| Fulltext Datasheet Results |
1 - 50 of about 50 for 29X29 |
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First line: 29X29 JEITA Package Code P-HBGA729-29x29-1.00 RENESAS Code PRBG0729FA-A Previous Code 729F7K MASS[Typ.] 9.8g Abstract: .. ] RENESAS Code JEITA Package Code Previous Code P-HBGA729-29x29-1.00 9.8g 729F7K PRBG0729FA-A. φ b. φ× M S AB. ×4. 1.5 ZE 1.5 ZD. b. A1. y 0.2. e 1.0. x. 0.4 0.5 0.6. A 3.4. E 29.0. D 29.0. Reference Symbol Dimension .. Tags: 29X29 PRBG0729FA-A |
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First line: JEITA Package Code P-HBGA554-29x29-1.00 RENESAS Code PRBG0554FA-A Previous Code 554F7K Abstract: .. ] RENESAS Code JEITA Package Code Previous Code P-HBGA554-29x29-1.00 3.1g 554F7K PRBG0554FA-A. φ b. φ× M S AB. .. Tags: PRBG0554FA-A |
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First line: BGA 15X15 MBH29002 MBH29002* MBH29002 Series=CMBA022929 MBH29002-H12 MBH29002-H25 1373258 1373259 Model CMBA022929 Series Heat Sink 29x29 Chip Abstract: .. CMBA022929 Series For 29x29 Chip set. CMBA022929 Series. 1.Material : Al 6063. 2.Dimension : Foot print : 29x29mm. Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm. 3.Finish: Black Anodize .. Tags: MBH29002* MBH29002 BGA 15X15 6063 MBH29002 MBH29002-H12 MBH29002-H25 |
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First line: 0.97mm [0.038"] 37.50mm [1.476"] 0.97mm [0.038"] 1.27mm typ. Abstract: .. surface mount land pattern to terminal pins 1.27mm [0.050"] centers, 29x29 array Status: Released. Drawing: S.Natarajan. Scale: 3:1 Rev: A. Date: 6/3/05. Modified: File: LS-BGA829A-31 Dwg. LS .. Tags: datasheet abstract.. |
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First line: 37.50mm [1.476"] View 0.97mm [0.038"] 0.97mm [0.038"] 1.27mm typ. 37.50mm [1.476"] Abstract: .. 480 position BGA surface mount land pattern to terminal pins 1.27mm [0.050"] centers, 29x29 array Status: Released. Drawing: S. Faiz. Scale: 3:1 Rev: A. Date: 5/12/08. Modified: File: LS-BGA480B .. Tags: datasheet abstract.. |
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First line: 37.50mm [1.476"] View 0.97mm [0.038"] 0.97mm [0.038"] 1.27mm typ. 37.50mm [1.476"] Side View 1.68mm [0.066"] Abstract: .. surface mount land pattern to terminal pins 1.27mm [0.050"] centers, 29x29 array Status: Released. Drawing: S.Natarajan. Scale: 3:1 Rev: A. Date: 6/3/05. Modified: File: LS-BGA480B-31 Dwg. LS .. Tags: datasheet abstract.. |
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First line: 37.50mm [1.476"] View 0.97mm [0.038"] 0.97mm [0.038"] 1.27mm typ. 37.50mm [1.476"] Side View 1.68mm [0.066"] Abstract: .. surface mount land pattern to terminal pins 1.27mm [0.050"] centers, 29x29 array Status: Released. Drawing: S.Natarajan. Scale: 3:1 Rev: A. Date: 5/26/05. Modified: File: LS-BGA841A-31 Dwg .. Tags: datasheet abstract.. |
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First line: 729-PIN PLASTIC (FLIP CHIP TYPE)(29x29) Abstract: .. 729-PIN PLASTIC BGA FLIP CHIP TYPE 29x29 E1. .. Tags: P729F5-100-NN9-1* datasheet abstract.. |
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First line: NP383 Series (Open Top) Chip Scale Package 1,000M min. 100V Insulation Resistance: Dielectric Withstanding Voltage: 100V minute Contact Resistance: 100m max. 10mA/20mV max. Operating Temperature Range: -40°C +150°C 10gf approx. Contact Force: 2.2kg ±0.5 Operating Force: (CSP, 0.50mm P Abstract: .. NP383-84107-* 29x29 15.0x15.0 33.0x33 7x7. .. Tags: NP383 |
