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2SC4626G


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2SC4626G - 2SC4626G  


2SC4626G
Silicon epitaxial planar type
high-frequency amplification Features Package
Absolute Maximum Ratings 25°C
Parameter Symbol VCBO VCEO VEBO Collector-base voltage (Emitter open) Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open) Collector current
Collector power dissipation Junction temperature Storage temperature
Electrical Characteristics 25°C
Parameter Symbol ICBO Collector-base cutoff current (Emitter open) Forward current transfer ratio Transition frequency Noise figure
Reverse transfer impedance
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Rank classification Rank No-rank
Common-emitter reverse transfer capacitance
Product no-rank classified have indication rank.
Publication date: 2007
disc
Rating Unit Tstg +125 Conditions Unit 10.7
SJC00390AED
Optimum amplification FM/AM radios High transition frequency SS-Mini type package, allowing downsizing equipment automatic insertion through tape packing
Code SSMini3-F3 Marking Symbol: Name Base Emitter Collector
2SC4626G
25°C
25°C
Collector power dissipation (mW)
Collector current (mA)
Collector current (mA)
Ambient temperature (°C)
Collector-emitter voltage
Base current (mA)
25°C
Collector-emitter saturation voltage VCE(sat)
VCE(sat)
Collector current (mA)
Base current (mA)
85°C
85°C
25°C -25°C
25°C
-25°C
0.01
Base-emitter voltage
Base-emitter voltage
Collector current (mA)
Collector output capacitance (pF) (Common base, input open circuited)
25°C
Forward current transfer ratio
85°C
25°C -25°C
Collector current (mA)
Collector-base voltage
SJC00390AED
SSMini3-F3
Unit:
1.60 -0.03
+0.05 +0.05
0.26 -0.02
0.85 -0.03
1.60 ±0.05
+0.05
(0.50)
(0.50) 0.13 -0.02
+0.05
1.00 ±0.05
(5°)
0.375 ±0.05
(5°)
0.10
0.70 -0.03
+0.05
(0.45)
Request your special attention precautions using technical information semiconductors described this book
products technical information described this book exported provided non-residents, laws regulations exporting country, especially, those with regard security export control, must observed. technical information described this book intended only show main characteristics application circuit examples products, license granted under intellectual property right other right owned company other company. Therefore, responsibility assumed company infringement upon such right owned other company which arise result technical information described this book. products described this book intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this book subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with range absolute maximum rating guaranteed operating conditions (operating power supply voltage operating environment etc.). Especially, please careful exceed range absolute maximum rating transient state, such power-on, power-off mode-switching. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. Comply with instructions order prevent breakdown characteristics change external factors (ESD, EOS, thermal stress mechanical stress) time handling, mounting customer's process. When using products which damp-proof packing required, satisfy conditions, such shelf life elapsed time since first opening packages. This book reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd.

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