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2SC4626G
Top Searches for this datasheet2SC4626G - 2SC4626G 2SC4626G Silicon epitaxial planar type high-frequency amplification Features Package Absolute Maximum Ratings 25°C Parameter Symbol VCBO VCEO VEBO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Collector power dissipation Junction temperature Storage temperature Electrical Characteristics 25°C Parameter Symbol ICBO Collector-base cutoff current (Emitter open) Forward current transfer ratio Transition frequency Noise figure Reverse transfer impedance Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Rank classification Rank No-rank Common-emitter reverse transfer capacitance Product no-rank classified have indication rank. Publication date: 2007 disc Rating Unit Tstg +125 Conditions Unit 10.7 SJC00390AED Optimum amplification FM/AM radios High transition frequency SS-Mini type package, allowing downsizing equipment automatic insertion through tape packing Code SSMini3-F3 Marking Symbol: Name Base Emitter Collector 2SC4626G 25°C 25°C Collector power dissipation (mW) Collector current (mA) Collector current (mA) Ambient temperature (°C) Collector-emitter voltage Base current (mA) 25°C Collector-emitter saturation voltage VCE(sat) VCE(sat) Collector current (mA) Base current (mA) 85°C 85°C 25°C -25°C 25°C -25°C 0.01 Base-emitter voltage Base-emitter voltage Collector current (mA) Collector output capacitance (pF) (Common base, input open circuited) 25°C Forward current transfer ratio 85°C 25°C -25°C Collector current (mA) Collector-base voltage SJC00390AED SSMini3-F3 Unit: 1.60 -0.03 +0.05 +0.05 0.26 -0.02 0.85 -0.03 1.60 ±0.05 +0.05 (0.50) (0.50) 0.13 -0.02 +0.05 1.00 ±0.05 (5°) 0.375 ±0.05 (5°) 0.10 0.70 -0.03 +0.05 (0.45) Request your special attention precautions using technical information semiconductors described this book products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products, license granted under intellectual property right other right owned company other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd. Other recent searchesSi9407BDY - Si9407BDY Si9407BDY Datasheet SG211V - SG211V SG211V Datasheet MLC852A - MLC852A MLC852A Datasheet MBRD835L - MBRD835L MBRD835L Datasheet KMM366F40 - KMM366F40 KMM366F40 Datasheet
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