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First line: forging Model Name MBA29001-15W/2.6 Heat Sink Specification: 1.Material: Heat Sink Aluminum 6063 Clip Plastic (UL94-V0) 2.Heat Sink Dimension 28.6*28.6*14.6 height (with base) Base 2.6mm, height 12mm 3.Weight: 13.8 4.Technology: Precision Forging 5.Finish: Black Nature Anodize Clip available Chip th Abstract: .. For 29x29 Chip setMBA29001-15W/2.6. 0.0. 0.5. 1.0. 1.5. 2.0. 2.5. 3.0 3.5. 4.0. 4.5. 5.0. 5.5. 6.0. 6.5. 7.0. 0 100 200 300 400 500 600 700 800 900 1000. Air Velocity LFM Rsa oC/W 0.00. 0.02. 0.03. 0.05. 0.06. 0.08. 0.09 .. Tags: forging MBA29001-15W 2 |
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First line: str 451 BQFP132 BROTHANEK COMPONENTS GMBH Datasheet Art.No.: Suitable development experiments with different package types. adapters could connected with pin-headers number different prototyping boards with 2.54mm Hole spacing. connection between prototyping board Adapter will made with headers. Mat Abstract: .. PQFP160 3 29x29 160 0.65. Material : Epoxy FR4 , 1.5 mm. Size : 199 x 125 mm. Hole spacing : 2.54 mm. Trace : Refer to picture. Hole diameter : 1.0 mm. Surface : 35 μ Copper foil, solder mask, chem. nickel/gold .. Tags: BQFP132 str 451 PQFP160 9505 BQFP100 BQFP132 BQFP164 PQFP160 |
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First line: 45.23mm [1.781"] 2.50mm [0.099"] 2.71mm [0.107"] 2.50mm [0.099"] 2.33mm [0.092"] 2.54mm [0.100"] 45.23mm [1.781"] Abstract: .. position surface mount land pattern to terminal pins 1.27mm centers, 29x29 array . To be used with GHz sockets. Status: Released. Drawing: S. Faiz. Scale: 3:1 Rev: A. Date: 5/6/08. Modified: File .. Tags: bga48* datasheet abstract.. |
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First line: PLASTIC (29x29) Abstract: .. 272 PIN PLASTIC BGA 29x29 φ φ. Index mark Z. 0.25 MIN. 0.009 MIN. Y C1.5 0.059. Z C0.5 0.020. NOTES .. Tags: S272S* datasheet abstract.. |
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First line: NP276-75319-1 NP276-75319-1 1.27mm typ. [0.050"] Abstract: .. 633 open top ZIF socket customer provided 1.27mm [0.050"] centers, 29x29 array to 625 pin 25x25 PGA base array 2.54mm [0.100"] center . 8 pins are NC. Status: Released Drawing: E Smolentseva .. Tags: np276 NP276-75319-1 |
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First line: AM2 Processor Functional Data Sheet amd 31117* am2 pin socket AM2 AM2 31117 AthlonTM Processor Product Data Sheet Compatible with Existing 32-Bit Code Base Including support SSE, SSE2, SSE3*, MMXTM, 3DNow!TM technology legacy instructions *SSE3 supported later processors 754-Pin Package Specific Fea Abstract: .. • Packaging – 754-pin lidded micro PGA – 1.27-mm pin pitch – 29x29-row pin array – 40mm x 40mm organic substrate – Organic C4 die attach. • Integrated Memory Controller – Low-latency, high-bandwidth .. Tags: AM2 31117 am2 pin amd 31117* Socket AM2 Processor Functional Data Sheet socket AM2 socket 939 datasheet socket 939 Socket 754 order #31117 athlon socket AM2 athlon AM2 AMD64 amd publication 31117 amd athlon 64 socket 754 AMD64 |
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First line: 31117 athlon AM2 amd 31117* amd athlon 64 socket 939 AthlonTM Processor Product Data Sheet Compatible with Existing 32-Bit Code Base Including support SSE, SSE2, SSE3, MMXTM, 3DNow!TM technology legacy instructions (SSE3 supported later processors) Runs existing operating systems drivers Local APIC Abstract: .. • Packaging – 754-pin lidded micro PGA – 1.27-mm pin pitch – 29x29-row pin array – 40mm x 40mm organic substrate – Organic C4 die attach. • Integrated Memory Controller – Low-latency, high-bandwidth .. Tags: amd athlon 64 socket 939 socket AM2 Socket 754 athlon socket AM2 athlon AM2 AMD64 amd publication 31117 amd athlon 64 socket 754 amd 31117* AM2 socket data AM2 Processor Functional Data Sheet am2 pins AMD64 |
