GS4021 - GS4021 GS4021 Datasheet
AN4137 - AN4137 AN4137 Datasheet
Privacy Policy | Disclaimer
© 2013 Datasheets.org.uk