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First line: Socket Direct mount, solderless Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection View Minimum real estate required 42.725mm Compression plate distributes forces evenly Ball guide prevents over compression elastomer Easily removable swivel socket Abstract: .. Array: 29x29. D. E. Øb. TOP VIEW. SIDE VIEW. C o m. p a ti. b le B. G A S. p e c. BOTTOM VIEW. e. DIM. MIN. MAX. A. 2.5. A1. 0.7. b. 0 .. Tags: datasheet abstract.. |
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First line: 57.55mm Socket Direct mount, solderless Features Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Abstract: .. Array 29x29. D2. E2. D3. E3. D1. E1. A2 1.0 1.2. D1/E1 28.0. 27.8 28.2. 22.8 23.2. D2/E2. D3/E3. A. A1. DETAIL. 0.2 Z Z. 0 .. Tags: diode sg 03 BGA OUTLINE DRAWING A 6099 datasheet abstract.. |
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First line: Socket Direct mount, solderless Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required 42.725mm Compression plate distributes forces evenly Ball guide prevents over compression elastomer Easily removable swivel socket Abstract: .. Array: 29x29. D. E Y. X. Ø0.25 Ø0.10. Z X. Y. Øb. TOP VIEW. SIDE VIEW. C o m. p a ti. b le B. G A S. p e c. 0.20. BOTTOM VIEW. e .. Tags: datasheet abstract.. |
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First line: Socket Direct mount, solderless Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required 30.225mm Compression plate distributes forces evenly Ball guide prevents over compression elastomer Easily removable swivel socket Abstract: .. 24.00 BSC 24.00 BSC 0.8 BSC Array 29x29. 3 4 5. Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter .. Tags: datasheet abstract.. |
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First line: Socket Direct mount, solderless Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Abstract: .. PAGE 3 of 4 Array: 29x29. D. E. Øb. TOP VIEW. SIDE VIEW. C o m. p a ti. b le B. G A S. p e c. BOTTOM VIEW. e. DETAIL. DIM. MIN .. Tags: datasheet abstract.. |
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First line: Socket Direct mount, solderless Directly mounts target (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required 42.725mm Compression plate distributes forces evenly Ball guide prevents over compression elastomer Easily removable swivel socket Abstract: .. Array: 29x29. D. E Y. X. Ø0.25 Ø0.10. Z X. Y. Øb. TOP VIEW. SIDE VIEW. C o m. p a ti. b le B. G A S. p e c. 0.20. BOTTOM VIEW. e .. Tags: datasheet abstract.. |
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First line: 31117 SEMPRON Processors Socket 754 SempronTM Processor Product Data Sheet Compatible with Existing 32-Bit Code Base Including support SSE, SSE2, SSE3*, MMXTM, 754-Pin Package Specific Features 3DNow!TM technology legacy instructions *SSE3 supported Rev. later processors Refer Functional Data Sheet, Abstract: .. • Packaging – 754-pin lidded micro PGA – 1.27-mm pin pitch – 29x29-row pin array – 40mm x 40mm organic substrate – Organic C4 die attach. • Integrated Memory Controller – Low-latency, high-bandwidth .. Tags: AM2 31117 Socket am2 Processor Functional Data Sheet socket AM2 Socket 754 SEMPRON Processors Socket 754 sempron amd sempron 754 sempron AMD64 amd publication 31117 amd 31117* am2 specification AMD64 |
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First line: diode sg 94 12x12 mlf BGA Package 14x14 SCR 6004 1mm pitch BGA socket Sockets SG.1 sockets provide excellent signal integrity small, cost effective socket prototype test applications. They support pitches from 1.27mm down 0.5mm. typically ship within days ARO. Abstract: .. SG-BGA-6099 1 29x29 829 31 31 0.2 3.56 0.7 0.2 0.6 0.4 included. SG-BGA-6041 1 42x42 860 42.5 42.5 0.2 2.3 0.7 0.15 0.4 0.6 BP-1004. SG-BGA-6042 1 30x30 900 31 31 0.2 3.4 0.7 0.2 0.4 0.6 BP-1000. SG-BGA-6097 .. Tags: 1mm pitch BGA socket SCR 6004 BGA Package 14x14 12x12 mlf diode sg 94 SG-MLF-7002 SG-BGA-6031* SG 87 sg 81 SG 32 SG 02 SF 829 B MLF-7002 EE30 diode sg 87 diode sg 64 datasheet abstract.. |
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First line: Tape Ball Grid Array (TBGA) 2000 Page otorola General Business Information otorola TBGA Construction Abstract: .. in TBGA: – Voyager / MPC8260 / PowerQUICC II • 480 pins 29x29 array, 1.27 mm pitch, 5 perimeter rows • 37.5 mm square body size. • 1 layer/grounded stiffener • 2 layer under development, qual scheduled .. Tags: datasheet abstract.. |
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First line: fbga 4x4 VFBGA 120 BGA and QFP Package 14x14 Package Line-up July, 2009 mass production Under development Package name Package dimensions (mil) 6.3x.4 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) .9x2 (400) 13x36.72 (600) 13x45.5 (600) 14x37.3 (600) 17x Abstract: .. HBGA 29x29 1.00 3.40. • 2.80. • 33x33 3.20. • 35x35 3.80. • 37.5x37.5 1.27 3.30. • 1.00 3.20. • 2.90. • 42 .. Tags: BGA and QFP Package 14x14 VFBGA 120 fbga 4x4 datasheet abstract.. |
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First line: ep3c16 CyClone 65-nm low-Cost FPGAs Cyclone product specs Cyclone floorplan Altera® Cyclone® FPGAs, newest offering Cyclone series low-cost devices, feature power high functionality deliver more, sooner, less--especially your most cost-sensitive high-volume applications. Built TSMC's 65-nm l Abstract: .. Nominal length x width mm 22 x 22 31 x 31 35 x 35 17 x 17 19 x 19 23 x 23 29x29 14 x 14 19 x 19. Maximum surface area mm 493 952 1,215 296 369 538 841 196 369. Maximum height mm 1.6 4.1 4.1 1.55 2.6 2.6 2.6 2.2 .. Tags: ep3c16 pin information ep3c5 EP3c55* 18-bit DDR2 SDRAM datasheet abstract.. |
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First line: IC398 NP437* NP440* NP352 NP352* 0.4mm Pitch Product Line-up Size (mm) Grid 10,11 12,13,14 15,16 17,18,19 20,21 21,22 Open Type NP437 series Si/Features Abstract: .. NP383-84107 max grid : 10X18 max grid : 18X18 max grid : 25X25 max grid : 29X29 IC398 series â–¼ SÃ/Features mmm^-r V fcHRqm U-shape contact minimizes contact mark on solder ball. Also available in .. Tags: NP352* NP352 NP440* NP437* IC398 datasheet abstract.. |
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First line: 238 pin PGA socket 238 pin PGA socket precidip* c54400* Diode KD 514 PLCC SOCKETS PLCC SOCKETS QUICK SELECTOR CHART PLCC Abstract: .. 29x29. ..-480M29-001.. 29x29. ..-504M29-001.. 30x30. ..-500M30-001.. 30x30. ..- .. Tags: Diode KD 514 c54400* precidip* 238 pin PGA socket 238 pin PGA socket datasheet abstract.. |
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First line: 38S02* MSM38S Gates MSM98S Customer Structured Arrays 0.8µm Mixed 3-V/5-V Abstract: .. Body Size mm 9x10 15x19 14x14 14x20 14x20 28x28 28x28 28x28 32x32 40x40 17x17 24x24 29x29 10x10 10x10 12x12 14x14 20x20 24x24 28x28 27x27 35x35 35x35. Lead Pitch mm 0.8 1.0 0.8 0.8 0.65 0.8 0.65 .. Tags: 74151 38S02* MSM38S MSM98S |
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First line: FPGA 456 XC3S1000-FT256 XPressArray-II 0.15mm Structured ASIC Features Next-generation 0.15mm hybrid structured ASIC Platform high-performance 1.5V/1.2V ASICs FPGAto-ASIC conversions production cost savings Significant time-to-market advantages Drop-in replacement cost-reducing Xilinx® Virtex-II Abstract: .. 780 FBGA 780 Fine Pitch Ball Grid Array 1.0 29x29 675. 896 FFBGA 896 Flip-Chip Fine Pitch Ball Grid Array 1.0 31x31 639. 956 PBGA 956 Standard Ball Grid Array 1.27 40x40 747. 957 BFBGA 957 Flip-Chip Standard .. Tags: FPGA 456 XC3S1500-FG676* XC3S1000-FT256 XC3S1000-FG676 datasheet XC3S1000-FG676 XC3S1000-FG456 XC3S1000 XC2VP70 XC2VP40-FG676 XC2VP40-FF1148 XC2VP30-FF896 XC2V3000-FG676 datasheet abstract.. |
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First line: U15700EJ1V1DS00* INTEGRATED CIRCUIT µPD30550 VR5500 Abstract: .. 272-PIN PLASTIC BGA CAVITY DOWN ADVANCED TYPE 29x29 ITEM MILLIMETERS. D 29.00±0.20. E 29.00±0.20. A1 0.60±0.10. A2 1.15. e. 1.80. A. 1.27. ZE. φ. φ. A4 0.25MIN. x1 0.30. x2 0.15. b. y 0.20. φ 0.75±0.15. ZD 1.80. P272F2 .. Tags: U15700EJ1V1DS00* VR5500 VR5432 NEC V20 hardware VR5500 |
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First line: VR5432 VR5432* INTEGRATED CIRCUIT µPD30550 VR5500TM 64-/32-BIT MICROPROCESSOR Abstract: .. 272-PIN PLASTIC BGA CAVITY DOWN ADVANCED TYPE 29x29 ITEM MILLIMETERS. D 29.00±0.20. E 29.00±0.20. A1 0.60±0.10. A2 1.15. e. 1.80. A. 1.27. ZE. φ. φ. A4 0.25MIN. x1 0.30. x2 0.15. b. y 0.20. φ 0.75±0.15. ZD 1.80. P272F2 .. Tags: VR5432* VR5500 VR5432 NEC V20 hardware VR5500TM |
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First line: Agilent HDMP-3268 Gbit/sec 68x68 Crosspoint Switch Features Supports data rates Gbit/sec each channel Fully differential high-speed signal path highest signal integrity Implemented independent 68-input multiplexers Supports broadcast/multicast modes. Inputs connected multiple outputs Provides indepe Abstract: .. Ball Matrix mm 29x29. Ball Layout 4 rows. Ball Pitch mm 1.27. Package Thickness mm 2.93. 15. Table 13. HDMP-3268 Detailed Pin Assignment A1 GND B22 DOUT[5]+ D14 CH[4] J3 DIN[59]+ A2 GND B23 DOUT[6]- D15 .. Tags: HDMP-3268 |
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First line: Abstract: .. 27 29.29x29.29x3.80 9.3x9.3 Cu ã‚¢ãƒã‚¤ 42 33 30 27 9. 表 5-2- 1 5. BGA 熱抵抗一覧表. PKG コード パッケージ外形サイズ θ jc. [mm] 風速0 m/sac 時 風速 0.5m/sac 時 風速1 .0m/sac 時 風速 2.0m/sac 時. [ °C /W] P-BGA 1 44- 1 3 1 3-0.8 1 3x 1 3x0.96 1 03 9 1 80 .. Tags: SOP32 P 430 soj28 sop28 datasheet abstract.. |
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First line: PGABGAPLCC PGABGAPLCC PGABGAPLCC Abstract: .. 29x29 ..-480M29-001.. 29x29 ..-504M29-001.. 30x30 ..-500M30 .. Tags: datasheet abstract.. |
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First line: pga/bga/plcc pga/bga/plcc PGA/BGA/PLCC Abstract: .. 29x29 ..-480M29-001.. 29x29 ..-504M29-001.. 30x30 ..-500M30 .. Tags: datasheet abstract.. |
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First line: VR5500A VR55* VR5532A VR5500* VR5532* INTEGRATED CIRCUIT µPD30550A VR5500A, VR5532A 64-/32-BIT MICROPROCESSOR Abstract: .. 272-PIN PLASTIC BGA CAVITY DOWN ADVANCED TYPE 29x29 Data Sheet U16678EJ3V0DS 28. μPD30550A. 208-PIN PLASTIC QFP FINE PITCH 28x28 ITEM MILLIMETERS. F. G 1.25. 1.25. B. C 28.0±0.2. 28.0±0.2. H .. Tags: VR5532* VR5500* VR5532A VR55* VR5500A VR5432 NEC V20 hardware VR5500A VR5532A |
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First line: PCB design guide athlon 64 AMD Athlon 64 pin diagram pcb thermal Design guide amd athlon 64 socket 754 AMD drawing datasheet AthlonTM OpteronTM Processors Thermal Design Guide Publication Issue Date: 26633 Rev: September 2003 3.03 Abstract: .. The pin array is 29x29 on a 1.27 mm pitch with a 9x9 depopulation in the center. In addition, three pins are removed from the A1 corner of the package, and a single pin is removed from the other three .. Tags: pcb thermal Design guide AMD Athlon 64 pin diagram PCB design guide athlon 64 Socket 754 retention frame PCB design guide gk-17 Athlon thermal design -intel athlon 64 AMD OPTERON 6000 AMD drawing datasheet AMD athlon socket 754 amd athlon datasheet amd athlon 64 socket 754 datasheet abstract.. |
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First line: µPD30500, 30500A, 30500B VR5000TM, VR5000ATM, VR5000BTM 64-BIT MICROPROCESSOR INTEGRATED CIRCUIT Abstract: .. 272-PIN PLASTIC BGA C/D advanced type 29x29 ITEM MILLIMETERS. A 29.00±0.20. D 29.00±0.20. G 0.60±0.10. H 0.90. E 1.80. F 1.27 T.P. Z C0.5. φ. φ. J 1.50±0.20. M 0.30. N 0.25 MIN. K 0.15. L. P 0.10. φ 0.75±0.15 .. Tags: VR5000TM VR5000ATM VR5000BTM |
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First line: µPD30500, 30500A VR5000TM, VR5000ATM 64-/32-BIT MICROPROCESSOR INTEGRATED CIRCUIT Abstract: .. 272-PIN PLASTIC BGA C/D advanced type 29x29 ITEM MILLIMETERS. A 29.00±0.20. D 29.00±0.20. G 0.60±0.10. H 0.90. E 1.80. F 1.27 T.P. Z C0.5. φ. φ. J 1.50±0.20. M 0.30. N 0.25 MIN. K 0.15. L. P 0.10. φ 0.75±0.15 .. Tags: R3000 nec VR5000TM VR5000ATM |
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First line: 88E1111 RGMII config MPC8569E-MDS-PB User Guide June 2009 Rev. MPC8569E-MDS-PB Moduled Development System Processor Board Abstract: .. The device package is a 783-pin, Flip-Chip PBGA of 29x29 mm pitch; its estimated power will not exceed 7W. Mode Optional Expansion Description. Standalone PEX RC. Includes the noted modules: • GETH3 .. Tags: 88E1111 RGMII config Marvell PHY 88E1111 Datasheet Marvell PHY 88E1111 bsdl marvell 88E1111 register RGMII QTH-030-01 MPC8569E-MDS-PB |
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First line: &PPS Series Grid Array Sockets PGM168-7A1715-V PPS238-7A1916-V SUPERLIF1" insertion withdrawal force contacts Non-wicking closed bottom, precision sleeve protects 100% against flux solder contamination Custom design capabilities Available molded plastic (PGM) glass epoxy (PPS) insulators Abstract: .. oooooooooo ooo oo 421 Pins A1 29x29 WÈÊB. SM 481 Pins A1 31x31 Need more technical information? Consult your Thomas & Betts sales office listed on the back cover 15F TOObMlD 73^ D45 Thomas & Betts 1555 .. Tags: datasheet abstract.. |
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First line: BGA64* BGA68* SK-PGA14 TEXTOOL 15x15 pga BGA240* Sockets Receptacles SK.1 Ironwood offers industry's widest array high quality sockets receptacles BGA, MGA, PGA, QIP, packages. also offer parts that provide sockets in-circuit emulators. Abstract: .. 2 7 m m 29X29 SF-BGA480B-B-01. LS-BGA480C-02 4 8 0 1.27mm 1 . 2 7 m m 2 6 X 2 6 SF-BGA480C-B-01. LS-BGA484B-02 4 8 4 1.27mm 1 . 2 7 m m 26X26 SF-BGA484B-B-01. LS-BGA500A-02 5 0 0 1 . 2 7 m m 1 . 2 7 m m 3 0 X 3 0 S F - B G A 5 .. Tags: BGA240* SK-PGA14 BGA68* BGA64* vadem TEXTOOL zif socket TEXTOOL 15x15 pga land pattern BGA 0.75 J 452A BGA432* bga244* bga 196 land pattern Am29240 *9243 851A datasheet abstract.. |
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First line: M39029/63 FCI FCI-OEN pps-gf40 LCP-GF30* pbt-GF30-fr www.precidip.com preCi-dip PHOne Saint-Henri P.O.Box CH-2800 Switzerland Abstract: .. 29x29. ..-480M29-001.. 29x29. ..-504M29-001.. 30x30. ..-500M30-001.. 30x30. ..- .. Tags: pbt-GF30-fr LCP-GF30* pps-gf40 FCI-OEN M39029/63 FCI CH-2800 |
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First line: DIN17224* swiss world connects 14-Chinese PRECI-DIP Abstract: .. 29x29 ..-480M29-001.. 29x29 ..-504M29-001.. 30x30 ..-500M30 .. Tags: DIN17224* datasheet abstract.. |
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First line: SMD transistor MARKING CODE g23 smd diode code marking 2U SMD MARKING CODE L33 SMD marking CODE 2U TRANSISTOR SMD MARKING CODE W25 Virtex-6 FPGA Packaging Pinout Specifications UG365 (v1.0) June 2009 Xilinx disclosing this user guide, manual, release note, and/or specification (the "Documentati Abstract: .. 29x29. XC6VLX75T. XC6VLX130T. XC6VLX195T. XC6VLX240T. FF1156 FFG1156. 35x35. XC6VLX130T .. Tags: TRANSISTOR SMD MARKING CODE W25 SMD MARKING CODE L33 smd diode code marking 2U SMD transistor MARKING CODE g23 XC6VSX475T XC6VLX130T* VIRTEX-6 UG365 SMD marking CODE 2U smd mark code zzz SMD l35 Transistor smd 2U 78 marking code R38 SMD Transistor m7 smd diodes ff1156 ap41 UG365 |
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First line: 42kc DIN17223 DIN17224* swiss world connects 14-Japanese Preci-DiP Abstract: .. 29x29 ..-480M29-001.. 29x29 ..-504M29-001.. 30x30 ..-500M30 .. Tags: DIN17224* DIN17223 42kc datasheet abstract.. |
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First line: SMD transistor MARKING CODE g23 TRANSISTOR SMD MARKING CODE y25 TRANSISTOR SMD MARKING CODE W27 RSN 310 R37 TRANSISTOR SMD MARKING CODE W25 Virtex-6 FPGA Packaging Pinout Specifications UG365 (v2.3) August 2010 Xilinx disclosing this user guide, manual, release note, and/or specification (the " Abstract: .. 29x29. XC6VLX75T 11.8 3.5 0.28 7.5 6.4 5.8. XC6VLX130T 11.2 3.1 0.17 7.1 6.0 5.4. XC6VLX195T 10.9 2.9 0.14 7.0 5.8 5.3. XC6VLX240T 10.8 2.7 0.11 6.8 5.7 5.2. FF1154 FFG1154. 35x35. XC6VHX250T 9.7 2.5 0.10 .. Tags: TRANSISTOR SMD MARKING CODE W25 RSN 310 R37 TRANSISTOR SMD MARKING CODE W27 TRANSISTOR SMD MARKING CODE y25 SMD transistor MARKING CODE g23 UG365 |
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First line: B42 diode smd SMD MARKING CODE h23 SMD marking CODE 2U RSN 310 R37 TRANSISTOR SMD MARKING CODE W25 Virtex-6 FPGA Packaging Pinout Specifications UG365 (v2.2) February 2010 Xilinx disclosing this user guide, manual, release note, and/or specification (the "Documentation") solely development Abstract: .. 29x29. XC6VLX75T 11.8 3.5 0.28 7.5 6.4 5.8. XC6VLX130T 11.2 3.1 0.17 7.1 6.0 5.4. XC6VLX195T 10.9 2.9 0.14 7.0 5.8 5.3. XC6VLX240T 10.8 2.7 0.11 6.8 5.7 5.2. FF1154 FFG1154. 35x35. XC6VHX250T 9.7 2.5 0.10 .. Tags: TRANSISTOR SMD MARKING CODE W25 RSN 310 R37 SMD marking CODE 2U SMD MARKING CODE h23 B42 diode smd XC6VSX475T XC6VLX130T VIRTEX-6 UG365 TRANSISTOR SMD MARKING CODE 352 TRANSISTOR SMD MARKING CODE 1P smd transistor L44 smd marking M22 smd mark code zzz smd M21 smd diode L44 smd diode L43 UG365 |
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